EP1127385B1 - Method for producing radio-frequency wave receivers by interconnecting three dimensional integrated circuits - Google Patents

Method for producing radio-frequency wave receivers by interconnecting three dimensional integrated circuits Download PDF

Info

Publication number
EP1127385B1
EP1127385B1 EP99950839A EP99950839A EP1127385B1 EP 1127385 B1 EP1127385 B1 EP 1127385B1 EP 99950839 A EP99950839 A EP 99950839A EP 99950839 A EP99950839 A EP 99950839A EP 1127385 B1 EP1127385 B1 EP 1127385B1
Authority
EP
European Patent Office
Prior art keywords
wafers
antenna
receiver
etching
frequency wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP99950839A
Other languages
German (de)
French (fr)
Other versions
EP1127385A1 (en
EP1127385B9 (en
Inventor
Xavier Thomson-CSF Prop. Intell. CHAMUSSY
Pascal Thomson-CSF Prop. Intell. BIL
Christian Thomson-CSF Prop. Intell. VAL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDA Armements SAS
Original Assignee
TDA Armements SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDA Armements SAS filed Critical TDA Armements SAS
Publication of EP1127385A1 publication Critical patent/EP1127385A1/en
Publication of EP1127385B1 publication Critical patent/EP1127385B1/en
Application granted granted Critical
Publication of EP1127385B9 publication Critical patent/EP1127385B9/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
    • H01Q21/0093—Monolithic arrays

Definitions

  • the present invention relates to a method for producing radio wave receivers by circuit interconnection integrated in three dimensions.
  • GPS Global Positioning System
  • the GPS it is possible to receive, at every moment and anywhere on the earth, by means of a receiver and a antenna, radio signals emitted by at least 6 satellites that allow the user to know his exact position in latitude, longitude and altitude.
  • an on-board GPS allows thanks a transponder to transmit trajectory correction commands to from a ground station, or directly control a system of onboard trajectory correction from the position of the shell and coordinates of an objective.
  • the electronic circuits must be able to operate with very severe acceleration constraints of 15 to 20,000 g for several milliseconds and, on the other hand, the volume occupied by the assembly must be very small for certain types of ammunition. , of the order of a few tens of cm 3 for example.
  • 3D technology of the type of described in the patent FR 2 670 323 and filed in the name of Thomson-CSF, may be considered.
  • the described method consists in carrying out the interconnection of stacked semiconductor pellets each having a circuit integrated.
  • connection pads are each connected to any one of the faces of the stack except one, so-called base which is intended to be in contact with a circuit substrate printed.
  • the formation of the connections of the pellets between them is carried out on the faces of the stack by laser etching.
  • the object of the invention is to overcome the aforementioned drawbacks.
  • the subject of the invention is a production method of a radio wave receiver coupled to a radio antenna stack receipt of semiconductor pellets containing each at least one integrated circuit and having pads of connection for connecting the pellets to one another, characterized in that metallizing the outer surface of the stacked pellets to create a ground plane of the receiver antenna, to cover the plane of mass by a dielectric material, to metallize the surface of the material dielectric and to etch the receiver antenna on the metallized surface obtained.
  • the subject of the invention is also a use of the method of the implementation of a GPS receiver embedded in a munition.
  • the main advantage of the invention is that it allows a implementation of onboard radio wave receivers on board of ammunition that gives them sufficient reliability to withstand the accelerations to which ammunition is subjected.For this fact it allows to ensure greater effectiveness in long-range firing as it is known that in the absence of trajectory correction device, this efficiency decreases very quickly with ammunition range due to errors of accuracy and dispersion.
  • the implementation according to the invention of a wave receiver radioelectric device by stacking semiconductor chips comprising an antenna engraved on the outer surface of the pellets constitutes a good means to constitute an on-board navigation aid system able to locate the ammunition on its trajectory and perform a course correction so that the ammunition can reach its goal.
  • Step 1 consists of producing in a known manner in the form of ASIC chips, English abbreviation for "Application Specific Integrated Circuit” the specific components of the GPS receiver.
  • the wiring of the chips or discrete components is carried out at Step 2 on flexible printed circuits type polyamide, epoxy or still on film according to the method known by the abbreviation Anglo Saxon TAB of "Automated Bonding Tape".
  • these movies can be four, a movie 7 feed, two movies 8 and 9 containing the signal processing electronics and a film 10 for microwave circuits.
  • step 3 The films 7 to 10 are coated in step 3 in a resin epoxy to form pellets.
  • step 3 is also realized the cutting pellets following the shape of the windows of TAB films and stacking them one above the other to form a module
  • the interconnections between each film level can be carried out according to the process described in patent FR 2,670,323 already cited. After metallization of the faces of the pellets, the interconnections between pellets are performed by laser etching and conduction tracks are protected by an insulating deposit. Stacking of the pellets is shown in Figure 3, where the elements homologous to those of the figure 2 are represented with the same references.
  • Plots 11 of connection of the module to an external printed circuit not shown are carried out according to the process known by the abbreviation BGA of "Ball Grid Array. "Outputs 12a, 12b connecting the hyper film to the antenna are also realized.
  • Step 4 consists in carrying out a metallization represented in FIG. 4 of the outer faces of the module composed of pellets stacked according to step 3 to create the ground plane of the antenna.
  • step 5 a deposit shown in FIG. 5 of a high dielectric constant dielectric material is carried out on the faces of the module, this deposit is followed in step 6 by metallization and etching of the antennas 13 a , 13 b as shown in Figure 6.
  • the antennas are preferably etched all around the module so that there is always an active antenna, that is to say capable of receiving data from the GPS satellite network when the ammunition is a rotation on itself.
  • the 3D technology used allows to consider all types of shapes, and to use compliant antennas or micro-ribbon antennas still known as Anglo-Saxon "patch" whose engraving is performed on the surface of the modules.
  • Figures 6 a to 6c shows different integration solutions capable of satisfying certain volume constraints.
  • FIG. 6 a corresponds to a cubic module embodiment with "patch" antennas arranged on four faces of the cube.
  • Figure 6b corresponds to an embodiment of a cylindrical module with a ribbon antenna arranged in turn.
  • Figure 6C is that of a cylindrical module with conical stranded antenna.
  • FIG. 7 represents a GPS module implemented according to the method of the invention, within an artillery rocket. Following this embodiment the GPS module 14 is placed in the nose of the rocket.It can be seen that its dimension is very small compared to the longitudinal dimension of the rocket which in this example is of the order of 145 mm, its maximum diameter being of the order of 50 mm.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Position Fixing By Use Of Radio Waves (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)

Description

La présente invention concerne un procédé de réalisation de récepteurs d'ondes radioélectriques par interconnexion de circuits intégrés en trois dimensions.The present invention relates to a method for producing radio wave receivers by circuit interconnection integrated in three dimensions.

Elle s'applique notamment à la réalisation de récepteurs connus sous l'abréviation anglo-saxonne GPS de "Global Positioning System",ces récepteurs étant embarqués à bord de munitions de type obus ou missiles pour l'amélioration des tirs. L'invention peut toutefois être étendue à d'autres domaines, chaque fois qu'il y a nécessité d'utiliser un GPS ou un récepteur d'ondes radioélectriques dans un volume réduit où à l'intérieur de mobiles lorsque ceux ci sont soumis à des accélérations et décélérations importantes.It applies in particular to the production of known receptors under the English abbreviation GPS of "Global Positioning System", these receivers embarked on ammunition-type shells or missiles for the improvement of the shots. The invention may however be extended to other areas, whenever there is a need to use a GPS or radio wave receiver in a small volume or indoors mobile devices when they are subject to accelerations and significant decelerations.

Développé initialement aux Etats-Unis d'Amérique pour des applications de défense en 1973, le GPS a révolutionné le monde de la navigation maritime et aérienne, pour entrer ensuite dans une ère d'application civile et de loisir notamment.Developed initially in the United States of America for defense applications in 1973, GPS revolutionized the world of maritime and air navigation, to then enter an era civil and leisure applications in particular.

Grâce au GPS il est possible de recevoir, à chaque instant et à n'importe quel endroit sur la terre, au moyen d'un récepteur et d'une antenne, des signaux radios émis par au moins 6 satellites qui permettent à l'utilisateur de connaítre sa position exacte en latitude, longitude et altitude.Thanks to the GPS it is possible to receive, at every moment and anywhere on the earth, by means of a receiver and a antenna, radio signals emitted by at least 6 satellites that allow the user to know his exact position in latitude, longitude and altitude.

Dans le domaine de l'artillerie, un GPS embarqué permet grâce à un transpondeur de transmettre des ordres de correction de trajectoire à partir d'une station au sol, ou de piloter directement un système de correction de trajectoire embarqué à partir de la position de l'obus et des coordonnées d'un objectif.In the field of artillery, an on-board GPS allows thanks a transponder to transmit trajectory correction commands to from a ground station, or directly control a system of onboard trajectory correction from the position of the shell and coordinates of an objective.

Cependant plusieurs difficultés s'opposent à cette mise en oeuvre. D'une part, les circuits électroniques doivent pouvoir fonctionner avec des contraintes d'accélération très sévères de 15 à 20 000 g pendant plusieurs millisecondes et d'autre part, le volume occupé par l'ensemble doit pour certains types de munitions être très réduit, de l'ordre de quelques dizaines de cm3 par exemple. However, several difficulties oppose this implementation. On the one hand, the electronic circuits must be able to operate with very severe acceleration constraints of 15 to 20,000 g for several milliseconds and, on the other hand, the volume occupied by the assembly must be very small for certain types of ammunition. , of the order of a few tens of cm 3 for example.

Pour résoudre ces problèmes une intégration en technologie à trois dimensions désignée ci-après technologie 3D, du type de celle décrite dans le brevet d'invention FR 2 670 323 et déposée au nom de Thomson-CSF, peut être envisagée.To solve these problems an integration in technology to three dimensions, hereinafter referred to as 3D technology, of the type of described in the patent FR 2 670 323 and filed in the name of Thomson-CSF, may be considered.

Le procédé décrit consiste à réaliser l'interconnexion de pastilles semiconductrices empilées comportant chacune un circuit intégré.The described method consists in carrying out the interconnection of stacked semiconductor pellets each having a circuit integrated.

Les pastilles semi-conductrices sont rendues solidaires les unes des autres par des plots de connexion. Les plots de connexion sont chacun reliés à l'une quelconque des faces de l'empilement sauf une, dite base qui est destinée à être en contact avec un substrat de circuit imprimé. La formation des connexions des pastilles entre elles est réalisée sur les faces de l'empilement par gravure laser.The semiconductor chips are made integral with each other others by connection pads. The connection pads are each connected to any one of the faces of the stack except one, so-called base which is intended to be in contact with a circuit substrate printed. The formation of the connections of the pellets between them is carried out on the faces of the stack by laser etching.

L'application de ce procédé à la réalisation d'un GPS embarqué sur une munition ne permet pas de satisfaire certaines contraintes volumiques, notamment à cause de la forme parallélipipédique des pastilles et de l'antenne qui est connectée à l'extérieur de celles-ci.Ceci a également pour effet de rendre le dispositif ainsi réalisé très vulnérable quand à sa résistance aux accélérations lors du coup d'envoi de la munition.The application of this process to the realization of an embedded GPS on a munition does not meet certain constraints in particular because of the parallelepipedic shape of the pastilles and the antenna that is connected to the outside of them.This has also the effect of making the device thus made very vulnerable when to its resistance to accelerations when kick off the ammunition.

Le but de l'invention est de palier les inconvénients précités.The object of the invention is to overcome the aforementioned drawbacks.

A cet effet, l'invention a pour objet un procédé de réalisation d'un récepteur d'ondes radioélectriques couplé à une antenne de réception par empilement de pastilles semiconductrices contenant chacune au moins un circuit intégré et comportant des plots de connexion pour raccorder les pastilles entre elles, caractérisé en ce qu'il consiste à métalliser la surface extérieure des pastilles empilées pour créer un plan de masse de l'antenne du récepteur, à recouvrir le plan de masse par un matériau diélectrique, à métalliser la surface du matériau diélectrique et à graver l'antenne du récepteur sur la surface métallisée obtenue.For this purpose, the subject of the invention is a production method of a radio wave receiver coupled to a radio antenna stack receipt of semiconductor pellets containing each at least one integrated circuit and having pads of connection for connecting the pellets to one another, characterized in that metallizing the outer surface of the stacked pellets to create a ground plane of the receiver antenna, to cover the plane of mass by a dielectric material, to metallize the surface of the material dielectric and to etch the receiver antenna on the metallized surface obtained.

L'invention à également pour objet une utilisation du procédé à la mise en oeuvre d'un récepteur GPS embarqué dans une munition. The subject of the invention is also a use of the method of the implementation of a GPS receiver embedded in a munition.

L'invention a principalement pour avantage qu'elle permet une mise en oeuvre de récepteurs d'ondes radioélectrique embarqués à bord de munitions qui leur confère une fiabilité suffisante pour résister aux accélérations aux quelles sont soumis les munitions.De ce fait elle permet d'assurer une plus grande efficacité aux tirs de longue portée car il est connu qu'en l'absence de dispositif de correction de trajectoire, cette efficacité diminue très vite avec la portée de la munition en raison des erreurs de justesse et de dispersion.The main advantage of the invention is that it allows a implementation of onboard radio wave receivers on board of ammunition that gives them sufficient reliability to withstand the accelerations to which ammunition is subjected.For this fact it allows to ensure greater effectiveness in long-range firing as it is known that in the absence of trajectory correction device, this efficiency decreases very quickly with ammunition range due to errors of accuracy and dispersion.

On sait en effet qu'au- delà de 15 km il y a nécessité de corriger la trajectoire alors que pour mettre à distance de sécurité des unités d'artillerie des contrebatteries adverses il faut actuellement envisager des portées de 35 km. A 35 km l'écart type sur la portée est d'environ 600 m et l'écart type latéral est d'environ 200 m.We know that beyond 15 km there is a need for correct the trajectory while to put safe distance from artillery units the opposing counterbatteries it currently takes consider ranges of 35 km. At 35 km the standard deviation on the range is about 600 m and the lateral standard deviation is about 200 m.

Aussi la mise en oeuvre selon l'invention d'un récepteur d'onde radioélectrique par empilement de pastilles semi-conductrices comportant une antenne gravée sur la surface externe des pastilles constitue un bon moyen pour constituer un système d'aide à la navigation embarqué capable de localiser la munition sur sa trajectoire et d'effectuer une correction de trajectoire pour que la munition puisse atteindre son objectif.Also the implementation according to the invention of a wave receiver radioelectric device by stacking semiconductor chips comprising an antenna engraved on the outer surface of the pellets constitutes a good means to constitute an on-board navigation aid system able to locate the ammunition on its trajectory and perform a course correction so that the ammunition can reach its goal.

D'autres caractéristiques et avantages de l'invention apparaítront dans la description qui suit faite en regard des dessins annexés qui représentent :

  • La figure 1 les différentes étapes du procédé selon l'invention sous la forme d'un organigramme.
  • La figure 2 un mode de réalisation de câblage sur film TAB où TAB est l'abréviation anglo-saxonne de "Tape Automated Bounding".
  • La figure 3 un module intégré sans les antennes.
  • La figure 4 un module intégré avec le plan de masse de l'antenne.
  • La figure 5 un module intégré avec substrat de l'antenne.
  • La figure 6 un module GPS intégré en technologie 3D.
  • Les figures 7a, 7b, 7c différents modèles d'intégration.
    • Other features and advantages of the invention will appear in the following description made with reference to the appended drawings which represent:
  • Figure 1 the different steps of the method according to the invention in the form of a flowchart.
  • Figure 2 an embodiment of TAB film wiring where TAB is the abbreviation for "Tape Automated Bounding".
  • Figure 3 an integrated module without antennas.
  • Figure 4 an integrated module with the ground plane of the antenna.
  • Figure 5 an integrated module with substrate of the antenna.
  • Figure 6 an integrated GPS module in 3D technology.
  • Figures 7a, 7b, 7c different integration models.

    • Le procédé selon l'invention se déroule en 6 étapes référencées de 1 à 6 sur la figure 1.The process according to the invention takes place in 6 referenced steps from 1 to 6 in Figure 1.

    L'étape 1 consiste à réaliser de façon connue sous forme de puces d'ASIC, abréviation anglo-saxonne de "Application Specific Integrated Circuit"les composants spécifiques au récepteur GPS.Step 1 consists of producing in a known manner in the form of ASIC chips, English abbreviation for "Application Specific Integrated Circuit "the specific components of the GPS receiver.

    Le câblage des puces ou des composants discrets est réalisé à l'étape 2 sur des circuits imprimés souples type polyamide, époxy ou encore sur film selon le procédé connu sous l'abréviation anglo saxonne TAB de "Tape Automated Bonding". Pour un récepteur GPS ces films peuvent être au nombre de quatre, un film 7 d'alimentation, deux films 8 et 9 contenant l'électronique de traitement du signal et un film 10 pour les circuits hyperfréquence.The wiring of the chips or discrete components is carried out at Step 2 on flexible printed circuits type polyamide, epoxy or still on film according to the method known by the abbreviation Anglo Saxon TAB of "Automated Bonding Tape". For a GPS receiver these movies can be four, a movie 7 feed, two movies 8 and 9 containing the signal processing electronics and a film 10 for microwave circuits.

    Les films 7 à 10 sont enrobés à l'étape 3 dans une résine époxy pour former des pastilles. Au cours de l'étape 3 est également réalisé le découpage pastilles suivant la forme des fenêtres des films TAB et leur empilement les unes au dessus des autres pour former un module récepteur.Les interconnexions entre chaque niveau de film peuvent être réalisées suivant le procédé décrit dans le brevet FR 2 670 323 déjà cité. Après métallisation des faces des pastilles, les interconnexions entre pastilles sont effectuées par gravure laser et les pistes de conduction sont protégées par un dépôt isolant. L'empilage des pastilles est représenté à la figure 3, où les éléments homologues à ceux de la figure 2 sont représentés avec les mêmes références. Des plots 11 de raccordement du module sur un circuit imprimé extérieur non représenté, sont réalisés suivant le procédé connu sous l'abréviation BGA de "Ball Grid Array". Des sorties 12a, 12b de connexion du film hyper à l'antenne sont également réalisés.The films 7 to 10 are coated in step 3 in a resin epoxy to form pellets. During step 3 is also realized the cutting pellets following the shape of the windows of TAB films and stacking them one above the other to form a module The interconnections between each film level can be carried out according to the process described in patent FR 2,670,323 already cited. After metallization of the faces of the pellets, the interconnections between pellets are performed by laser etching and conduction tracks are protected by an insulating deposit. Stacking of the pellets is shown in Figure 3, where the elements homologous to those of the figure 2 are represented with the same references. Plots 11 of connection of the module to an external printed circuit not shown, are carried out according to the process known by the abbreviation BGA of "Ball Grid Array. "Outputs 12a, 12b connecting the hyper film to the antenna are also realized.

    L'étape 4 consiste à effectuer une métallisation représentée à la figure 4 des faces extérieures du module composé des pastilles empilées selon l'étape 3 pour créer le plan de masse de l'antenne.Step 4 consists in carrying out a metallization represented in FIG. 4 of the outer faces of the module composed of pellets stacked according to step 3 to create the ground plane of the antenna.

    A l'étape 5 un dépôt représenté à la figure 5 d'un matériau diélectrique à constante diélectrique élevée est effectué sur les faces du module, ce dépôt est suivi à l'étape 6 par une métallisation et une gravure des antennes 13a, 13b comme montré à la figure 6. Les antennes sont de préférence gravées tout autour du module de façon qu'il y ait toujours une antenne active, c'est-à-dire susceptible de recevoir des données du réseau de satellite GPS lorsque la munition est une rotation sur elle-même.In step 5 a deposit shown in FIG. 5 of a high dielectric constant dielectric material is carried out on the faces of the module, this deposit is followed in step 6 by metallization and etching of the antennas 13 a , 13 b as shown in Figure 6. The antennas are preferably etched all around the module so that there is always an active antenna, that is to say capable of receiving data from the GPS satellite network when the ammunition is a rotation on itself.

    Dans son principe la technologie 3D mise en oeuvre permet d'envisager tout type de formes, et d'utiliser des antennes conformes ou des antennes à micro-ruban encore connue sous la désignation anglo-saxonne "patch" dont la gravure est réalisée à la superficie des modules.In principle, the 3D technology used allows to consider all types of shapes, and to use compliant antennas or micro-ribbon antennas still known as Anglo-Saxon "patch" whose engraving is performed on the surface of the modules.

    Les figures 6a à 6c montre différentes solutions d'intégration capables de satisfaire certaines contraintes volumiques.Figures 6 a to 6c shows different integration solutions capable of satisfying certain volume constraints.

    La figure 6a correspond à une réalisation de module cubique avec antennes "patch" disposées sur quatre faces du cube.FIG. 6 a corresponds to a cubic module embodiment with "patch" antennas arranged on four faces of the cube.

    La figure 6b correspond à une réalisation d'un module cylindrique avec une antenne ruban disposée tout a tour.Figure 6b corresponds to an embodiment of a cylindrical module with a ribbon antenna arranged in turn.

    Enfin la réalisation de la figure 6c est celle d'un module cylindro conique avec antenne multibrins.Finally, the embodiment of Figure 6C is that of a cylindrical module with conical stranded antenna.

    La figure 7 représente un module GPS mis en oeuvre selon le procédé de l'invention, à l'intérieur d'une fusée d'artillerie. Suivant ce mode de réalisation le module GPS 14 est placé dans le nez de la fusée.On peut constater que sa dimension est très petite par rapport à la dimension longitudinale de la fusée qui dans cet exemple est de l'ordre de 145 mm, son diamètre maximum étant de l'ordre de 50 mm.FIG. 7 represents a GPS module implemented according to the method of the invention, within an artillery rocket. Following this embodiment the GPS module 14 is placed in the nose of the rocket.It can be seen that its dimension is very small compared to the longitudinal dimension of the rocket which in this example is of the order of 145 mm, its maximum diameter being of the order of 50 mm.

    La description ci-dessus n'a été faite qu'à titre d'exemple non limitatif en s'appuyant sur une réalisation de type GPS, il va de soit que l'invention peut également s'appliquer à la miniaturisation de tout type de récepteur d'ondes radioélectriques chaque fois notamment que le récepteur est destiné à fonctionner dans un environnement mécanique sévère, tout en occupant un espace très réduit.The description above has been made only as a non limiting relying on a realization of GPS type, it goes without saying that the invention can also be applied to the miniaturization of any type of radio wave receiver whenever including that the receiver is intended to operate in a mechanical environment severe, while occupying a very small space.

    Claims (9)

    1. Method for producing a radio-frequency wave receiver coupled to a reception antenna, by stacking (3) semiconductor wafers each containing at least one integrated circuit and comprising bonding pads to connect the wafers to each other, characterized in that it consists in metallizing (4) the outer surface of the stacked wafers to create a ground plane for the antenna of the receiver, in covering (5) the ground plane with a dielectric material, in metallizing (6) the surface of the dielectric material and in etching the antenna of the receiver on the metallized surface obtained.
    2. Method according to Claim 1, characterized in that the semiconductor wafers are obtained by wiring electronic chips to TAB film followed by coating in an epoxy resin.
    3. Method according to Claims 1 and 2, characterized in that it consists in stacking the wafers by arranging them to form a cube.
    4. Method according to Claim 3, characterized in that it consists in etching patch antennas on the faces of the cube.
    5. Method according to either of Claims 1 and 2, characterized in that it consists in arranging the wafers in the form of a cylinder.
    6. Method according to Claim 5, characterized in that it consists in etching a strip antenna all around the cylinder.
    7. Method according to either of Claims 1 and 2, characterized in that it consists in stacking the wafers by arranging them to form a cone.
    8. Method according to Claim 7, characterized in that it consists in etching the antennas on the surface of the cone.
    9. Use of the method according to any of Claims 1 to 8 for implementing a GAS receiver installed in a weapon or for implementing radio-frequency wave receivers.
    EP99950839A 1998-11-03 1999-10-26 Method for producing radio-frequency wave receivers by interconnecting three dimensional integrated circuits Expired - Lifetime EP1127385B9 (en)

    Applications Claiming Priority (3)

    Application Number Priority Date Filing Date Title
    FR9813814 1998-11-03
    FR9813814A FR2785452B1 (en) 1998-11-03 1998-11-03 METHOD FOR PRODUCING RADIO WAVES RECEIVERS BY INTERCONNECTION OF THREE-DIMENSIONAL INTEGRATED CIRCUITS
    PCT/FR1999/002606 WO2000026992A1 (en) 1998-11-03 1999-10-26 Method for producing radio-frequency wave receivers by interconnecting three dimensional integrated circuits

    Publications (3)

    Publication Number Publication Date
    EP1127385A1 EP1127385A1 (en) 2001-08-29
    EP1127385B1 true EP1127385B1 (en) 2003-09-03
    EP1127385B9 EP1127385B9 (en) 2004-03-03

    Family

    ID=9532311

    Family Applications (1)

    Application Number Title Priority Date Filing Date
    EP99950839A Expired - Lifetime EP1127385B9 (en) 1998-11-03 1999-10-26 Method for producing radio-frequency wave receivers by interconnecting three dimensional integrated circuits

    Country Status (4)

    Country Link
    EP (1) EP1127385B9 (en)
    DE (1) DE69911047T2 (en)
    FR (1) FR2785452B1 (en)
    WO (1) WO2000026992A1 (en)

    Families Citing this family (3)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    DE102004013643A1 (en) * 2004-03-19 2005-10-13 Infineon Technologies Ag Antenna assembly and method of making the same
    US8461542B2 (en) 2008-09-08 2013-06-11 Koninklijke Philips Electronics N.V. Radiation detector with a stack of converter plates and interconnect layers
    FR2940521B1 (en) 2008-12-19 2011-11-11 3D Plus COLLECTIVE MANUFACTURING METHOD OF ELECTRONIC MODULES FOR SURFACE MOUNTING

    Family Cites Families (5)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    FR2670323B1 (en) * 1990-12-11 1997-12-12 Thomson Csf METHOD AND DEVICE FOR INTERCONNECTING THREE-DIMENSIONAL INTEGRATED CIRCUITS.
    US5219377A (en) * 1992-01-17 1993-06-15 Texas Instruments Incorporated High temperature co-fired ceramic integrated phased array package
    US5367308A (en) * 1992-05-29 1994-11-22 Iowa State University Research Foundation, Inc. Thin film resonating device
    US5493305A (en) * 1993-04-15 1996-02-20 Hughes Aircraft Company Small manufacturable array lattice layers
    DE19535962C1 (en) * 1995-09-27 1997-02-13 Siemens Ag Doppler radar module

    Also Published As

    Publication number Publication date
    FR2785452B1 (en) 2003-06-13
    DE69911047T2 (en) 2004-04-29
    WO2000026992A1 (en) 2000-05-11
    FR2785452A1 (en) 2000-05-05
    EP1127385A1 (en) 2001-08-29
    DE69911047D1 (en) 2003-10-09
    EP1127385B9 (en) 2004-03-03

    Similar Documents

    Publication Publication Date Title
    US9172143B2 (en) Electronic device module with integrated antenna structure, and related manufacturing method
    US11671169B2 (en) Radio frequency data downlink for a high revisit rate, near earth orbit satellite system
    CA2701538A1 (en) Onboard antenna system for satellite tracking with polarisation control
    EP2716549A2 (en) Satellite with deployable payload modules
    EP1127385B1 (en) Method for producing radio-frequency wave receivers by interconnecting three dimensional integrated circuits
    EP0512487B1 (en) Antenna with shaped lobe and high gain
    FR2778043A1 (en) Orbitting satellite transmitter/receiver tracker
    FR2727934A1 (en) Geostationary satellite e.g. for telephone and television broadcast applications
    FR2737184A1 (en) GEOSTATIONARY SATELLITE OBSERVATION SYSTEM, USE OF SUCH A SYSTEM AND CORRESPONDING OBSERVATION METHODS
    FR2823569A1 (en) Azimuth information system has overlapping GPS antennas with signal comparison
    EP3097648B1 (en) Communication device on board of an aircraft allowing the reception of data and gps signals
    CA2808511C (en) Flat antenna for a terminal operating in dual circular polarisation, airborne terminal and satellite telecommunication system featuring at least one antenna
    EP3840116B1 (en) Reconfigurable antenna with transmitter network with monolithic integration of elementary cells
    EP1152258A1 (en) Low-cost radar, in particular for high-resolution imaging
    EP3223360B1 (en) Dual-loop antenna for an immersed vehicle
    EP4046241B1 (en) Antenna array
    FR3123513A1 (en) Stack for manufacturing an integrated circuit intended to provide an electromagnetic lens function for a reconfigurable antenna with a transmitter array
    EP0805988B1 (en) Method for automatically lowering the acquisition and tracking thresholds of spread spectrum codes received in orbit
    US6045712A (en) Micromachined reflector antenna method
    FR2947388A1 (en) ANTENNA POINT ASSISTING METHOD, ASSISTED POINT ANTENNA USING THE SAME, AND NOMAD TERMINAL HAVING SUCH ANTENNA
    EP2409425A1 (en) Payload for a satellite with ais, and corresponding method
    EP2293385B1 (en) Self-directing antenna with circular polarisation
    EP2109232B1 (en) Agile satellite with distributed transmission antennas
    FR3023264A1 (en) SATELLITE A MASTER VARIABLE COUPLE
    EP4194344B1 (en) Ttc antenna arrangement for flat satellite

    Legal Events

    Date Code Title Description
    PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

    Free format text: ORIGINAL CODE: 0009012

    17P Request for examination filed

    Effective date: 20010316

    AK Designated contracting states

    Kind code of ref document: A1

    Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

    GRAG Despatch of communication of intention to grant

    Free format text: ORIGINAL CODE: EPIDOS AGRA

    17Q First examination report despatched

    Effective date: 20020214

    GRAG Despatch of communication of intention to grant

    Free format text: ORIGINAL CODE: EPIDOS AGRA

    GRAH Despatch of communication of intention to grant a patent

    Free format text: ORIGINAL CODE: EPIDOS IGRA

    GRAH Despatch of communication of intention to grant a patent

    Free format text: ORIGINAL CODE: EPIDOS IGRA

    GRAA (expected) grant

    Free format text: ORIGINAL CODE: 0009210

    AK Designated contracting states

    Kind code of ref document: B1

    Designated state(s): DE FR GB

    REG Reference to a national code

    Ref country code: GB

    Ref legal event code: FG4D

    Free format text: NOT ENGLISH

    PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

    Ref country code: FR

    Payment date: 20031003

    Year of fee payment: 5

    REF Corresponds to:

    Ref document number: 69911047

    Country of ref document: DE

    Date of ref document: 20031009

    Kind code of ref document: P

    REG Reference to a national code

    Ref country code: IE

    Ref legal event code: FG4D

    Free format text: FRENCH

    GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

    Effective date: 20031229

    REG Reference to a national code

    Ref country code: IE

    Ref legal event code: FD4D

    PLBE No opposition filed within time limit

    Free format text: ORIGINAL CODE: 0009261

    STAA Information on the status of an ep patent application or granted ep patent

    Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

    26N No opposition filed

    Effective date: 20040604

    PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

    Ref country code: FR

    Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

    Effective date: 20050630

    REG Reference to a national code

    Ref country code: FR

    Ref legal event code: ST

    PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

    Ref country code: DE

    Payment date: 20181016

    Year of fee payment: 20

    PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

    Ref country code: GB

    Payment date: 20181009

    Year of fee payment: 20

    REG Reference to a national code

    Ref country code: DE

    Ref legal event code: R071

    Ref document number: 69911047

    Country of ref document: DE

    REG Reference to a national code

    Ref country code: GB

    Ref legal event code: PE20

    Expiry date: 20191025

    PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

    Ref country code: GB

    Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION

    Effective date: 20191025