EP1127385A1 - Method for producing radio-frequency wave receivers by interconnecting three dimensional integrated circuits - Google Patents
Method for producing radio-frequency wave receivers by interconnecting three dimensional integrated circuitsInfo
- Publication number
- EP1127385A1 EP1127385A1 EP99950839A EP99950839A EP1127385A1 EP 1127385 A1 EP1127385 A1 EP 1127385A1 EP 99950839 A EP99950839 A EP 99950839A EP 99950839 A EP99950839 A EP 99950839A EP 1127385 A1 EP1127385 A1 EP 1127385A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- pellets
- antenna
- etching
- receiver
- stacking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
- H01Q21/0093—Monolithic arrays
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9813814A FR2785452B1 (en) | 1998-11-03 | 1998-11-03 | METHOD FOR PRODUCING RADIO WAVES RECEIVERS BY INTERCONNECTION OF THREE-DIMENSIONAL INTEGRATED CIRCUITS |
FR9813814 | 1998-11-03 | ||
PCT/FR1999/002606 WO2000026992A1 (en) | 1998-11-03 | 1999-10-26 | Method for producing radio-frequency wave receivers by interconnecting three dimensional integrated circuits |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1127385A1 true EP1127385A1 (en) | 2001-08-29 |
EP1127385B1 EP1127385B1 (en) | 2003-09-03 |
EP1127385B9 EP1127385B9 (en) | 2004-03-03 |
Family
ID=9532311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99950839A Expired - Lifetime EP1127385B9 (en) | 1998-11-03 | 1999-10-26 | Method for producing radio-frequency wave receivers by interconnecting three dimensional integrated circuits |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1127385B9 (en) |
DE (1) | DE69911047T2 (en) |
FR (1) | FR2785452B1 (en) |
WO (1) | WO2000026992A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005091437A1 (en) * | 2004-03-19 | 2005-09-29 | Infineon Technologies Ag | Antenna assembly and method for producing said assembly |
US8359740B2 (en) | 2008-12-19 | 2013-01-29 | 3D Plus | Process for the wafer-scale fabrication of electronic modules for surface mounting |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8461542B2 (en) | 2008-09-08 | 2013-06-11 | Koninklijke Philips Electronics N.V. | Radiation detector with a stack of converter plates and interconnect layers |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2670323B1 (en) * | 1990-12-11 | 1997-12-12 | Thomson Csf | METHOD AND DEVICE FOR INTERCONNECTING THREE-DIMENSIONAL INTEGRATED CIRCUITS. |
US5219377A (en) * | 1992-01-17 | 1993-06-15 | Texas Instruments Incorporated | High temperature co-fired ceramic integrated phased array package |
US5367308A (en) * | 1992-05-29 | 1994-11-22 | Iowa State University Research Foundation, Inc. | Thin film resonating device |
US5493305A (en) * | 1993-04-15 | 1996-02-20 | Hughes Aircraft Company | Small manufacturable array lattice layers |
DE19535962C1 (en) * | 1995-09-27 | 1997-02-13 | Siemens Ag | Doppler radar module |
-
1998
- 1998-11-03 FR FR9813814A patent/FR2785452B1/en not_active Expired - Fee Related
-
1999
- 1999-10-26 EP EP99950839A patent/EP1127385B9/en not_active Expired - Lifetime
- 1999-10-26 DE DE69911047T patent/DE69911047T2/en not_active Expired - Lifetime
- 1999-10-26 WO PCT/FR1999/002606 patent/WO2000026992A1/en active IP Right Grant
Non-Patent Citations (1)
Title |
---|
See references of WO0026992A1 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005091437A1 (en) * | 2004-03-19 | 2005-09-29 | Infineon Technologies Ag | Antenna assembly and method for producing said assembly |
US8359740B2 (en) | 2008-12-19 | 2013-01-29 | 3D Plus | Process for the wafer-scale fabrication of electronic modules for surface mounting |
Also Published As
Publication number | Publication date |
---|---|
DE69911047D1 (en) | 2003-10-09 |
FR2785452A1 (en) | 2000-05-05 |
FR2785452B1 (en) | 2003-06-13 |
EP1127385B9 (en) | 2004-03-03 |
DE69911047T2 (en) | 2004-04-29 |
EP1127385B1 (en) | 2003-09-03 |
WO2000026992A1 (en) | 2000-05-11 |
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