EP1158389A3 - Computer mit Kühleinrichtung und Wärmetauscher der Kühleinrichtung - Google Patents
Computer mit Kühleinrichtung und Wärmetauscher der Kühleinrichtung Download PDFInfo
- Publication number
- EP1158389A3 EP1158389A3 EP00126464A EP00126464A EP1158389A3 EP 1158389 A3 EP1158389 A3 EP 1158389A3 EP 00126464 A EP00126464 A EP 00126464A EP 00126464 A EP00126464 A EP 00126464A EP 1158389 A3 EP1158389 A3 EP 1158389A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat
- cooling apparatus
- exchanging device
- heat exchanging
- computer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0031—Radiators for recooling a coolant of cooling systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US579282 | 1995-12-27 | ||
US09/579,282 US6313990B1 (en) | 2000-05-25 | 2000-05-25 | Cooling apparatus for electronic devices |
KR1020000064009A KR20010000940A (ko) | 2000-05-25 | 2000-10-30 | 냉각장치가 구비된 컴퓨터 및 그 냉각장치의 열교환기 |
KR2000640009 | 2000-10-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1158389A2 EP1158389A2 (de) | 2001-11-28 |
EP1158389A3 true EP1158389A3 (de) | 2002-11-13 |
Family
ID=26638498
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00126464A Withdrawn EP1158389A3 (de) | 2000-05-25 | 2000-12-07 | Computer mit Kühleinrichtung und Wärmetauscher der Kühleinrichtung |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1158389A3 (de) |
KR (1) | KR100403966B1 (de) |
TW (1) | TW501001B (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109963422A (zh) * | 2019-04-09 | 2019-07-02 | 福州经济技术开发区馨橙文化创意有限责任公司 | 一种通讯设备散热保护装置 |
CN110275595A (zh) * | 2019-06-28 | 2019-09-24 | 李璐昆 | 一种嵌入式主机设备的冷却散热结构 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW577578U (en) * | 2001-08-24 | 2004-02-21 | Uniwill Comp Corp | Heat dissipation device of low flow resistance for notebook computer |
KR100464759B1 (ko) * | 2002-02-22 | 2005-01-13 | (주)네오유토 | 컴퓨터 중앙연산처리장치용 냉각장치 및 그 제조방법 |
DE20208658U1 (de) | 2002-06-04 | 2002-08-14 | NEOLEC COMPONENTS GmbH, 40470 Düsseldorf | Kühlelement für ein Flüssigkeitskühlsystem |
DE102004020642A1 (de) * | 2004-04-22 | 2005-11-10 | Höhne, Sven, Dipl.-Ing (FH) | Schwerkraftkühlung für elektronische Bauteile |
CN100453952C (zh) * | 2004-09-24 | 2009-01-21 | 蒋毅 | 分体式热管 |
KR100742329B1 (ko) * | 2006-09-22 | 2007-07-27 | 정수리치 | 컴퓨터의 방출열을 이용한 족탕기 |
DE102007020037B4 (de) * | 2007-04-27 | 2010-01-28 | Airbus Deutschland Gmbh | Kühlanordnung zum Kühlen einer elektronischen Einrichtung eines Luftfahrzeuges |
CA2668663A1 (en) | 2006-11-20 | 2008-05-29 | Airbus Deutschland Gmbh | Cooling system and method for cooling an aircraft device |
KR101504291B1 (ko) * | 2007-11-26 | 2015-03-23 | 주식회사 에이티티알앤디 | 냉각장치 |
KR101239892B1 (ko) * | 2012-09-26 | 2013-03-06 | 김진규 | 프라즈마 연소장치의 파워서플라이 냉각장치 및 이를 구비한 파워서플라이 |
CN103327799B (zh) * | 2013-07-17 | 2016-06-29 | 曙光信息产业股份有限公司 | 用于机架式服务器的冷却组件、及机架式服务器机组 |
CN107577308B (zh) * | 2017-08-22 | 2024-05-17 | 安庆师范大学 | 一种便于安装的计算机散热器 |
CN108281590B (zh) * | 2018-03-29 | 2024-02-02 | 长沙优力电驱动系统有限公司 | 电池热管理装置及设有该装置的电池 |
US11460899B2 (en) * | 2018-12-13 | 2022-10-04 | Hewlett-Packard Development Company, L.P. | Computing devices with integrated and isolated liquid cooling |
CN111124068B (zh) * | 2019-12-05 | 2021-04-02 | 山东中科好靓科技有限公司 | 一种搭载区块链技术的便于降温散热的计算机 |
CN112162612A (zh) * | 2020-11-05 | 2021-01-01 | 吴根花 | 一种改善喷油现象的光驱 |
CN112565929B (zh) * | 2020-12-23 | 2022-09-27 | 中国人民解放军军事科学院战争研究院 | 一种执行接入控制的用户设备 |
US11602086B2 (en) * | 2021-04-20 | 2023-03-07 | Dell Products L.P. | Cooling computing modules of a rack-mountable tray |
CN113540336B (zh) * | 2021-07-17 | 2023-04-18 | 江西明正变电设备有限公司 | 一种压电变压器散热装置及压电变压器 |
CN114654674B (zh) * | 2022-04-05 | 2023-03-10 | 东台迈盛智能科技有限公司 | 一种内置快速降温机构的风力发电机叶片模具 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2422999A3 (fr) * | 1978-04-10 | 1979-11-09 | Philips Nv | Dispositif de traitement de donnees |
GB2120530A (en) * | 1982-05-21 | 1983-12-07 | Charles Scott | Cooking utensils |
EP0448806A1 (de) * | 1990-03-29 | 1991-10-02 | Siemens Aktiengesellschaft | Kühleinrichtung für Geräteeinschübe |
DE9420466U1 (de) * | 1994-12-21 | 1995-02-09 | Hilpert, Bernhard, 71636 Ludwigsburg | Computergehäuse für den Industrie-Einsatz |
WO1998008038A1 (en) * | 1996-08-22 | 1998-02-26 | Kioan Cheon | Cooling system for computer |
DE29904928U1 (de) * | 1999-03-18 | 1999-06-17 | Fritschle, Simone, 70195 Stuttgart | Gehäuse mit einer Lüftereinrichtung und Lüftereinrichtung |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR950003481B1 (ko) * | 1992-09-29 | 1995-04-13 | 대우통신 주식회사 | 망제어장치(ncu)보드 테스터 |
JPH06119083A (ja) * | 1992-10-07 | 1994-04-28 | Toshiba Corp | 電子機器の冷却装置 |
US5901038A (en) * | 1997-03-17 | 1999-05-04 | Cheng; Wing Ling | Power supply system for high density printed circuit boards |
KR19980019402A (ko) * | 1998-03-16 | 1998-06-05 | 천기완 | 피.씨의 씨.피.유 냉각장치(cpu cooling device of pc) |
KR19990041018U (ko) * | 1998-05-12 | 1999-12-06 | 윤종용 | 중앙처리장치(cpu) 냉각장치의 방열판 |
US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
KR200185030Y1 (ko) * | 2000-01-13 | 2000-06-15 | 서인수 | 컴퓨터용 샤시의 가공구조 |
-
2000
- 2000-12-07 EP EP00126464A patent/EP1158389A3/de not_active Withdrawn
- 2000-12-15 TW TW089126863A patent/TW501001B/zh not_active IP Right Cessation
-
2001
- 2001-05-23 KR KR10-2001-0028477A patent/KR100403966B1/ko not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2422999A3 (fr) * | 1978-04-10 | 1979-11-09 | Philips Nv | Dispositif de traitement de donnees |
GB2120530A (en) * | 1982-05-21 | 1983-12-07 | Charles Scott | Cooking utensils |
EP0448806A1 (de) * | 1990-03-29 | 1991-10-02 | Siemens Aktiengesellschaft | Kühleinrichtung für Geräteeinschübe |
DE9420466U1 (de) * | 1994-12-21 | 1995-02-09 | Hilpert, Bernhard, 71636 Ludwigsburg | Computergehäuse für den Industrie-Einsatz |
WO1998008038A1 (en) * | 1996-08-22 | 1998-02-26 | Kioan Cheon | Cooling system for computer |
DE29904928U1 (de) * | 1999-03-18 | 1999-06-17 | Fritschle, Simone, 70195 Stuttgart | Gehäuse mit einer Lüftereinrichtung und Lüftereinrichtung |
Non-Patent Citations (1)
Title |
---|
STILLER A: "TURBO-COOLER 800 MHZ ATHLON MIT KRYOTECH-KUEHLER", CT MAGAZIN FUER COMPUTER TECHNIK, VERLAG HEINZ HEISE GMBH., HANNOVER, DE, no. 24, 22 November 1999 (1999-11-22), pages 110 - 111, XP000862542, ISSN: 0724-8679 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109963422A (zh) * | 2019-04-09 | 2019-07-02 | 福州经济技术开发区馨橙文化创意有限责任公司 | 一种通讯设备散热保护装置 |
CN109963422B (zh) * | 2019-04-09 | 2020-10-27 | 海宁北斗皓远科技有限公司 | 一种通讯设备散热保护装置 |
CN110275595A (zh) * | 2019-06-28 | 2019-09-24 | 李璐昆 | 一种嵌入式主机设备的冷却散热结构 |
Also Published As
Publication number | Publication date |
---|---|
TW501001B (en) | 2002-09-01 |
KR20010069976A (ko) | 2001-07-25 |
KR100403966B1 (ko) | 2003-10-30 |
EP1158389A2 (de) | 2001-11-28 |
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