EP1116181B1 - Module transpondeur et procede permettant de le produire - Google Patents

Module transpondeur et procede permettant de le produire Download PDF

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Publication number
EP1116181B1
EP1116181B1 EP99947274A EP99947274A EP1116181B1 EP 1116181 B1 EP1116181 B1 EP 1116181B1 EP 99947274 A EP99947274 A EP 99947274A EP 99947274 A EP99947274 A EP 99947274A EP 1116181 B1 EP1116181 B1 EP 1116181B1
Authority
EP
European Patent Office
Prior art keywords
metallization
circuit chip
main surface
layer
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP99947274A
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German (de)
English (en)
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EP1116181A1 (fr
Inventor
Andreas Plettner
Karl Haberger
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Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
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Publication of EP1116181A1 publication Critical patent/EP1116181A1/fr
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Publication of EP1116181B1 publication Critical patent/EP1116181B1/fr
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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector

Definitions

  • Transponder modules for electronic labels are from the Patent Abstracts of Japan, publication number 09297535A Japanese application 08109052 and patent abstracts of Japan, publication number 09293130A to the Japanese application 08109051 discloses.
  • an integrated circuit chip together with a The antenna is cast in a film-like resin.
  • This film-like resin is then placed in a metal mold, in which cast an outer resin around the film-like resin becomes.
  • publication number 08216573A to Japanese application 07021785 is one Non-contact IC card that describes a circuit chip and has an antenna section.
  • the circuit chip is on a circuit section that is on a polyester film is provided, attached, the antenna section is formed on the polyester film.
  • an adhesive layer is a second polyester film covering the circuit chip embedded, formed on the first polyester film.
  • a third polyester film using another Adhesive layer on the surface of the second polyester film appropriate.
  • Chip cards have an electrically insulating, one-piece card body on which one or more recesses on one side of it. Furthermore, a Conductor pattern provided on the surface of the card body, the conductor tracks directly on surface areas the card body side provided with at least one recess are attached, being in the recesses or several chips that are connected to at least one of the conductor tracks are contacted, are arranged.
  • FR 2760113 A relates to a manufacturing method a chip card for contactless signal transmission, in which initially a module of an integrated circuit and one Flat coil antenna is made by the ends of the flat coil antenna soldered to pads of the integrated circuit become. Then the integrated circuit chip becomes like this placed in an opening of a plastic carrier that the Flat coil to lie on the surface of the plastic carrier comes and the circuit chip on an adhesive film that the Closes underside of the opening of the plastic carrier, adheres. Another plastic plate is made by means of a connection layer connected to the plastic carrier, such that the antenna and the integrated circuit are encapsulated. Finally, the adhesive layer can be removed.
  • the object of the present invention is methods for the production of an ultra-flat transponder module to accomplish.
  • the present invention is also based on the object an inexpensive by means of mass production technologies producible, ultra-flat transponder module, in particular for an electronic label.
  • the present invention provides methods of making a transponder module with a very low temporal and material expenditure are feasible. In particular they provide a simple assembly and connection technique, that meet the requirements of an inexpensive Mass production oriented.
  • the transponder module according to the invention is a "disposable electronics" suitable because the same from an inexpensive Circuit chip and an inexpensive ecologically accepted Carrier formed by the insulation substrate is exists.
  • the contactless transponder module according to the invention that in a preferred embodiment from a Circuit chip and an antenna coil by one single insulating substrate is held, can between two papers or other thin, flexible substrates, such as. Polymer films to be embedded.
  • the invention Transponder module can be characterized by an extreme low overall height. This makes installation in or between thin substrates possible, with the small Thickness application of the transponder module according to the invention subsequent paper technology processes, such as printing, Laminating, etc., are not affected. Furthermore is the transponder module according to the invention very low in mass, what positive on the material costs and the disposal of the "Disposable electronics" affects.
  • the circuit chip of the transponder module according to the invention usually comes with two electrical connections, which is both a power supply and a bidirectional Ensure data flow.
  • two connections of the circuit chip can all functions of one intelligent labels, for example for contactlessly queryable ones Identification systems of all kinds of simple goods labeling through to tickets.
  • An important aspect with such a transponder module is the connection technology of the circuit chip with the antenna device. Because according to the present invention at least a main surface of the circuit chip with a main surface of the only provided carrier substrate is flush, can make such a connection simple and with a low Thickness order can be carried out. Thus, the present enables Invention a transponder module with a small size and light weight, which is inexpensive on the one hand and on the other hand, high performance and reliability having.
  • the transponder module according to the invention is very small Thickness are common methods for forming a Light protection layer, for example the application of an epoxy drop, the soot particle, can not be used because the thickness of this drop at the thickness of the circuit chip far exceeds.
  • Sun protection can be used in the invention
  • Transponder chip can be realized in that the metallic Pads of the circuit chip on the or the main surfaces thereof are designed such that at least over all active areas of the circuit chip are arranged and thus incidence of light on this prevent active areas. So that's an impairment the functioning of the circuit chip through a generation of charge carriers, caused by incidence of light locked out.
  • this light protection layer can be made from a semiconductor material that has a smaller bandgap has as silicon, or a highly conductive silicide is formed be, with such a light protection layer a very small thickness an excellent light absorption capacity has.
  • the transponder module according to the invention for electronic Labels are used in particularly harsh environments, in which there is, for example, a high level of moisture it is possible on the first and / or second main surface a passivation layer of the insulating carrier substrate a thickness of less than 5 microns, preferably a thickness of 1 ⁇ m.
  • a passivation layer of the insulating carrier substrate a thickness of less than 5 microns, preferably a thickness of 1 ⁇ m.
  • Such a thin passivation layer increases the total thickness of the transponder module only in a way after inserting the transponder module between two layers of paper or the like, the workability, for example the printability of the resultant electronic labels are not affected.
  • the present invention further relates to methods an extremely thin transponder module using suitable connection technologies, through a suitable arrangement of the connections on the circuit chip and by a suitable arrangement to manufacture the circuit chip in a carrier substrate.
  • suitable connection technologies for contacting the circuit chip or for attaching the same on the carrier substrate, a variety known methods are used, for example flip-chip bonding or gluing the circuit chip the substrate by means of a conductive adhesive or by means of an anisotropically conductive adhesive.
  • contacting and simultaneously creating a peripheral Conductor structure carried out by means of a screen printing process become.
  • the Transponder module has an insulating substrate 2, the can be made of any insulating material, on.
  • the insulation substrate 2 can be, for example, a flexible one Be substrate made of a polymer film or paper or plastic.
  • a metallization 4 is preferably applied over the entire surface. Is in a recess of the insulation substrate 2 suitably arranged a circuit chip 6, such that a Pad (not shown) on the lower main surface of the circuit chip in contact with the metallization layer 4 is.
  • a structured metallization 8 On the upper main surface of the insulation substrate 2 is a structured metallization 8 provided that, as shown in Fig. 2, a coil 10 defined with a plurality of windings.
  • the structured Metallization 8 is also formed such that a first terminal end 12 thereof with one in the top Main surface of the circuit chip 6 arranged pad (not shown) is electrically conductively connected.
  • the embodiment of a transponder module shown in Fig. 1 preferably has an overall height of less than 25 ⁇ m, the respective metallization levels 4 and 8 can have a height of about 5 microns, while the Isolation substrate 2 and the circuit chip 6 for example can have a height of approx. 15 ⁇ m.
  • This low height the transponder module can be easily connected by each formed in a main surface of the circuit chip Pads with the metallization layer 4 or reached the connection end 12 of the structured metallization 8 become.
  • This simple connection technique is possible since both main surfaces of the circuit chip 6 are flush with the main surfaces of the insulation substrate 2, so that in each case a direct connection of the metallization levels 4 and 8 with those in the main surfaces of the circuit chip 6 pads formed can be realized.
  • the embodiment shown in FIGS. 1 and 2 applied to the surface of the insulation substrate structured metallization for example using known thin film techniques, screen printing techniques or Stamp techniques are applied.
  • a fine wire can be used, which is laid on the substrate becomes.
  • the wire can be made using thermal compression techniques partially submerged in the substrate.
  • This wire should be as conductive as possible and at the same time be thin, taking care that the wire has a sufficient cross-sectional area so that the quality of the transponder resonant circuit does not become too small.
  • the Wire has a rectangular or elliptical cross-section, to increase the quality without increasing the thickness.
  • the wire can also be made with a thin plastic material be insulated, stripping the plastic jacket achieved on the contacts by the local supply of heat can be.
  • a very thin passivation layer with a thickness of less than 5 microns, preferably a thickness of 1 micron, applied to keep moisture out and contamination as well as to prevent surface leakage currents.
  • Passivation is in particular polymer layers, for example Polyimide, as well as inorganic layers, such as nitrides, Oxides, etc., are suitable.
  • 3a) shows a top view of a transponder module, it can be seen that, compared to FIG. 2, the second Terminal end 12 'of the coil 10 is enlarged such that the same is the upper surface of the circuit chip 6 substantially covered.
  • the metallization for example can have a thickness of 1 ⁇ m can be a reliable one Sun protection can be achieved.
  • 3b) shows like the metallization 12 'of the second connection end with one in the top main surface of the circuit chip 6 provided pad 60 is connected, between the metallization 12 'and the circuit chip 6 one Insulation layer 62 is provided to isolate the Metallization of the semiconductor material of the circuit chip 6 to effect. If such isolation is not necessary, can, as shown in Fig. 3c), the insulation layer 62 omitted.
  • FIG. 4 is another one Schematic cross-sectional representation shown, which illustrates as in the embodiment shown in Fig. 1 by enlarging the connection end 12 to the shown form 12 'to have a sunscreen for the Circuit chip 6 can be achieved.
  • the metallization 4 provided on the back also Sun protection from the back guaranteed.
  • transponder module Preferred embodiments for producing the invention
  • the transponder module will be referenced below 5 to 8 explained in more detail.
  • a method of manufacturing the embodiment shown in FIG. 1 of the transponder module according to the invention is in the 5a) to 5e) are shown.
  • a first subcarrier 100 on which a metallization layer 4 is applied, which in preferred Embodiments of the method according to the invention an area that is the size of the fabricated Corresponds to the transponder module, completely occupied. however the metallization layer 4 can also be a structured one Be metallization.
  • On this metallization layer a circuit chip 6, the one on the underside of the same Has pad (not shown), applied and in same processing step electrically connected.
  • the Auxiliary carrier 100 serves for stabilization, since the metallization layer 4 only a very small thickness in the area of about 5 ⁇ m or less.
  • the circuit chip 6 After the application of the circuit chip 6 is around the same an insulation layer 2 is formed, which directly to the outline of the circuit chip 6 adjoins and the main surface flush with the exposed main surface of the circuit chip 6 is. Consequently, the circuit chip 6 is suitable in a recess of the insulation substrate 2 is arranged. Further an opening 102 is formed in the insulation substrate 2, which is used for a later via connection. This Opening can be done using known methods, for example be generated photolithographically. The resulting Structure is shown in Fig. 5b).
  • the next step is structured metallization on the exposed surface of the insulation substrate 2 and the circuit chip 6 applied.
  • this structured metallization 8 preferably by means of a second auxiliary carrier 104 applied.
  • the second connection end 14 of the structured metallization 8 is above the through hole 102 arranged.
  • the second subcarrier 104 removed, whereupon through hole 102 a via 16 between the front and the back of the transponder module is effected.
  • Such a via can for example by means of thermal compression or an ultrasonic compression can be realized. It is however, it is obvious to those skilled in the art that the through hole 102 even before the structured metallization is applied 8 be filled with a conductive material can to implement via 16.
  • Metallization layers 4 and 8 it is necessary that structured at least one of the two layers is, that is, conductor tracks and contact areas in the same be formed. It is obvious to experts that in the method step shown in Fig. 5a) first one structured metallization, which is a coil with the corresponding Connection ends defined on the first subcarrier 100 can be applied. Then you can then in the a process stage not shown in FIG. 5c) structured metallization layer on the surface of the Isolation substrates are applied. Even with this approach becomes a transponder module shown in Fig. 5d) receive essentially identical transponder module.
  • FIG. 6 is an alternative embodiment of an inventive Procedure shown with the same a transponder module, as shown in Fig. 1, obtained becomes.
  • Fig. 6a first again a metallization layer 4 on a first auxiliary carrier applied.
  • Fig. 6b is now on the Metallization layer 4 with the insulation substrate 2 therein formed recesses 110 and 102 generated.
  • the recess 110 serves to accommodate the circuit chip 6, which follows is inserted into the recess, as by the arrow 112 in Fig. 6b).
  • the recess 102 in turn serves for the production of a via.
  • the recesses 110 and 102 in the insulation substrate 2 for example using conventional lithographic Techniques can be formed. Otherwise, can be an insulation layer already provided with the recesses applied to the metallization layer 4 become.
  • a via can be produced by drilling a hole in the insulation layer and a wire through opening 102 to the metallization level 4 is performed here. Drilling can be done mechanically, by laser radiation, by ultrasound radiation or also by a chemical wet or Dry etching is done. In chemical hole production a lithography process can be dispensed with if the application of the caustic substance can be limited locally can, for example through a cannula with suction Residues. Simultaneously with the formation of the through hole 102 is preferably the recess 110 in the insulation layer made for the circuit chip, meaningfully the same procedures as for the formation of the Through hole 102 can be used.
  • circuit chip 6 corresponds to Structure of the method according to FIG. 6, which is shown in Fig. 5b).
  • the further process steps thus correspond to those of the referring to FIG. 5a) to 5e) described embodiment, wherein in Fig. 6c) the structured one applied to the second auxiliary carrier 104 Metallization 8 is shown that on the insulation substrate 2 and the circuit chip 6 is applied, as shown by an arrow 114. 6d) to 6f) correspond to FIGS. 5b) to 5d).
  • FIG. 7 A third embodiment of the method according to the invention will now be described with reference to FIG. 7. there correspond to the method steps shown in FIGS. 7a) and 7b) the method described in FIGS. 6a) and 6b) before inserting the circuit chip 6.
  • the metallization layer 120 can in turn by means of a second auxiliary carrier are applied or will be alternative structured from a flat metal layer.
  • a metallization layer can cover the entire surface generated by electrodeposition on the substrate and then be structured. However, it becomes a structured one Metallization applied using an auxiliary carrier, the subcarrier is immediately removed.
  • the circuit chip 6 brought up which is attached to a third submount 106 can be.
  • the overlapping End 122 be mechanically bent up, as by an arrow 124 in Fig. (7e). This will make the recess 110 fully opened so that the circuit chip 6 in the same placed (arrow 126) and at the same time a conductive Connection between one provided in the bottom of the same Pad (not shown) and the metallization layer 4 can be produced.
  • This contacting can by means of known methods, for example soldering or gluing by means of an anisotropically conductive Glue are carried out.
  • the finished Obtain transponder module which is shown in Fig. 9g) is, the structure of which is essentially that of the in Fig. 1 corresponds to the embodiment shown, wherein only the first connection end 122 of the structured metallization 120 has a different shape that the above described bending and bending back of the same enables.
  • FIG. 8a A final alternative embodiment for manufacturing of a transponder module in which the circuit chip pads in both main surfaces thereof, is explained below with reference to FIG. 8.
  • a Insulation layer 2 is formed, as shown in Fig. 8c).
  • the Circuit chip 6 first on a structured metallization 8, which is applied to a second auxiliary carrier 128 is applied such that a pad (not shown) in a first main surface of the same with a first connection end 12 of the structured metallization 8 Is conductively connected, see Fig. 8b).
  • the so on that Subcarrier 128 attached chip is then in the recess 110 introduced, see arrow 130, the auxiliary carrier 128 serves as a handling aid.
  • transponder module essentially the structure shown in Fig. 1 having.
  • Subcarriers are used. These subcarriers can each be applied by various detachable methods, for example by means of releasable adhesive layers. alternative can have a holding effect due to negative pressure, electrostatic Attraction, magnetism, etc.
  • thermocompression Insulation substrate so that the same after this Insertion fitted in a recess of the insulation substrate is arranged.
  • thermocompression process can be advantageous in that the walls of the Isolation substrates absolutely conform to the adjacent walls of the circuit chip are.
  • the present invention has been made with reference to each Transponder module explained in which the antenna device is realized by a coil. However, it is obvious that the present invention with another peripheral circuitry that defines an antenna device, is feasible.
  • the small thickness of the transponder modules according to the invention can be an effective light shield at preferred Embodiments are effected by a light shield through a suitable design of the connection surfaces is realized.
  • Another thickness reduction can be achieved by the structured metallization through a wire with an elliptical or rectangular Cross section is realized using a thermocompression process using ultrasound or Some or all of the heat is sunk into the insulation substrate becomes.
  • Etching the required vias can preferably by local supply of an etchant, for example, take place through a cannula, at the same time the residues through the same or a second cannula be sucked off.
  • the required Vias through the insulation substrate can be realized in a variety of ways. For example can, as with reference to the figures respectively a via connection has been described, by forming a through hole in the insulation substrate is subsequently filled with a metallization becomes. Alternatively, the vias can be made using Thermocompression processes are made. moreover can use the required structured metallizations on the one hand, by first forming a Metallization layer is applied over the entire surface and is structured below. Alternatively, one can already structured metallization layer by means of an auxiliary carrier be applied.
  • the methods of the invention can be used to produce a A plurality of transponder modules are advantageously used, when insulation substrates bonded to side surfaces thereof are used, which are then in tape form, so to speak can be fed to the respective processing stations.
  • the Outlines of the individual insulation substrates can by Perforations can be defined, separating the isolation substrates then done along the perforations. alternative the perforations can only be made after completion of the transponder modules.
  • the present invention thus creates ultra-thin transponder modules, which especially for use as disposable electronics Suitable in contactless electronic labels are.
  • the same can advantageously be used between two layers of paper or thin polymer films are inserted, whereby due to the small thickness of the transponder modules according to the invention a later treatment of the electronic generated in this way Labels, for example printing is not affected becomes.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Semiconductor Integrated Circuits (AREA)

Claims (13)

  1. Procédé pour produire un module transpondeur, aux étapes suivantes consistant à :
    appliquer une couche de métallisation (4) sur un premier support auxiliaire (100) ;
    appliquer sur la couche de métallisation (4) une puce de circuit (6) avec une première face de raccordement sur une première surface principale de cette dernière et une seconde face de raccordement sur une seconde surface principale, opposée à la première surface principale, de cette dernière, de sorte que la seconde face de raccordement soit assemblée de manière conductrice avec la couche de métallisation (4) ;
    générer une couche isolante (2) sur la couche de métallisation (4), de sorte que la puce de circuit (6) soit entourée par la couche isolante (2) et que la surface, éloignée de la couche de métallisation, de la couche isolante (2) se trouve à plat sur la première surface, éloignée de la couche de métallisation, de la puce de circuit (6) ;
    générer une métallisation structurée (8) avec une première et une seconde extrémité de connexion (12, 14), définissant un dispositif d'antenne, sur la couche isolante (2) et la puce de circuit (6), de sorte que la première extrémité de connexion (12) soit assemblée avec la première face de raccordement de la puce de circuit (6) ;
    générer une mise en contact traversante (16) dans la couche isolante (2), pour assembler de manière conductrice la seconde extrémité de connexion (14) de la métallisation structurée (8) avec la couche de métallisation (4) ; et
    éliminer le premier support auxiliaire (100).
  2. Procédé pour produire un module transpondeur, aux étapes suivantes consistant à :
    appliquer une couche de métallisation (4) sur un premier support auxiliaire (100) ;
    générer une couche isolante (2) sur la couche de métallisation (4) ;
    introduire une puce de circuit (6) avec une première face de raccordement sur une première surface principale de cette dernière et une seconde face de raccordement sur une seconde surface principale, opposée à la première surface principale, de cette dernière dans un évidemment (110) de la couche isolante (2) traversant la couche isolante (2) jusqu'à la couche de métallisation (4), de sorte que la première surface principale, éloignée de la couche de métallisation, de la puce de circuit (6) se trouve sensiblement à plat sur la surface, éloignée de la couche de métallisation, de la couche isolante (2), un assemblage conducteur étant ainsi créé entre la seconde face de raccordement et la couche de métallisation (4) ;
    générer une métallisation structurée (8) avec une première et une seconde extrémité de connexion (12, 14), définissant un dispositif d'antenne, sur la couche isolante (2) et la puce de circuit (6), de sorte que la première extrémité de connexion (12) soit assemblée avec la première face de raccordement de la puce de circuit (6) ;
    générer une mise en contact traversante (16) dans la couche isolante (2), pour assembler de manière conductrice la seconde extrémité de connexion (14) de la métallisation structurée (8) avec la couche de métallisation (4) ; et
    éliminer le premier support auxiliaire (100).
  3. Procédé pour produire un module transpondeur, aux caractéristiques suivantes :
    appliquer une couche de métallisation (4) sur un premier support auxiliaire (100) ;
    générer une couche isolante (2) sur la couche de métallisation (4) ;
    générer une métallisation structurée (120) avec une première extrémité de raccordement (122) et une seconde extrémité de raccordement (124), définissant un dispositif d'antenne, sur la couche isolante (2), de sorte qu'un segment de la première extrémité de raccordement (122) de la métallisation structurée recouvre l'évidement (110);
    replier le segment recouvrant de la première extrémité de raccordement (122) ;
    introduire une puce de circuit (6) avec une première face de raccordement sur une première surface principale de cette dernière et une seconde face de raccordement sur une seconde surface principale, opposée à la première surface principale, de cette dernière dans un évidement (110) dans la couche isolante (2) traversant la couche isolante (2) jusqu'à la couche de métallisation (4), de sorte que la première surface principale, éloignée de la couche de métallisation, de la puce de circuit (6) se trouve sensiblement à plat sur la surface, éloignée de la couche de métallisation (4), de la couche isolante (2), un assemblage conducteur étant ainsi créé entre la seconde face de raccordement et la couche de métallisation (4) ;
    plier le segment replié de la première extrémité de raccordement (122) de la couche de métallisation structurée (120) sur la puce de circuit (6), pour créer un assemblage conducteur entre la première extrémité de raccordement (122) et la première face de raccordement de la puce de circuit (6) ;
    générer une mise en contact traversante (16) dans la couche isolante (2), pour assembler de manière conductrice la seconde extrémité de connexion de la métallisation structurée (120) avec la couche de métallisation (4) ; et
    éliminer le premier support auxiliaire (100).
  4. Procédé selon l'une des revendications 1 à 3, dans lequel la métallisation structurée (8 ; 120) est générée, à l'aide d'un second support auxiliaire (104), sur la couche isolante (2), le second support auxiliaire (104) étant ensuite éliminé.
  5. Procédé pour produire un module transpondeur, aux étapes suivantes consistant à :
    appliquer une couche de métallisation (4) sur un premier support auxiliaire (100) ;
    générer une couche isolante (2) sur la couche de métallisation (4) ;
    générer une métallisation structurée (8) avec une première et une seconde extrémité de connexion (12, 14), définissant un dispositif d'antenne, sur un second support auxiliaire (128);
    appliquer sur la métallisation structurée (8) une puce de circuit (6) avec une première face de raccordement sur une première surface principale de cette dernière et une seconde face de raccordement sur une seconde surface principale, opposée à la première surface principale, de cette dernière, de sorte que la première face de raccordement soit assemblée avec la première extrémité de connexion (12) de la métallisation structurée (8) ;
    introduire la puce de circuit (6) dans un évidemment (110) de la couche isolante (2) traversant la couche isolante (2) jusqu'à la couche de métallisation (4), de sorte que la première surface principale, éloignée de la couche de métallisation (4), de cette dernière se trouve sensiblement à plat sur la surface, éloignée de la couche de métallisation (4), de la couche isolante (2), que la seconde face de raccordement soit assemblée de manière conductrice avec la couche de métallisation (4) et que la métallisation structurée (8) soit appliquée sur la surface, éloignée de la couche de métallisation (4), de la couche isolante (2) ;
    éliminer le second support auxiliaire (128) ;
    générer une mise en contact traversante (16) dans la couche isolante (2), pour assembler de manière conductrice la seconde extrémité de connexion (14) de la métallisation structurée (8) avec la couche de métallisation (4) ; et
    éliminer le premier support auxiliaire.
  6. Procédé selon l'une des revendications 1 à 5, dans lequel la métallisation structurée (8 ; 120) définit une bobine hélicoïdale (10) comme dispositif d'antenne.
  7. Procédé selon l'une des revendications 2, 3 ou 5, dans lequel l'évidement est formé dans la couche isolante en introduisant la puce de circuit dans la couche isolante à l'aide d'un procédé de thermocompression.
  8. Procédé selon la revendication 2 ou 5, dans lequel l'évidemment (110 ; 210) est généré avec l'introduction de la puce de circuit (6 : 20) dans la couche isolante (2 ; 22).
  9. Module transpondeur, aux caractéristiques suivantes :
    une couche (2) d'un matériau isolant, prévue comme substrat de support unique ;
    un dispositif d'antenne (8) formé sur une première surface principale du substrat de support (2) ;
    une puce de circuit (6) sans boítier disposée dans un évidement du substrat de support (2), de telle sorte qu'une première surface principale de la puce de circuit (6) se trouve sensiblement à plat sur la première surface principale du substrat de support (2) et qu'une seconde surface principale de la puce de circuit (6), opposée à la première surface principale, se trouve à plat sur une seconde surface principale du substrat de support (2) opposée à la première surface principale du substrat de support (2) ;
    aménagements de connexion électrique (4, 12, 14) entre la puce de circuit (6) et le dispositif d'antenne (8),
       caractérisé par le fait
    que sur la seconde surface principale du substrat de support (2) est prévue, sensiblement sur toute la surface, une couche de métallisation (4),
    que la puce de circuit (6) présente au moins une face de raccordement sur la première surface principale de celle-ci et au moins une face de raccordement sur la seconde surface principale de celle-ci, et
    qu'une première extrémité de raccordement (12) du dispositif d'antenne est assemblée de manière conductrice avec la première face de raccordement de la puce de circuit et qu'une seconde extrémité de raccordement (14) du dispositif d'antenne est assemblée de manière conductrice, par l'intermédiaire d'une mise en contact traversante (16) dans le substrat de support (2) et la couche de métallisation (4) prévue sur la seconde surface principale du substrat de support (2), avec la seconde face de raccordement de la puce de circuit.
  10. Module transpondeur selon la revendication 9, dans lequel le dispositif d'antenne (8) est une bobine (10) formée par une métallisation structurée en spirale sur la première surface principale du substrat de support (2).
  11. Module transpondeur selon la revendication 10, dans lequel la métallisation sur la première surface principale du substrat de support est noyée du moins partiellement dans le substrat de support.
  12. Module transpondeur selon l'une des revendications 9 à 11, dans lequel la puce de circuit présente sur sa première et/ou la seconde surface principale une couche de protection contre la lumière réalisée en métal ou en un matériau semi-conducteur présentant un plus petit intervalle de bande que le silicium, ou en un siliciure hautement conducteur.
  13. Etiquette électronique avec un module transpondeur selon l'une des revendications 9 à 12, le module transpondeur étant disposé, sans autre mise sous boítier de celui-ci, entre deux couches de papier ou de minces films polymères.
EP99947274A 1998-09-03 1999-09-02 Module transpondeur et procede permettant de le produire Expired - Lifetime EP1116181B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19840220A DE19840220A1 (de) 1998-09-03 1998-09-03 Transpondermodul und Verfahren zur Herstellung desselben
DE19840220 1998-09-03
PCT/EP1999/006467 WO2000014680A1 (fr) 1998-09-03 1999-09-02 Module transpondeur et procede permettant de le produire

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EP1116181A1 EP1116181A1 (fr) 2001-07-18
EP1116181B1 true EP1116181B1 (fr) 2002-11-13

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EP (1) EP1116181B1 (fr)
AT (1) ATE227867T1 (fr)
AU (1) AU6079799A (fr)
DE (2) DE19840220A1 (fr)
WO (1) WO2000014680A1 (fr)

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US6774470B2 (en) 2001-12-28 2004-08-10 Dai Nippon Printing Co., Ltd. Non-contact data carrier and method of fabricating the same
US6777829B2 (en) * 2002-03-13 2004-08-17 Celis Semiconductor Corporation Rectifier utilizing a grounded antenna
DE10235771A1 (de) * 2002-08-05 2004-02-26 Texas Instruments Deutschland Gmbh Gekapselter Chip und Verfahren zu seiner Herstellung
EP1724712A1 (fr) * 2005-05-11 2006-11-22 Stmicroelectronics Sa Micromodule, notamment pour carte à puce
EP1816592A1 (fr) * 2006-02-06 2007-08-08 Assa Abloy Identification Technology Group AB Procédé de production d'une étiquette de type RFID avec au moins une antenne comprenant deux extrémités et une puce de circuit intégré
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
EP2070017B2 (fr) † 2006-09-26 2014-09-24 Féinics AmaTech Teoranta Procédé de connexion d'une antenne à une puce de transpondeur et incrustation de transpondeur correspondante
EP2070014B1 (fr) * 2006-09-26 2016-05-25 HID Global GmbH Procédé et appareil permettant de créer une incrustation de radiofréquence
ES2355682T3 (es) 2007-09-18 2011-03-30 Hid Global Ireland Teoranta Procedimiento para la unión de un conductor de cable dispuesto sobre un sustrato.
DE102009012255A1 (de) * 2009-03-07 2010-09-09 Michalk, Manfred, Dr. Schaltungsanordnung
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WO2019008159A1 (fr) * 2017-07-06 2019-01-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Dispositif et procédé de sécurisation d'un produit
FR3123778A1 (fr) * 2021-06-07 2022-12-09 Eyco Procédé de fabrication d’un circuit imprimé intégrant un composant électronique et module de carte à puce obtenu par ledit procédé.
DE102021119190A1 (de) 2021-07-23 2023-01-26 Infineon Technologies Ag Verfahren zum Herstellen einer Dokumentenstruktur und Dokumentenstruktur

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Also Published As

Publication number Publication date
DE19840220A1 (de) 2000-04-20
WO2000014680A1 (fr) 2000-03-16
EP1116181A1 (fr) 2001-07-18
ATE227867T1 (de) 2002-11-15
AU6079799A (en) 2000-03-27
DE59903426D1 (de) 2002-12-19

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