Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
  • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
  • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
  • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
  • G01L19/14—Housings
  • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
  • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
  • G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
  • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
  • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
  • G01L19/069—Protection against electromagnetic or electrostatic interferences
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/4805—Shape
  • H01L2224/4809—Loop shape
  • H01L2224/48091—Arched

Definitions

• the invention is based on a pressure sensor module according to the preamble of claim 1.
• a pressure sensor device which has a semiconductor chip with a pressure sensor.
• the arrangement is intended for mounting on a printed circuit board.
• the electrical connections of the semiconductor chip are not injected airtight in the plastic of the housing. If there is a negative pressure in the area of the pressure sensor in relation to the outside area, air is drawn into the gel along the connections . pulled and leads to a mechanical load on the bond wires or bond connections. In addition, the separating element falsifies the pressure characteristic of the semiconductor chip due to its not negligible rigidity. With higher demands on the measuring accuracy, an enlargement of the membrane diameter and a reduction of the membrane thickness are necessary. This affects the miniaturization.
• a pressure sensor chip is known from mstnews 2/99, pages 8 to 9, which is mounted as an individual part in a pressure sensor module housing and fastened there. A calibration of the pressure sensor is only possible after mounting the pressure sensor chip, since the mounting of the
• Pressure sensor chips and passivation with the aid of an opacifying agent influenced a calibration curve.
• the entire module housing with the attached pressure sensor must be exposed to different temperatures and pressures in order to carry out a calibration. This is very expensive due to the long waiting time for heating the large sensor housing and due to the low packing density during the adjustment.
• the reject during calibration is only detected after the sensor chip has been installed. In this case, the expensive pressure sensor module housing can no longer be used. This increases the reject costs.
• a pressure sensor module is known from DE 197 314 20 AI, in which the pressure sensor is closed in a pressure-tight manner by a cover. This type of assembly as well as the use of a ceramic substrate is complex. In addition, the frame that encompasses the gel must be attached to the ceramic substrate.
• the pressure sensor module according to the invention with the characterizing features of claim 1 has the advantage that a pressure sensor is mounted in a module housing in a simple manner and a pressure sensor module can be manufactured.
• a sensor housing is advantageously made of plastic, because this is easy to manufacture.
• connection elements are at least partially enclosed by the sensor housing, as a result of which they are held and a passage of the connection elements through the sensor housing is achieved.
• the sensor housing In order to protect a pressure sensor in its sensor housing from external environmental influences and to encapsulate it in a pressure-tight manner, the sensor housing is enclosed by a casting compound.
• the sealing compound also ensures a gas-tight passage of the connection elements.
• the pressure sensor has elements for improving the electromagnetic compatibility.
• Capacitors as elements for improving the electromagnetic compatibility, are connected electrically and mechanically in an advantageous manner by conductive adhesive, soldering or welding on the electrical connections.
• a media-resistant gel such as, for example, is advantageously used as a covering agent for the pressure sensor chip.
• TTluor Silicone Gel used, so that other protective measures are not necessary.
• FIG. 1 shows a first embodiment of a pressure sensor module designed according to the invention
• FIG. 2 shows a second embodiment of a pressure sensor module designed according to the invention
• FIG. 3 shows a third embodiment of a pressure sensor module designed according to the invention.
• FIG. 1 shows a first exemplary embodiment of a pressure sensor module 1 according to the invention.
• the pressure sensor module 1 consists, among other things, of a module housing 3 in which a pressure sensor 6, for example in the form of a sensor chip, is arranged in a sensor housing 8.
• the pressure sensor 6 is in contact with a medium 10 to be measured, which reaches the pressure sensor 6, for example, via a connector 33.
• the sensor housing 8 has, for example, a U-Forr ⁇ , the opening of the U-shape being connected to the medium 10 to be measured and completely enclosing an opening 11 of the connecting piece 33.
• the pressure sensor 6 is covered in its sensor housing 8 by a covering agent, for example a gel, and is thus protected.
• the sensor housing 8 is arranged, for example, in a recess 15 in the module housing 3 and, for example, completely enclosed by a casting compound 17.
• the casting compound 17 seals the sensor housing 8 and the module housing 3 in such a way that a medium 10 to be measured does not get into the recess 15.
• the casting compound 17 to be hardened can hold the sensor housing 8 in the recess 15 and also seals the electrical connections 21 running through the sensor housing 8.
• a lid that encapsulates the recess 15 in an airtight manner and protects it from external influences can be dispensed with here.
• the pressure sensor 6 is connected by bonding wires 19 to the electrical connection elements 21, which establish the connection to external electrical plug elements 25.
• the plug elements 25 serve to connect to an electronic control.
• the connection point 23 of the connector elements 25 with the connecting elements 21, produced by welding or soldering, is also in the recess 15 in the casting compound 17th
• the capacitors 27 are, for example, by means of conductive adhesive,
• the capacitors 27 are arranged, for example, directly on the connection point 23.
• FIG. 2 shows a further exemplary embodiment of a pressure sensor module 1 according to the invention.
• the module housing 3 has, in addition to the recess 15, a trough 35 through which the plug elements 25 or the electrical connection elements 21 run.
• the capacitors 27 are electrically connected in the trough 35 on the plug elements 25 and are enclosed and protected by a casting compound 17.
• the connection point 23 can also be arranged in the trough 35.
• capacitors 27 are spatially further away from the welded connection point 23 of the plug elements 25 and connection elements 21 compared to FIG. 1, they can also be electrically connected to the electrical connection elements 21 or the plug elements 25 by soldering or gluing.
• the module housing 3 also has, for example, the socket 33 with a sealing ring 29, so that the socket 33 can be inserted into a further component which contains the medium 10 to be measured.
• the connector 33 is sealed off from the component by the sealing ring 29, so that the medium 10 to be measured in the component only comes into contact with the pressure sensor 6 and cannot escape the component at the assembly point of the connector 33.
• the pressure sensor module 1 can furthermore have a temperature sensor 40, for example an NTC resistor.
• FIG. 3 shows a further exemplary embodiment of the pressure sensor module 1 according to the invention, starting from FIG. 2.
• the welded connection point 23 lies in the trough 35, so that the elements 27 are arranged as close as possible to the pressure sensor 6, that is to say in the depression 15.

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• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Electromagnetism (AREA)
• Chemical & Material Sciences (AREA)
• Analytical Chemistry (AREA)
• Measuring Fluid Pressure (AREA)

Applications Claiming Priority (3)

Publications (1)

Family

ID=7661707

Family Applications (1)

Country Status (10)

Families Citing this family (28)

Family Cites Families (17)

• 2000
  • 2000-11-01 DE DE10054013A patent/DE10054013B4/de not_active Expired - Fee Related
• 2001
  • 2001-10-31 EP EP01992877A patent/EP1334342A1/de not_active Withdrawn
  • 2001-10-31 BR BR0107390-7A patent/BR0107390A/pt not_active IP Right Cessation
  • 2001-10-31 JP JP2002539781A patent/JP2004513339A/ja active Pending
  • 2001-10-31 CN CNB018033865A patent/CN1332190C/zh not_active Expired - Fee Related
  • 2001-10-31 AU AU21538/02A patent/AU775608B2/en not_active Ceased
  • 2001-10-31 KR KR1020027008342A patent/KR20020065617A/ko not_active Application Discontinuation
  • 2001-10-31 US US10/169,451 patent/US6805010B2/en not_active Expired - Fee Related
  • 2001-10-31 WO PCT/DE2001/004123 patent/WO2002037074A1/de active IP Right Grant
  • 2001-10-31 RU RU2002120909/28A patent/RU2279650C2/ru not_active IP Right Cessation

Non-Patent Citations (1)

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