EP1026742A3 - Solder ball grid array for connecting multiple millimeter wave assemblies - Google Patents

Solder ball grid array for connecting multiple millimeter wave assemblies Download PDF

Info

Publication number
EP1026742A3
EP1026742A3 EP00101673A EP00101673A EP1026742A3 EP 1026742 A3 EP1026742 A3 EP 1026742A3 EP 00101673 A EP00101673 A EP 00101673A EP 00101673 A EP00101673 A EP 00101673A EP 1026742 A3 EP1026742 A3 EP 1026742A3
Authority
EP
European Patent Office
Prior art keywords
coaxial
solder ball
grid array
ball grid
interconnection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00101673A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1026742A2 (en
Inventor
William D. Bjorndahl
D. Ian Stones
Kenneth C. Selk
Roger A. Davidheiser
Alfred E. Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northrop Grumman Corp
Original Assignee
TRW Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TRW Inc filed Critical TRW Inc
Publication of EP1026742A2 publication Critical patent/EP1026742A2/en
Publication of EP1026742A3 publication Critical patent/EP1026742A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/045—Coaxial joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H01L2223/6622—Coaxial feed-throughs in active or passive substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Waveguides (AREA)
  • Combinations Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
EP00101673A 1999-02-05 2000-02-02 Solder ball grid array for connecting multiple millimeter wave assemblies Withdrawn EP1026742A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US245317 1999-02-05
US09/245,317 US6194669B1 (en) 1999-02-05 1999-02-05 Solder ball grid array for connecting multiple millimeter wave assemblies

Publications (2)

Publication Number Publication Date
EP1026742A2 EP1026742A2 (en) 2000-08-09
EP1026742A3 true EP1026742A3 (en) 2002-10-23

Family

ID=22926180

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00101673A Withdrawn EP1026742A3 (en) 1999-02-05 2000-02-02 Solder ball grid array for connecting multiple millimeter wave assemblies

Country Status (3)

Country Link
US (1) US6194669B1 (ja)
EP (1) EP1026742A3 (ja)
JP (1) JP3292719B2 (ja)

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US6066516A (en) 1995-06-26 2000-05-23 Seiko Epson Corporation Method for forming crystalline semiconductor layers, a method for fabricating thin film transistors, and method for fabricating solar cells and active matrix liquid crystal devices
JP3393469B2 (ja) 1999-07-15 2003-04-07 日本電気株式会社 薄膜半導体素子の製造方法及び薄膜半導体形成装置
US6639154B1 (en) * 2000-10-10 2003-10-28 Teradyne, Inc. Apparatus for forming a connection between a circuit board and a connector, having a signal launch
JP2002298962A (ja) * 2001-03-30 2002-10-11 Jst Mfg Co Ltd 樹脂ハンダを用いた電気接触子、電気コネクタ及びこれらのプリント配線板への接続方法
JP2002298940A (ja) * 2001-03-30 2002-10-11 Jst Mfg Co Ltd 樹脂ハンダを用いた電気接触子、電気コネクタ及びこれらのプリント配線板への接続方法
JP2002298995A (ja) * 2001-03-30 2002-10-11 Jst Mfg Co Ltd 樹脂ハンダを用いた同軸ケーブルの結束部材及び同軸ケーブルの電気コネクタ並びに結束部材の同軸ケーブル又は電気コネクタへの接続方法
JP2002298938A (ja) * 2001-03-30 2002-10-11 Jst Mfg Co Ltd 樹脂ハンダを用いたツイストペアケーブルの電気コネクタ及びこの電気コネクタへの電線接続方法
JP2002298946A (ja) * 2001-03-30 2002-10-11 Jst Mfg Co Ltd 樹脂ハンダを用いた電気接続具、電気コネクタ及びこれらへの電線接続方法
US6727777B2 (en) 2001-04-16 2004-04-27 Vitesse Semiconductor Corporation Apparatus and method for angled coaxial to planar structure broadband transition
WO2003049149A2 (en) * 2001-11-30 2003-06-12 Vitesse Semiconductor Corporation Apparatus and method for inter-chip or chip-to-substrate connection with a sub-carrier
WO2004105128A1 (ja) 2003-05-20 2004-12-02 Fujitsu Limited 半導体パッケージ
US6768189B1 (en) * 2003-06-04 2004-07-27 Northrop Grumman Corporation High power chip scale package
US6933596B2 (en) * 2003-07-01 2005-08-23 Northrop Grumman Corporation Ultra wideband BGA
WO2005036644A2 (en) * 2003-10-10 2005-04-21 Koninklijke Philips Electronics N.V. Electronic device and carrier substrate
US20060226928A1 (en) * 2005-04-08 2006-10-12 Henning Larry C Ball coax interconnect
US20070251719A1 (en) * 2006-04-27 2007-11-01 Rick Sturdivant Selective, hermetically sealed microwave package apparatus and methods
CN101572228B (zh) * 2008-04-28 2011-03-23 中芯国际集成电路制造(北京)有限公司 多晶硅薄膜及栅极的形成方法
US8680689B1 (en) 2012-10-04 2014-03-25 International Business Machines Corporation Coplanar waveguide for stacked multi-chip systems
EP2945222A1 (en) * 2014-05-14 2015-11-18 Gapwaves AB A microwave or millimeter wave RF part using pin grid array (PGA) and/or ball grid array (BGA) technologies
CN112086371B (zh) * 2020-08-19 2023-03-14 中国电子科技集团公司第二十九研究所 宽带射频板级互连集成方法、结构及装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0604005A1 (en) * 1992-10-26 1994-06-29 Texas Instruments Incorporated Device packaged in a high interconnect density land grid array package having electrical and optical interconnects
US5331514A (en) * 1991-08-05 1994-07-19 Ngk Spark Plug Co., Ltd. Integrated-circuit package
US5347086A (en) * 1992-03-24 1994-09-13 Microelectronics And Computer Technology Corporation Coaxial die and substrate bumps
JPH08236655A (ja) * 1995-02-27 1996-09-13 Shinko Electric Ind Co Ltd Ｂｇａパッケージと該パッケージの実装構造
JPH10178144A (ja) * 1996-12-19 1998-06-30 Fujitsu Ltd Ｂｇａ型電子部品の同軸電極構造

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7003475A (ja) * 1969-03-28 1970-09-30
US4295183A (en) 1979-06-29 1981-10-13 International Business Machines Corporation Thin film metal package for LSI chips
US5376584A (en) 1992-12-31 1994-12-27 International Business Machines Corporation Process of making pad structure for solder ball limiting metallurgy having reduced edge stress
US5401912A (en) * 1993-06-07 1995-03-28 St Microwave Corp., Arizona Operations Microwave surface mount package
US5456004A (en) 1994-01-04 1995-10-10 Dell Usa, L.P. Anisotropic interconnect methodology for cost effective manufacture of high density printed circuit boards
US5593082A (en) 1994-11-15 1997-01-14 Tosoh Smd, Inc. Methods of bonding targets to backing plate members using solder pastes and target/backing plate assemblies bonded thereby
SE9502326D0 (sv) * 1995-06-27 1995-06-27 Sivers Ima Ab Mikrovågskrets, sådan krets av kapslat utförande, samt användning av mikrovågskretsen i ett kretsarrangemang
JP4195731B2 (ja) * 1996-07-25 2008-12-10 富士通株式会社 多層プリント板及びこれを利用した高周波回路装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5331514A (en) * 1991-08-05 1994-07-19 Ngk Spark Plug Co., Ltd. Integrated-circuit package
US5347086A (en) * 1992-03-24 1994-09-13 Microelectronics And Computer Technology Corporation Coaxial die and substrate bumps
EP0604005A1 (en) * 1992-10-26 1994-06-29 Texas Instruments Incorporated Device packaged in a high interconnect density land grid array package having electrical and optical interconnects
JPH08236655A (ja) * 1995-02-27 1996-09-13 Shinko Electric Ind Co Ltd Ｂｇａパッケージと該パッケージの実装構造
JPH10178144A (ja) * 1996-12-19 1998-06-30 Fujitsu Ltd Ｂｇａ型電子部品の同軸電極構造

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 01 31 January 1997 (1997-01-31) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 11 30 September 1998 (1998-09-30) *

Also Published As

Publication number Publication date
EP1026742A2 (en) 2000-08-09
JP3292719B2 (ja) 2002-06-17
JP2000232197A (ja) 2000-08-22
US6194669B1 (en) 2001-02-27

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Inventor name: DAVIDHEISER, ROGER A.

Inventor name: BJORNDAHL, WILLIAM D.

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Inventor name: SELK, KENNETH C.

Inventor name: LEE, ALFRED E.

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