EP1333976B1 - Method for the production of screen cavities in a rotogravure form and base body applicable in said method - Google Patents

Method for the production of screen cavities in a rotogravure form and base body applicable in said method Download PDF

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EP1333976B1
EP1333976B1 EP01980111A EP01980111A EP1333976B1 EP 1333976 B1 EP1333976 B1 EP 1333976B1 EP 01980111 A EP01980111 A EP 01980111A EP 01980111 A EP01980111 A EP 01980111A EP 1333976 B1 EP1333976 B1 EP 1333976B1
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Prior art keywords
layer
support layer
copper
radiation
regions
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German (de)
French (fr)
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EP1333976A1 (en
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Jakob Frauchiger
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Daetwyler Global Tec Holding AG
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MDC Max Daetwyler AG
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41BMACHINES OR ACCESSORIES FOR MAKING, SETTING, OR DISTRIBUTING TYPE; TYPE; PHOTOGRAPHIC OR PHOTOELECTRIC COMPOSING DEVICES
    • B41B17/00Photographic composing machines having fixed or movable character carriers and without means for composing lines prior to photography
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41CPROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00Forme preparation
    • B41C1/02Engraving; Heads therefor
    • B41C1/04Engraving; Heads therefor using heads controlled by an electric information signal
    • B41C1/05Heat-generating engraving heads, e.g. laser beam, electron beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41NPRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00Printing plates or foils; Materials therefor
    • B41N1/04Printing plates or foils; Materials therefor metallic
    • B41N1/06Printing plates or foils; Materials therefor metallic for relief printing or intaglio printing

Definitions

  • the invention relates to a method according to the preamble of patent claim 1 and a base body of a gravure printing form according to the preamble of patent claim 8.
  • DE-A 2 218 393 a non-generic method for the production of gravure forms with electron beams is known.
  • DE-A 2 218 393 has therefore proposed coating the surfaces to be engraved with electron beams with a separating layer of silver or copper sulfide having a layer thickness of only 0.1 ⁇ m.
  • a second layer of copper with a layer thickness of 15 ⁇ m was then applied to the separating layer. Separation layer and second layer served only to reduce ablation depth.
  • EP-B 0 473 973 proposes to produce the wells no longer in copper, but in zinc.
  • the object of the invention is to provide a method and to provide a base body in which or on the Rastemäpfchen a gravure mold directly by means of laser radiation preferably in copper, but also in other materials without ejection crater edge, i. burr-free Rastezepfchen can be produced.
  • the object is achieved in that a preferably only a single ablation support layer is applied to the base body via the upper layer regions provided for the information embossing, through which sieve cups are laser ablated by material ablation (vaporization and / or ejection of molten material) into the jacket regions are introduced and then this support layer is removed, whereupon burr-free Rastemäpfchen be obtained.
  • the laser radiation is a temporally modulated in their intensity course radiation. Usually you will use a pulsed radiation, but this is not mandatory. Laser spikes, Q-switch, mode-locking etc. are also possible. Upon removal of the backing layer, there is no change in the snap-in cups in the topsheet regions.
  • the quality of the Rastmäpfchen so produced without burr is so good that without aftertreatment, a hard layer, especially a chromium layer, can be applied.
  • the chromium layer in such intaglio printing plates will preferably be applied with a layer thickness between 4 ⁇ m and 30 ⁇ m, in particular between 8 ⁇ m and 10 ⁇ m.
  • the burr-free well cups preferably in copper, can be achieved by selecting the support layer to allow good energy launch for the laser radiation with good ablation of material to the underlying material with minimized directional radiation backscatter.
  • Minimized radiation backscatter is important to prevent radiation from entering the laser cavity. This would namely amplified there and could cause damage to the optical components.
  • a good energy coupling of the laser radiation is important, because then only a small amount of radiation remains, the even for a return reflection yet could be considered.
  • a good energy input causes a strong heating of the material of the support layer. Once the support layer has become liquid, there is virtually no need to worry about radiation absorption.
  • the melting point should definitely be lower than that of the underlying upper layer material, in which then the Rastezepfchen lie. If the Rastemäpfchen are in copper, the melting point should be below 1083 ° C. Only at the melting point would the metals be 961 ° C silver, 660 ° C aluminum, 1063 ° C gold (which, however, would immediately be cost-off), gallium and germanium 937 ° C, indium 927 ° C, lead at 327 ° C, tin at 232 ° C, zinc at 419 ° C, etc.
  • the material of the backing layer is intended to cause a material removal in the underlying material carrying the printing information. That is, it should be done by the introduced with the laser radiation local heat energy as quickly as possible reproduced melting of the underlying material. As tests have shown, this reproducible melting is only given if the layer thickness of the Abtragungsunterstützungs harsh is everywhere the same thickness. If this is the case, precisely the cell volume to be generated can be specified via the irradiated maximum pulse intensity and the pulse shape. The cell volume can be determined most simply experimentally.
  • the material of the ablation support layer should have the highest possible vapor pressure.
  • the vapor pressure of the "base material” should be at least five times smaller than that of the material lying thereon. If left in the above example, zinc has a vapor pressure about 100 times higher than copper.
  • the material of the ablation support layer should be well removable, especially chemically, without attacking the information-bearing cladding regions.
  • the wavelength of the laser radiation used is to be adapted to the absorption of the material of the ablation support layer. Also, the wavelength has to be adapted to the dimensions of the sieve cups to be produced in accordance with the optical imaging laws.
  • a CO 2 laser wavelength 10.6 microns
  • a pulse shaping as well as an optical setup for the beam guidance of the laser will preferably be carried out as described in EP 00 810 552.0. If an Nd: YAG laser is used, zinc has also proved to be a material of the ablation support layer in this case as well.
  • the ablation support layer not only initiates a material removal in the underlying material, it also causes a turn-on delay for the drilling operation in the underlying layer.
  • the laser pulse has thus already risen to a higher intensity value compared to its initial pulse value, which results in a drilling intensity increase. This results in a good, i. a hemispherical sieve cup shape.
  • Metallic rotary gravure printing plates are usually constructed of several functional elements.
  • the main body 1 is usually a steel cylinder.
  • a copper layer 3 is applied with a thickness of several Millimetem
  • the copper layer 3 is the information-carrying intaglio printing plate.
  • the information consists of an arrangement of a plurality of Rastemäpfchen 5, which absorb the color required for the print.
  • a chromium coating 7 having a typical thickness of about 10 ⁇ m is applied as the uppermost layer
  • the printing information is now introduced directly into the copper layer 3 in the upper layer region 8 with a beam 9 of a pulsed Nd: YAG laser by material removal.
  • the copper surface 11 is galvanic with a zinc layer 13 as ablation support layer a small thickness tolerance (less than 5 ⁇ 10 -5 ) provided. Burr freedom is a prerequisite for perfect quality in the printing process.
  • the laser pulse 9 for generating in each case a detent cup 5 pierces the zinc layer 13 while melting .
  • Solid zinc has an absorption for the radiation 9 of the Nd: YAG laser of approximately 50%. Furthermore, solid zinc shows virtually no directional reflection. Does the zinc go because of its relatively low melting point and its low thermal conductivity in relation to copper in the liquid state, there is a nearly 100 percent radiation absorption. There is a strong local heating of the zinc, which further passes in the absorbent state to the underlying copper, whereupon this also goes into the liquid state. Copper is now of almost 100 percent reflection for the radiation 9 of the Nd: YAG laser (the reflection but does not come to effect, since the copper is still covered by zinc) in the solid state, now liquid in an approximately 100- percent absorption.
  • the copper material ejection or that of the zinc 15 lie on the zinc layer 13 and can easily be removed by chemically detaching them in a subsequent cleaning process.
  • the exposed engraving (Rastemäpfchen 5) in copper 3 is burr-free and can be easily chromed.
  • zinc prevents the melting from adhering, reduces the initial reflection for the laser radiation 9 and therefore allows an efficient drilling process in copper 3.
  • the method just described is not limited to zinc 13 as a copper coating.
  • the ablation support layer to be applied to copper 3 does not necessarily have to be a metal layer.
  • Non-metals are also suitable, provided they have the required properties regarding absorption, directional reflection and melting point.
  • ablation support layer 13 instead of just a single ablation support layer 13 , multiple layers may be superimposed. However, it has proven the only zinc layer 13 for cost reasons and because of the ease of handling.
  • the main body 1 of a gravure form does not necessarily have to be cylindrical; it can also be semi-cylindrical, flat or otherwise shaped.

Description

Die Erfindung betrifft ein Verfahren gemäss dem Oberbegriff des Patentanspruchs 1 und einen Grundkörper einer Tiefdruckform gemäss dem Oberbegriff des-Patentanspruchs 8.The invention relates to a method according to the preamble of patent claim 1 and a base body of a gravure printing form according to the preamble of patent claim 8.

Stand der TechnikState of the art

Aus der DE-A 2 218 393 ist ein gattungsfremdes Verfahren zur Herstellung von Tiefdruckformen mit Elektronenstrahlen bekannt. Bei der Herstellung von Tiefdruckformen mit Elektronenstrahlen ergaben sich Schwierigkeiten bei der Erzeugung von Rasternäpfchen mit einer Tiefe unter 10 µm. Die DE-A 2 218 393 hat deshalb vorgeschlagen, die mit Elektronenstrahlen zu gravierenden Oberflächen mit einer Trennschicht aus Silber bzw. Kupfersulfid mit einer Schichtdicke von lediglich 0,1 µm zu beschichten. Auf die Trennschicht wurde dann eine zweite Schicht aus Kupfer mit einer Schichtdicke von 15 µm aufgebracht. Trennschicht und zweite Schicht dienten lediglich dazu, auf Abtragungstiefe zu reduzieren. Nach dem Gravieren mit Elektronenstrahlen, wobei Näpfchen mit einer Tiefe bis zu 20 µm erzeugt wurden, verblieben beim nachträglichen Abziehen der Trenn- und Kupferschicht lediglich Näpfchen mit einer Tiefe von 5 µm; d.h. unter 10 µm, wie gewünscht.From DE-A 2 218 393 a non-generic method for the production of gravure forms with electron beams is known. In the production of gravure printing forms with electron beams, difficulties were encountered in the production of screen wells with a depth below 10 microns. DE-A 2 218 393 has therefore proposed coating the surfaces to be engraved with electron beams with a separating layer of silver or copper sulfide having a layer thickness of only 0.1 μm. A second layer of copper with a layer thickness of 15 μm was then applied to the separating layer. Separation layer and second layer served only to reduce ablation depth. After engraving with electron beams, where Wells were produced with a depth of up to 20 microns, remained on the subsequent removal of the separation and copper layer only wells with a depth of 5 microns; ie below 10 microns, as desired.

Das in der DE-A 2 218 393 beschriebene Verfahren stellte aufgrund einer Erzeugung von zwei Schichten mit unterschiedlichen Materialen und einem Arbeiten im Vakuum ein kompliziertes Verfahren dar.The process described in DE-A 2 218 393 represented a complicated process due to the production of two layers with different materials and working in a vacuum.

Aus der DE-A 30 35 714 ist ein weiteres Verfahren zur Herstellung von Drucknäpfchen für eine Tiefdruckform bekannt. Hierbei wurde die noch "rohe" Tiefdruckform mit einem ätzmittelresistenten Lack belegt. Der Lack wurde dann mit einer elektronischen Graviervorrichtung an den Stellen abgetragen, an denen später Rasternäpfchen vorhanden sein sollten. Als elektronische Graviervorrichtung wurde ein Stichel, ein Laserstrahl oder ein Elektronenstrahl verwendet. Nach dem gezielten Abtragen des Lacks erfolgte zur Erzeugung der Rasternäpfchen ein Ätzvorgang. Das hier beschriebene Herstellungsverfahren war kompliziert und zeitaufwendig.From DE-A 30 35 714 a further method for the production of pressure cups for a gravure printing form is known. Here, the still "raw" gravure mold was coated with an etchant-resistant paint. The varnish was then removed with an electronic engraving device at the locations where later sieve cups should be present. The electronic engraving device used was a stylus, a laser beam or an electron beam. After the targeted removal of the paint, an etching process was carried out to produce the sieve cups. The manufacturing process described here was complicated and time consuming.

Ein hierzu analoges Verfahren ist in der DE-A 2 344 233 beschrieben.A method analogous thereto is described in DE-A 2 344 233.

In der EP-B 0 473 973 wird nun vorgeschlagen, mittels Laserstrahlung eine direkte Gravur der Rastemäpfchen für die Tiefdruckform vorzunehmen, wobei hier darauf hingewiesen wird, dass eine Laserbearbeitung von Tiefdruckformen mit einer Aussenschicht aus Kupfer mit den nachfolgenden Schwierigkeiten verbunden waren:

  1. 1. Sehr starke Reflexion der Kupferschicht;
  2. 2. Hohe Schmelz- bzw. Verdampfungstemperatur von Kupfer;
  3. 3. Hohe Schmelz- bzw. Verdampfungswärme von Kupfer;
  4. 4. Gute Wärmeleitfähigkeit von Kupfer und damit starke Wärmeabgabe an die Umgebung der Rastemäpfchen.
In EP-B 0 473 973 it is now proposed to carry out a direct engraving of the detent cups for the intaglio printing plate by means of laser radiation, it being pointed out here that laser processing of intaglio printing plates with an outer layer of copper was associated with the following difficulties:
  1. 1. Very strong reflection of the copper layer;
  2. 2. High melting or evaporation temperature of copper;
  3. 3. high melting or heat of vaporization of copper;
  4. 4. Good thermal conductivity of copper and thus strong heat transfer to the environment of Rastemäpfchen.

Bei der Lasergravur von Kupferschichten ergab sich zudem ein überstehender Auswurfkraterrand am Näpfchen. Dieser Rand musste dann in mühevoller Weise entfernt werden.The laser engraving of copper layers also resulted in a projecting ejection crater edge on the well. This edge then had to be removed in a laborious way.

Aus diesem Grund schlägt die EP-B 0 473 973 vor, die Näpfchen nicht mehr in Kupfer, sondem in Zink zu erzeugen.For this reason, EP-B 0 473 973 proposes to produce the wells no longer in copper, but in zinc.

Das in der EP-B 0 473 973 beschriebene Verfahren ist zwar einsetzbar, nachteilig bei den hiermit hergestellten Tiefdruckformen ist jedoch, dass die gesamte Tiefdrucktechnik nun einmal auf Kupfer als Material ausgerichtet ist, in dem sich die Rasternäpfchen befinden.Although the process described in EP-B 0 473 973 can be used, it is disadvantageous in the intaglio printing forms produced therewith that the entire gravure printing technique now once aligned with copper as a material in which the sieve cups are located.

Aufgabe der ErfindungObject of the invention

Aufgabe der Erfindung ist es, ein Verfahren vorzustellen sowie einen Grundkörper zu schaffen, bei dem bzw. auf dem Rastemäpfchen einer Tiefdruckform direkt mittels Laserstrahlung bevorzugt in Kupfer, aber auch in anderen Materialien ohne Auswurfskraterrand, d.h. gratfreie Rastemäpfchen herstellbar sind.The object of the invention is to provide a method and to provide a base body in which or on the Rastemäpfchen a gravure mold directly by means of laser radiation preferably in copper, but also in other materials without ejection crater edge, i. burr-free Rastemäpfchen can be produced.

Lösung der AufgabeSolution of the task

Die Aufgabe wird dadurch gelöst, dass auf dem Grundkörper über dessen, für die Informationseinprägung vorgesehenen Oberschichtbereichen eine, bevorzugt nur eine einzige Abtragungsunterstützungsschicht aufgebracht wird, durch die hindurch Rasternäpfchen mit der Laserstrahlung durch Materialablation (Verdampfen und/oder Auswurf von geschmolzenem Material) in die Mantelbereiche eingebracht werden und anschliessend diese Unterstützungsschicht entfernt wird, worauf gratfreie Rastemäpfchen erhalten werden. Die Laserstrahlung ist eine zeitlich in ihrem intensitätsverlauf modulierte Strahlung. In der Regel wird man eine gepulste Strahlung verwenden, was jedoch nicht zwingend ist. Laserspikes, Q-switch, mode-locking usw. sind ebenfalls möglich. Bei der Entfernung der Unterstützungsschicht erfolgt keine Veränderung der Rastemäpfchen in den Oberschichtbereichen. Die Qualität der derart ohne Grat hergestellten Rastemäpfchen ist so gut, dass ohne Nachbehandlung eine Hartschicht, insbesondere eine Chromschicht, aufgebracht werden kann. Die Chromschicht bei derartigen Tiefdruckformen wird man vorzugsweise mit einer Schichtdicke zwischen 4 µm und 30 µm, insbesondere zwischen 8 µm und 10 µm aufbringen.The object is achieved in that a preferably only a single ablation support layer is applied to the base body via the upper layer regions provided for the information embossing, through which sieve cups are laser ablated by material ablation (vaporization and / or ejection of molten material) into the jacket regions are introduced and then this support layer is removed, whereupon burr-free Rastemäpfchen be obtained. The laser radiation is a temporally modulated in their intensity course radiation. Usually you will use a pulsed radiation, but this is not mandatory. Laser spikes, Q-switch, mode-locking etc. are also possible. Upon removal of the backing layer, there is no change in the snap-in cups in the topsheet regions. The quality of the Rastmäpfchen so produced without burr is so good that without aftertreatment, a hard layer, especially a chromium layer, can be applied. The chromium layer in such intaglio printing plates will preferably be applied with a layer thickness between 4 μm and 30 μm, in particular between 8 μm and 10 μm.

Die gratfreien Rasternäpfchen, vorzugsweise in Kupfer, lassen sich inbesondere dadurch erreichen, dass die Unterstützungsschicht derart ausgewählt wird, dass sie eine gute Energieeinkopplung für die Laserstrahlung mit einer guten Materialabtragungsinitierung (Ablation) zum darunterliegenden Material bei einer minimierten gerichteten Strahlungsrückstreuung ermöglicht. Eine minimierte Strahlungsrückstreuung ist wichtig, damit keine Strahlung zurück in den Laserresonator gelangt. Diese würde nämlich dort verstärkt und könnte Beschädigungen an den optischen Komponenten bewirken. Eine gute Energieeinkopplung der Laserstrahlung ist wichtig, da dann nur noch ein geringer Strahlungsanteil verbleibt, der überhaupt für eine Rückreflexion noch in Frage kommen könnte. Andererseits bewirkt eine gute Energieeinkopplung eine starke Aufheizung des Materials der Unterstützungsschicht. Ist die Unterstützungsschicht einmal in den flüssigen Zustand übergegangen, muss man sich praktisch keine Sorgen mehr betreffend Strahlungsabsorption machen.In particular, the burr-free well cups, preferably in copper, can be achieved by selecting the support layer to allow good energy launch for the laser radiation with good ablation of material to the underlying material with minimized directional radiation backscatter. Minimized radiation backscatter is important to prevent radiation from entering the laser cavity. This would namely amplified there and could cause damage to the optical components. A good energy coupling of the laser radiation is important, because then only a small amount of radiation remains, the even for a return reflection yet could be considered. On the other hand, a good energy input causes a strong heating of the material of the support layer. Once the support layer has become liquid, there is virtually no need to worry about radiation absorption.

Wählt man nun dieses Material der Unterstützungsschicht noch derart aus, dass bei seinem wesentlichen Materialanteil der Schmelzpunkt tief liegt, so tritt die hohe Strahlungsabsorption auch schnell ein. Der Schmelzpunkt sollte jedoch auf jeden Fall tiefer liegen als derjenige des darunterliegenden Oberschichtmaterials, in dem dann die Rastemäpfchen liegen. Sollen die Rastemäpfchen in Kupfer liegen, so sollte der Schmelzpunkt unter 1083 °C liegen. Lediglich vom Schmelzpunkt her, würden sich bei den Metallen Silber mit 961 °C, Aluminium mit 660 °C, Gold mit 1063 °C (was jedoch sofort von den Kosten her herausfällt), Gallium und Germanium mit 937 °C, Indium mit 927 °C, Blei mit 327 °C, Zinn mit 232 °C, Zink mit 419 °C usw. anbieten. Vernünftig verwendbar sind jedoch nur Materialien, deren Dämpfe nicht gesundheitsschädlich sind, da ansonsten grosse Aufwendung für eine Dampfabsaugung vorgenommen werden müssten. Unter einem wesentlichen Materialanteil des Schichtmaterials wird ein Prozentsatz verstanden, der die oben angeführte Eigenschaft hervorruft. Ein wesentlicher Materialanteil dürfte je nach Materialien bei einem Prozentanteil von 80 % bis nahe 100% liegen.If one now selects this material of the support layer still such that at its essential material content of the melting point is low, the high radiation absorption occurs quickly. However, the melting point should definitely be lower than that of the underlying upper layer material, in which then the Rastemäpfchen lie. If the Rastemäpfchen are in copper, the melting point should be below 1083 ° C. Only at the melting point would the metals be 961 ° C silver, 660 ° C aluminum, 1063 ° C gold (which, however, would immediately be cost-off), gallium and germanium 937 ° C, indium 927 ° C, lead at 327 ° C, tin at 232 ° C, zinc at 419 ° C, etc. Reasonably usable, however, are only materials whose vapors are not harmful to health, otherwise would have to be made large expenditure for a vapor extraction. By a substantial proportion of material of the layer material is meant a percentage which causes the above-mentioned property. Depending on the material, a substantial proportion of material is likely to be between 80% and almost 100%.

Das Material der Unterstützungsschicht soll einen Materialabtrag in dem die Druckinformation tragenden darunterliegenden Material bewirken. D.h. es soll durch die mit der Laserstrahlung eingebrachte örtliche Wärmeenergie möglichst rasch ein reproduziertes Schmelzen des darunterliegenden Materials erfolgen. Wie Versuche gezeigt haben, ist dieses reproduzierbare Schmelzen nur gegeben, wenn die Schichtdicke der Abtragungsunterstützungsschicht überall gleich dick ist. Ist dies der Fall, kann nämlich über die eingestrahlte maximale Pulsintensität und die Pulsform exakt das zu erzeugende Näpfchenvolumen vorgegeben werden. Das Näpfchenvolumen lässt sich am einfachsten experimentell ermitteln. Gute Ergebnisse haben sich bei Kupfer als informationstragender Schicht und Zink als Abtragungsunterstützungsschicht bei deren Schichtdicke zwischen 1 µm bis 15 µm, bevorzugt zwischen 5 µm und 10 µm mit einer Schichtdicketoleranz von kleiner als 10-3, bevorzugt von besser als 5 · 10-5 ergeben. Eine Zinkschicht mit einer derartigen Genauigkeit wird am besten galvanisch aufgebracht.The material of the backing layer is intended to cause a material removal in the underlying material carrying the printing information. That is, it should be done by the introduced with the laser radiation local heat energy as quickly as possible reproduced melting of the underlying material. As tests have shown, this reproducible melting is only given if the layer thickness of the Abtragungsunterstützungsschicht is everywhere the same thickness. If this is the case, precisely the cell volume to be generated can be specified via the irradiated maximum pulse intensity and the pulse shape. The cell volume can be determined most simply experimentally. Good results have been found in copper as an information-bearing layer and zinc as Abtragungsunterstützungsschicht at their layer thickness between 1 .mu.m to 15 .mu.m, preferably between 5 .mu.m and 10 .mu.m with a Schichtdicketoleranz of less than 10 -3 , preferably of better than 5 × 10 -5 , A zinc layer with such accuracy is best applied by electroplating.

Durch Versuche konnte ferner festgestellt werden, dass das Material der Abtragungsunterstützungsschicht einen möglichst hohen Dampfdruck aufweisen sollte. Vom Laserpuls aus der informationstragenden Schicht ausgeworfenes "Untergrundmaterial", welches noch flüssig auf die Unterstützungsschicht fällt, bringt diese zum Schmelzen und Verdampfen und wird dann durch den Dampf unter einem weiteren Wärmeverlust weggeschleudert. Der Dampfdruck des "Untergrundmaterials" sollte mindestens fünfmal kleiner sein als derjenige des darauf liegenden Materials. Wird beim oben angeführten Beispiel verblieben, so hat Zink einen etwa 100 mal höheren Dampfdruck als Kupfer.It was also found by experiments that the material of the ablation support layer should have the highest possible vapor pressure. The "background material" ejected from the information-carrying layer by the laser pulse, which liquid still falls on the support layer, causes it to melt and evaporate and is then thrown away by the steam with a further loss of heat. The vapor pressure of the "base material" should be at least five times smaller than that of the material lying thereon. If left in the above example, zinc has a vapor pressure about 100 times higher than copper.

Das Material der Abtragungsunterstützungsschicht sollte gut, insbesondere chemisch, ohne Angreifen der informationstragenden Mantelbereiche entfernbar sein.The material of the ablation support layer should be well removable, especially chemically, without attacking the information-bearing cladding regions.

Die Wellenlänge der verwendeten Laserstrahlung ist der Absorption des Materials der Abtragungsunterstützungsschicht anzupassen. Auch ist die Wellenlänge gemäss den optischen Abbildungsgesetzen den Dimensionen der zu erzeugenden Rasternäpfchen anzupassen. Für Rastemäpfchen mit einem Durchmesser grösser als 10 µm kann ein CO2-Laser (Wellenlänge 10,6 µm) verwendet werden. Für kleine Durchmesser wird man bevorzugt einen Nd:YAG-Laser (1,06 µm) verwenden. Eine Pulsformung sowie einen optischen Aufbau für die Strahlführung des Lasers wird man vorzugsweise derart vornehmen, wie in der EP 00 810 552.0 beschrieben. Wird ein Nd:YAG-Laser verwendet, hat sich auch in diesem Fall Zink als Material der Abtragungsunterstützungsschicht bewährt.The wavelength of the laser radiation used is to be adapted to the absorption of the material of the ablation support layer. Also, the wavelength has to be adapted to the dimensions of the sieve cups to be produced in accordance with the optical imaging laws. For Rastemäpfchen with a diameter greater than 10 microns, a CO 2 laser (wavelength 10.6 microns) can be used. For small diameters, it is preferable to use a Nd: YAG laser (1.06 μm). A pulse shaping as well as an optical setup for the beam guidance of the laser will preferably be carried out as described in EP 00 810 552.0. If an Nd: YAG laser is used, zinc has also proved to be a material of the ablation support layer in this case as well.

Die Abtragungsunterstützungsschicht initiert nicht nur einen Materialabtrag in dem darunter liegenden Material, sie bewirkt zudem eine Einschaltverzögerung für den Bohrvorgang in die darunterliegende Schicht. Der Laserpuls ist somit bereits auf einen gegenüber seinem Pulsanfangswert höheren Intensitätswert angestiegen, was eine Bohrintensitätserhöhung ergibt. Hierdurch ergibt sich eine gute, d.h. eine halbkugelförmige Rasternäpfchenform.The ablation support layer not only initiates a material removal in the underlying material, it also causes a turn-on delay for the drilling operation in the underlying layer. The laser pulse has thus already risen to a higher intensity value compared to its initial pulse value, which results in a drilling intensity increase. This results in a good, i. a hemispherical sieve cup shape.

Weitere Vorteile der Erfindung sowie der Ausführungsvarianten ergeben sich auch noch aus dem untenstehenden Text.Further advantages of the invention and the variants are also apparent from the text below.

Nachfolgend wird ein Ausführungsbeispiel angeführt, welches jedoch gemäss obigen Ausführungen in einem weiten Bereich auch materialmässig variierbar ist.Hereinafter, an embodiment is given, which, however, according to the above embodiments in a wide range and material is variable.

Aus der nachfolgenden Detailbeschreibung und der Gesamtheit der Patentansprüche ergeben sich weitere vorteilhafte Ausführungsformen und Merkmalskombinationen der Erfindung.From the following detailed description and the totality of the claims, there are further advantageous embodiments and feature combinations the invention.

Kurze Beschreibung der ZeichnungenBrief description of the drawings

Die zur Erläuterung der Ausführungsbeispiele verwendeten Zeichnungen zeigen:

Fig. 1
einen Querschnitt durch den efindungsgemässen Grundkörper in vergrösserter Darstellung mit einem Rastemäpfchen erzeugenden, gepulsten Laserstrahl,
Fig. 2
einen zu Figur 1 analogen Querschnitt, wobei hier die Abtragungsunterstützungsschicht entfernt ist und
Fig. 3
einen zu den Figuren 1 und 2 analogen Querschnitt, wobei hier eine Hartschicht aufgebracht ist
The drawings used to explain the embodiments show:
Fig. 1
a cross section through the eferungsgemässen base body in an enlarged view with a Rastemäpfchen generating, pulsed laser beam,
Fig. 2
a similar to Figure 1 cross-section, in which case the Abtragungsunterstützungsschicht is removed and
Fig. 3
a cross section analogous to Figures 1 and 2, wherein here a hard layer is applied

Grundsätzlich sind in den Figuren gleiche Teile mit gleichen Bezugszeichen versehen.Basically, the same parts are provided with the same reference numerals in the figures.

Wege zur Ausführung der ErfindungWays to carry out the invention

Metallische Rotations-Tiefdruckformen sind üblicherweise aus mehreren funktionellen Elementen aufgebaut. Als Grundkörper 1 dient meist ein Stahlzylinder. Auf dem Stahlzylinder ist eine Kupferlage 3 mit einer Dicke von einigen Millimetem aufgebracht Die Kupferlage 3 ist die informationstragende Tiefdruckform. Die Information besteht aus einer Anordnung einer Vielzahl von Rastemäpfchen 5, welche die für den Druck benötigte Farbe aufnehmen. Zur Erhöhung der Wiederstandsfähigkeit ist als oberste Schicht eine Chrombeschichtung 7 mit einer typischen Dicke von etwa 10 µm aufgebrachtMetallic rotary gravure printing plates are usually constructed of several functional elements. As the main body 1 is usually a steel cylinder. On the steel cylinder, a copper layer 3 is applied with a thickness of several Millimetem The copper layer 3 is the information-carrying intaglio printing plate. The information consists of an arrangement of a plurality of Rastemäpfchen 5, which absorb the color required for the print. To increase the resistance, a chromium coating 7 having a typical thickness of about 10 μm is applied as the uppermost layer

Die Druckinformation wird nun direkt in die Kupferlage 3 in deren Oberschichtbereich 8 mit einem Strahl 9 eines gepulsten Nd:YAG-Lasers durch Materialabtragung eingebracht Um diese direkte Materialabtragung mit gratfreien Rastemäpfchen 5 zu erreichen, wird die Kupferoberfläche 11 galvanisch mit einer Zinkschicht 13 als Abtragungsunterstützungsschicht mit einer geringen Dickentoleranz (kleiner als 5 · 10-5) versehen. Die Gratfreiheit ist eine Voraussetzung für eine einwandfreie Qualität im Druckprozess.The printing information is now introduced directly into the copper layer 3 in the upper layer region 8 with a beam 9 of a pulsed Nd: YAG laser by material removal. In order to achieve this direct material removal with burr-free Rastemäpfchen 5 , the copper surface 11 is galvanic with a zinc layer 13 as ablation support layer a small thickness tolerance (less than 5 · 10 -5 ) provided. Burr freedom is a prerequisite for perfect quality in the printing process.

Der Laserpuls 9 zur Erzeugung jeweils eines Rastemäpfchens 5 durchstösst unter einem Aufschmelzen die Zink-Schicht 13. Festes Zink hat eine Absorption für die Strahlung 9 des Nd:YAG-Lasers von etwa 50 %. Ferner zeigt festes Zink so gut wie keine gerichtete Rückstrahlung. Geht das Zink aufgrund seines relativ tiefen Schmelzpunkts und seiner im Verhältnis zu Kupfer geringen Wärmeleitfähigkeit in den flüssigen Zustand über, erfolgt eine nahezu 100-prozentige Strahlungsabsorption. Es erfolgt eine starke örtliche Erwärmung des Zinks, welches weiterhin im absorbierenden Zustand diese an das darunterliegende Kupfer weitergibt, worauf dieses ebenfalls in den flüssigen Zustand übergeht. Kupfer ist nun von einer nahezu 100-prozentigen Reflexion für die Strahlung 9 des Nd:YAG-Lasers (wobei die Reflexion jedoch nicht zur Wirkung kommt, da das Kupfer noch von Zink bedeckt ist) im festen Zustand, jetzt flüssig in eine annähernd 100-prozentige Absorption übergegangen.The laser pulse 9 for generating in each case a detent cup 5 pierces the zinc layer 13 while melting . Solid zinc has an absorption for the radiation 9 of the Nd: YAG laser of approximately 50%. Furthermore, solid zinc shows virtually no directional reflection. Does the zinc go because of its relatively low melting point and its low thermal conductivity in relation to copper in the liquid state, there is a nearly 100 percent radiation absorption. There is a strong local heating of the zinc, which further passes in the absorbent state to the underlying copper, whereupon this also goes into the liquid state. Copper is now of almost 100 percent reflection for the radiation 9 of the Nd: YAG laser (the reflection but does not come to effect, since the copper is still covered by zinc) in the solid state, now liquid in an approximately 100- percent absorption.

Der Kupfermaterialauswurf bzw. derjenige des Zinks 15 liegen auf der Zinkschicht 13 und können leicht entfernt werden, indem diese in einem folgenden Reinigungsprozess chemisch abgelöst wird. Die freigelegte Gravur (Rastemäpfchen 5) im Kupfer 3 ist gratfrei und kann problemlos verchromt werden.The copper material ejection or that of the zinc 15 lie on the zinc layer 13 and can easily be removed by chemically detaching them in a subsequent cleaning process. The exposed engraving (Rastemäpfchen 5) in copper 3 is burr-free and can be easily chromed.

Mit der dünn aufgetragenen Zinkschicht 13 ist nun eine wirtschaftliche, direkte, gratfreie Lasergravur in Kupfer 3 möglich geworden. Zink verhindert insbesondere ein Anhaften der Aufschmelzungen, reduziert die Anfangsreflexion für die Laserstrahlung 9 und erlaubt deshalb einen effizienten Bohrprozess in Kupfer 3. With the thinly applied zinc layer 13 is now an economic, direct, burr-free laser engraving in copper 3 has become possible. In particular, zinc prevents the melting from adhering, reduces the initial reflection for the laser radiation 9 and therefore allows an efficient drilling process in copper 3.

Das gerade beschriebene Verfahren ist selbstverständlich nicht auf Zink 13 als Kupferbeschichtung beschränkt. Wie eingangs ausgeführt, sind eine Reihe anderer Materialien möglich. Die auf Kupfer 3 aufzubringende Abtragungsunterstützungsschicht muss auch nicht unbedingt eine Metallschicht sein. Auch Nicht-Metalle eignen sich, sofern sie die geforderten Eigenschaften betreffend Absorption, gerichteter Reflexion und Schmelzpunkt aufweisen.Of course, the method just described is not limited to zinc 13 as a copper coating. As stated above, a number of other materials are possible. Also, the ablation support layer to be applied to copper 3 does not necessarily have to be a metal layer. Non-metals are also suitable, provided they have the required properties regarding absorption, directional reflection and melting point.

Anstelle nur einer einzigen Abtragungsunterstützungsschicht 13 können auch mehrere Schichten übereinander angebracht werden. Es hat sich jedoch die einzige Zinkschicht 13 aus Kostengründen und aufgrund des einfachen Handlings bewährt.Instead of just a single ablation support layer 13 , multiple layers may be superimposed. However, it has proven the only zinc layer 13 for cost reasons and because of the ease of handling.

Der Grundkörper 1 einer Tiefdruckform muss nicht unbedingt zylindrisch ausgebildet sein; er kann auch halbzylindrisch, flach oder anders geformt sein.The main body 1 of a gravure form does not necessarily have to be cylindrical; it can also be semi-cylindrical, flat or otherwise shaped.

Claims (10)

  1. A method for the production of a rotogravure form carrying screen cavities (5) as print information, the form preferably comprising a rotation-symmetrical base body (1), by means of time-modulated, particularly pulsed laser radiation (9), characterised in that an erosion support layer (13) is deposited on the base body (1) over its upper-layer regions (8) provided for information engraving, through which the screen cavities (5) are produced in the upper-layer regions (8) with the laser radiation (9) by means of material ablation, and this erosion support layer (13) is subsequently removed, after which burr-free screen cavities (5) are obtained.
  2. The method according to claim 1, characterised in that only a single erosion support layer (13) is deposited, and after its removal a hard layer (7), in particular a chromium layer (7), preferably with a layer thickness between 4 µm and 30 µm, in particular between 8 µm and 10 µm, is deposited and the layer regions (8) provided for the information engraving are preferably made of copper.
  3. The method according to claim 1 or 2, characterised in that the support layer (13) is selected in such a way that it enables good energy coupling for the laser radiation (9) with good material erosion initiation for the material (3, 8) lying thereunder at the same time as minimised directed radiation backscattering.
  4. The method according to any one of claims 1 to 3, characterised in that the support layer (13) is deposited with a thickness that is constant up to a tolerance, in order that the screen cavity depth can be produced with a preselectable, reproducible form factor by an adjustable energy, or more precisely a time-modulated intensity course of the laser radiation (9), and that the support layer (13) is deposited with a thickness between 1 µm and 15 µm, in particular between 5 µm and 10 µm, especially galvanically, with particular regard to a layer thickness tolerance of less than 10-3, preferably less than 5.10-5.
  5. The method according to any one of claims 1 to 4, characterised in that a material with a high vapour pressure, preferably with at least one that is higher by a factor five than copper, is selected for the support layer (13), and in particular the support layer (13) can be readily removed, in particular chemically, without attack of the information-carrying layer regions (8).
  6. The method according to any one of claims 1 to 5, characterised in that a substantial material proportion of the support layer (13) is selected in such a way that it has a low melting point, preferably below that of copper, in particular below 500°C, and in particular is a metal, in particular zinc.
  7. The method according to any one of claims 1 to 6, characterised in that a laser radiation (9) with a preferred wavelength between 0.8 µm and 11 µm, preferably the radiation of a CO2 laser, especially in the case of screen cavities in the micrometer range the radiation of an Nd:YAG laser, is used.
  8. A base body (1) of a rotogravure form, in the upper-layer region or regions (8) whereof screen cavities (5) are produced as print information by means of time-modulated, particularly pulsed laser radiation (9), with a method according to claims 1 to 7, characterised in that each upper-layer region (8) is covered with a single, removable layer acting as an erosion support layer (13), through which the screen cavities (5) can be produced with the laser radiation (9), a substantial material proportion of the support layer (13) is metal, and the support layer (13), compared with the surface region or regions, enables better energy coupling for the laser radiation (9) with good material erosion initiation for the material (3) lying thereunder at the same time as a minimised directed radiation backscattering.
  9. The base body (1) according to claim 8, characterised in that the layer regions (8) provided for the information engraving are made of copper and the support layer (13) has a thickness between 1 µm and 15 µm, in particular between 5 µm and 10 µm, with a layer thickness tolerance of less than 10-3, in particular less than 5.10-5, whereby the support layer (13) is a material with a high vapour pressure, preferably with at least one that is higher by a factor five than copper, and in particular the support layer (13) can be readily removed, in particular chemically, without attack of the information-carrying layer regions (8).
  10. The base body (1) according to claim 8 or 9, characterised in that a substantial material proportion of the support layer (13) has a low melting point, preferably below that of copper, in particular below 500°C, and in particular is zinc.
EP01980111A 2000-11-15 2001-11-15 Method for the production of screen cavities in a rotogravure form and base body applicable in said method Expired - Lifetime EP1333976B1 (en)

Applications Claiming Priority (3)

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CH221900 2000-11-15
CH22192000 2000-11-15
PCT/CH2001/000668 WO2002040272A1 (en) 2000-11-15 2001-11-15 Method for the production of screen cavities in a rotogravure form and base body applicable in said method

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EP1333976B1 true EP1333976B1 (en) 2006-08-23

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WO2002040272A1 (en) 2002-05-23
JP2004512997A (en) 2004-04-30
DE50110828D1 (en) 2006-10-05
US20040029048A1 (en) 2004-02-12

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