EP1021575B1 - Legierung auf kupferbasis, gekennzeichnet durch ausscheidungshärtung und durch härtung im festen zustand - Google Patents

Legierung auf kupferbasis, gekennzeichnet durch ausscheidungshärtung und durch härtung im festen zustand Download PDF

Info

Publication number
EP1021575B1
EP1021575B1 EP98943252A EP98943252A EP1021575B1 EP 1021575 B1 EP1021575 B1 EP 1021575B1 EP 98943252 A EP98943252 A EP 98943252A EP 98943252 A EP98943252 A EP 98943252A EP 1021575 B1 EP1021575 B1 EP 1021575B1
Authority
EP
European Patent Office
Prior art keywords
alloy
content
hardening
strength
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP98943252A
Other languages
English (en)
French (fr)
Other versions
EP1021575A1 (de
Inventor
David H. Mandle
Daniel D. Farquharson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DUERER CORPORATION
Original Assignee
Miller Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miller Co filed Critical Miller Co
Priority to EP02018195A priority Critical patent/EP1264905A3/de
Publication of EP1021575A1 publication Critical patent/EP1021575A1/de
Application granted granted Critical
Publication of EP1021575B1 publication Critical patent/EP1021575B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent

Definitions

  • This invention relates to a copper alloy, particularly a copper alloy that is especially useful in electrical and electronic interconnection components and switch applications, including high temperature switching. This alloy shows special promise in "spring type” applications.
  • U.S. Patent No. 5,041,176 discloses a copper alloy including from 0.1-10% nickel (Ni); 0.1-10% tin (Sn); 0.05-5% silicon (Si); 0.01-5% iron (Fe); and 0.0001-1% boron (B), by weight.
  • This disclosure requires formation of an Ni-Si intermetallic compound homogeneously dispersed in the alloy. Fe is required for age hardening. However, at Fe concentrations greater than 5%, electrical conductivity is compromised and corrosion becomes a serious problem.
  • B is incorporated into the alloy to improve corrosion resistance, hardness and strength. High hardness is achieved by precipitation hardening at a tempering temperature of 400° to 450°C. Si also serves as a deoxidizer.
  • the Mikawa alloy is suitable for use in electronic parts where good electrical conductivity, heat conductivity, strength, hardness, plating ability, soldering ability, elasticity, and corrosion resistance including resistance to acids are required, this alloy is of a different composition and displays different characteristics from those obtainable according to the instant invention.
  • Kubosonc et al. U.S. Patent No. 5,516,484.
  • Kubosono et al. discloses copper-nickel based alloys that are processed using horizontal continuous casting with a graphite mold.
  • the Ni-Cu alloy system is essentially a different alloy than the alloy of the instant invention.
  • copper (Cu) is an undesired impurity whose content must be kept below 0.02%.
  • Kubosono et al. teaches that effects obtainable by addition of Si cannot be recognized if no B is present.
  • U.S. Patent No. 5,334,346 to Kim et al. discloses a high performance copper alloy for electrical and electronic parts.
  • the Kim alloy consists essentially of copper and 0.5 to 2.4% by weight Ni; 0.1-0.5% Si; 0.02 to 0.16% P; and 0.02 to 0.2% magnesium (Mg).
  • Kim et al. discusses precipitation hardening where Ni 2 Si and Ni 3 P precipitate in the copper matrix. Any excess of free Si and P, is taught as causing formation of brittle intermetallic compounds which lead to peeling and cracking.
  • Mg is proposed as a scavenger element to remove free Si and P. However, as content of Mg increases, conductivity and utility of the alloy are compromised. Zinc (Zn) and Fe are also disclosed as possible scavengers. This alloy does not contain Sn.
  • Hashizume et al. U.S. Patent No. 5,064,611 discloses a process for producing a copper alloy that contains 1-8% Ni; 0.1-0.8% P; 0.6-1.0% Si; optionally, 0.03 to 0.5% Zn; and Cu.
  • Ni 5 P 2 and Ni 2 Si are disclosed as intermetallic compounds for increasing mechanical strength of the alloy with minimal decrease in electrical conductivity. Sn is not present in this alloy.
  • U.S. Patent No. 5,021,105 discloses an alloy comprising 2.0-7.0% Sn; 1.0-6.0% Ni, cobalt (Co) or chromium (Cr); 0:1-2.0% Si; and Cu.
  • This alloy may be processed to exhibit elongation of 3-20%; strength of 70-100 kg/mm 2 ; and electroconductivity from 10-30% IACS.
  • Ni is disclosed as being important for strengthening; Cr is disclosed as improving hot rolling properties and heat resistance; and Co is disclosed as contributing to effective heat resistance.
  • Sn content is limited to 7% by the hot rolling method used to process the alloy.
  • Asai et al. does not disclose phosphorus (P) as a constituent. Accordingly, this alloy suffers similar limitations to Mikawa et al., as discussed above.
  • Arita et al. U.S. Patent No. 4,337,089, discloses a Cu-Ni-Sn alloy containing 0.5-3.0% Ni; 0.3-0.9% Sn; 0.01-0.05% P; 0.0-0.35% manganese (Mn) or Si; and Cu.
  • This alloy features 60 kg/mm 2 tensile strength and elongation of more than 6% (i.e., to provide the mechanical property necessary for bend working) by combining heat treatment and cold rolling in its processing.
  • Si or Mn is incorporated to enhance strength.
  • the low Sn content disclosed in Arita et al. does not provide the combined formability-strength properties of the instant invention.
  • U.S. Patent No. 5,132,083 teaches a laser padding material which is a powder containing 1-5% Ni; 0.2-5% Si; less than 1% B; less than 2% P; less than 3% Mn; and Cu. Sn and lead (Pb) are optional ingredients, at 8-15% for each.
  • This powder can be laser processed to produce a copper laser padding material excellent in sliding-abrasion resistance.
  • the chemistries involved in laser padding are not the same as in the alloy of the instant invention. For example, no rolling, hot or cold, is used to process the padding material.
  • UNS Unified Numbering System
  • This system is in common use in North America and uses a five digit (recently expanded from three digit) numbering following a C prefix.
  • the numbering system is not a specification, but rather a useful number code for identifying mill and foundry products.
  • the C designations appearing below refer to the UNS numbers.
  • the general art that includes alloys thus includes many patentable alloys that are similar in some respects in composition, but that display different desired properties depending on the specific content and processing of the alloy.
  • UNS alloy C85800 is a leaded yellow brass containing 1.5% Sn, 1.5% Pb, 31-41% Zn, 0.5% Fe, 0.05%Sb, 0.5% Ni (incl Co), 0.25% Mn, 0.05% As, 0.05% S, 0.01% P, 0.55% Al, 0.25% Si and 57.0% minimum Cu.
  • the document JP-A-02 197 543 discloses a copper alloy for a connecting device comprising Ni : 1.5-6.0 wt% ; Si : 0.1-3.0 wt% ; P: 0.12-1.0 wt%; Sn : 1.2-4.2 wt%; O 2 : 20 ppm or less ; S: 10 ppm or less; balance Cu and unavoidable impurities.
  • the present invention provides a phosphor bronze alloy with characteristics much improved over those known in the art.
  • the invention provides an alloy that when processed has desired spring and strength properties and superior durability especially at higher temperatures at an economic price.
  • a particle dispersion enhanced phosphor bronze in accordance with the present invention includes a nickel content of from 0.4 to 3.0% by weight; a Si content of from 0.1 to 1.0% by weight; a P content of from 0.01-0.06% by weight; a Sn content of 3.0-11.0% by weight ; balance copper with unavoidable impurities. Sn enhances formability at a given level of strength. P helps impart optimal spring and strength properties as well as providing fluidity in casting copper based alloys. P also aids in deoxidation of the melt. P is the primary deoxidizer of the melt. Si is not lost in uncontrolled quantities in the melting process, which permits maintaining a stoichiometrical relationship between Si and Ni in the alloy.
  • Sn content of below 8% and P content of 0.01-0.2% by wt. are especially preferred in some embodiments.
  • Solid solution hardening is contributed by tin, phosphorous and copper, while precipitation hardening resides in nickel silicide and nickel phosphides precipitated in the matrix.
  • Solid solution of a copper base occurs when the alloying element is dissolved to form a homogenous liquid solution.
  • the alloying metal goes into solution to form a solid solution.
  • the alloying element thereby becomes an integral part of the matrix crystal.
  • Substitution of elements in solid solution tends to increase the strength of the metal as it decreases electrical conductivity.
  • the increased strength is related to a greater resistance to slip.
  • the solute atoms are different in size from the copper atoms, causing a distortion of the lattice structure that imparts slip resistance. That is, greater energy is required to distort the lattice.
  • the phosphor bronze according to the instant invention has consistent mechanical properties, optimum yield strength and excellent formability.
  • the alloy is especially useful in high temperature applications, e.g., where operational temperatures may reach 140°C, 150°C or higher, for example, up to 200°C in specific applications.
  • the alloy is designed to be a high strength alloy with moderate conductivity. In these applications, no comparable alloy has been previously available.
  • the alloy family will have the strength and formability of known phosphor bronzes, but will exhibit superior resistance to stress relaxation especially at elevated temperatures.
  • the material for the alloy is mixed according to desired concentrations and melted in channel or coreless electric induction furnaces.
  • the obtained melt is horizontally continuous cast through a graphite die. This process is sometimes referred to as horizontal thin strip continuous casting.
  • Special enhanced cooling can be employed to assure proper quenching of solidified material, to maintain all solute in solution.
  • the preferred casting practice employs special enhanced cooling within the graphite die assembly to assure a sufficiently rapid quench of the just-solidified metal from its solidus temperature to a temperature below 450°C. This assures that the solute remains to a high degree (estimated at approx. 90%) in solution, and does not have time to significantly precipitate during the cooling phase.
  • This enhanced cooling involves the use of high thermal conductivity (minimum .77 cal/cm/sec) copper plates to which a high thermal conductivity graphite die (minimum .29 cal/cm/sec) has been bolted as per current standard art.
  • a high conductivity gas such as Helium or Hydrogen or mixtures thereof is introduced, or carrier gases with significant concentrations of Helium and/or Hydrogen, between the copper plates and graphite plates of the assembly.
  • the high conductivity gas replaces atmospheric O 2 /N; in the copper/graphite interface, thereby improving the cooling action.
  • the cast material is surface milled and then rolled down to thinner gages. Heat treatments are imposed in the course of rolling to assure 1) maximum solution of alloying elements, and 2) precipitation of the dissolved alloying elements. The precipitate provides strength and resistance to stress relaxation.
  • the material is for some applications further rolled to attain increased strength, and may or may not be stress relieved thermally and/or mechanically at finish.
  • improved solutioning of the solute is obtained by heat treating at elevated temperatures at the cast stage, or at intermediate stages.
  • the process stages can include the following protocols:
  • the process overcomes problems previously plaguing the art wherein hot rolling technologies did not permit P to be used at levels as instantly claimed.
  • the instant invention provides an alloy that can contain if desired, a wide range of Sn content, for example, greater than 7% Sn, (including 8-11% Sn in several embodiments) with excellent working properties and product characteristics. Although below 8% Sn content is preferred for greater electrical conductivity desired in some applications, higher levels of Sn will provide greater strength desired in other applications. In contrast, many applications will demand that the Sn content be 8% by weight or less, for example, 7%, 5%, and possibly approaching 3%. Alloys with Sn content below 3% will have lower potential strength levels and will not achieve the contact forces required in some more demanding spring contact applications.
  • P levels of 0.01-0.20 may prove particularly advantageous in many applications.
  • Ni and Si in the phosphor bronze according to the invention allow improved strengths and will increase the alloy's resistance to stress relaxation at elevated temperatures where the alloy may be used.
  • the instant invention provides a metal alloy consisting of by weight: Sn 3.0-11.0% Ni 0.4-3.0% Si 0.1-1.0% P 0.01-0.06%
  • Cu comprises the balance. Preferred embodiments of this invention may be limited to preferred subranges of various components, e.g., Sn content of below 8%, 4.7-5.3%, 7-11%, 7-8% or 7-9%, etc. Si content can be 0.22-0.30 % or 0.4-0.5 %. Ni content can be 1.3-1.7%, 2.5-3.0%, or 1.0-3.0%, etc.
  • This alloy of the invention consists of, by weight: Sn 3.0-11.0% Ni 0.4-3.0% Si 0.1-1.0% P 0.01-0.06%, or smaller preferred ranges of each element, with the balance being Cu.
  • the inventive alloy consists essentially of: Sn 3.0-7.0% Ni 0.4-3.0% Si 0.1-1.0% P 0.01-0.06%, with the balance being Cu. Again, smaller specific subranges are contemplated as applications dictate.
  • the alloy consists of, by weight: Sn 3.0-11.0% Ni 0.4-3.0% Si 0.1-1.0% P 0.01-0.06%, or especially, Sn 3.0-7.0% Ni 1.0-3.0% Si 0.2-1.0% P 0.02-0.06%, in each case with the balance being Cu.
  • the alloys according to the instantly claimed invention will demonstrate improved properties, for example, conductivity and tensile strength, over those alloys known in the art.
  • Devices incorporating the alloy will be more economical to produce and maintain and will demonstrate improved durability.
  • Table 1 shows a comparison of exemplary alloys according to the invention, with several standard phosphor bronze alloys.
  • an alloy designated alloy MHP101 was cast with the chemistry as follows:
  • the material was processed to .0070" thick and had mechanical properties as follows in the bare conditions unless otherwise stated:
  • the softening behavior is shown in Figure 1 compared with data of C51100 alloy (4% Sn Phosphor Bronze) and C52100 (8% Sn Phosphor Bronze). The time at temperature was one hour.
  • the stress relaxation behavior is shown in Figure 2 compared with C51100 alloy.
  • the test stress was 80% of initial stress, and the initial stress in the test sample was 88ksi.
  • the test temperature was 150°C.
  • the data collected for MHP101 confirm that alloy formulations of the instant invention provide resistance to stress relaxation at higher temperatures than the current offering to standard Phosphor Bronze alloys such as the C51100 used in the comparison.
  • strengths equal to higher tin-containing Phosphor Bronzes can be achieved with increased electrical conductivity.
  • the alloy MHP101 an example of the alloys of the instant invention, is thus shown to have excellent formability properties.
  • the invention also provides the above described alloy for use as a casting material.
  • Sn over 7% for example, nominal Sn content of 8%, 9%, or 10% will add strength to the alloy.
  • the alloy will also have better formability at a given tensile strength.
  • the invention especially includes embodiments where the alloy displays properties of solid solution hardening, and precipitation hardening, and dispersion hardening.
  • Another aspect of the invention is a phosphor bronze casting.
  • the product resulting from the processing of the casting is useful as a material for electrical lead conductor applications.
  • Such applications include those relating to integrated circuits and those encountered in the automotive industry such as engine compartment circuitry.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Laminated Bodies (AREA)

Claims (15)

  1. Phosphorbronzelegierung, bestehend aus 0,4-3,0 Gew.-% Ni, 0,1-1,0 Gew.-% Si, 0,01-0,06 Gew.-% P, 3,0-11,0 Gew.-% Sn und zum Rest Cu und erschmelzungsbedingten Verunreinigungen.
  2. Legierung nach Anspruch 1, dadurch gekennzeichnet, dass der Ni-Gehalt 1,0-3,0 Gew.-% beträgt.
  3. Legierung nach Anspruch 1, dadurch gekennzeichnet, dass der Sn-Gehalt weniger als 8 Gew.-% beträgt.
  4. Legierung nach Anspruch 1, dadurch gekennzeichnet, dass der Si-Gehalt 0,22-0,30 Gew.-% beträgt.
  5. Legierung nach Anspruch 1, dadurch gekennzeichnet, dass der Si-Gehalt 0,4-0,5 Gew.-% beträgt.
  6. Legierung nach Anspruch 1, dadurch gekennzeichnet, dass der Sn-Gehalt 4,7-5,3 Gew.-% be-; trägt.
  7. Legierung nach Anspruch 1, dadurch gekennzeichnet, dass der Sn-Gehalt 7-11 Gew.-% beträgt.
  8. Legierung nach Anspruch 1, dadurch gekennzeichnet, dass der Sn-Gehalt 7-8 Gew.-% beträgt.
  9. Legierung nach Anspruch 1, dadurch gekennzeichnet, dass der P-Gehalt 0,05-0,06 Gew.-% beträgt.
  10. Legierung nach Anspruch 1, dadurch gekennzeichnet, dass der Ni-Gehalt 1,3-1,7 Gew.-% beträgt.
  11. Legierung nach Anspruch 1, dadurch gekennzeichnet, dass der Ni-Gehalt 2,5-3,0 Gew.-% beträgt.
  12. Legierung nach Anspruch 1, dadurch gekennzeichnet, dass der Ni-Gehalt 1,3-1,7 Gew.-% beträgt, dass der Si-Gehalt 0,22-0,30 Gew-% beträgt und dass der P-Gehalt 0,01-0,06 Gew.-% beträgt.
  13. Legierung nach Anspruch 12, dadurch gekennzeichnet, dass der Sn-Gehalt 4,7-5,3 Gew.-% oder 7,0-8,0 Gew.-% beträgt.
  14. Legierung nach Anspruch 1, dadurch gekennzeichnet, dass der Ni-Gehalt 2,5-3,0 Gew.-% beträgt, dass der Si-Gehalt 0,4-0,5 Gew.-% beträgt, dass der P-Gehalt 0,01-0,06 Gew.-% beträgt und dass der Sn-Gehalt 7,0-8,0 Gew.-% beträgt.
  15. Phosphorbronzegussstück aus der Legierung nach Anspruch 1.
EP98943252A 1997-09-05 1998-08-21 Legierung auf kupferbasis, gekennzeichnet durch ausscheidungshärtung und durch härtung im festen zustand Expired - Lifetime EP1021575B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP02018195A EP1264905A3 (de) 1997-09-05 1998-08-21 Legierung auf Kupferbasis, gekennzeichnet durch Ausscheidungshärtung und Härtung in der festen Lösung

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5777997P 1997-09-05 1997-09-05
US57779P 1997-09-05
PCT/US1998/017196 WO1999013117A1 (en) 1997-09-05 1998-08-21 Copper based alloy featuring precipitation hardening and solid-solution hardening

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP02018195A Division EP1264905A3 (de) 1997-09-05 1998-08-21 Legierung auf Kupferbasis, gekennzeichnet durch Ausscheidungshärtung und Härtung in der festen Lösung

Publications (2)

Publication Number Publication Date
EP1021575A1 EP1021575A1 (de) 2000-07-26
EP1021575B1 true EP1021575B1 (de) 2003-05-14

Family

ID=22012718

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98943252A Expired - Lifetime EP1021575B1 (de) 1997-09-05 1998-08-21 Legierung auf kupferbasis, gekennzeichnet durch ausscheidungshärtung und durch härtung im festen zustand

Country Status (12)

Country Link
EP (1) EP1021575B1 (de)
JP (1) JP2001515960A (de)
KR (1) KR20010023699A (de)
CN (1) CN1097095C (de)
AR (1) AR017044A1 (de)
AT (1) ATE240413T1 (de)
AU (1) AU9108398A (de)
BR (1) BR9811448A (de)
CA (1) CA2303164A1 (de)
DE (1) DE69814657T2 (de)
TW (1) TW364019B (de)
WO (1) WO1999013117A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10317330B4 (de) * 2002-04-15 2013-12-24 Autonetworks Technologies, Ltd. Lichtbogenbeständiger Anschluss, Verwendung davon für ein lichtbogenbeständiges Anschlusspaar, für einen Verbinder, für einen Anschlusskasten, für eine Unterbrechervorrichtung oder dgl. und für ein Kraftfahrzeug und einen Motor
JP4100629B2 (ja) * 2004-04-16 2008-06-11 日鉱金属株式会社 高強度高導電性銅合金
EP2426224B1 (de) 2006-05-26 2015-09-16 Kabushiki Kaisha Kobe Seiko Sho Kupferlegierung mit hoher Festigkeit, hoher elektrischer Leitfähigkeit und herausragender Biegbarkeit
CN101939460B (zh) * 2008-02-08 2012-09-05 三井住友金属矿山伸铜株式会社 沉淀硬化型铜合金条的制造方法
CN102149833B (zh) * 2008-09-10 2013-07-17 大丰工业株式会社 不含Pb的Cu－Bi系烧结材料制得的滑动部件
CN106435250A (zh) * 2009-04-08 2017-02-22 瑞士金属-Ums瑞士金属加工有限公司 可机加工的铜基合金和生产它的方法
CN113646116A (zh) * 2019-02-07 2021-11-12 埃奎斯费雷斯公司 用于包括再熔工艺的应用的具有低沉淀物密度的合金及其制备方法
KR102107585B1 (ko) * 2019-11-22 2020-05-07 주식회사 풍산 내마모성이 우수한 동합금재 및 이의 제조방법
CN110923505B (zh) * 2019-12-31 2021-11-02 内蒙古工业大学 Cu-Ni-Mn合金及其制备方法和应用
CN113249612A (zh) * 2021-04-21 2021-08-13 铁岭富兴铜业有限公司 新型触点铜合金及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61143564A (ja) * 1984-12-13 1986-07-01 Nippon Mining Co Ltd 高力高導電性銅基合金の製造方法
JPH02122039A (ja) * 1988-10-31 1990-05-09 Nippon Mining Co Ltd 酸化膜密着性に優れた高力高導電銅合金

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU219368A1 (de) * 1966-07-16 1968-05-30 Припой Пайки Меди
JPS5727051A (en) * 1980-07-25 1982-02-13 Nippon Telegr & Teleph Corp <Ntt> Copper nickel tin alloy for integrated circuit conductor and its manufacture
JPH02197543A (ja) * 1989-01-26 1990-08-06 Furukawa Electric Co Ltd:The 接続機器用銅合金
JPH0776397B2 (ja) * 1989-07-25 1995-08-16 三菱伸銅株式会社 Ｃｕ合金製電気機器用コネクタ
JP2780584B2 (ja) * 1992-11-13 1998-07-30 三菱伸銅株式会社 熱間加工性および打抜き加工性に優れた電気電子部品用Ｃｕ合金

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61143564A (ja) * 1984-12-13 1986-07-01 Nippon Mining Co Ltd 高力高導電性銅基合金の製造方法
JPH02122039A (ja) * 1988-10-31 1990-05-09 Nippon Mining Co Ltd 酸化膜密着性に優れた高力高導電銅合金

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 198632, Derwent World Patents Index; Class LO3, AN 1986-209673 *
DATABASE WPI Week 199025, Derwent World Patents Index; Class LO3, AN 1990-188450 *
SCHROEDER K.H.: "Werkstoffe für elektrische Kontakte und ihre Anwendungen, PAGES 44, 52-53", EXPERT VERLAG, RENNINGEN-MALMSHEIM (GERMANY), , *

Also Published As

Publication number Publication date
DE69814657T2 (de) 2004-03-25
CA2303164A1 (en) 1999-03-18
AU9108398A (en) 1999-03-29
TW364019B (en) 1999-07-11
WO1999013117A1 (en) 1999-03-18
KR20010023699A (ko) 2001-03-26
ATE240413T1 (de) 2003-05-15
BR9811448A (pt) 2000-08-22
DE69814657D1 (de) 2003-06-18
AR017044A1 (es) 2001-08-22
CN1275171A (zh) 2000-11-29
CN1097095C (zh) 2002-12-25
JP2001515960A (ja) 2001-09-25
EP1021575A1 (de) 2000-07-26

Similar Documents

Publication Publication Date Title
KR100929276B1 (ko) 구리합금
TWI415958B (zh) Copper alloy for electronic material and method for manufacturing the same
EP0666931A4 (de)
JP2004225093A (ja) 銅基合金およびその製造方法
JP2002180165A (ja) プレス打ち抜き性に優れた銅基合金およびその製造方法
KR20090123017A (ko) 전자 재료용 Ｃｕ-Ｎｉ-Ｓｉ 계 합금
EP2270242B1 (de) Kupferlegierungsmaterial für elektrische oder elektronische vorrichtungen, verfahren zu dessen herstellung und bauteil
US6379478B1 (en) Copper based alloy featuring precipitation hardening and solid-solution hardening
JP2002180161A (ja) 高強度銅合金
US20010001400A1 (en) Grain refined tin brass
EP1021575B1 (de) Legierung auf kupferbasis, gekennzeichnet durch ausscheidungshärtung und durch härtung im festen zustand
US5853505A (en) Iron modified tin brass
US5508001A (en) Copper based alloy for electrical and electronic parts excellent in hot workability and blankability
KR20160003555A (ko) 구리합금재, 구리합금재의 제조방법, 리드프레임 및 커넥터
JPH1143731A (ja) スタンピング加工性及び銀めっき性に優れる高力銅合金
EP1264905A2 (de) Legierung auf Kupferbasis, gekennzeichnet durch Ausscheidungshärtung und Härtung in der festen Lösung
JP4664584B2 (ja) 高強度銅合金板および高強度銅合金板の製造方法
CN111575531B (zh) 高导电铜合金板材及其制造方法
JPH0718355A (ja) 電子機器用銅合金およびその製造方法
CN112567058B (zh) 具有优异的强度和导电性的铜合金片材的生产方法及其生产的铜合金片材
KR20160001634A (ko) 구리합금재, 구리합금재의 제조방법, 리드프레임 및 커넥터
MXPA00002305A (en) Copper based alloy featuring precipitation hardening and solid-solution hardening
US20110017358A1 (en) Copper alloy material for electrical/electronic equipments, and electrical/electronic part
JPH0323620B2 (de)
JPH08209271A (ja) はんだ接合強度に優れた電子機器用銅合金とその製造法

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20000303

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: DUERER CORPORATION

17Q First examination report despatched

Effective date: 20001031

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: THE MILLER COMPANY

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030514

Ref country code: LI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030514

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030514

Ref country code: CH

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030514

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030514

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030514

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 69814657

Country of ref document: DE

Date of ref document: 20030618

Kind code of ref document: P

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20030721

Year of fee payment: 6

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20030808

Year of fee payment: 6

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030814

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030814

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030814

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030814

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20030818

Year of fee payment: 6

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20030821

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20030821

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030821

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030825

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20030831

NLV1 Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act
REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

ET Fr: translation filed
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20040217

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20040821

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20050301

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20040821

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20050429

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED.

Effective date: 20050821