EP1214197B1 - Plaques d'impression lithographique thermique sans eau - Google Patents

Plaques d'impression lithographique thermique sans eau Download PDF

Info

Publication number
EP1214197B1
EP1214197B1 EP00945482A EP00945482A EP1214197B1 EP 1214197 B1 EP1214197 B1 EP 1214197B1 EP 00945482 A EP00945482 A EP 00945482A EP 00945482 A EP00945482 A EP 00945482A EP 1214197 B1 EP1214197 B1 EP 1214197B1
Authority
EP
European Patent Office
Prior art keywords
near infrared
alkyl
infrared absorbing
cross
linked silicone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP00945482A
Other languages
German (de)
English (en)
Other versions
EP1214197A1 (fr
Inventor
My T. Nguyen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
American Dye Source Inc
Original Assignee
American Dye Source Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Dye Source Inc filed Critical American Dye Source Inc
Publication of EP1214197A1 publication Critical patent/EP1214197A1/fr
Application granted granted Critical
Publication of EP1214197B1 publication Critical patent/EP1214197B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/003—Printing plates or foils; Materials therefor with ink abhesive means or abhesive forming means, such as abhesive siloxane or fluoro compounds, e.g. for dry lithographic printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/10—Forme preparation for lithographic printing; Master sheets for transferring a lithographic image to the forme
    • B41C1/1008—Forme preparation for lithographic printing; Master sheets for transferring a lithographic image to the forme by removal or destruction of lithographic material on the lithographic support, e.g. by laser or spark ablation; by the use of materials rendered soluble or insoluble by heat exposure, e.g. by heat produced from a light to heat transforming system; by on-the-press exposure or on-the-press development, e.g. by the fountain of photolithographic materials
    • B41C1/1033—Forme preparation for lithographic printing; Master sheets for transferring a lithographic image to the forme by removal or destruction of lithographic material on the lithographic support, e.g. by laser or spark ablation; by the use of materials rendered soluble or insoluble by heat exposure, e.g. by heat produced from a light to heat transforming system; by on-the-press exposure or on-the-press development, e.g. by the fountain of photolithographic materials by laser or spark ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C2210/00—Preparation or type or constituents of the imaging layers, in relation to lithographic printing forme preparation
    • B41C2210/16—Waterless working, i.e. ink repelling exposed (imaged) or non-exposed (non-imaged) areas, not requiring fountain solution or water, e.g. dry lithography or driography

Definitions

  • the invention relates to thermal waterless lithographic printing plates comprising layers of inherent near infrared absorbing polymers for computer-to-plate and digital-offset-press technologies. More specially, this invention relates to thermal waterless lithographic printing plates, which can be imaged with near infrared laser light and which do not require post chemical processing step.
  • Thermal waterless lithographic printing plates are known.
  • U.S. patents 5,310,869 and 5,339,737 describe thermal waterless lithographic printing plates comprising an ink-repelling layer overlying a near infrared absorbing imaging layer.
  • the ink-repelling layer is transparent to radiation and comprises mainly cross-linked silicone polymers.
  • the near infrared absorbing imaging layer contains binder resins and near infrared absorbing materials, such as carbon black and molecular dyes.
  • These thermal waterless lithographic printing plates require high doses of laser energy to ablate the near infrared absorbing layer and weaken the adhesion of the ink repelling cross-linked silicone polymer layer.
  • the exposed area of the plate must be removed during a further chemical processing step to become an image area.
  • U.S. Patent 5,379,698 also describes thermal waterless lithographic printing plates, which comprise ink repelling cross-linked silicone polymers overlying a thin metallic or metal oxide film of titanium deposited on a substrate as a laser imaging layer.
  • U.S. Patent 5,487,338 teaches to use an infrared reflective layer situated below the near infrared absorbing layer. Manufacturing of such printing plates requires vacuum deposition of the corresponding metals. Hence it is very expensive.
  • WO9831550, WO9700175 and WO9401280 also describe thermal waterless lithographic printing plates, which comprise a layer of ink repelling cross-linked silicone polymers overlying a near infrared absorbing imaging layer containing binder resins and near infrared absorbing pigments, dyes or thin metal films.
  • thermal waterless lithographic printing require high laser energy doses for imaging.
  • WO9706956 also describes thermal waterless lithographic printing plates, which comprise a near infrared absorbing layer containing binder resins and near infrared absorption dyes or pigments, and a overlying transparent hydrophobic layer containing fluorinated polymeric materials soluble in fluorinated solvents. Upon exposure to near infrared laser radiation, the exposed area is ablated and accepts ink, while the non-exposed area still repels ink.
  • One drawback of such plates is that the non-exposed area is sensitive to handling and easily becomes dirty on press.
  • EP0764522 also provides a thermal waterless printing plate containing a near infrared transparent cross-linked silicone polymer ink repelling layer and a near infrared absorbing imaging layer.
  • the ink repelling layer and near infrared absorbing imaging layers contain cross-linked functionality, which form interlayer cross-linked bonds to increase the run length on press.
  • Such printing plate requires high laser energy doses for imaging and requires a chemical processing step.
  • WO9911467 also provides a thermal waterless lithographic printing plate, comprising a layer of ink repelling cross-linked silicone polymer overlying a near infrared absorbing imaging layer containing polyurethane resins and near infrared absorption dyes. Although, such printing plate exhibits faster laser imaging speed, they are very sensitive to the different developers used in the final chemical processing step.
  • the main objects is to provide lithographic printing plate coating compositions which combine the advantages of: long-life printing plates, absence of phase separation of the overlaid coatings, easily manufactured and inexpensive coating formulations, coatings which may be precisely and rapidly imaged with laser accuracy.
  • This invention relates to thermal waterless lithographic printing plates for computer-to-plate and digital-offset-press technologies. More specially, this invention relates to thermal lithographic printing plates comprising:
  • the present invention provides a thermal waterless printing plate suitable for near infrared laser imaging, said printing plate comprising:
  • the thermal waterless lithographic printing plates of this invention can be imaged with near infrared laser lights having a radiation between about 780 and about 1200 nm. Depending on the laser imaging energy doses, the imaged plates may not require post chemical processing step.
  • This invention relates to thermal waterless lithographic printing plates for computer-to-plate and digital-offset-press technologies. More specially, this invention relates to thermal waterless lithographic printing plates, which can be imaged with near infrared laser light having a radiation between about 780 and about 1200 nm.
  • the thermal waterless lithographic printing plates of this invention comprise (I) a support substrate, and (II) a composite top layer consisting of an inherent near infrared absorbing ink-repelling composite comprising inherent near infrared absorbing polymers.
  • the support substrate of this invention may be any sheet material such as metal, plastic and paper.
  • the surface of the substrate may be treated to enhance the adhesion by techniques known in the art.
  • the surface of aluminum sheet may be treated by metal finishing techniques including electrochemical roughening, chemical roughening, mechanical roughening, anodizing and the like.
  • the surface of plastic sheets may be modified by corona treatment and chemical etchings.
  • the near infrared absorbing ink repelling composite layer is the near infrared absorbing ink repelling composite layer.
  • the near infrared absorbing ink repelling composite layer of this invention comprises (a) a near infrared absorbing adhesion promoting layer, which is applied between a support substrate and (b) a near infrared absorbing ink repelling cross-linked silicone polymer layer.
  • the near infrared absorbing ink repelling cross-linked silicone polymers of this invention may be obtained by the in-situ addition reactions of poly(hydroalkylsiloxane) with poly(dialkylsiloxane) and near infrared absorption molecules containing alkenyl functional groups under presence of metal complex catalysts, such as hydrogen hexachloro platinate. They may also be obtained by the condensation reactions of poly(dialkylsiloxane) containing silanol functional groups with organic compounds containing acyloxy or alkoxy silane functional groups under presence of carboxylic acid salt of zinc, tin, iron or titanium catalyst.
  • the near infrared absorption segments contained in the cross-linked silicone polymer backbone Upon exposure to near infrared radiation between 780 and 1200 nm, the near infrared absorption segments contained in the cross-linked silicone polymer backbone convert the photo-energy into heat, which induces the thermal fragmentation and decomposition of the polymeric networks.
  • the thermal fragmentation of the near infrared absorbing ink repelling layer combining with thermal fragmentation of the near infrared absorbing adhesion promoting beneath layer result in the formation of low molecular weight materials.
  • Near infrared absorption polymer ADS-00-1CTP was synthesized by slowly adding 21.2 parts of trimethyl-1,6-diisocyanatohexane (available from Aldrich Chemicals) into a solution containing 100 parts of N-methyl pyrrolidinone, 6.8 parts of 2-[2-[2-choloro-3-[2-(1,3-dihydro-1-(2-hydroxyethyl)-3,3-dimethyl-2H-benz[e]indol-2-ylidene)ethylidene]-1-cyclohexene-1-yl]ethenyl]-1-(2-hydroxyethyl) -3,3-dimethyl-1H-benz[e]indolium perchlorate (available from American Dye Source, Inc.), 18.0 parts of a,a,a',a'-tetramethyl-1,4-benzenedimethanol (available from Aldrich Chemicals) and 0.5 parts of dibutyltin dilaurate (
  • the obtained near infrared absorption polymer has glass transition and decomposition temperatures at around 133 °C and 214 °C, respectively.
  • the film of near infrared absorption polymer ADS-001-CTP on polyester film shows a broad absorption band having a maximum at around 842 nm.
  • the ideal structure of ADS-001-CTP can be represented as following:
  • Near infrared absorption polymer ADS-002-CTP was synthesized by slowly adding 26.0 parts of methylene bis(4-cyclohexylisocyanate) (available from Bayer) into a solution containing 100 parts of N-methyl pyrrolidinone, 6.8 parts of 2-[2-[2-choloro-3-[2-(1,3-dihydro-1-(2-hydroxyethyl)-3,3-dimethyl-2H-benz[e]indol -2-ylidene)ethylidene]-1-cyclohexene-1-yl]ethenyl]-1-(2-hydroxyethyl)-3,3-dimethyl-1H-benz[e]indolium perchlorate (available from American Dye Source, Inc.), 18.0 parts of a,a,a',a'-tetramethyl-1,4-benzenedimethanol (available from Aldrich Chemicals) and 0.5 parts of dibutyltin dilaurate (available from
  • ADS-002-CTP near infrared absorbing polymer has the glass transition and decomposition temperatures at around 132 °C and 214 °C, respectively.
  • the film of near infrared absorption polymer ADS-002-CTP on polyester film shows a broad absorption band having a maximum at around 839 nm.
  • the ideal structure of ADS-002-CTP can be represented as following:
  • Near infrared absorption polymer ADS-003-CTP was synthesized by slowly adding 21.2 parts of trimethyl-1,6-diisocyanatohexane (available from Aldrich Chemicals) into a solution containing 100 parts of N-methyl pyrrolidinone, 6.4 parts of 2-[2-[2-allyloxy-3-[2-(1,3-dihydro-1-(2-hydroxyethyl)-3,3-dimethyl-2H-benz[e]indol-2-ylidene)ethylidene]-1-cyclohexene-1-yl]ethenyl]-1-(2-hydroxyethyl) -3,3-dimethyl-1H-benz[e]indolium perchlorate (available from American Dye Source, Inc.), 18.0 parts of a,a,a',a'-tetramethyl-1,4-benzenedimethanol (available from Aldrich Chemicals) and 0.5 parts of dibutyltin dilaurate
  • ADS-003-CTP on polyester film shows a broad absorption band having a maximum at around 832 nm.
  • the ideal structure of ADS-003-CTP can be represented as following:
  • Near infrared absorption polymer ADS-004-CTP was synthesized by slowly adding 26.0 parts of methylene bis(4-cyclohexylisocyanate) (available from Bayer) into a solution containing 100 parts of N-methyl pyrrolidinone, 6.8 parts of 2-[2-[2-choloro-3-[2-(1,3-dihydro-1-(2-hydroxyethyl)-3,3-dimethyl-2H-benz[e]indol -2-ylidene)ethylidene]-1-cyclohexene-1-yl]ethenyl]-1-(2-hydroxyethyl)-3,3-dimethyl-1H-benz[e]indolium perchlorate (available from American Dye Source, Inc.), 11.6 parts of a,a,a',a'-tetramethyl-1,4-benzenedimethanol (available from Aldrich Chemicals), 2.6 parts of 3-allyl-1,2-propanediol (
  • ADS-004-CTP near infrared absorbing polymer has the glass transition and decomposition temperatures at around 113 and 210 °C, respectively.
  • the film of near infrared absorption polymer ADS-004-CTP on polyester film shows a broad absorption band having a maximum at around 841 nm.
  • the ideal structure of ADS-004-CTP can be represented as following:
  • Near infrared absorption polymer ADS-CTP-005 was synthesized by slowly adding 21.2 parts of trimethyl-1,6-diisocyanatohexane (available from Aldrich Chemicals) into a solution containing 100 parts of N-methyl pyrrolidinone, 6.8 parts of 2-[2-[2-choloro-3-[2-(1,3-dihydro-1-(2-hydroxyethyl)-3,3-dimethyl-2H-benz[e]indol-2-ylidene)ethylidene]-1-cyclohexene-1-yl]ethenyl]-1-(2-hydroxyethyl) -3,3-dimethyl-1H-benz[e]indolium perchlorate (available from American Dye Source, Inc.), 11.6 parts of a,a,a',a'-tetramethyl-1,4-benzenedimethanol (available from Aldrich Chemicals), 3.4 parts of 2,6-bis(hydroxymethyl)-p-cre
  • ADS-005-CTP near infrared absorbing polymer has the glass transition and decomposition temperatures at around 117 and 215 °C, respectively.
  • the film of near infrared absorption polymer ADS-005-CTP on polyester film shows a broad absorption band having a maximum at around 841 nm.
  • the ideal structure of ADS-005-CTP can be represented as following:
  • the near infrared absorbing ink repelling cross-linked silicone polymer was prepared by adding 300 parts of water containing 1.0 part of 2-[2-[2-allyloxy-3-[2-(1,3-dihydro-1-(4-sulfobutyl)-3,3-dimethyl-2H-benz[e]indol-2-ylidene) ethylidene]-1-cyclohexene-1-yl]ethenyl]-1-(4-sulfobutyl)-3,3-dimethyl-1H-benz[e]indolium inner salt (available from American Dye Source, Inc.) into a solution containing 50 parts of reactive silicone polymeric emulsion (Syl-Off 7910, available from Dow Corning, 40 % solid weight), 50 parts of silicone polymeric cross-linker emulsion containing platinum catalyst (Syl-Off 7922, available from Dow Corning, 40 % solid weight) and 1.5 parts of silicone wetting agent (Q2-5211,
  • the freshly prepared polymeric solution was coated on an anodized aluminum substrate using a wire wound rod.
  • the coating was dried under hot air stream and then further cured at 120°C for 5 minutes to produce a uniform coating film having a coating weight around 1.0 g/m 2 .
  • the UV-Vis-NIR spectrum of the resulted polymer on polyester film shows a broad absorption band having a maximum at 840 nm.
  • the ideal structure of the near infrared absorbing ink repelling cross-linked silicone polymer can be represented as following:
  • the near infrared absorbing ink repelling cross-linked silicone polymer was prepared by adding 300 parts of water containing 1.0 part of 2-[2-[2-chloro-3-[2-(1,3-dihydro-1-allyl-3,3-dimethyl-7-sulfonyl-2H-benz[e]indol-2-ylidene) ethylidene]-1-cyclohexene-1-yl]ethenyl]-1-allyl-3,3-dimethyl-7-sulfonyl-1H-benz[e]indolium 4-methylbenzenesulfonic acid (available from American Dye Source, Inc.) into a solution containing 50 parts of reactive silicone emulsion (Syl-Off 7910, available from Dow Corning, 40 % solid weight), 50 parts of reactive silicone emulsion with platinum catalyst (Syl-Off 7922, available from Dow Corning, 40 % solid weight) and 1.5 parts of wetting agent (Q2-5211, available from Dow
  • the freshly prepared polymeric solution was coated on an anodized aluminum substrate using a wire wound rod.
  • the coating was dried under hot air stream and then further cured at 120 °C for 5 minutes to produce a uniform coating film having a coating weight around 1.0 g/m 2 .
  • the UV-Vis-NIR spectrum of the resulted polymer on polyester film shows a broad absorption band having a maximum at 842 nm.
  • the ideal structure of the near infrared absorbing ink repelling cross-linked silicone polymer can be represented as following:
  • the near infrared absorbing ink repelling cross-linked silicone polymer was prepared by adding 300 parts of water containing 1.0 part of 2-[2-[2-allyloxy-3-[2-(1,3-dihydro-1-allyl-3,3-dimethyl-7-sulfonyl-2H-benz[e]indol-2-ylidene)ethylidene]-1-cyclohexene-1-yl]ethenyl]-1-allyl-3,3-dimethyl-7-sulfonyl-1H-benz[e]indolium 4-methylbenzenesulfonic acid (available from American Dye Source, Inc.) into a solution containing 50 parts of reactive silicone emulsion (Syl-Off 7910, available from Dow Corning, 40 % solid weight), 50 parts of reactive silicone emulsion with platinum catalyst (Syl-Off 7922, available from Dow Corning, 40 % solid weight) and 1.5 parts of wetting agent (Q2-5211, available from Dow Corn
  • the freshly prepared polymeric solution was coated on an anodized aluminum substrate using a wire wound rod.
  • the coating was dried under hot air stream and then further cured at 120 °C for 5 minutes to produce a uniform coating film having a coating weight around 1.0 g/m 2 .
  • the UV-Vis-NIR spectrum of the resulted polymer on polyester film shows a broad absorption band having a maximum at 837 nm.
  • the ideal structure of the near infrared absorbing ink repelling cross-linked silicone polymer can be represented as following:
  • the near infrared absorbing ink repelling cross-linked silicone polymer was prepared by adding a solution containing 10 parts of methyl ethyl ketone dissolving with 0.10 parts of 2-[2-[2-allyloxy-3-[2-(1,3-dihydro-1-heptyl-3,3-dimethyl-2H-benz[e]indol-2-ylidene)ethylidene]-1-cyclohexene-1-yl]ethenyl]-1-heptyl)-3,3-dimethyl-1 H-benz[e]indolium 4-methyl benzenesulfonate (available from American Dye Source, Inc.) into a solution containing 2.0 parts of polydimethylsiloxane divinyl terminated (PS445, availble from United Chemical), 1.0 part of high molecular weight polydimethylsiloxane divinyl terminated (PS225, availble from United Chemical), 1.0 part of polyhydromethylsiloxane (SL60
  • the freshly prepared polymeric solution was coated on an anodized aluminum substrate using a wire wound rod.
  • the coating was dried under hot air stream and then further cured at 120°C for 5 minutes to produce a uniform coating film having a coating weight around 1.0 g/m 2 .
  • the UV-Vis-NIR spectrum of the resulted polymer on polyester film shows a broad absorption band having a maximum at 835 nm.
  • the ideal structure of the near infrared absorbing ink repelling cross-linked silicone polymer can be represented as following:
  • the near infrared absorbing ink repelling cross-linked silicone polymer was prepared similarly to that of Example 4, excepted that 2-[2-[2-dodecyloxy-3-[2-(1,3-dihydro-1-allyl-3,3-dimethyl-2H-benz[e]indol-2-ylidene)ethylidene]-1-cyclohexene-1-yl]ethenyl]-1-allyl-3,3-dimethyl-1H-benz[e]indolium 4-methyl benzenesulfonate (available from American Dye Source, Inc.) was used to replace 2-[2-[2-[2-allyloxy-3-[2-(1,3-dihydro-1-heptyl-3,3-dimethyl-2H-benz[e]indol-2-ylidene)ethylidene]-1-cyclohexene-1-yl]ethenyl]-1-heptyl-3,3-dimethyl-1H-benz[
  • the freshly prepared polymeric solution was coated on an anodized aluminum substrate using a wire wound rod.
  • the coating was dried under hot air stream and then further cured at 120°C for 5 minutes to produce a uniform coating film having a coating weight around 1.0 g/m 2 .
  • the UV-Vis-NIR spectrum of the resulted polymer on polyester film shows a broad absorption band having a maximum at 829 nm.
  • the ideal structure of the near infrared absorbing ink repelling cross-linked silicone polymer can be represented as following:
  • the near infrared absorbing ink repelling cross-linked silicone polymer was prepared similarly to that of Example 4, excepted that 2-[2-[2-dodecyloxy-4- tert -butyl-3-[2-(1,3-dihydro-1-allyl-3,3-dimethyl-2H-benz[e]indol-2-ylidene) ethylidene]-1-cyclohexene-1-yl]ethenyl]-1-allyl-3,3-dimethyl-1H-benz[e]indolium 4-methyl benzenesulfonate (available from American Dye Source, Inc.) was used to replace 2-[2-[2-[2-allyloxy-3-[2-(1,3-dihydro-1-heptyl-3,3-dimethyl-2H-benz[e]indol-2-ylidene)ethylidene]-1-cyclohexene-1-yl]ethenyl]-1-heptyl-3
  • the freshly prepared polymeric solution was coated on an anodized aluminum substrate using a wire wound rod.
  • the coating was dried under hot air stream and then further cured at 120°C for 5 minutes to produce a uniform coating film having a coating weight around 1.0 g/m 2 .
  • the UV-Vis-NIR spectrum of the resulted polymer on polyester film shows a broad absorption band having a maximum at 829 nm.
  • the ideal structure of the near infrared absorbing ink repelling cross-linked silicone polymer can be represented as follows:
  • the near infrared absorbing ink repelling cross-linked silicone polymer was prepared similarly to that of Example 4, excepted that 2-[2-[2-allyloxy-3-[2-(1,3-dihydro-1-(octyl-8-ene)-3,3-dimethyl-2H-benz[e]indol-2-ylidene)ethylidene]-1-cyclohexene-1-yl]ethenyl]-1-(octyl-8-ene)-3,3-dimethyl-1H-benz[e]indolium 4-methylbenzenesulfonate (available from American Dye Source, Inc.) was used to replace 2-[2-[2-allyloxy-3-[2-(1,3-dihydro-1-heptyl-3,3-dimethyl-2H-benz[e]indol-2-ylidene)ethylidene]-1-cyclohexene-1-yl]ethenyl]-1-heptyl)
  • the freshly prepared polymeric solution was coated on an anodized aluminum substrate using a wire wound rod.
  • the coating was dried under hot air stream and then further cured at 120 °C for 5 minutes to produce a uniform coating film having a coating weight around 1.0 g/m 2 .
  • the UV-Vis-NIR spectrum of the resulted polymer on polyester film shows a broad absorption band having a maximum at 829 nm.
  • the ideal structure of the near infrared absorbing ink repelling cross-linked silicone polymer can be represented as following:
  • a waterless printing plate was prepared by dissolving 10.0 parts of ADS-001-CTP from Example 1 in 90.0 parts of solvent system containing 35 % methoxyethanol, 30 % methyl ethyl ketone and 35 % methanol.
  • the near infrared absorption polymeric solution was filtered to remove any solid residues. It was than coated on an anodized aluminum substrate using a wire-wound rod and dried under hot air stream at 80 °C for 5 minutes to produce a uniform coating having a coating weight at around 1.5 g/m 2 .
  • the solution of near infrared absorbing ink repelling cross-linked silicone polymer was prepared similarly to Example 6.
  • the plate was then coated on the near infrared absorbing adhesion ink promoting layer using a wire-wound rod.
  • the coating was dried under hot air stream and cured at 120 °C for 5 minutes to produce a uniform coating having a coating weight at around 1.0 g/m 2 .
  • the plate was imaged with a home-built laser image-setter, which was equipped with an aluminum drum, a single beam 1 watt solid state diode laser emitting at 830 nm (available from Optopower) at energy density between 200 and 800 mJ/cm 2 .
  • the plate was tested on an AB Dick press with Sun Chemical Drilith "H" Cyan Ink (available from Sun Chemical) in the absence of fountain solution. Before printing, the debris at the exposed area was gently cleaned with a cotton cloth wetted with soap water. The exposed area produced high optical printing image while the non-exposed area remained clean.
  • the plate can be printed to more than 10,000 copies without deterioration.
  • a waterless printing plate was prepared similarly to the procedure of Example 13, excepted that the near infrared absorbing ink repelling cross-linked silicone polymer layer prepared similarly to Example 7 (i.e., ADS-002-Si) was used to coated on the near infrared absorbing adhesion promoting layer using a wire-wound rod.
  • the coating was dried under hot air and cured at 120 °C for 5 minutes to produce a uniform coating having a coating weight af around 1.0 g/m 2 .
  • the plate was imaged with a home-built laser image-setter, which was equipped with an aluminum drum, a single beam 1 watt solid state diode laser emitting at 830 nm (available from Optopower) at energy density between 200 and 800 mJ/cm 2 .
  • the plate was tested on an AB Dick press with Sun Chemical Drilith "H" Cyan Ink (available from Sun Chemical) in the absence of fountain solution. Before printing, the debris at the exposed area was gently cleaned with a cotton cloth wetted with soap water. The exposed area produced high optical printing image while the non-exposed area remained clean.
  • the plate can be printed to more than 10,000 copies without deterioration.
  • a waterless printing plate was prepared similarly to the procedure of Example 13, excepted that the near infrared absorbing ink repelling cross-linked silicone polymer layer prepared similarly to Example 8 (i.e., ADS-003-Si) was used to coated on the near infrared absorbing adhesion promoting layer using a wire-wound rod.
  • the coating was dried under hot air and cured at 120 °C for 5 minutes to produce a uniform coating having a coating weight at around 1.0 g/m 2 .
  • the plate was imaged with a home-built laser image-setter, which was equipped with an aluminum drum, a single beam 1 watt solid state diode laser emitting at 830 nm (available from Optopower) at energy density between 200 and 800 mJ/cm 2 .
  • the plate was tested on an AB Dick press with Sun Chemical Drilith "H” Ink (available from Sun Chemical) in the absence of fountain solution. Before printing, the debris at the exposed area was gently cleaned with a cotton cloth wetted with soap water. The exposed area produced high optical printing image while the non-exposed area remained clean.
  • the plate can be printed to more than 10,000 copies without deterioration.
  • a waterless printing plate was prepared similarly to the procedure of Example 13, excepted that the near infrared absorbing ink repelling cross-linked silicone polymer obtained similarly to Example 9 (i.e., ADS-004-Si) was used to coat on the near infrared absorbing adhesion promoting layer using a wire-wound rod.
  • the coating was dried under hot air and cured at 120 °C for 5 minutes to produce a uniform coating having a coating weight at around 1.0 g/m 2 .
  • the plate was imaged with a home-built laser image-setter, which was equipped with an aluminum drum, a single beam 1 watt solid state diode laser emitting at 830 nm (available from Optopower) at energy density between 200 and 800 mJ/cm 2 .
  • the plate was tested on an AB Dick press with Sun Chemical Drilith "H" Cyan Ink (available from Sun Chemical) in the absence of fountain solution. Before printing, the debris at the exposed area was gently cleaned with a cotton cloth wetted with soap water. The exposed area produced high optical printing image while the non-exposed area remained clean.
  • the plate can be printed to more than 10,000 copies without deterioration.
  • a waterless printing plate was prepared similarly to the procedure of Example 13, excepted that the near infrared absorbing ink repelling cross-linked silicone polymer obtained similarly to Example 12 (i.e., ADS-007-Si) was used to coat on the near infrared absorbing adhesion promoting layer using a wire-wound rod.
  • the coating was dried under hot air and cured at 120 °C for 5 minutes to produce a uniform coating having a coating weight at around 1.0 g/m 2 .
  • the plate was imaged with a home-built laser image-setter, which was equipped with an aluminum drum, a single beam 1 watt solid state diode laser emitting at 830 nm (available from Optopower) at energy density between 200 and 800 mJ/cm 2 .
  • the plate was tested on an AB Dick press with Sun Chemical Drilith "H" Cyan Ink (available from Sun Chemical) in the absence of fountain solution. Before printing, the debris at the exposed area was gently cleaned with a cotton cloth wetted with soap water. The exposed area produced high optical printing image while the non-exposed area remained clean.
  • the plate can be printed to more than 10,000 copies without deterioration.
  • a waterless printing plate was prepared similarly to Example 15, excepted that the near infrared absorbing polymer obtained from Example 3 (i.e., ADS-003-CTP) was used to prepare the near infrared adhesion promoting layer.
  • the plate was imaged with a home-built laser image-setter, which was equipped with an aluminum drum, a single beam 1 watt solid state diode laser emitting at 830 nm (available from Optopower) at energy density between 200 and 800 mJ/cm 2 .
  • the plate was tested on an AB Dick duplicator press with Sun Chemical Drilith "H" Cyan Ink (available from Sun Chemical) in the absence of fountain solution. Before printing, the debris at the exposed area was gently cleaned with a cotton cloth wetted with soap water. The exposed area produced high optical printing image while the non-exposed area remained clean.
  • the plate can be printed to more than 10,000 copies without deterioration.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Heat Sensitive Colour Forming Recording (AREA)
  • Paints Or Removers (AREA)

Claims (6)

  1. Ensemble de composition de revêtement de plaque d'impression pour impression à sec thermique, ledit ensemble de composition de revêtement comprenant au moins deux compositions de composant distinctes, destinées à être appliquées par recouvrement, la première composition de composant étant destinée à être appliquée à un substrat de feuille approprié pour former une première couche et la seconde composition de composant étant destinée à être appliquée sur ladite première couche de composition de composant une fois que ladite première couche est sèche, ladite première composition de composant consistant en une composition activant l'adhérence par absorption des infrarouges proches, et ladite seconde composition de composant consistant d'un polymère silicone réticulé répulsive d'encre adsorbant les infrarouges proches ;
       dans lequel ladite première composition de composant contenant des polymères absorbant les infrarouges proches présente une forte absorption à des longueurs d'onde d'environ 780 à environ 1200 nm, lesdits polymères étant capables de former des liaisons covalentes, avec le polymère de silicone réticulé de la seconde composition de composant, lesdits polymères de ladite première composition de composant ayant une structure selon la formule I :
    Figure 00530001
       Dans laquelle
    a et b représentent des rapports molaires dans lesquels b peut varier de 0,1 à 0,2 et a peut varier de 0,9 à 0,8 ;
    T représente un segment répétitif transparent dans l'infrarouge proche qui peut avoir une structure selon la formule II, IIII, IV et V,
    Figure 00530002
    Figure 00540001
    Figure 00540002
    Figure 00540003
       A représente un segment répétitif absorbant dans l'infrarouge proche, qui peut avoir une structure selon la formule VI
    Figure 00540004
       Dans laquelle
    Z1 et Z2 représentent des atomes suffisants pour former des cycles aromatiques condensés, substitués ou non substitués, comme le phényle et le naphtyle,
    D1 et D2 représentent un -O-, -S-, -Se-, -CH=CH-, et -C(CH3)2-,
    R1 et R2 représentent une substitution alkyle, alkyloxy, halogénure d'alkyle, alkyle pyridine, allyloxy, vinyloxy, alkylthio, arylthio, anninothiophénol, sulfoalkyle, et carboxyalkyle,
    R3 représente l'hydrogène une substitution, alkyle et aryle,
    X1 représente un contre-ion anionique choisi parmi le bromure, le chlorure, l'iodure, le tosylate, le triflate, le carbonate de trifluorométhane, le benzosulfonate et le tétrafluoroborate.
    n représente 0 et 1 ;
    m varie de 1 à 8.
  2. Ensemble de composition de revêtement selon la revendication 1, dans lequel ladite première composition de composant comprend en outre les résines de liant qui sont transparentes aux radiations infrarouges proches.
  3. Ensemble de composition de revêtement selon la revendication 2, dans lequel les résines de liant sont choisies dans le groupe de polymères contenant des motifs monomères dérivés de la nitrocellulose, de l'hydroxyalkylcellulose, du styrène, du carbonate, d'amide, d'uréthane, d'acrylate, d'alcool vinylique, et d'ester, et des mélanges de ceux-ci.
  4. Ensemble de composition de revêtement selon la revendication 3, dans lequel ladite seconde composition de composant comprend des polymères de silicone réticulés ayant des motifs de répétitifs absorbants dans l'infrarouge proche, choisis dans les réseaux polymères de silicone réticulés selon les formules VIII, IX et X :
    Figure 00550001
    Figure 00550002
    Figure 00560001
       Dans lesquelles
    -(R4)2-Si-O- représente des réseaux polymères de silicone réticulés ;
    R4 représente une substitution méthyle, éthyle et aryle des réseaux polymères de silicone réticulé,
    B représente des motifs de répétitifs absorbant dans l'infrarouge proche, qui présentent de fortes bandes d'absorption entre 780 et 1200 nm. Les motifs répétitifs absorbant dans l'infrarouge proche comprennent des dérivés d'indole, de benz[e]indole, de benz[cd]indole, de benzothiazole, de naphtothiazole, de naphtoxazole, de benzsélènazole, et le naphtosélènazole, qui peuvent être représentés selon les formules XI, XII et XIII ;
    Figure 00560002
    Figure 00570001
    Figure 00570002
       Dans lesquelles
    Z1 et Z2 représentent des atomes suffisants pour former des cycles aromatiques condensés, substitués ou non substitués, comme le phényle et le naphtyle ;
    D1 et D2 représentent -O-, -S-, -Se-, -CH=CH- et -C(CH3)2-
    R5 représente un alkyle, un alkyloxy, un halogénure d'alkyle, une pyridine, une alkyl pyridine et un alkylthio,
    R6 représente une substitution alkyle, sulfonylalkyle, et carboxy-alkyle ;
    R7 représente l'hydrogène une substitution, alkyle et aryle,
    R8 représente une substitution alkyle, benzyle, alkylamine, acide alkyl sulfonique, acide alkyl carboxylique,
    X2 représente un contre-ion anionique choisi parmi le bromure, le chlorure, l'iodure, le tosylate, le triflate, le carbonate de trifluorométhane, le dodécyl-benzosulfonate et le tétrafluoroborate,
    n représente 0 et 1,
    m varie de 1 à 18.
  5. Plaque d'impression à sec thermique appropriée à une imagerie laser à infrarouges proches, ladite plaque d'impression comprenant : (i) un substrat de support, et (ii) une couche composite supérieure comprenant un ensemble de composition de revêtement selon l'une quelconque des revendications 1 à 4.
  6. Plaque d'impression à sec thermique selon la revendication 5, dans laquelle le substrat de support est réalisé en n'importe quel matériau de feuille appropriée, choisi parmi les matériaux consistant en métal, plastique, matière composite et papier.
EP00945482A 1999-07-29 2000-07-04 Plaques d'impression lithographique thermique sans eau Expired - Lifetime EP1214197B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CA002279299A CA2279299C (fr) 1999-07-29 1999-07-29 Plaques d'impression lithographique sans eau par procede thermique
CA2279299 1999-07-29
PCT/CA2000/000797 WO2001008885A1 (fr) 1999-07-29 2000-07-04 Plaques d'impression lithographique thermique sans eau

Publications (2)

Publication Number Publication Date
EP1214197A1 EP1214197A1 (fr) 2002-06-19
EP1214197B1 true EP1214197B1 (fr) 2004-06-09

Family

ID=4163899

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00945482A Expired - Lifetime EP1214197B1 (fr) 1999-07-29 2000-07-04 Plaques d'impression lithographique thermique sans eau

Country Status (7)

Country Link
EP (1) EP1214197B1 (fr)
AT (1) ATE268692T1 (fr)
AU (1) AU5957400A (fr)
CA (1) CA2279299C (fr)
DE (1) DE60011448T2 (fr)
ES (1) ES2222911T3 (fr)
WO (1) WO2001008885A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6715420B2 (en) 2001-07-02 2004-04-06 Alcoa Inc. Printing plate with dyed and anodized surface
US8875629B2 (en) 2010-04-09 2014-11-04 Presstek, Inc. Ablation-type lithographic imaging with enhanced debris removal
WO2016027886A1 (fr) * 2014-08-22 2016-02-25 富士フイルム株式会社 Composition de développement de couleur, plaque d'original d'impression lithographique, procédé de fabrication de plaque d'impression lithographique et révélateur chromogène

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ZA967894B (en) * 1995-09-22 1997-04-07 Sun Chemical Corp Compositions and solventless process for digital laser imagable lithographic printing plate production
US5919600A (en) * 1997-09-03 1999-07-06 Kodak Polychrome Graphics, Llc Thermal waterless lithographic printing plate
EP0908779B1 (fr) * 1997-10-08 2002-06-19 Agfa-Gevaert Méthode pour la production de plaques d'impression positives à partir d'un élément thermosensible

Also Published As

Publication number Publication date
DE60011448T2 (de) 2005-06-23
CA2279299A1 (fr) 2001-01-29
WO2001008885A1 (fr) 2001-02-08
EP1214197A1 (fr) 2002-06-19
ATE268692T1 (de) 2004-06-15
ES2222911T3 (es) 2005-02-16
DE60011448D1 (de) 2004-07-15
CA2279299C (fr) 2008-11-25
AU5957400A (en) 2001-02-19

Similar Documents

Publication Publication Date Title
EP1885759B1 (fr) Copolymeres d'acetals absorbant l'infrarouge proche thermiquement reactifs, procedes de preparation et procedes d'utilisation
EP1011984B1 (fr) Planche de tirage litho thermique sans mouillage
CN101203382B (zh) 热敏成像元件
JP2002526303A (ja) 感熱性のポリマー性画像記録物質
US6177182B1 (en) Thermally reactive near infrared absorption polymer coatings, method of preparing and methods of use
US6132933A (en) Thermal waterless lithographic printing plates
US6040115A (en) Processless planographic printing plate
JPH07186562A (ja) 平版印刷版
JPH1036331A (ja) ジアゾ化合物を含む熱転写ドナー要素
US6022668A (en) Positive-working direct write waterless lithographic printing members and methods of imaging and printing using same
EP1214197B1 (fr) Plaques d'impression lithographique thermique sans eau
US6596460B2 (en) Polyvinyl acetals having azido groups and use thereof in radiation-sensitive compositions
JP2002501848A (ja) 熱感受性ポリマーを有するプロセスレスの直接書き込み印刷板
WO2007083542A1 (fr) Matériau pour cliché lithographique et procédé de production correspondant
US20060185542A1 (en) Lithographic printing plate original form and plate making method
JPH09150589A (ja) 直描型水なし平版印刷版原版
CN112912798B (zh) 平版印刷版前体
JP3484589B2 (ja) 直描型水なし平版印刷版原版
JPH11188974A (ja) 直描型水なし平版印刷版原版
US20210206189A1 (en) Lithographic printing original plate, method for manufacturing lithographic printing plate, and method for manufacturing prints using same
JPH1039497A (ja) 直描型水なし平版印刷版原版
CN117581157A (zh) 无水平版印刷版原版、无水平版印刷版的制造方法和分拣方法以及印刷物的制造方法
CN116829366A (zh) 机上显影型平版印刷版原版、平版印刷版的制作方法、平版印刷方法及呈色剂
JP2020026065A (ja) 平版印刷版原版、およびそれを用いた平版印刷版の製造方法、印刷物の製造方法
JPH09131976A (ja) 直描型水なし平版印刷版原版

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20020211

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

17Q First examination report despatched

Effective date: 20030326

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CH

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20040609

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20040609

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20040609

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20040609

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20040609

Ref country code: LI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20040609

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20040609

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20040704

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20040705

REF Corresponds to:

Ref document number: 60011448

Country of ref document: DE

Date of ref document: 20040715

Kind code of ref document: P

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20040731

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20040909

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20040909

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20040909

LTIE Lt: invalidation of european patent or patent extension

Effective date: 20040609

NLV1 Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act
REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2222911

Country of ref document: ES

Kind code of ref document: T3

ET Fr: translation filed
REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20050310

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20041109

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20120723

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20120724

Year of fee payment: 13

Ref country code: FR

Payment date: 20120803

Year of fee payment: 13

Ref country code: DE

Payment date: 20120927

Year of fee payment: 13

Ref country code: ES

Payment date: 20120723

Year of fee payment: 13

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20130704

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20140331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20130704

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20140201

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 60011448

Country of ref document: DE

Effective date: 20140201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20130704

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20130731

REG Reference to a national code

Ref country code: ES

Ref legal event code: FD2A

Effective date: 20141016

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20130705