JPH0165132U - - Google Patents
Info
- Publication number
- JPH0165132U JPH0165132U JP1987159875U JP15987587U JPH0165132U JP H0165132 U JPH0165132 U JP H0165132U JP 1987159875 U JP1987159875 U JP 1987159875U JP 15987587 U JP15987587 U JP 15987587U JP H0165132 U JPH0165132 U JP H0165132U
- Authority
- JP
- Japan
- Prior art keywords
- magnetic field
- electrodes
- plasma
- discharge
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005684 electric field Effects 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Drying Of Semiconductors (AREA)
Description
第1図は、本考案の一実施例のプラズマ処理装
置の構成図、第2図は、第1図のA―A視図、第
3図は、本考案の他の実施例のプラズマ処理装置
の第2図と同一部位図である。
1……処理室、2……電磁石、3……試料、4
……試料台、5……電源、6……永久磁石。
FIG. 1 is a configuration diagram of a plasma processing apparatus according to an embodiment of the present invention, FIG. 2 is a view taken along line AA in FIG. 1, and FIG. 3 is a plasma processing apparatus according to another embodiment of the present invention. This is the same part diagram as Fig. 2 of . 1...Processing chamber, 2...Electromagnet, 3...Sample, 4
...sample stage, 5...power supply, 6...permanent magnet.
Claims (1)
用により放電を生じさせ、該放電で処理ガスをプ
ラズマ化し、該プラズマを利用して試料を処理す
る装置において、磁界強度、極性を個別に制御可
能な前記磁界発生手段を前記電極間外で該電極に
対応して配設したことを特徴とするプラズマ処理
装置。 Magnetic field strength and polarity can be controlled individually in a device that generates a discharge by combining the electric field between electrodes and a magnetic field with a magnetic field, converts the processing gas into plasma by the discharge, and processes the sample using the plasma. A plasma processing apparatus characterized in that the magnetic field generating means is disposed outside between the electrodes and corresponding to the electrodes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987159875U JPH0165132U (en) | 1987-10-21 | 1987-10-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987159875U JPH0165132U (en) | 1987-10-21 | 1987-10-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0165132U true JPH0165132U (en) | 1989-04-26 |
Family
ID=31441459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987159875U Pending JPH0165132U (en) | 1987-10-21 | 1987-10-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0165132U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013149722A (en) * | 2012-01-18 | 2013-08-01 | Tokyo Electron Ltd | Substrate processing device |
-
1987
- 1987-10-21 JP JP1987159875U patent/JPH0165132U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013149722A (en) * | 2012-01-18 | 2013-08-01 | Tokyo Electron Ltd | Substrate processing device |
KR20190104436A (en) * | 2012-01-18 | 2019-09-09 | 도쿄엘렉트론가부시키가이샤 | Substrate processing method |
US10651012B2 (en) | 2012-01-18 | 2020-05-12 | Tokyo Electron Limited | Substrate processing method |
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