EP1127385A1 - Verfahren zur realisierung von empfängen für elektromagnetische wellen durch verbinden von integrierten schaltkreisen in drei dimensionen - Google Patents

Verfahren zur realisierung von empfängen für elektromagnetische wellen durch verbinden von integrierten schaltkreisen in drei dimensionen

Info

Publication number
EP1127385A1
EP1127385A1 EP99950839A EP99950839A EP1127385A1 EP 1127385 A1 EP1127385 A1 EP 1127385A1 EP 99950839 A EP99950839 A EP 99950839A EP 99950839 A EP99950839 A EP 99950839A EP 1127385 A1 EP1127385 A1 EP 1127385A1
Authority
EP
European Patent Office
Prior art keywords
pellets
antenna
etching
receiver
stacking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP99950839A
Other languages
English (en)
French (fr)
Other versions
EP1127385B9 (de
EP1127385B1 (de
Inventor
Xavier Thomson-CSF Prop. Intell. CHAMUSSY
Pascal Thomson-CSF Prop. Intell. BIL
Christian Thomson-CSF Prop. Intell. VAL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDA Armements SAS
Original Assignee
TDA Armements SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDA Armements SAS filed Critical TDA Armements SAS
Publication of EP1127385A1 publication Critical patent/EP1127385A1/de
Application granted granted Critical
Publication of EP1127385B1 publication Critical patent/EP1127385B1/de
Publication of EP1127385B9 publication Critical patent/EP1127385B9/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
    • H01Q21/0093—Monolithic arrays

Definitions

  • the present invention relates to a method for producing radio wave receivers by interconnecting three-dimensional integrated circuits.
  • GPS Global Positioning System
  • these receivers being carried on board munitions of the shell or missile type for improving fire.
  • the invention can however be extended to other fields, whenever there is a need to use a GPS or a radio wave receiver in a reduced volume or inside mobiles when these are subjected to significant accelerations and decelerations.
  • the GPS it is possible to receive, at any time and at any place on the earth, by means of a receiver and an antenna, radio signals emitted by at least 6 satellites which allow the user to know its exact position in latitude, longitude and altitude.
  • an on-board GPS allows, thanks to a transponder, to transmit trajectory correction orders from a ground station, or to directly pilot an on-board trajectory correction system from the position of the shell and coordinates of a target.
  • connection pads are each connected to any one of the faces of the stack except one, said base which is intended to be in contact with a printed circuit substrate.
  • the connections between the pellets are formed between them on the faces of the stack by laser etching.
  • the object of the invention is to overcome the aforementioned drawbacks.
  • the subject of the invention is a method for producing a radio wave receiver coupled to a reception antenna by stacking semiconductor pads each containing at least one integrated circuit and comprising connection pads for connecting the pads between them, characterized in that it consists in metallizing the external surface of the stacked pellets to create a ground plane of the antenna of the receiver, in covering the ground plane with a dielectric material, in metallizing the surface of the dielectric material and to etch the receiver antenna on the metallized surface obtained.
  • the invention also relates to a use of the method for implementing a GPS receiver on board a munition.
  • the main advantage of the invention is that it allows the use of radio wave receivers on board ammunition which gives them sufficient reliability to withstand the accelerations to which the ammunition is subjected. As a result, it makes it possible to ensure greater effectiveness in long-range shots because it is known that in the absence of a trajectory correction device, this efficiency decreases very quickly with the range of the ammunition due to the errors of accuracy and dispersion.
  • the implementation according to the invention of a radio wave receiver by stacking semiconductor pellets comprising an antenna etched on the external surface of the pellets constitutes a good means for constituting an on-board navigation aid system capable to locate the ammunition on its trajectory and to carry out a correction of trajectory so that the ammunition can reach its objective.
  • Figure 1 the different steps of the method according to the invention in the form of a flowchart.
  • FIG. 2 an embodiment of wiring on TAB film where TAB is the abbreviation for "Tape Automated Bounding”.
  • Figure 3 an integrated module without the antennas.
  • Figure 4 a module integrated with the ground plane of the antenna.
  • Figure 5 an integrated module with antenna substrate.
  • Figure 6 an integrated GPS module in 3D technology.
  • FIG. 7a, 7b, 7c different integration models.
  • the method according to the invention takes place in 6 steps referenced from 1 to 6 in FIG. 1.
  • Step 1 consists of producing, in a known manner in the form of ASIC chips, an abbreviation for "Application Specifies Integrated Circuit", the components specific to the GPS receiver.
  • step 2 The wiring of the chips or of the discrete components is carried out in step 2 on flexible printed circuits of the polyamide, epoxy type or else on film according to the process known under the English abbreviation TAB of "Tape Automated Bonding".
  • TAB Transmission Automated Bonding
  • these films can be four in number, a supply film 7, two films 8 and 9 containing the signal processing electronics and a film 10 for the microwave circuits.
  • Step 3 Films 7 to 10 are coated in step 3 with an epoxy resin to form pellets.
  • the pellets are also cut according to the shape of the windows of the TAB films and their stacking one above the other to form a receiver module.
  • the interconnections between each level of film can be carried out according to the method described in patent FR 2,670,323 already cited.
  • Plugs 1 1 for connecting the module to an external circuit not shown, are produced according to the method known by the abbreviation BGA of "Bail
  • Step 4 consists of metallization shown in Figure 4 of the outer faces of the module composed of the pellets stacked according to step 3 to create the ground plane of the antenna.
  • step 5 a deposition shown in FIG. 5 of a dielectric material with a high dielectric constant is carried out on the faces of the module, this deposition is followed in step 6 by metallization and etching of the antennas 1 3a, 1 3b as shown in figure 6.
  • the antennas are preferably engraved all around the module so that there is always an active antenna, that is to say capable of receiving data from the GPS satellite network when the munition is rotating on itself.
  • the 3D technology implemented makes it possible to envisage any type of shape, and to use conforming antennas or micro-ribbon antennas still known under the Anglo-Saxon designation "patch", the engraving of which is carried out by area of the modules.
  • Figures 6a to 6c show different integration solutions capable of satisfying certain volume constraints.
  • FIG. 6a corresponds to an embodiment of a cubic module with “patch” antennas arranged on four faces of the cube.
  • FIG. 6b corresponds to an embodiment of a cylindrical module with a ribbon antenna arranged in turn.
  • the embodiment of FIG. 6c is that of a cylindrical conical module with multi-strand antenna.
  • FIG. 7 represents a GPS module implemented according to the method of the invention, inside an artillery rocket.
  • the GPS module 1 4 is placed in the nose of the rocket.
  • its dimension is very small compared to the longitudinal dimension of the rocket which in this example is of the order of 1 45 mm, its maximum diameter being of the order of 50 mm.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Position Fixing By Use Of Radio Waves (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
EP99950839A 1998-11-03 1999-10-26 Verfahren zur realisierung von empfängen für elektromagnetische wellen durch verbinden von integrierten schaltkreisen in drei dimensionen Expired - Lifetime EP1127385B9 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9813814 1998-11-03
FR9813814A FR2785452B1 (fr) 1998-11-03 1998-11-03 Procede de realisation de recepteurs d'ondes radioelectriques par interconnexion de circuits integres en trois dimensions
PCT/FR1999/002606 WO2000026992A1 (fr) 1998-11-03 1999-10-26 Procede de realisation de recepteurs d'ondes radioelectriques par interconnexion de circuits integres en trois dimensions

Publications (3)

Publication Number Publication Date
EP1127385A1 true EP1127385A1 (de) 2001-08-29
EP1127385B1 EP1127385B1 (de) 2003-09-03
EP1127385B9 EP1127385B9 (de) 2004-03-03

Family

ID=9532311

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99950839A Expired - Lifetime EP1127385B9 (de) 1998-11-03 1999-10-26 Verfahren zur realisierung von empfängen für elektromagnetische wellen durch verbinden von integrierten schaltkreisen in drei dimensionen

Country Status (4)

Country Link
EP (1) EP1127385B9 (de)
DE (1) DE69911047T2 (de)
FR (1) FR2785452B1 (de)
WO (1) WO2000026992A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005091437A1 (de) * 2004-03-19 2005-09-29 Infineon Technologies Ag Antennenanordnung und verfahren zum herstellen derselben
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8461542B2 (en) 2008-09-08 2013-06-11 Koninklijke Philips Electronics N.V. Radiation detector with a stack of converter plates and interconnect layers

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2670323B1 (fr) * 1990-12-11 1997-12-12 Thomson Csf Procede et dispositif d'interconnexion de circuits integres en trois dimensions.
US5219377A (en) * 1992-01-17 1993-06-15 Texas Instruments Incorporated High temperature co-fired ceramic integrated phased array package
US5367308A (en) * 1992-05-29 1994-11-22 Iowa State University Research Foundation, Inc. Thin film resonating device
US5493305A (en) * 1993-04-15 1996-02-20 Hughes Aircraft Company Small manufacturable array lattice layers
DE19535962C1 (de) * 1995-09-27 1997-02-13 Siemens Ag Dopplerradarmodul

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0026992A1 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005091437A1 (de) * 2004-03-19 2005-09-29 Infineon Technologies Ag Antennenanordnung und verfahren zum herstellen derselben
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting

Also Published As

Publication number Publication date
FR2785452B1 (fr) 2003-06-13
DE69911047T2 (de) 2004-04-29
EP1127385B9 (de) 2004-03-03
EP1127385B1 (de) 2003-09-03
FR2785452A1 (fr) 2000-05-05
WO2000026992A1 (fr) 2000-05-11
DE69911047D1 (de) 2003-10-09

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