EP1352253A2 - Pointe de contact haute frequence - Google Patents

Pointe de contact haute frequence

Info

Publication number
EP1352253A2
EP1352253A2 EP01989385A EP01989385A EP1352253A2 EP 1352253 A2 EP1352253 A2 EP 1352253A2 EP 01989385 A EP01989385 A EP 01989385A EP 01989385 A EP01989385 A EP 01989385A EP 1352253 A2 EP1352253 A2 EP 1352253A2
Authority
EP
European Patent Office
Prior art keywords
measuring
frequency probe
tip
signal
probe tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01989385A
Other languages
German (de)
English (en)
Inventor
Steffen Thies
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rosenberger Hochfrequenztechnik GmbH and Co KG
Original Assignee
Rosenberger Hochfrequenztechnik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rosenberger Hochfrequenztechnik GmbH and Co KG filed Critical Rosenberger Hochfrequenztechnik GmbH and Co KG
Publication of EP1352253A2 publication Critical patent/EP1352253A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
    • H01R11/18—End pieces terminating in a probe
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes

Definitions

  • the invention relates to a high-frequency probe tip, in particular for printed circuit boards and / or HF cables, according to the preamble of claim 1.
  • TDR measurements Time Domain Reflectometry measurements
  • a measuring tip for measuring purposes.
  • a measuring tip has also been proposed, in which a measuring mandrel of the ground contact is arranged pivotably. By appropriately pivoting the measuring mandrel, different distances between the ground contact and the signal contact can be realized.
  • problems arise with regard to impedance matching and undesired reflections limit a frequency range in which such a measuring tip can be used, for example to a maximum of 125 MHz.
  • measuring tips are required today that can be used up to the GHz range.
  • the invention has for its object to provide an improved high-frequency probe tip of the above type, which is easy to handle exercise and at the same time ensures good functional reliability even at high frequencies in the GHz range.
  • the ground conductor arrangement is designed in such a way that the signal conductor can be displaced within the ground conductor arrangement together with the dielectric surrounding it.
  • the ground conductor arrangement is box-shaped in the predetermined region, the electrical field between the ground conductor arrangement and the signal conductor in this region practically runs only through a correspondingly flattened region of the dielectric which surrounds the signal conductor.
  • the impedance is independent of the position of the signal conductor within the ground conductor arrangement. This effect is reinforced by the fact that the box-shaped ground conductor arrangement has a small and a large diameter in cross section, the small diameter being smaller than the diameter of the dielectric of the signal conductor.
  • the ground conductor arrangement is designed as a flattened tube in the predetermined area.
  • a standard coaxial connection for the measuring cable is expediently provided at the connection end.
  • the ground contact is preferably formed on the measuring tip.
  • two signal conductors each with a signal contact, are provided.
  • FIG. 1 shows a preferred embodiment of a high-frequency probe tip according to the invention in a perspective view
  • FIG. 2 shows the high-frequency probe tip of FIG. 1 in a longitudinal section
  • FIG. 3 is a sectional view taken along line A-A of FIG. 2;
  • FIG. 4 shows an alternative embodiment of a high-frequency probe tip according to the invention in a perspective view
  • Fig. 5 shows the high-frequency probe tip of Fig. 4 in a longitudinal section
  • FIG. 6 is a sectional view taken along line B-B of FIG. 5.
  • FIGS. 1 and 2 The preferred embodiment of a high-frequency probe tip according to the invention shown in FIGS. 1 and 2 comprises a connection end 10 to which a measuring cable, not shown, can be connected for connection to a measuring device, not shown, and a measuring tip 12, to which a signal contact 14 and a ground contact 16 are trained.
  • the contacts 14, 16 form an RF transition, for example to a test object.
  • a coaxial conductor 18 with ground conductor arrangement 20 and signal conductor 22 connects the connection end 10 to the measuring tip 12.
  • the signal conductor 22 is surrounded by a dielectric 24.
  • a handle 26 is formed and a standard coaxial connection 28 is arranged for the measuring cable.
  • the mass conductor arrangement 20 is designed as a flattened tube in a predetermined area 30.
  • this tube 20 has a large diameter 32 and a small diameter 34 in cross section, the small diameter 34 being somewhat smaller than the regular diameter of the dielectric 24. Therefore, the dielectric 24 becomes in the region 30 something pressed together.
  • the transition from the coaxial cable 18 to the tubular ground conductor arrangement 20 takes place.
  • the sheath of the coaxial cable 18 is soldered to the open end of the tube 20, while the inner conductor or signal conductor 22 is continued in one piece with dielectric 24.
  • the flattening of the tube 20 in the region 30 ensures that the same impedance as in the coaxial cable 18 prevails in this tube 20 despite the same insulator diameter.
  • a distance between the ground contact 16 and the signal contact 14 is infinitely adjustable by means of the movable signal conductor 22.
  • a slide 38 (FIG. 1, 2) is provided on the tube 20, which carries the flexible signal conductor 22 between thorns 40. In this way, the signal conductor 22 can be pushed back and forth within the tube 20 in the direction of arrow 42.
  • the measuring tip 12 has a constant impedance throughout, ie also for all distances, and is therefore particularly suitable for TDR measurements in which the measurement accuracy and resolution are based on a transition with as little reflection as possible depend on the test object.
  • the distance between the signal contact 14 and the ground contact 16 can be changed in a simple manner by actuating the slide 38. When the slide 34 is actuated, the flexible inner or signal conductor 22 with its insulation 24 moves in the box-shaped outer conductor 20.
  • FIGS. 4 to 6 In the alternative embodiment of a high-frequency probe tip according to the invention shown in FIGS. 4 to 6, functionally identical parts are designated with the same reference numbers as in FIGS. 1 to 3, so that reference is made to the above description of FIGS. 1 to 3 for their explanation.
  • this high-frequency probe tip comprises a symmetrical tip with two signal conductors 22 and accordingly two signal contacts 14 on the measuring tip 12.
  • Corresponding outer conductors of coaxial cables 44 are soldered to the tubular outer conductor 20 in the transition region 36.
  • this high-frequency probe tip thus has a second, equivalent signal contact 14a on the measuring tip 12, which sits on the rigid line 22a shown in the upper figure.
  • the second line 22 in the lower figure can be displaced analogously to the asymmetrical measuring tip 12 according to FIGS. 1 to 3.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

L'invention concerne une pointe de contact haute fréquence, notamment pour des cartes de circuits imprimés et/ou des câbles haute fréquence. Cette pointe comporte une extrémité de raccordement (10), qui permet de raccorder un câble de mesure à un appareil de mesure, un contact de masse (16) et une pointe de mesure (12) comportant au moins un contact de signal (14). Un conducteur coaxial (18) à dispositif conducteur de masse (20) et au moins un conducteur de signaux (22) entouré d'un diélectrique (24) relient l'extrémité de raccordement (10) à la pointe de mesure (12). Partant de la pointe de mesure (12) et traversant une zone définie (30) de la pointe de contact haute fréquence, le dispositif conducteur de masse (20) est façonné de telle sorte qu'au moins un conducteur de signaux (22), avec le diélectrique (24) qui l'entoure, coulisse à l'intérieur du dispositif conducteur de masse (20).
EP01989385A 2000-12-21 2001-12-06 Pointe de contact haute frequence Withdrawn EP1352253A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE20021685U DE20021685U1 (de) 2000-12-21 2000-12-21 Hochfrequenz-Tastspitze
DE20021685U 2000-12-21
PCT/DE2001/004619 WO2002050556A2 (fr) 2000-12-21 2001-12-06 Pointe de contact haute fréquence

Publications (1)

Publication Number Publication Date
EP1352253A2 true EP1352253A2 (fr) 2003-10-15

Family

ID=7950409

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01989385A Withdrawn EP1352253A2 (fr) 2000-12-21 2001-12-06 Pointe de contact haute frequence

Country Status (7)

Country Link
US (1) US20040066181A1 (fr)
EP (1) EP1352253A2 (fr)
JP (1) JP2004537031A (fr)
CN (1) CN1466686A (fr)
CA (1) CA2420581A1 (fr)
DE (1) DE20021685U1 (fr)
WO (1) WO2002050556A2 (fr)

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Publication number Priority date Publication date Assignee Title
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
DE10143173A1 (de) 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
WO2003052435A1 (fr) 2001-08-21 2003-06-26 Cascade Microtech, Inc. Systeme de detection a membrane
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US7321234B2 (en) 2003-12-18 2008-01-22 Lecroy Corporation Resistive test probe tips and applications therefor
US7262614B1 (en) * 2005-02-10 2007-08-28 Lecroy Corporation Planar on edge probing tip with flex
DE112004002554T5 (de) 2003-12-24 2006-11-23 Cascade Microtech, Inc., Beaverton Active wafer probe
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
JP2008512680A (ja) 2004-09-13 2008-04-24 カスケード マイクロテック インコーポレイテッド 両面プロービング構造体
US7183779B2 (en) * 2004-12-28 2007-02-27 Spectrum Technologies, Inc. Soil probe device and method of making same
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US9404940B1 (en) 2006-01-06 2016-08-02 Teledyne Lecroy, Inc. Compensating probing tip optimized adapters for use with specific electrical test probes
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7804314B2 (en) * 2008-02-19 2010-09-28 Siemens Industry, Inc. Adjustable electrical probes for circuit breaker tester
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
WO2010059247A2 (fr) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Coupon amovible pour appareil de sondage
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
DE202009003966U1 (de) * 2009-03-20 2009-06-04 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Messspitzen

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US3447078A (en) 1964-07-17 1969-05-27 American Electronic Lab Electrical probe for testing transistors and the like having rotatably supported actuator for plural probe tips
DE3332187C2 (de) 1983-09-07 1986-01-30 Feinmetall Gmbh, 7033 Herrenberg Kontaktstift
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DE3801222C2 (de) 1988-01-18 1996-11-14 Siemens Ag Kontaktiereinrichtung für Prüfzwecke, insbesondere zur Prüfung von Halbleiterbausteinen
DE3818728A1 (de) 1988-06-01 1989-12-14 Feinmetall Gmbh Federkontaktstift
US4923407A (en) 1989-10-02 1990-05-08 Tektronix, Inc. Adjustable low inductance probe
DE4216261A1 (de) 1992-05-16 1993-11-18 Pmk Mess Und Kommunikationstec Tastkopf zur Überprüfung elektrischer Schaltungen
US5565788A (en) * 1994-07-20 1996-10-15 Cascade Microtech, Inc. Coaxial wafer probe with tip shielding
US5506515A (en) * 1994-07-20 1996-04-09 Cascade Microtech, Inc. High-frequency probe tip assembly
DE29603288U1 (de) 1996-02-24 1996-04-18 Amrhein, Herbert, 74321 Bietigheim-Bissingen Kontaktklemme
DE19641880A1 (de) 1996-10-10 1998-04-16 Rosenberger Hochfrequenztech Meßspitzeneinheit zum Kontaktieren von planaren Mikrowellenschaltungen
JP3112873B2 (ja) * 1997-10-31 2000-11-27 日本電気株式会社 高周波プローブ
DE29823489U1 (de) 1998-01-14 1999-06-24 Ch. Beha Gmbh Technische Neuentwicklungen, 79286 Glottertal Gerät zum Messen und/oder Prüfen von elektrischen Größen
US6366104B2 (en) * 2000-02-15 2002-04-02 Hughes Electronics Corp. Microwave probe for surface mount and hybrid assemblies

Non-Patent Citations (1)

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Title
See references of WO0250556A3 *

Also Published As

Publication number Publication date
CN1466686A (zh) 2004-01-07
JP2004537031A (ja) 2004-12-09
US20040066181A1 (en) 2004-04-08
WO2002050556A3 (fr) 2002-12-05
DE20021685U1 (de) 2001-03-15
CA2420581A1 (fr) 2003-02-25
WO2002050556A2 (fr) 2002-06-27

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