EP1021575B1 - Copper based alloy featuring precipitation hardening and solid-solution hardening - Google Patents
Copper based alloy featuring precipitation hardening and solid-solution hardening Download PDFInfo
- Publication number
- EP1021575B1 EP1021575B1 EP98943252A EP98943252A EP1021575B1 EP 1021575 B1 EP1021575 B1 EP 1021575B1 EP 98943252 A EP98943252 A EP 98943252A EP 98943252 A EP98943252 A EP 98943252A EP 1021575 B1 EP1021575 B1 EP 1021575B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- alloy
- content
- hardening
- strength
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
Definitions
- This invention relates to a copper alloy, particularly a copper alloy that is especially useful in electrical and electronic interconnection components and switch applications, including high temperature switching. This alloy shows special promise in "spring type” applications.
- U.S. Patent No. 5,041,176 discloses a copper alloy including from 0.1-10% nickel (Ni); 0.1-10% tin (Sn); 0.05-5% silicon (Si); 0.01-5% iron (Fe); and 0.0001-1% boron (B), by weight.
- This disclosure requires formation of an Ni-Si intermetallic compound homogeneously dispersed in the alloy. Fe is required for age hardening. However, at Fe concentrations greater than 5%, electrical conductivity is compromised and corrosion becomes a serious problem.
- B is incorporated into the alloy to improve corrosion resistance, hardness and strength. High hardness is achieved by precipitation hardening at a tempering temperature of 400° to 450°C. Si also serves as a deoxidizer.
- the Mikawa alloy is suitable for use in electronic parts where good electrical conductivity, heat conductivity, strength, hardness, plating ability, soldering ability, elasticity, and corrosion resistance including resistance to acids are required, this alloy is of a different composition and displays different characteristics from those obtainable according to the instant invention.
- Kubosonc et al. U.S. Patent No. 5,516,484.
- Kubosono et al. discloses copper-nickel based alloys that are processed using horizontal continuous casting with a graphite mold.
- the Ni-Cu alloy system is essentially a different alloy than the alloy of the instant invention.
- copper (Cu) is an undesired impurity whose content must be kept below 0.02%.
- Kubosono et al. teaches that effects obtainable by addition of Si cannot be recognized if no B is present.
- U.S. Patent No. 5,334,346 to Kim et al. discloses a high performance copper alloy for electrical and electronic parts.
- the Kim alloy consists essentially of copper and 0.5 to 2.4% by weight Ni; 0.1-0.5% Si; 0.02 to 0.16% P; and 0.02 to 0.2% magnesium (Mg).
- Kim et al. discusses precipitation hardening where Ni 2 Si and Ni 3 P precipitate in the copper matrix. Any excess of free Si and P, is taught as causing formation of brittle intermetallic compounds which lead to peeling and cracking.
- Mg is proposed as a scavenger element to remove free Si and P. However, as content of Mg increases, conductivity and utility of the alloy are compromised. Zinc (Zn) and Fe are also disclosed as possible scavengers. This alloy does not contain Sn.
- Hashizume et al. U.S. Patent No. 5,064,611 discloses a process for producing a copper alloy that contains 1-8% Ni; 0.1-0.8% P; 0.6-1.0% Si; optionally, 0.03 to 0.5% Zn; and Cu.
- Ni 5 P 2 and Ni 2 Si are disclosed as intermetallic compounds for increasing mechanical strength of the alloy with minimal decrease in electrical conductivity. Sn is not present in this alloy.
- U.S. Patent No. 5,021,105 discloses an alloy comprising 2.0-7.0% Sn; 1.0-6.0% Ni, cobalt (Co) or chromium (Cr); 0:1-2.0% Si; and Cu.
- This alloy may be processed to exhibit elongation of 3-20%; strength of 70-100 kg/mm 2 ; and electroconductivity from 10-30% IACS.
- Ni is disclosed as being important for strengthening; Cr is disclosed as improving hot rolling properties and heat resistance; and Co is disclosed as contributing to effective heat resistance.
- Sn content is limited to 7% by the hot rolling method used to process the alloy.
- Asai et al. does not disclose phosphorus (P) as a constituent. Accordingly, this alloy suffers similar limitations to Mikawa et al., as discussed above.
- Arita et al. U.S. Patent No. 4,337,089, discloses a Cu-Ni-Sn alloy containing 0.5-3.0% Ni; 0.3-0.9% Sn; 0.01-0.05% P; 0.0-0.35% manganese (Mn) or Si; and Cu.
- This alloy features 60 kg/mm 2 tensile strength and elongation of more than 6% (i.e., to provide the mechanical property necessary for bend working) by combining heat treatment and cold rolling in its processing.
- Si or Mn is incorporated to enhance strength.
- the low Sn content disclosed in Arita et al. does not provide the combined formability-strength properties of the instant invention.
- U.S. Patent No. 5,132,083 teaches a laser padding material which is a powder containing 1-5% Ni; 0.2-5% Si; less than 1% B; less than 2% P; less than 3% Mn; and Cu. Sn and lead (Pb) are optional ingredients, at 8-15% for each.
- This powder can be laser processed to produce a copper laser padding material excellent in sliding-abrasion resistance.
- the chemistries involved in laser padding are not the same as in the alloy of the instant invention. For example, no rolling, hot or cold, is used to process the padding material.
- UNS Unified Numbering System
- This system is in common use in North America and uses a five digit (recently expanded from three digit) numbering following a C prefix.
- the numbering system is not a specification, but rather a useful number code for identifying mill and foundry products.
- the C designations appearing below refer to the UNS numbers.
- the general art that includes alloys thus includes many patentable alloys that are similar in some respects in composition, but that display different desired properties depending on the specific content and processing of the alloy.
- UNS alloy C85800 is a leaded yellow brass containing 1.5% Sn, 1.5% Pb, 31-41% Zn, 0.5% Fe, 0.05%Sb, 0.5% Ni (incl Co), 0.25% Mn, 0.05% As, 0.05% S, 0.01% P, 0.55% Al, 0.25% Si and 57.0% minimum Cu.
- the document JP-A-02 197 543 discloses a copper alloy for a connecting device comprising Ni : 1.5-6.0 wt% ; Si : 0.1-3.0 wt% ; P: 0.12-1.0 wt%; Sn : 1.2-4.2 wt%; O 2 : 20 ppm or less ; S: 10 ppm or less; balance Cu and unavoidable impurities.
- the present invention provides a phosphor bronze alloy with characteristics much improved over those known in the art.
- the invention provides an alloy that when processed has desired spring and strength properties and superior durability especially at higher temperatures at an economic price.
- a particle dispersion enhanced phosphor bronze in accordance with the present invention includes a nickel content of from 0.4 to 3.0% by weight; a Si content of from 0.1 to 1.0% by weight; a P content of from 0.01-0.06% by weight; a Sn content of 3.0-11.0% by weight ; balance copper with unavoidable impurities. Sn enhances formability at a given level of strength. P helps impart optimal spring and strength properties as well as providing fluidity in casting copper based alloys. P also aids in deoxidation of the melt. P is the primary deoxidizer of the melt. Si is not lost in uncontrolled quantities in the melting process, which permits maintaining a stoichiometrical relationship between Si and Ni in the alloy.
- Sn content of below 8% and P content of 0.01-0.2% by wt. are especially preferred in some embodiments.
- Solid solution hardening is contributed by tin, phosphorous and copper, while precipitation hardening resides in nickel silicide and nickel phosphides precipitated in the matrix.
- Solid solution of a copper base occurs when the alloying element is dissolved to form a homogenous liquid solution.
- the alloying metal goes into solution to form a solid solution.
- the alloying element thereby becomes an integral part of the matrix crystal.
- Substitution of elements in solid solution tends to increase the strength of the metal as it decreases electrical conductivity.
- the increased strength is related to a greater resistance to slip.
- the solute atoms are different in size from the copper atoms, causing a distortion of the lattice structure that imparts slip resistance. That is, greater energy is required to distort the lattice.
- the phosphor bronze according to the instant invention has consistent mechanical properties, optimum yield strength and excellent formability.
- the alloy is especially useful in high temperature applications, e.g., where operational temperatures may reach 140°C, 150°C or higher, for example, up to 200°C in specific applications.
- the alloy is designed to be a high strength alloy with moderate conductivity. In these applications, no comparable alloy has been previously available.
- the alloy family will have the strength and formability of known phosphor bronzes, but will exhibit superior resistance to stress relaxation especially at elevated temperatures.
- the material for the alloy is mixed according to desired concentrations and melted in channel or coreless electric induction furnaces.
- the obtained melt is horizontally continuous cast through a graphite die. This process is sometimes referred to as horizontal thin strip continuous casting.
- Special enhanced cooling can be employed to assure proper quenching of solidified material, to maintain all solute in solution.
- the preferred casting practice employs special enhanced cooling within the graphite die assembly to assure a sufficiently rapid quench of the just-solidified metal from its solidus temperature to a temperature below 450°C. This assures that the solute remains to a high degree (estimated at approx. 90%) in solution, and does not have time to significantly precipitate during the cooling phase.
- This enhanced cooling involves the use of high thermal conductivity (minimum .77 cal/cm/sec) copper plates to which a high thermal conductivity graphite die (minimum .29 cal/cm/sec) has been bolted as per current standard art.
- a high conductivity gas such as Helium or Hydrogen or mixtures thereof is introduced, or carrier gases with significant concentrations of Helium and/or Hydrogen, between the copper plates and graphite plates of the assembly.
- the high conductivity gas replaces atmospheric O 2 /N; in the copper/graphite interface, thereby improving the cooling action.
- the cast material is surface milled and then rolled down to thinner gages. Heat treatments are imposed in the course of rolling to assure 1) maximum solution of alloying elements, and 2) precipitation of the dissolved alloying elements. The precipitate provides strength and resistance to stress relaxation.
- the material is for some applications further rolled to attain increased strength, and may or may not be stress relieved thermally and/or mechanically at finish.
- improved solutioning of the solute is obtained by heat treating at elevated temperatures at the cast stage, or at intermediate stages.
- the process stages can include the following protocols:
- the process overcomes problems previously plaguing the art wherein hot rolling technologies did not permit P to be used at levels as instantly claimed.
- the instant invention provides an alloy that can contain if desired, a wide range of Sn content, for example, greater than 7% Sn, (including 8-11% Sn in several embodiments) with excellent working properties and product characteristics. Although below 8% Sn content is preferred for greater electrical conductivity desired in some applications, higher levels of Sn will provide greater strength desired in other applications. In contrast, many applications will demand that the Sn content be 8% by weight or less, for example, 7%, 5%, and possibly approaching 3%. Alloys with Sn content below 3% will have lower potential strength levels and will not achieve the contact forces required in some more demanding spring contact applications.
- P levels of 0.01-0.20 may prove particularly advantageous in many applications.
- Ni and Si in the phosphor bronze according to the invention allow improved strengths and will increase the alloy's resistance to stress relaxation at elevated temperatures where the alloy may be used.
- the instant invention provides a metal alloy consisting of by weight: Sn 3.0-11.0% Ni 0.4-3.0% Si 0.1-1.0% P 0.01-0.06%
- Cu comprises the balance. Preferred embodiments of this invention may be limited to preferred subranges of various components, e.g., Sn content of below 8%, 4.7-5.3%, 7-11%, 7-8% or 7-9%, etc. Si content can be 0.22-0.30 % or 0.4-0.5 %. Ni content can be 1.3-1.7%, 2.5-3.0%, or 1.0-3.0%, etc.
- This alloy of the invention consists of, by weight: Sn 3.0-11.0% Ni 0.4-3.0% Si 0.1-1.0% P 0.01-0.06%, or smaller preferred ranges of each element, with the balance being Cu.
- the inventive alloy consists essentially of: Sn 3.0-7.0% Ni 0.4-3.0% Si 0.1-1.0% P 0.01-0.06%, with the balance being Cu. Again, smaller specific subranges are contemplated as applications dictate.
- the alloy consists of, by weight: Sn 3.0-11.0% Ni 0.4-3.0% Si 0.1-1.0% P 0.01-0.06%, or especially, Sn 3.0-7.0% Ni 1.0-3.0% Si 0.2-1.0% P 0.02-0.06%, in each case with the balance being Cu.
- the alloys according to the instantly claimed invention will demonstrate improved properties, for example, conductivity and tensile strength, over those alloys known in the art.
- Devices incorporating the alloy will be more economical to produce and maintain and will demonstrate improved durability.
- Table 1 shows a comparison of exemplary alloys according to the invention, with several standard phosphor bronze alloys.
- an alloy designated alloy MHP101 was cast with the chemistry as follows:
- the material was processed to .0070" thick and had mechanical properties as follows in the bare conditions unless otherwise stated:
- the softening behavior is shown in Figure 1 compared with data of C51100 alloy (4% Sn Phosphor Bronze) and C52100 (8% Sn Phosphor Bronze). The time at temperature was one hour.
- the stress relaxation behavior is shown in Figure 2 compared with C51100 alloy.
- the test stress was 80% of initial stress, and the initial stress in the test sample was 88ksi.
- the test temperature was 150°C.
- the data collected for MHP101 confirm that alloy formulations of the instant invention provide resistance to stress relaxation at higher temperatures than the current offering to standard Phosphor Bronze alloys such as the C51100 used in the comparison.
- strengths equal to higher tin-containing Phosphor Bronzes can be achieved with increased electrical conductivity.
- the alloy MHP101 an example of the alloys of the instant invention, is thus shown to have excellent formability properties.
- the invention also provides the above described alloy for use as a casting material.
- Sn over 7% for example, nominal Sn content of 8%, 9%, or 10% will add strength to the alloy.
- the alloy will also have better formability at a given tensile strength.
- the invention especially includes embodiments where the alloy displays properties of solid solution hardening, and precipitation hardening, and dispersion hardening.
- Another aspect of the invention is a phosphor bronze casting.
- the product resulting from the processing of the casting is useful as a material for electrical lead conductor applications.
- Such applications include those relating to integrated circuits and those encountered in the automotive industry such as engine compartment circuitry.
Description
Sn | 3.0-11.0% |
Ni | 0.4-3.0% |
Si | 0.1-1.0% |
P | 0.01-0.06% |
Sn | 3.0-11.0% |
Ni | 0.4-3.0% |
Si | 0.1-1.0% |
P | 0.01-0.06%, |
Sn | 3.0-7.0% |
Ni | 0.4-3.0% |
Si | 0.1-1.0% |
P | 0.01-0.06%, |
Sn | 3.0-11.0% |
Ni | 0.4-3.0% |
Si | 0.1-1.0% |
P | 0.01-0.06%, or especially, |
Sn | 3.0-7.0% |
Ni | 1.0-3.0% |
Si | 0.2-1.0% |
P | 0.02-0.06%, |
- Tensile strength 91.9 ksi (1 ksi = 6.895 MPa)
- Yield strength @.2 84.4 ksi
- Elongation on 2" 13.9%
- Grain size .010mm
- Conductivity 31.1% I.A.C.S.
- Good way bend (180deg) Flat at .690" wide, bare
- Bad way bend (180deg) Radius .006" at .690" wide, bare
Flat at .690" wide, tinned 40
microinches per side (1 inch = 1" = 25.4mm) - Bad way bend (180deg) Flat at .020" wide, bare.
- Modulus of
Elasticity 20 psi X 106, tension (1 psi = 6895 Pa) - Density .323 lbs/cu inch at 68°F (1lbs = 453.6 g) (°F = 1.8°C + 32)
ELECTRONIC APPLICATIONS ALLOY GUIDE | ||||
Alloy | Chemistry (Nominal%) | Conductivity (% IACS) | Tensile Strength (KSI)/n/mm2 | |
| Spring | |||
MHP | ||||
2 | Cu, 1.5 Sn, 1.5 Ni, 0.30 Si, 0.2 | 40 | 70/483 min | 85/586 |
MHP | ||||
5 | Cu, 2.4 Sn, 0.5 Ni, 0.10 Si, 0.2 P max | 35 | 70/483 min | 85/586 min |
MHP 105 | Cu, 5.0 Sn, 1.5 Ni, 0.3 Si, 0.2 P max | 13 | 82/565 | 100/690 |
C 51000 | Cu, 5 Sn, 0.2 P | 15 | 76-91/ 524-628 | 95-110/ 655-759 |
MHP 101 | Cu, 2.4 Sn, 1.5 Ni, 0.3 Si, 0.2 P max | 30 | 75/517 | 90/620 |
C 51100 | Cu, 4.2 Sn, 0.2 | 20 | 72-87/ 496-600 | 91-105/ 628-724 |
C 51900 | Cu, 6 Sn, 0.2 P | 14 | 80-96/ 552-662 | 99-114/ 683-786 |
MHP 108 | Cu, 7.5 Sn, 1.5 Ni, 0.3 Si, 0.2 P max | 10 | 90/620 | 110/758 |
C 52100 | Cu, 8 Sn, 0.2 P | 13 | 85-100/ 586-690 | 105-119/ 724-821 |
MHP 109 | Cu, 7.5 Sn, 2.75 Ni, 0.45 Si, 0.2 P max | 9 | 95/655 | 110/758 |
| Cu, 1.5 Ni, 1.25 Sn, 0.3 Si, 0.2 P | 40 | 70/483 | 85/586 |
C50500 | Cu, 1.3 Sn, 0.35 P max | 48 | 59/407 | 70/483 |
MHP 4 | Cu, 7.5 Sn, 0.5 Ni, 0.10 Si, 0.2 P max | 12 | 85/586 min | 105/724 min |
Claims (15)
- A phosphor bronze alloy consisting of 0.4 to 3.0 wt% Ni, 0.1 to 1.0 wt% Si, 0.01 to 0.06 wt% P, 3.0 to 11.0 wt% Sn and the remainder being Cu with unavoidable impurities.
- The alloy of claim 1 wherein the Ni content is 1.0 to 3.0 wt%.
- The alloy of claim 1 wherein the Sn content is below 8 wt%.
- The alloy of claim 1 wherein the Si content is 0.22-0.30 wt%.
- The alloy of claim 1 wherein the Si content is 0.4-0.5 wt%.
- The alloy or claim 1 wherein the Sn content is 4.7-5.3 wt%.
- The alloy of claim 1 wherein the Sn content is 7-11 wt%.
- The alloy of claim 1 wherein the Sn content is 7-8 wt%.
- The alloy of claim 1 wherein the P content is 0.05-0.06 wt%.
- The alloy of claim 1 wherein the Ni content is 1.3-1.7 wt%.
- The alloy of claim 1 wherein the Ni content is 2.5-3.0 wt%.
- The alloy of claim 1 wherein the Ni content is 1.3-1.7 wt%, the Si content is 0.22-0.30 wt%, the P content is 0.01-0.06 wt%.
- The alloy of claim 12 wherein the Sn content is 4.7-5.3 wt% or 7.0-8.0 wt%.
- The alloy of claim 1 wherein the Ni content is 2.5-3.0 wt%, the Si content is 0.4-0.5 wt%, the P content is 0.01-0,06 wt% and the Sn content is 7.0-8.0 wt%.
- A phosphor bronze casting of the alloy of claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02018195A EP1264905A3 (en) | 1997-09-05 | 1998-08-21 | Copper based alloy featuring precipitation hardening and solid-solution hardening |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5777997P | 1997-09-05 | 1997-09-05 | |
US57779P | 1997-09-05 | ||
PCT/US1998/017196 WO1999013117A1 (en) | 1997-09-05 | 1998-08-21 | Copper based alloy featuring precipitation hardening and solid-solution hardening |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP02018195A Division EP1264905A3 (en) | 1997-09-05 | 1998-08-21 | Copper based alloy featuring precipitation hardening and solid-solution hardening |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1021575A1 EP1021575A1 (en) | 2000-07-26 |
EP1021575B1 true EP1021575B1 (en) | 2003-05-14 |
Family
ID=22012718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP98943252A Expired - Lifetime EP1021575B1 (en) | 1997-09-05 | 1998-08-21 | Copper based alloy featuring precipitation hardening and solid-solution hardening |
Country Status (12)
Country | Link |
---|---|
EP (1) | EP1021575B1 (en) |
JP (1) | JP2001515960A (en) |
KR (1) | KR20010023699A (en) |
CN (1) | CN1097095C (en) |
AR (1) | AR017044A1 (en) |
AT (1) | ATE240413T1 (en) |
AU (1) | AU9108398A (en) |
BR (1) | BR9811448A (en) |
CA (1) | CA2303164A1 (en) |
DE (1) | DE69814657T2 (en) |
TW (1) | TW364019B (en) |
WO (1) | WO1999013117A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10317330B4 (en) * | 2002-04-15 | 2013-12-24 | Autonetworks Technologies, Ltd. | Arc-resistant terminal, use thereof for an arc-resistant terminal pair, for a connector, for a connection box, for a breaker device or the like and for a motor vehicle and a motor |
JP4100629B2 (en) * | 2004-04-16 | 2008-06-11 | 日鉱金属株式会社 | High strength and high conductivity copper alloy |
EP2048251B1 (en) | 2006-05-26 | 2012-01-25 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy having high strength, high electric conductivity and excellent bending workability |
CN101939460B (en) * | 2008-02-08 | 2012-09-05 | 三井住友金属矿山伸铜株式会社 | Process for producing precipitation-hardened copper alloy strip |
CN102149833B (en) * | 2008-09-10 | 2013-07-17 | 大丰工业株式会社 | Sliding component consisting of Pb-free Cu-Bi type sintered material |
CN106435250A (en) * | 2009-04-08 | 2017-02-22 | 瑞士金属-Ums瑞士金属加工有限公司 | Machinable copper base alloy and production method thereof |
CA3128732A1 (en) * | 2019-02-07 | 2020-08-13 | Equispheres Inc. | Alloys with a low density of precipitates for use in applications that include remelting processes, and preparation process thereof |
KR102107585B1 (en) * | 2019-11-22 | 2020-05-07 | 주식회사 풍산 | Copper alloy material with excellent wear resistance and method for producing same |
CN110923505B (en) * | 2019-12-31 | 2021-11-02 | 内蒙古工业大学 | Cu-Ni-Mn alloy and preparation method and application thereof |
CN113249612A (en) * | 2021-04-21 | 2021-08-13 | 铁岭富兴铜业有限公司 | Novel contact copper alloy and preparation method thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61143564A (en) * | 1984-12-13 | 1986-07-01 | Nippon Mining Co Ltd | Manufacture of high strength and highly conductive copper base alloy |
JPH02122039A (en) * | 1988-10-31 | 1990-05-09 | Nippon Mining Co Ltd | High strength and high conductivity copper alloy having excellent adhesion of oxidized film |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU219368A1 (en) * | 1966-07-16 | 1968-05-30 | Припой Пайки Меди | |
JPS5727051A (en) * | 1980-07-25 | 1982-02-13 | Nippon Telegr & Teleph Corp <Ntt> | Copper nickel tin alloy for integrated circuit conductor and its manufacture |
JPH02197543A (en) * | 1989-01-26 | 1990-08-06 | Furukawa Electric Co Ltd:The | Copper alloy for connecting apparatus |
JPH0776397B2 (en) * | 1989-07-25 | 1995-08-16 | 三菱伸銅株式会社 | Cu alloy electrical equipment connector |
JP2780584B2 (en) * | 1992-11-13 | 1998-07-30 | 三菱伸銅株式会社 | Cu alloy for electrical and electronic parts with excellent hot workability and punching workability |
-
1998
- 1998-08-21 WO PCT/US1998/017196 patent/WO1999013117A1/en not_active Application Discontinuation
- 1998-08-21 AU AU91083/98A patent/AU9108398A/en not_active Abandoned
- 1998-08-21 EP EP98943252A patent/EP1021575B1/en not_active Expired - Lifetime
- 1998-08-21 CA CA002303164A patent/CA2303164A1/en not_active Abandoned
- 1998-08-21 DE DE69814657T patent/DE69814657T2/en not_active Expired - Fee Related
- 1998-08-21 JP JP2000510901A patent/JP2001515960A/en not_active Withdrawn
- 1998-08-21 CN CN98810040A patent/CN1097095C/en not_active Expired - Fee Related
- 1998-08-21 KR KR1020007002353A patent/KR20010023699A/en not_active Application Discontinuation
- 1998-08-21 BR BR9811448-4A patent/BR9811448A/en not_active Application Discontinuation
- 1998-08-21 AT AT98943252T patent/ATE240413T1/en not_active IP Right Cessation
- 1998-08-27 TW TW087114229A patent/TW364019B/en active
- 1998-09-01 AR ARP980104367A patent/AR017044A1/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61143564A (en) * | 1984-12-13 | 1986-07-01 | Nippon Mining Co Ltd | Manufacture of high strength and highly conductive copper base alloy |
JPH02122039A (en) * | 1988-10-31 | 1990-05-09 | Nippon Mining Co Ltd | High strength and high conductivity copper alloy having excellent adhesion of oxidized film |
Non-Patent Citations (3)
Title |
---|
DATABASE WPI Week 198632, Derwent World Patents Index; Class LO3, AN 1986-209673 * |
DATABASE WPI Week 199025, Derwent World Patents Index; Class LO3, AN 1990-188450 * |
SCHROEDER K.H.: "Werkstoffe für elektrische Kontakte und ihre Anwendungen, PAGES 44, 52-53", EXPERT VERLAG, RENNINGEN-MALMSHEIM (GERMANY), , * |
Also Published As
Publication number | Publication date |
---|---|
DE69814657T2 (en) | 2004-03-25 |
TW364019B (en) | 1999-07-11 |
WO1999013117A1 (en) | 1999-03-18 |
JP2001515960A (en) | 2001-09-25 |
AR017044A1 (en) | 2001-08-22 |
BR9811448A (en) | 2000-08-22 |
ATE240413T1 (en) | 2003-05-15 |
EP1021575A1 (en) | 2000-07-26 |
CA2303164A1 (en) | 1999-03-18 |
DE69814657D1 (en) | 2003-06-18 |
CN1275171A (en) | 2000-11-29 |
KR20010023699A (en) | 2001-03-26 |
AU9108398A (en) | 1999-03-29 |
CN1097095C (en) | 2002-12-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100929276B1 (en) | Copper alloy | |
TWI415958B (en) | Copper alloy for electronic material and method for manufacturing the same | |
JP3699701B2 (en) | Easy-to-process high-strength, high-conductivity copper alloy | |
EP0666931A4 (en) | ||
JP2004225093A (en) | Copper-base alloy and manufacturing method therefor | |
JP2002180165A (en) | Copper based alloy having excellent press blanking property and its production method | |
KR20090123017A (en) | Cu-ni-si-based alloy for electronic material | |
EP2270242B1 (en) | Copper alloy material for electric or electronic apparatuses, method for producing it and component | |
US6379478B1 (en) | Copper based alloy featuring precipitation hardening and solid-solution hardening | |
JP2002180161A (en) | High strength copper alloy | |
US20010001400A1 (en) | Grain refined tin brass | |
EP1021575B1 (en) | Copper based alloy featuring precipitation hardening and solid-solution hardening | |
US5853505A (en) | Iron modified tin brass | |
US5508001A (en) | Copper based alloy for electrical and electronic parts excellent in hot workability and blankability | |
KR20160003555A (en) | Copper alloy material, method for producing copper alloy material, lead frames and connectors | |
JPH1143731A (en) | High strength copper alloy excellent in stamping property and suitable for silver plating | |
EP1264905A2 (en) | Copper based alloy featuring precipitation hardening and solid-solution hardening | |
JP4664584B2 (en) | High strength copper alloy plate and method for producing high strength copper alloy plate | |
CN111575531B (en) | High-conductivity copper alloy plate and manufacturing method thereof | |
JPH0718355A (en) | Copper alloy for electronic appliance and its production | |
CN112567058B (en) | Method for producing copper alloy sheet having excellent strength and conductivity, and copper alloy sheet produced thereby | |
KR20160001634A (en) | Copper alloy material, method for producing copper alloy material, lead frames and connectors | |
MXPA00002305A (en) | Copper based alloy featuring precipitation hardening and solid-solution hardening | |
US20110017358A1 (en) | Copper alloy material for electrical/electronic equipments, and electrical/electronic part | |
JPH0323620B2 (en) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20000303 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: DUERER CORPORATION |
|
17Q | First examination report despatched |
Effective date: 20001031 |
|
GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: THE MILLER COMPANY |
|
GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20030514 Ref country code: LI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20030514 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20030514 Ref country code: CH Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20030514 Ref country code: BE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20030514 Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20030514 |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D |
|
REF | Corresponds to: |
Ref document number: 69814657 Country of ref document: DE Date of ref document: 20030618 Kind code of ref document: P |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20030721 Year of fee payment: 6 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20030808 Year of fee payment: 6 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20030814 Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20030814 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20030814 Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20030814 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20030818 Year of fee payment: 6 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20030821 Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20030821 Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20030821 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20030825 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MC Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20030831 |
|
NLV1 | Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act | ||
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
ET | Fr: translation filed | ||
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed |
Effective date: 20040217 |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: MM4A |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20040821 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20050301 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20040821 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20050429 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED. Effective date: 20050821 |