EP1205964A4 - Plasma process device, electrode structure thereof, and stage structure - Google Patents
Plasma process device, electrode structure thereof, and stage structureInfo
- Publication number
- EP1205964A4 EP1205964A4 EP00937315A EP00937315A EP1205964A4 EP 1205964 A4 EP1205964 A4 EP 1205964A4 EP 00937315 A EP00937315 A EP 00937315A EP 00937315 A EP00937315 A EP 00937315A EP 1205964 A4 EP1205964 A4 EP 1205964A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- plasma process
- process device
- stage
- electrode structure
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/2002—Controlling environment of sample
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17361399 | 1999-06-21 | ||
JP17361399 | 1999-06-21 | ||
JP2000168297A JP2001068538A (en) | 1999-06-21 | 2000-06-05 | Electrode structure, mounting base structure, plasma treatment system, and processing unit |
JP2000168297 | 2000-06-05 | ||
PCT/JP2000/004011 WO2000079575A1 (en) | 1999-06-21 | 2000-06-20 | Plasma process device, electrode structure thereof, and stage structure |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1205964A1 EP1205964A1 (en) | 2002-05-15 |
EP1205964A4 true EP1205964A4 (en) | 2005-02-02 |
EP1205964B1 EP1205964B1 (en) | 2006-03-29 |
Family
ID=26495531
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00937315A Expired - Lifetime EP1205964B1 (en) | 1999-06-21 | 2000-06-20 | Plasma process device, electrode structure thereof, and stage structure |
Country Status (7)
Country | Link |
---|---|
US (1) | US7033444B1 (en) |
EP (1) | EP1205964B1 (en) |
JP (1) | JP2001068538A (en) |
KR (1) | KR100452649B1 (en) |
DE (1) | DE60026996T2 (en) |
TW (1) | TW483087B (en) |
WO (1) | WO2000079575A1 (en) |
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-
2000
- 2000-06-05 JP JP2000168297A patent/JP2001068538A/en active Pending
- 2000-06-20 DE DE60026996T patent/DE60026996T2/en not_active Expired - Lifetime
- 2000-06-20 KR KR10-2001-7016361A patent/KR100452649B1/en not_active IP Right Cessation
- 2000-06-20 WO PCT/JP2000/004011 patent/WO2000079575A1/en active IP Right Grant
- 2000-06-20 EP EP00937315A patent/EP1205964B1/en not_active Expired - Lifetime
- 2000-06-21 TW TW089112182A patent/TW483087B/en not_active IP Right Cessation
- 2000-09-22 US US09/667,770 patent/US7033444B1/en not_active Expired - Fee Related
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EP0467390A1 (en) * | 1990-07-20 | 1992-01-22 | Tokyo Electron Limited | Support table for plate-like body and processing apparatus using the table |
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PATENT ABSTRACTS OF JAPAN vol. 0185, no. 99 (E - 1631) 15 November 1994 (1994-11-15) * |
See also references of WO0079575A1 * |
Also Published As
Publication number | Publication date |
---|---|
TW483087B (en) | 2002-04-11 |
DE60026996D1 (en) | 2006-05-18 |
US7033444B1 (en) | 2006-04-25 |
KR100452649B1 (en) | 2004-10-12 |
WO2000079575A1 (en) | 2000-12-28 |
DE60026996T2 (en) | 2007-03-15 |
JP2001068538A (en) | 2001-03-16 |
EP1205964A1 (en) | 2002-05-15 |
EP1205964B1 (en) | 2006-03-29 |
KR20020022072A (en) | 2002-03-23 |
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