JPH0178026U - - Google Patents
Info
- Publication number
- JPH0178026U JPH0178026U JP1987174327U JP17432787U JPH0178026U JP H0178026 U JPH0178026 U JP H0178026U JP 1987174327 U JP1987174327 U JP 1987174327U JP 17432787 U JP17432787 U JP 17432787U JP H0178026 U JPH0178026 U JP H0178026U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- sealing material
- airtight sealing
- resistant
- sandwiched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003566 sealing material Substances 0.000 claims description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Description
第1図は本考案による一実施例の要部側断面図
、第2図は第1図の平面図、第3図は従来技術に
よる要部側断面図、第4図は第3図の平面図であ
る。
図において、1は反応室、4は加熱ステージ、
1aは壁体、4aはシーズヒータ、1a―1は開
口部、4a―1は電源端子、2は絶縁性台座、1
0は被加工物、2aは導入孔、3は耐熱性気密シ
ール材を示す。
Fig. 1 is a side sectional view of the main part of an embodiment according to the present invention, Fig. 2 is a plan view of Fig. 1, Fig. 3 is a side sectional view of the main part according to the prior art, and Fig. 4 is a plan view of Fig. 3. It is a diagram. In the figure, 1 is a reaction chamber, 4 is a heating stage,
1a is a wall, 4a is a sheathed heater, 1a-1 is an opening, 4a-1 is a power terminal, 2 is an insulating pedestal, 1
0 indicates a workpiece, 2a indicates an introduction hole, and 3 indicates a heat-resistant airtight sealing material.
Claims (1)
けた開口部1a―1の内側に耐熱性気密シール材
3を挟んで電線を挿通する導入孔2aを穿設した
耐熱性台座2を設け、該台座上に耐熱性気密シー
ル材3を挾んで加熱ステージ4を気密固設し、該
加熱ステージに内蔵したシーズヒータ4aの電源
端子4a―1を上記開口部および導入孔とを通じ
て大気中に露出して備えることを特徴とするプラ
ズマ処理装置。 A heat-resistant pedestal 2 is provided with an introduction hole 2a through which an electric wire is inserted, with a heat-resistant airtight sealing material 3 sandwiched between the opening 1a-1 provided in a part of the wall 1a of the reaction chamber 1 whose interior is depressurized. The heat-resistant airtight sealing material 3 is sandwiched between the heat-resistant airtight sealing material 3 and the heating stage 4 is hermetically fixed on the pedestal. A plasma processing apparatus characterized by being exposed to and provided with.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987174327U JPH0178026U (en) | 1987-11-13 | 1987-11-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987174327U JPH0178026U (en) | 1987-11-13 | 1987-11-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0178026U true JPH0178026U (en) | 1989-05-25 |
Family
ID=31466190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987174327U Pending JPH0178026U (en) | 1987-11-13 | 1987-11-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0178026U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001068538A (en) * | 1999-06-21 | 2001-03-16 | Tokyo Electron Ltd | Electrode structure, mounting base structure, plasma treatment system, and processing unit |
JP2007035886A (en) * | 2005-07-26 | 2007-02-08 | Ngk Insulators Ltd | Power supplying member and semiconductor manufacturing device employing it |
-
1987
- 1987-11-13 JP JP1987174327U patent/JPH0178026U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001068538A (en) * | 1999-06-21 | 2001-03-16 | Tokyo Electron Ltd | Electrode structure, mounting base structure, plasma treatment system, and processing unit |
JP2007035886A (en) * | 2005-07-26 | 2007-02-08 | Ngk Insulators Ltd | Power supplying member and semiconductor manufacturing device employing it |
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