CN1097095C - Copper based alloy featuring precipitation hardening and solid-solution hardening - Google Patents
Copper based alloy featuring precipitation hardening and solid-solution hardening Download PDFInfo
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- CN1097095C CN1097095C CN98810040A CN98810040A CN1097095C CN 1097095 C CN1097095 C CN 1097095C CN 98810040 A CN98810040 A CN 98810040A CN 98810040 A CN98810040 A CN 98810040A CN 1097095 C CN1097095 C CN 1097095C
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- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
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Abstract
A phosphor bronze alloy consisting of: 0.4 to 3.0 wt.% Ni, 1.0 to 11.0 wt.% Sn, 0.1 to 1.0 wt.% Si, 0.01 to 0.35 wt.% P, the remainder being substantially Cu. The alloy is suitable for electrical lead conductors and for electrical or electronic interconnections.
Description
The application requires the U.S. that submits to 1997.9.5 to apply for No.60/057, and 777 is right of priority, and the full content of this application is introduced into as a reference.
The present invention relates to a kind of copper base alloy, especially for conduction with the electronic interconnection element and comprise the copper base alloy of the switch application of high temperature switch, this alloy is promising especially in " types of springs " used.
A few as can be known class copper base alloys in different prior aries.For example, people's such as Mikawa U.S. patent No.5041176 discloses a kind of copper base alloy, and it comprises (weight %) 0.1-10% nickel (Ni); 0.1-10% tin (Sn); 0.05-5% silicon (Si); 0.01-5 iron (Fe); With 0.0001-1% boron (B).The disclosure patent need form homogeneous and be distributed in Ni-Si intermetallic compound in the alloy.Fe is that age hardening is required.But work as Fe concentration and be higher than 5%, then specific conductivity is compromised, and corrodibility becomes serious problem.B is joined in the alloy to improve erosion resistance, hardness and intensity.Can obtain high rigidity by under 400-450 ℃ tempering temperature, carrying out precipitation hardening.Si also plays the effect of reductor.
Though the Mikawa alloy is applicable to the electronic component that requires good specific conductivity, thermal conductivity, intensity, hardness, plating performance, welding property, elasticity and comprise the acid proof erosion resistance, but the alloy phase ratio that this alloy and the present invention obtain, the composition difference, and demonstrate different features.
Another comparative alloy is disclosed in people's such as Kubosono U.S. patent No.5516484.Copper-nickel-base alloy that the disclosing of people such as Kubosono utilizes the horizontal continuous-casting that has graphite mould to process.This Ni-Cu alloy system is the different in essence alloy of alloy a kind of and of the present invention.Copper in this alloy (Cu) is nonconforming impurity, and its content must be below 0.02%.People's such as Kubosono proposition then can not be observed by adding the effect that Si obtained if there is not B to exist.
U.S. patent No.5334346, people's such as Kim the high property copper alloy that discloses a kind of that be used to conduct electricity and electronic component.This Kim alloy is basically by the Ni of copper, 0.5-2.4 weight %; 0.1-0.5%Si; 0.02-0.16%P; Form with 0.02-0.2% magnesium (Mg).People's such as Kim discussion Ni
2Si and Ni
3P is deposited on the PH in the copper matrix.Thinking that the surplus of monomer Si and P can cause forms easily crisp intermetallic compound and causes peeling off and crackle.Suggestion Mg is as removing element to remove monomer Si and P.But when the increase of Mg content, then the specific conductivity of alloy and utilization ratio are compromised.Zinc (Zn) and Fe are also disclosed as possible scavenging agent.This alloy does not comprise Sn.
People's such as Hashizume U.S. patent No.5064611 discloses to make and has contained 1-8%Ni; 0.1-0.8%P; 0.6-1.0%Si; Optional 0.03-0.5%Zn; Technology with the copper base alloy of Cu.Ni is disclosed
5P
2And Ni
2Si is used to improve the mechanical property of alloy as intermetallic compound, and inferior limit ground has reduced specific conductivity.There is not Sn in this alloy.
As a promptly bronze example of copper-tin alloy, people's such as Asai, U.S. patent No.5021105 discloses a kind of alloy, and it comprises 2.0-7.0%Sn; 1.0-6.0%Ni, cobalt (Co) or chromium (Cr); 0.1-2.0%Si; And Cu.This alloy can be processed, demonstrate the elongation of 3-20%; 70-100kg/mm
2Intensity; Specific conductivity with 10-30%IACS.Disclosing Ni is important for reinforcement, discloses Cr and has improved hot rolling characteristic and thermotolerance, also discloses Co and has helped effective thermotolerance.According to people's such as Asai the hot-rolling method that passes through to be used to process this alloy, Sn content is restricted to 7%.People such as Asai do not disclose phosphorus (P) as component.Therefore, this alloy is subjected to limiting as the above-mentioned people's such as Mikawa that discuss alloy type.
Similarly, people's such as Arita, U.S. patent No.4337089 discloses a kind of Cu-Ni-Sn alloy, and it contains 0.5-3.0%Ni; 0.3-0.9%Sn; 0.01-0.2%P; 0.0-0.35% manganese (Mn) or Si; And Cu.This alloy with thermal treatment and cold rolling combining, is characterized as 60kg/mm in its technology
2Tensile strength and surpass 6% extensibility (mechanical property of bending operation necessity promptly is provided).In people's such as Arita alloy, add Si or Mn to improve intensity.People such as Arita disclose low Sn content, but the formability-strength property that combines of the present invention is not provided.
People's such as Takeda, U.S. patent No.5132083 has proposed a kind of laser filler, and this filler is for containing 1-5%Ni; 0.2-5%Si; Be no more than 1%B; Be no more than 2%P; Be no more than 3%Mn; Powder with Cu.Sn and lead (Pb) are optional members, every kind of 8-15%.This powder laser can be handled to produce the copper base laser filler of anti-sliding friction property excellence.This chemical constitution that the laser filler relates to is different with alloy of the present invention.For example, do not use rolling (heat or cold rolling) to handle this filler.
A kind of providing determined and the designation systems of identification copper and copper alloy means are known as UNS (Unified Numbering System).This system uses general in the North America, use five (extended from 3 recently) numerals after the C prefix.This digital display circuit is not to describe in detail, but a kind of useful numerical coding of discerning factory and foundry's product.The C sign that occurs below refers to this UNS value.Comprise that thereby general prior art that alloy comprises many alloys that patent is similarly aspect some of composition, but prior art demonstrates the different desired properties that depends on alloy certain content and technology.
UNS alloy C85800 is a kind of brass of leading, and it contains 1.5%Sn, 1.5%Pb, 31-41%Zn, 0.5%Fe, 0.05%Sb, 0.5%Ni (incl Co), 0.25%Mn, 0.05%As, 0.05%S, 0.01%P, 0.55%Al, 0.25%Si and 57.0% MIN Cu.
In electronic industry, it is known having the phosphor bronze that needs intensity and formability, can use when reaching 100 ℃.But alloy needs the temperature of Nai Genggao, as 120 ℃, 140 ℃ with meet or exceed 150 ℃ temperature.Higher temperature is used and will be made electronic treatment speed faster, and alloy can be used in the environment of higher temperature.
Therefore, the invention provides a kind of than the known alloy of prior art, phosphor bronze alloy with performance of very big improvement.The present invention provides a kind of alloy with economic price, has the elasticity and strength property and the excellent wearing quality that need after it is processed, particularly at high temperature.
Fig. 1 has described the softening behavior data and curves of embodiment MHP101 alloy and Comparative Examples alloy.
Fig. 2 has described the stress relaxation data and curves of embodiment MHP101 alloy and Comparative Examples alloy.
Contain 0.4-3.0 weight %Ni according to dispersed particle-strengthened phosphor bronze of the present invention, 0.1-1.0 weight %Si, 0.01-0.06 weight %P, 1.0-11.0 weight %Sn and copper.Sn improves the formability under the certain intensity level.P is of value to the elasticity and the strength property of giving the best, and provides mobile in the casting copper base alloy.P also helps the melt deoxidation.P is the primary oxygen scavenger of melt.Si can be with amount out of control loss in melting process, and this can keep Si in the alloy and the stoichiometric relation between the Ni.
The preferred alloy of the present invention, wherein Ni content is 1.3-1.7wt%, and Si content is 0.22-0.30wt%, and P content is 0.01-0.06wt%.The preferred alloy of the present invention, wherein Sn content is 1.0-1.5wt%, 2.1-2.7wt%, 4.7-5.3wt% or 7.0-8.0wt%.The preferred alloy of the present invention, wherein Ni content is 2.5-3.0wt%, and Si content is 0.4-0.5wt%, and P content is 0.01-0.06wt%, and Sn content is 7.0-8.0wt%.The preferred alloy 1.5wt%Ni of the present invention, 0.28wt%Si, 0.057wt%P, 2.46wt%Sn and surplus are copper and unavoidable impurities.
Preferred especially in certain embodiments Sn content is lower than 8wt% and P content is 0.01-0.2wt%.
Tin, phosphorus and copper are given the credit in solution hardening, and precipitation hardening belongs to nickel silicide and the nickel phosphide that is deposited in the matrix simultaneously.
When the alloy element dissolving formed the liquor of homogeneous, the sosoloid of copper base appearred.When solution solidifies and rolling subsequently/annealing, metal of alloying enters into solution and forms sosoloid.Thereby this alloy element becomes the integral part of matrix cystal.
The replacement of element is intended to improve metal strength in sosoloid, and it has reduced specific conductivity simultaneously.The intensity of this raising and anti-sliding relationship are very big.Solute atoms is different dimensionally with copper atom, the destruction that causes crystalline network, and this has given anti-slipping property.Promptly need more energy to destroy lattice.
Preliminary analysis revealed, this alloy proof stress is lax, promptly under certain constant compression, especially uses under the high temperature that is run at some, and the stress in the solid reduces in time.Phosphor bronze according to the invention has the constant mechanical property, best yield strength and excellent formability.This alloy is particularly useful in high temperature is used, and for example service temperature can reach 140 ℃, 150 ℃ or higher as reach 200 ℃ in specific application.This alloy is designed to have the high-strength alloy of appropriate specific conductivity.In these are used, also there is not comparative alloy to use at present.
This alloy type will have the intensity and the formability of known phosphor bronze, but will show excellent stress relaxation drag, particularly at high temperature.
In illustrative technology, the material of alloy is mixed according to required concentration, and in pipeline or centreless electric induction furnace, melt.The melt of gained is passed through the graphite mould horizontal casting.This technology is sometimes referred to as horizontal thin strap continuous casting.Can use the cooling of special enhanced guaranteeing the suitable quenching of solidification material, thereby keep all solutes in the solution.
Special enhanced cooling is adopted in preferred casting experiment in the graphite mould assembly, quench fully rapidly to the temperature that is lower than 450 ℃ from its solidus temperature with the metal of guaranteeing just to have solidified.Guaranteed that like this solute keeps high degree (estimating nearly 90%) in solution, and the precipitation significantly that in the cooling stages process, has no time.
The cooling of this enhanced relates to uses high heat conductance (minimum .77cal/cm/sec) copper dish, the graphite mould (minimum .29cal/cm/sec) of a high heat conductance is fixed on this bronze medal, as each existing ordinary skill.The present invention introduces high conductance gas for example helium or hydrogen or their mixture between the copper dish of assembly and graphite plate, or contains the carrier gas of the helium and/or the hydrogen of high density.Atmosphere O in this high conductance gas Alloy instead of Copper/graphite interface
2/ N
2Thereby, improve the cooling behavior.
This cast material is carried out surface grinding, be rolled down to thin specification then.In the operation of rolling, heat-treat with the maximum dissolving of guaranteeing (1) alloy element and the precipitation of (2) dissolved alloy element.This precipitation provides intensity and stress relaxation drag.
Need less cold rolling with obtain with alloy in the identical tensile strength of Sn concentration (sosoloid content) raising.The a plurality of shaping process operations subsequently of less cold rolling permission.
After thermal treatment, for some is used, this material is by further rolling intensity to obtain to improve, and can be maybe when precision work cannot be with it with hot and/or mechanically eliminate stress.
In the further embodiment of the present invention, by in cast sections, or at high temperature heat-treat in the intermediate stage, can obtain the further dissolving of solute.
Comprise following rules according to this processing step of the present invention:
An embodiment (for those milling trains that so disposes)
Casting
Grind
Homogenize (=heat rapidly/homogenize/quench).The maximum dissolving that this homogenizes and guarantees alloy element.This quenching guarantees to keep maximum solid solution.The temperature that reaches is 800-950 ℃.
Rolling
375-550 ℃ of precipitation annealing.
Be rolled down to terminal point
Stress relieving for different tensile strength and yield strength condition
Additional embodiments (for those milling trains that so disposes)
Casting
Grind
Be rolled down to intermediate specification
Homogenizing anneal
Rolling
Precipitation annealing
Be rolled down to terminal point
The annealing of elimination internal stress
Additional embodiments (for being the maximum strength of cost with some specific conductivity)
Casting
Grind
Homogenize
Rolling
Follow the rapid annealing (in technology, may need a plurality of " following the annealing of quenching " step) of quenching to reach thin specification
Rolling
Sclerosis annealing in the factory
Additional embodiments
Casting
Grind
Be rolled down to intermediate specification
Homogenize
Rolling
Follow the rapid annealing (in technology, may need a plurality of " following the annealing of quenching " step) of quenching to reach thin specification
Rolling
Alternative is that cooling rapidly can replace the quenching in the above-mentioned casting experiment.
The present invention has overcome present puzzlement prior art problems, and in the prior art, the hot rolling technology does not allow to use the P as under the level of the presently claimed invention.The present invention also provides a kind of the have excellent performance characteristics and the alloy of product feature, and this alloy is if need to comprise the Sn content of wide region, as greater than 7%Sn (comprising 8-11%Sn in several embodiments).Though use required more high conductivity for some, preferred Sn content is lower than 8%, and high-load Sn will be provided at required higher intensity in other application.What form contrast is that it is 8% or lower that many application will need Sn content, as 7%, 5%, and may reach 3%.Use for some, can prove that the content of 1%Sn is favourable because of the intensity of its high conductivity and appropriateness.Sn content is lower than 1% alloy will have lower potential energy strength level, and will can not obtain some more need spring contact use in required contact force.
0.01-0.20 P content proof particularly advantageous in many application.
Ni in the phosphor bronze according to the invention and Si can improve intensity, and will improve the stress relaxation drag of this alloy under the operable high temperature of alloy.
The invention provides a kind of metal alloy, it comprises (weight percent):
Sn 1.0-11.0％
Ni 0.4-3.0％
Si 0.1-1.0％
P 0.01-0.35％
Surplus is Cu.The preferred embodiment of the invention can be restricted to the preferred subrange of various components, and for example, Sn content is lower than 8%, 1.0-1.5%, 2.1-2.7%, 4.7-5.3%, 1-7%, 7-11%, 7-8% or 7-9% etc., preferred Sn content is 1.25% nominal to 11.0 weight %.Similarly, preferably other component for example P can be restricted to, as 0.01-0.2%, 0.01-0.06%, 0.05-0.18% or 0.2% etc.Si content can be 0.22-0.30% or 0.4-0.5%.Ni content can be 1.3-1.7%, 2.5-3.0%, or 1.0-3.0% etc.
Certainly, the present inventor reckons with the small amount of impurities that can not avoid economically existing.
In other preferred embodiment of the present invention, this alloy is grouped into by following one-tenth basically, weight percent:
Sn 1.0-11.0％
Ni 0.4-3.0％
Si 0.1-1.0％
P 0.01-0.35%, or every kind of preferable range that element is littler, surplus is Cu.
In a preferred embodiment of the present invention, alloy of the present invention is grouped into by following one-tenth basically:
Sn 1.0-7.0％
Ni 0.4-3.0％
Si 0.1-1.0％
P 0.01-0.2%, surplus is Cu.As described in the applicant, reckon with littler spy
Stator range.
In another one embodiment preferred of the present invention, alloy is grouped into by following one-tenth, (weight percent):
Sn 1.0-11.0％
Ni 0.4-3.0％
Si 0.1-1.0％
P 0.01-0.35%, perhaps particularly
Sn 1.0-7.0％
Ni 1.0-3.0％
Si 0.2-1.0％
P 0.02-0.2%, surplus is Cu under every kind of situation.
According to preliminary analysis, alloy of the present invention will demonstrate the performance that makes moderate progress than the known alloy of prior art, as specific conductivity and tensile strength, make and will safeguard that the equipment that contains this alloy is with more economical and will demonstrate the wearing quality of raising.The comparison of table 1 expression illustration alloy of the present invention and several common phosphor bronze alloy.
Embodiment
In one embodiment of the invention, cast a kind of alloy that is masked as alloy MHP101, its chemical ingredients is as follows:
Cu 95.67%, and Sn 2.46%, and P.057%, Ni 1.50%, Si.28% and unavoidable impurities.
Unless otherwise indicated, under exposed condition, with this materials processing to 0.0178cm (.0070 ") is thick, and this material has following mechanical property:
-tensile strength 64605.7kg/cm
2(91.9ksi)
-Qu Fuqiangdu @.2 5933.3kg/cm
2(84.4ksi)
-2 " unit elongation 13.9%
-grain-size .010mm
-specific conductivity 31.1%I.A.C.S.
-good way bending (180deg) flat bar, (.690 ") is wide, and is exposed for 1.753cm
-difference mode bending (180deg) radius 0.152cm (.006 "), 1.753cm (.690 ")
Wide, exposed
(.690 ") is wide, every zinc-plated 1.02 for flat bar 1.753cm
* 10
-6Cm (40 microinch)
(.020 ") is wide, and is exposed for-difference mode bending (180deg) flat bar 0.051cm
-Young's modulus 1.4 * 10
6Kg/cm
2(20psi * 10
6), tension force
-density is at 20 ℃, 8.95g/cm
3(68 .323 lbs/cu inches)
Be shown in Fig. 1 with C51100 (4%Sn phosphor bronze) and the correlated softening behavior of C52100 (8%Sn phosphor bronze) alloy.Time under the temperature is 1 hour.
Be shown in Fig. 2 with the correlated stress relaxation behavior of C51100 alloy.Experiment stress is 80% initial stress, and the initial stress of test specimen is 6186.4kg/cm
2(88ksi).Experimental temperature is 150 ℃.
Indicate the alloy phase contrast with similar UNS, the electronic application guide data of the expectation of MHP101 according to the invention and other alloys is shown in Table 1.
The data acknowledgement that MHP101 is collected, under the temperature of the C51100 that is higher than the common phosphor bronze alloy of present supply, uses in as Comparative Examples, alloy formula of the present invention provides the stress relaxation drag.In addition, can obtain the intensity identical, and have the specific conductivity of raising with the phosphor bronze that contains high tin.
Thereby alloy MHP101, an example of alloy of the present invention shows to have excellent formability.
It also has higher modulus of elasticity, for the web member planner provides a kind of material that has the contact force of raising for certain amount of deflection.
The present invention also provides above-mentioned alloy to use as cast material.
The present invention also comprises the embodiment for some application, more above-mentioned littler composition range of these application requiring such as 0.02-0.2%P.All subranges in the above-mentioned scope are as a part of the present invention.
Sn surpasses 7%, will improve the intensity of alloy as 8%, 9% or 10% Sn content of nominal.This alloy will have good formability under certain tensile strength.
The present invention demonstrates solution hardening, precipitation hardening and dispersion hardening performance particularly including alloy
Embodiment.
Another aspect of the present invention is the phosphate bronze casting of alloy of the present invention.The material that generation is used as conductive lead wire from the product of casting technique.Such application comprises the application that the application that is relevant to unicircuit and automotive industry such as cabin circuit are run into.
Table 1
Electronic application alloy guide
*The performance of new alloy chemical composition and expectation
*Min=minimum value " MHP " is The Miller Company, the transferee's of present patent application invention trade mark
| Alloy | Chemical constitution (nominal %) | Specific conductivity (%IACS) | Tensile strength (KSI)/n/mm 2Hardness elasticity | |
| *MHP 2 | Cu, 1.5 Sn, 1.5 Ni, 0.30 Si, 0.2 P maximum | 40 | 70/483 min ** | 85/586 min |
| *MHP 5 | Cu, 2.4 Sn, 0.5 Ni, 0.10 Si, 0.2 P maximum | 35 | 70/483 min | 85/586 min |
| *MHP 105 | Cu, 5.0 Sn, 1.5 Ni, 0.3 Si, 0.2 P maximum | 13 | 82/565 | 100/690 |
| C 51000 | Cu，5 Sn，0.2 P | 15 | 76-91/ 524-628 | 95-110/ 655-759 |
| *MHP 101 | Cu, 2.4 Sn, 1.5 Ni, 0.3 Si, 0.2 P maximum | 30 | 75/517 | 90/620 |
| C 51100 | Cu，4.2 Sn，0.2 P | 20 | 72-87/ 496-600 | 91-105/ 628-724 |
| C 51900 | Cu，6 Sn，0.2 P | 14 | 80-96/ 552-662 | 99-114/ 683-786 |
| *MHP 108 | Cu, 7.5 Sn, 1.5 Ni, 0.3 Si, 0.2 P maximum | 10 | 90/620 | 110/758 |
| C 52100 | Cu，8 Sn，0.2 P | 13 | 85-100/ 586-690 | 105-119/ 724-821 |
| *MHP 109 | Cu, 7.5 Sn, 2.75 Ni, 0.45 Si, 0.2 P maximum | 9 | 95/655 | 110/758 |
| *MHP 100 | Cu, 1.5 Ni, 1.25 Sn, 0.3 Si, 0.2 P maximum | 40 | 70/483 | 85/586 |
| C50500 | Cu, 1.3 Sn, 0.35 P maximum | 48 | 59/407 | 70/483 |
| *MHP 4 | Cu, 7.5 Sn, 0.5 Ni, 0.10 Si, 0.2 P maximum | 12 | 85/586 min | 105/724 min |
Claims (20)
1, a kind of phosphor bronze alloy, it is grouped into by following one-tenth basically: 0.4-3.0wt%Ni, 0.1-1.0wt%Si, 0.01-0.06wt%P, 1.0-11.0wt%Sn and surplus are Cu and unavoidable impurities.
2, the alloy of claim 1, wherein Ni content is 1.0-3.0wt%.
3, the alloy of claim 1, wherein Sn content is lower than 8wt%.
4, the alloy of claim 1, wherein Si content is 0.22-0.30wt%.
5, the alloy of claim 1, wherein Si content is 0.4-0.5wt%.
6, the alloy of claim 1, wherein Sn content is 1-7wt%.
7, the alloy of claim 1, wherein Sn content is 1.0-1.5wt%.
8, the alloy of claim 1, wherein Sn content is 2.1-2.7wt%.
9, the alloy of claim 1, wherein Sn content is 4.7-5.3wt%.
10, the alloy of claim 1, wherein Sn content is 7-11wt%.
11, the alloy of claim 1, wherein Sn content is 7-8wt%.
12, the alloy of claim 1, wherein P content is 0.05-0.06wt%.
13, the alloy of claim 1, wherein Ni content is 1.3-1.7wt%.
14, the alloy of claim 1, wherein Ni content is 2.5-3.0wt%.
15, the alloy of claim 1, wherein Ni content is 1.3-1.7wt%, and Si content is 0.22-0.30wt%, and P content is 0.01-0.06wt%.
16, the alloy of claim 15, wherein Sn content is 1.0-1.5wt%, 2.1-2.7wt%, 4.7-5.3wt% or 7.0-8.0wt%.
17, the alloy of claim 1, wherein Ni content is 2.5-3.0wt%, and Si content is 0.4-0.5wt%, and P content is 0.01-0.06wt%, and Sn content is 7.0-8.0wt%.
18, the alloy of claim 1, it contains 1.5wt%Ni basically, 0.28wt%Si, 0.057wt%P, 2.46wt%Sn and surplus are copper and unavoidable impurities.
19, the phosphate bronze casting of the alloy of claim 1.
20, the alloy of claim 1, wherein Sn content is 1.25% nominal to 11.0 weight %.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5777997P | 1997-09-05 | 1997-09-05 | |
| US60/057,779 | 1997-09-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1275171A CN1275171A (en) | 2000-11-29 |
| CN1097095C true CN1097095C (en) | 2002-12-25 |
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ID=22012718
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98810040A Expired - Fee Related CN1097095C (en) | 1997-09-05 | 1998-08-21 | Copper based alloy featuring precipitation hardening and solid-solution hardening |
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| Country | Link |
|---|---|
| EP (1) | EP1021575B1 (en) |
| JP (1) | JP2001515960A (en) |
| KR (1) | KR20010023699A (en) |
| CN (1) | CN1097095C (en) |
| AR (1) | AR017044A1 (en) |
| AT (1) | ATE240413T1 (en) |
| AU (1) | AU9108398A (en) |
| BR (1) | BR9811448A (en) |
| CA (1) | CA2303164A1 (en) |
| DE (1) | DE69814657T2 (en) |
| TW (1) | TW364019B (en) |
| WO (1) | WO1999013117A1 (en) |
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| CN101939460B (en) * | 2008-02-08 | 2012-09-05 | 三井住友金属矿山伸铜株式会社 | Process for producing precipitation-hardened copper alloy strip |
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| JP4100629B2 (en) * | 2004-04-16 | 2008-06-11 | 日鉱金属株式会社 | High strength and high conductivity copper alloy |
| WO2007138956A1 (en) | 2006-05-26 | 2007-12-06 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy having high strength, high electric conductivity and excellent bending workability |
| EP2322676A4 (en) * | 2008-09-10 | 2012-06-13 | Taiho Kogyo Co Ltd | SLIDING COMPONENT CONSISTING OF Pb-FREE Cu-Bi TYPE SINTERED MATERIAL |
| CN106435250A (en) * | 2009-04-08 | 2017-02-22 | 瑞士金属-Ums瑞士金属加工有限公司 | Machinable copper base alloy and production method thereof |
| WO2020160682A1 (en) * | 2019-02-07 | 2020-08-13 | Equispheres Inc. | Alloys with a low density of precipitates for use in applications that include remelting processes, and preparation process thereof |
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| CN110923505B (en) * | 2019-12-31 | 2021-11-02 | 内蒙古工业大学 | Cu-Ni-Mn alloy and preparation method and application thereof |
| CN113249612A (en) * | 2021-04-21 | 2021-08-13 | 铁岭富兴铜业有限公司 | Novel contact copper alloy and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4337089A (en) * | 1980-07-25 | 1982-06-29 | Nippon Telegraph And Telephone Public Corporation | Copper-nickel-tin alloys for lead conductor materials for integrated circuits and a method for producing the same |
| JPH02197543A (en) * | 1989-01-26 | 1990-08-06 | Furukawa Electric Co Ltd:The | Copper alloy for connecting apparatus |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU219368A1 (en) * | 1966-07-16 | 1968-05-30 | Припой Пайки Меди | |
| JPS61143564A (en) * | 1984-12-13 | 1986-07-01 | Nippon Mining Co Ltd | Manufacture of high strength and highly conductive copper base alloy |
| JPH02122039A (en) * | 1988-10-31 | 1990-05-09 | Nippon Mining Co Ltd | High strength and high conductivity copper alloy having excellent adhesion of oxidized film |
| JPH0776397B2 (en) * | 1989-07-25 | 1995-08-16 | 三菱伸銅株式会社 | Cu alloy electrical equipment connector |
| JP2780584B2 (en) * | 1992-11-13 | 1998-07-30 | 三菱伸銅株式会社 | Cu alloy for electrical and electronic parts with excellent hot workability and punching workability |
-
1998
- 1998-08-21 BR BR9811448-4A patent/BR9811448A/en not_active Application Discontinuation
- 1998-08-21 AU AU91083/98A patent/AU9108398A/en not_active Abandoned
- 1998-08-21 AT AT98943252T patent/ATE240413T1/en not_active IP Right Cessation
- 1998-08-21 CA CA002303164A patent/CA2303164A1/en not_active Abandoned
- 1998-08-21 EP EP98943252A patent/EP1021575B1/en not_active Expired - Lifetime
- 1998-08-21 KR KR1020007002353A patent/KR20010023699A/en not_active Application Discontinuation
- 1998-08-21 DE DE69814657T patent/DE69814657T2/en not_active Expired - Fee Related
- 1998-08-21 CN CN98810040A patent/CN1097095C/en not_active Expired - Fee Related
- 1998-08-21 JP JP2000510901A patent/JP2001515960A/en not_active Withdrawn
- 1998-08-21 WO PCT/US1998/017196 patent/WO1999013117A1/en not_active Application Discontinuation
- 1998-08-27 TW TW087114229A patent/TW364019B/en active
- 1998-09-01 AR ARP980104367A patent/AR017044A1/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4337089A (en) * | 1980-07-25 | 1982-06-29 | Nippon Telegraph And Telephone Public Corporation | Copper-nickel-tin alloys for lead conductor materials for integrated circuits and a method for producing the same |
| JPH02197543A (en) * | 1989-01-26 | 1990-08-06 | Furukawa Electric Co Ltd:The | Copper alloy for connecting apparatus |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101939460B (en) * | 2008-02-08 | 2012-09-05 | 三井住友金属矿山伸铜株式会社 | Process for producing precipitation-hardened copper alloy strip |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69814657D1 (en) | 2003-06-18 |
| WO1999013117A1 (en) | 1999-03-18 |
| CA2303164A1 (en) | 1999-03-18 |
| JP2001515960A (en) | 2001-09-25 |
| BR9811448A (en) | 2000-08-22 |
| AR017044A1 (en) | 2001-08-22 |
| DE69814657T2 (en) | 2004-03-25 |
| EP1021575A1 (en) | 2000-07-26 |
| KR20010023699A (en) | 2001-03-26 |
| ATE240413T1 (en) | 2003-05-15 |
| CN1275171A (en) | 2000-11-29 |
| AU9108398A (en) | 1999-03-29 |
| EP1021575B1 (en) | 2003-05-14 |
| TW364019B (en) | 1999-07-11 |
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