BR9811448A - Copper based alloy depicting precipitation quenching and solid solution quenching - Google Patents

Copper based alloy depicting precipitation quenching and solid solution quenching

Info

Publication number
BR9811448A
BR9811448A BR9811448-4A BR9811448A BR9811448A BR 9811448 A BR9811448 A BR 9811448A BR 9811448 A BR9811448 A BR 9811448A BR 9811448 A BR9811448 A BR 9811448A
Authority
BR
Brazil
Prior art keywords
quenching
solid solution
based alloy
copper based
weight
Prior art date
Application number
BR9811448-4A
Other languages
Portuguese (pt)
Inventor
David H Mandle
Daniel D Farquharson
Original Assignee
Miller Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miller Co filed Critical Miller Co
Publication of BR9811448A publication Critical patent/BR9811448A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Laminated Bodies (AREA)

Abstract

Patente de Invenção: <B>"LIGA COM BASE EM COBRE RETRATANDO TêMPERA POR PRECIPITAçãO E TêMPERA POR SOLUçãO SóLIDA"<D>. Uma liga de broze fosforoso consistindo de: 0,4 a 3,0 % em peso de Ni, 1,0 a 11,0 % em peso de Sn, 0,1 a 1,0 % em peso de Si, 0,01 a 0,35 % em peso de P, o restante sendo substancialmente Cu. A liga é adequada para condutores de chumbo elétricos e para interconexões elétricas ou eletrónicas.Invention Patent: <B> "ALLOY BASED ON COPPER PICTURING TEMPERATURE BY PRECIPITATION AND TEMPERATURE BY SOLID SOLUTION" <D>. A phosphorous broze alloy consisting of: 0.4 to 3.0% by weight of Ni, 1.0 to 11.0% by weight of Sn, 0.1 to 1.0% by weight of Si, 0.01 at 0.35% by weight of P, the remainder being substantially Cu. The alloy is suitable for electrical lead conductors and for electrical or electronic interconnections.

BR9811448-4A 1997-09-05 1998-08-21 Copper based alloy depicting precipitation quenching and solid solution quenching BR9811448A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5777997P 1997-09-05 1997-09-05
PCT/US1998/017196 WO1999013117A1 (en) 1997-09-05 1998-08-21 Copper based alloy featuring precipitation hardening and solid-solution hardening

Publications (1)

Publication Number Publication Date
BR9811448A true BR9811448A (en) 2000-08-22

Family

ID=22012718

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9811448-4A BR9811448A (en) 1997-09-05 1998-08-21 Copper based alloy depicting precipitation quenching and solid solution quenching

Country Status (12)

Country Link
EP (1) EP1021575B1 (en)
JP (1) JP2001515960A (en)
KR (1) KR20010023699A (en)
CN (1) CN1097095C (en)
AR (1) AR017044A1 (en)
AT (1) ATE240413T1 (en)
AU (1) AU9108398A (en)
BR (1) BR9811448A (en)
CA (1) CA2303164A1 (en)
DE (1) DE69814657T2 (en)
TW (1) TW364019B (en)
WO (1) WO1999013117A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10317330B4 (en) * 2002-04-15 2013-12-24 Autonetworks Technologies, Ltd. Arc-resistant terminal, use thereof for an arc-resistant terminal pair, for a connector, for a connection box, for a breaker device or the like and for a motor vehicle and a motor
JP4100629B2 (en) * 2004-04-16 2008-06-11 日鉱金属株式会社 High strength and high conductivity copper alloy
EP2426224B1 (en) 2006-05-26 2015-09-16 Kabushiki Kaisha Kobe Seiko Sho Copper alloy with high strength, high electrical conductivity, and excellent bendability
CN101939460B (en) * 2008-02-08 2012-09-05 三井住友金属矿山伸铜株式会社 Process for producing precipitation-hardened copper alloy strip
CN102149833B (en) * 2008-09-10 2013-07-17 大丰工业株式会社 Sliding component consisting of Pb-free Cu-Bi type sintered material
CN106435250A (en) * 2009-04-08 2017-02-22 瑞士金属-Ums瑞士金属加工有限公司 Machinable copper base alloy and production method thereof
CN113646116A (en) * 2019-02-07 2021-11-12 埃奎斯费雷斯公司 Alloys having low precipitate density for applications including remelting processes and methods of making the same
KR102107585B1 (en) * 2019-11-22 2020-05-07 주식회사 풍산 Copper alloy material with excellent wear resistance and method for producing same
CN110923505B (en) * 2019-12-31 2021-11-02 内蒙古工业大学 Cu-Ni-Mn alloy and preparation method and application thereof
CN113249612A (en) * 2021-04-21 2021-08-13 铁岭富兴铜业有限公司 Novel contact copper alloy and preparation method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU219368A1 (en) * 1966-07-16 1968-05-30 Припой Пайки Меди
JPS5727051A (en) * 1980-07-25 1982-02-13 Nippon Telegr & Teleph Corp <Ntt> Copper nickel tin alloy for integrated circuit conductor and its manufacture
JPS61143564A (en) * 1984-12-13 1986-07-01 Nippon Mining Co Ltd Manufacture of high strength and highly conductive copper base alloy
JPH02122039A (en) * 1988-10-31 1990-05-09 Nippon Mining Co Ltd High strength and high conductivity copper alloy having excellent adhesion of oxidized film
JPH02197543A (en) * 1989-01-26 1990-08-06 Furukawa Electric Co Ltd:The Copper alloy for connecting apparatus
JPH0776397B2 (en) * 1989-07-25 1995-08-16 三菱伸銅株式会社 Cu alloy electrical equipment connector
JP2780584B2 (en) * 1992-11-13 1998-07-30 三菱伸銅株式会社 Cu alloy for electrical and electronic parts with excellent hot workability and punching workability

Also Published As

Publication number Publication date
DE69814657T2 (en) 2004-03-25
CA2303164A1 (en) 1999-03-18
AU9108398A (en) 1999-03-29
TW364019B (en) 1999-07-11
WO1999013117A1 (en) 1999-03-18
KR20010023699A (en) 2001-03-26
ATE240413T1 (en) 2003-05-15
DE69814657D1 (en) 2003-06-18
AR017044A1 (en) 2001-08-22
CN1275171A (en) 2000-11-29
CN1097095C (en) 2002-12-25
JP2001515960A (en) 2001-09-25
EP1021575B1 (en) 2003-05-14
EP1021575A1 (en) 2000-07-26

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Legal Events

Date Code Title Description
PC Transfer

Free format text: DUERER CORPORATION (US)

TC Change of name
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]

Free format text: INDEFERIMENTO COM BASE NO ART. 8O COMBINADO COM ART.13 DA LPI 9.279 DE 14/05/1996.