EP0993358B1 - Einrichtung und verfahren zur trennung eines geformten substrates von einem prägewerkzeug - Google Patents

Einrichtung und verfahren zur trennung eines geformten substrates von einem prägewerkzeug Download PDF

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Publication number
EP0993358B1
EP0993358B1 EP99922117A EP99922117A EP0993358B1 EP 0993358 B1 EP0993358 B1 EP 0993358B1 EP 99922117 A EP99922117 A EP 99922117A EP 99922117 A EP99922117 A EP 99922117A EP 0993358 B1 EP0993358 B1 EP 0993358B1
Authority
EP
European Patent Office
Prior art keywords
substrate
chamber
carrier
tool
stamping tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP99922117A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0993358A1 (de
Inventor
Alf Springer
Frank Reuther
Lutz MÜLLER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jenoptik AG
Original Assignee
Jenoptik Jena GmbH
Jenoptik AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jenoptik Jena GmbH, Jenoptik AG filed Critical Jenoptik Jena GmbH
Publication of EP0993358A1 publication Critical patent/EP0993358A1/de
Application granted granted Critical
Publication of EP0993358B1 publication Critical patent/EP0993358B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
    • B29C33/46—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles using fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003—Discharging moulded articles from the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003—Records or discs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling

Definitions

  • the invention relates a device for separating a molded Substrate from an embossing tool according to the preamble of claim 1 and a method according to the preamble of claim 7.
  • LIGA technology lithography with synchrotron radiation. Electroforming, impression technique with plastics
  • LIGA technology is a manufacturing process microsystem components known.
  • a moldable material such as. B. a thermoplastic layer
  • Softening temperature of the moldable material with three-dimensional structures Structural heights in the range of a few nanometers up to a few hundred Micrometers.
  • a suitable device contains a chamber with a frame-fixed and an adjustable chamber part.
  • the setting of the pressure and temperature conditions within the chamber is associated with predetermined values of a force acting on the fixed chamber part.
  • a device serves this purpose of demolding, with which bending stresses during demolding are kept low and geometrical restrictions on the available surface of the molding tool are to be avoided.
  • a mold insert the microstructure of which is transferred to a molded part, is surrounded in its edge area by an ejector which can be moved between a rest position and a working position by the mold insert in order to demold the molded part.
  • a space is provided which can be filled with a pressurized fluid.
  • the fluid In the working position of the ejector, the fluid should reach under the molded part at the edges, build up pressure between the mold insert and the molded part to be removed from the mold, and thereby support the removal from the mold.
  • the ejector should be moved into its working position with the help of the pressure force of the fluid.
  • Such a method of operation in which the space provided for the dual function of the fluid must be designed as a pressure chamber and has to work like a pneumatic cylinder for moving the ejector, is associated with considerable uncertainties in the solution disclosed. The reason for this is that the mold insert and the adjoining ejector with the overlying layer of the molded part are provided as wall elements of the room.
  • the undefined adhesion of the molded part to the ejector can lead to leaks and significantly impair the function of the device.
  • the process of demolding is also undefined in its control, both through the applied force control and the termination through mechanical stops.
  • the behavior of the molded part remains largely uncontrollable.
  • EP 0 664 168 A1 discloses a device for deep drawing a Sheet metal blanks on a form die made of elastic material includes, also, with a substrate holder to the blank to be molded outside the molding area fix.
  • the object of the invention is to make the demoulding reliable and a Prevent damage to expensive components to a large extent.
  • the object is achieved by a device for separating a molded substrate from an embossing tool with a pair against each other adjustable chamber parts of a closable chamber, a first of which Chamber part as a carrier of the embossing tool and a second chamber part as a carrier serve the moldable substrate and with a substrate holder that the substrate fixed outside the embossing area, detached by the substrate being detached from the embossing tool through the substrate holder when increasing the distance of the two chamber parts is fixed on its support.
  • the substrate holder can be displaced parallel to the direction of adjustment of the chamber parts and includes a first pressure chamber with the support of the embossing tool.
  • the first pressure chamber is advantageously worked into the carrier of the embossing tool as an annular groove, which the substrate holder closes
  • the pressure chamber contains the substrate holder as a movable part and operates with high certainty as a pneumatic cylinder, in which the substrate holder is moved towards the substrate by increasing the chamber volume.
  • the substrate holder on a tool holder Carrier of the embossing tool encloses the embossing tool on his Encompasses peripheral surface. This creates a direct interface from the costly stamping tool avoided to a moving part and that Risk of damage significantly reduced.
  • the substrate holder is limited by its support on the substrate together with the tool holder, a second pressure chamber into which at least a channel for compressed air through the tool holder to support detachment of the substrate is guided by the embossing tool when the chamber is opened.
  • the carrier of the embossing tool contains supply channels for compressed air, one of which first with the first pressure chamber and a second with the channel in the Tool holder is connected.
  • the above object is further achieved according to the invention a method of separating a molded one Substrate from an embossing tool within a closed chamber, the one consists a pair of mutually adjustable chamber parts, a first of which Chamber part as a carrier of the embossing tool and a second chamber part as a carrier serve the moldable substrate, the substrate in an outside of a Edge area lying embossed area is fixed to its support, the Distance between the two chamber parts is increased, during which the substrate on his Carrier fixed, remains, loosened.
  • the behavior of the molded part remains largely controllable.
  • the substrate is not stripped or ejected, but first held and then removed.
  • separate pressure chambers are provided, in which stable pressure conditions prevail at all times.
  • the control of the detachment process can be carried out safely at any time so that the moldable material is released from the tool uniformly, without springback effects and structural tears.
  • the molding device operating under vacuum according to FIG. 1 can be closed Chamber constructed and consists of mutually adjustable chamber parts 1, 2, of which one chamber part 1 carrier for an embossing tool 3 and the other Chamber part 2 on a substrate carrier 4 contains a moldable substrate 5. Temperature control plates 6, 7 ensure a temperature setting for hot stamping is required.
  • the carrier for the embossing tool 3 contains a cylindrical tool holder 8 which is fastened in a sealed manner to a base plate 9 by a sealing ring 10 and engages around the embossing tool 3 on its circumferential surface.
  • a cylindrical tool holder 8 which is fastened in a sealed manner to the tempering plate 6 via sealing rings 11, 12, an annular groove 13 is incorporated, the inner cylindrical surface 14 of which is extended by the cylindrical lateral surface 15 of the tool holder 8.
  • An annular substrate holder 16 which can be displaced parallel to the direction of adjustment of the chamber parts, forms a first pressure chamber 17 with the groove 13 and the extending lateral surface 15, into which a first supply channel 18 for compressed air is guided through the base plate 9.
  • the substrate holder 16 which has a projection 19 serving as a hold-down device with a circumferential seal 20 at the end, rests with sealing means 21, 22 on the outer cylinder surface 15 of the tool holder 8 or on the outer cylinder surface 23 of the groove 13. This ensures that the substrate holder 16, which is movable in the axial direction, can work like the piston of a pneumatic cylinder.
  • the range of motion is limited in one direction by the base plate 9 and in the other direction by stops, not shown.
  • Return springs 24 serve to bring the substrate holder 16 back into its rest position after the compressed air supply has ended.
  • a second supply duct 25 for compressed air in the base plate 9 opens into a vertically extending duct 26 and extends through a further duct 27 in the tool holder 8 until an end exit.
  • Both feed channels 18, 25 are supplied by a preumatic control (not shown) of the molding device and can be controlled separately.
  • the stamping cycle in which the structure of the surface of the stamping tool 3 z. B. is transferred to the substrate according to DE 196 48 844 C1, begins with the closing of the impression device. At this time, the substrate holder 16 is in the rest position. After the required atmospheric conditions (vacuum) have been set via the pneumatic control and the set temperature via the temperature control plates 6, 7, the two chamber parts 1, 2 are positioned vertically with respect to one another in a force-controlled and displacement-controlled manner until there is contact between the embossing tool 3 and the moldable substrate 5 is coming. The substrate 5 is then pressed into the embossing tool 3 by a force-controlled positioning process in accordance with set process parameters.
  • the chamber is then cooled down to a process-dependent demolding temperature via the temperature control plates 6, 7.
  • the surface contact produced by the stamping process between the stamping tool 3 and the substrate 5 is maintained in a force-controlled manner.
  • the demolding temperature Once the demolding temperature has been reached, normal atmospheric pressure conditions are restored in the chamber.
  • the supply channel 18 is pressurized with compressed air via the pneumatic unit, whereby compressed air is to be understood as a pressurized gaseous medium suitable for the process. Due to the pressure building up in the first pressure chamber 17, the substrate holder 16 is displaced in the direction of the chamber part 2 until the projection 19 with the circumferential seal 20 rests on the surface of the substrate 5.
  • the annular projection 19 encloses a second pressure chamber 28 due to its sealed support on the substrate 5, which is also delimited by the substrate 5, the tool holder 8 and the embossing tool 3 and into which the channel 27 opens. After the pressure chamber 28 is filled with compressed air via the channels 25, 26, 27, the distance between the two chamber parts 1, 2 is continuously increased.
  • the compressed air present in the second pressure chamber 28 immediately flows into the gap which is created and supports the detachment of the substrate 5 with a demolding force proportional to the air pressure.
  • the increase in the surface area of the air associated with the progressive detachment leads to a further increase in the demolding force.
  • the detachment process is evenly distributed over the circumference of the substrate 5 and without springback effects.
  • the continuous movement of the chamber parts 1, 2 is carried out at a defined, uniform speed for a predetermined distance. After completion of this movement, the compressed air supply to the pressure chambers 17 and 28 is interrupted.
  • the return springs 24 move the substrate holder 16 back into its rest position. With the complete detachment of the subastrate 5 from the embossing tool 3, the chamber can be opened.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Press Drives And Press Lines (AREA)
EP99922117A 1998-05-04 1999-04-21 Einrichtung und verfahren zur trennung eines geformten substrates von einem prägewerkzeug Expired - Lifetime EP0993358B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19819761A DE19819761C2 (de) 1998-05-04 1998-05-04 Einrichtung zur Trennung eines geformten Substrates von einem Prägewerkzeug
DE19819761 1998-05-04
PCT/EP1999/002676 WO1999056928A1 (de) 1998-05-04 1999-04-21 Einrichtung und verfahren zur trennung eines geformten substrates von einem prägewerkzeug

Publications (2)

Publication Number Publication Date
EP0993358A1 EP0993358A1 (de) 2000-04-19
EP0993358B1 true EP0993358B1 (de) 2002-07-17

Family

ID=7866567

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99922117A Expired - Lifetime EP0993358B1 (de) 1998-05-04 1999-04-21 Einrichtung und verfahren zur trennung eines geformten substrates von einem prägewerkzeug

Country Status (11)

Country Link
US (1) US6416311B1 (ko)
EP (1) EP0993358B1 (ko)
JP (1) JP4356118B2 (ko)
KR (1) KR100340917B1 (ko)
CN (1) CN1105003C (ko)
AT (1) ATE220604T1 (ko)
DE (2) DE19819761C2 (ko)
DK (1) DK0993358T3 (ko)
ES (1) ES2180301T3 (ko)
TW (1) TW458882B (ko)
WO (1) WO1999056928A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006021507B4 (de) * 2005-05-10 2012-12-27 Toshiba Kikai K.K. Übertragungsvorrichtung und Verfahren zum Übertragen eines Musters

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US6873087B1 (en) 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
US7019819B2 (en) 2002-11-13 2006-03-28 Molecular Imprints, Inc. Chucking system for modulating shapes of substrates
DE10233462B4 (de) * 2002-07-24 2009-01-22 Forschungszentrum Karlsruhe Gmbh Vorrichtung zum Prägen und zur Entformung von Strukturkörpern
US7641840B2 (en) * 2002-11-13 2010-01-05 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
US7090716B2 (en) * 2003-10-02 2006-08-15 Molecular Imprints, Inc. Single phase fluid imprint lithography method
US7128559B1 (en) * 2004-01-13 2006-10-31 Sandia National Laboratories Programmable imprint lithography template
CN100405085C (zh) * 2004-06-28 2008-07-23 鸿富锦精密工业（深圳）有限公司 光学组件的制造方法及装置
US7676088B2 (en) * 2004-12-23 2010-03-09 Asml Netherlands B.V. Imprint lithography
JP4700996B2 (ja) * 2005-04-19 2011-06-15 東芝機械株式会社 転写装置
US7648354B2 (en) * 2005-04-28 2010-01-19 Toshiba Kikai Kabushiki Kaisha Transfer apparatus having gimbal mechanism and transfer method using the transfer apparatus
JP4701008B2 (ja) * 2005-05-25 2011-06-15 東芝機械株式会社 ジンバル機構を備えた転写装置
EP1731960A1 (en) 2005-06-07 2006-12-13 Obducat AB Apparatus and method for separating a composite
DE102005041505B3 (de) * 2005-09-01 2007-04-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zum Abformen von Strukturen
US7670534B2 (en) 2005-09-21 2010-03-02 Molecular Imprints, Inc. Method to control an atmosphere between a body and a substrate
TWI283631B (en) * 2005-10-25 2007-07-11 Ind Tech Res Inst Method and device for demolding
US7517211B2 (en) * 2005-12-21 2009-04-14 Asml Netherlands B.V. Imprint lithography
KR20080114681A (ko) * 2006-04-03 2008-12-31 몰레큘러 임프린츠 인코퍼레이티드 리소그래피 임프린팅 시스템
US8215946B2 (en) 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
WO2008096594A1 (ja) * 2007-02-07 2008-08-14 Asahi Glass Company, Limited インプリント用モールドおよびその製造方法
US7641467B2 (en) * 2007-05-02 2010-01-05 Asml Netherlands B.V. Imprint lithography
US20100096764A1 (en) * 2008-10-20 2010-04-22 Molecular Imprints, Inc. Gas Environment for Imprint Lithography
TWI384287B (zh) * 2008-12-15 2013-02-01 Taiwan Name Plate Co Ltd Hot pressing light guide plate device
JP4799630B2 (ja) * 2009-02-25 2011-10-26 株式会社日本製鋼所 剥離治具、微細構造転写成形装置及び被成形体の剥離方法
WO2012096076A1 (ja) * 2011-01-10 2012-07-19 Ｓｃｉｖａｘ株式会社 離型装置、離型方法およびこれらを用いたインプリント装置
EP2829383A4 (en) * 2012-03-22 2016-04-20 Toyo Seikan Group Holdings Ltd METHOD FOR MOLDING THERMOPLASTIC RESIN ARTICLE AND MOLDING APPARATUS THEREOF
WO2014000024A1 (en) * 2012-06-26 2014-01-03 University Of South Australia Apparatus for fabricating microstructured devices
CN105034345A (zh) * 2015-06-12 2015-11-11 天津大学 一种双振动超声微纳压印成形装置
CN109955420B (zh) * 2017-12-14 2021-05-18 奇景光电股份有限公司 模具分离装置及其分离方法
KR20230047950A (ko) * 2020-10-01 2023-04-10 신에츠 엔지니어링 가부시키가이샤 분리 장치 및 분리 방법
DE102021210271A1 (de) 2021-09-16 2023-03-16 Magna Exteriors Gmbh Verfahren zum Herstellen von Kunststoffbauteilen
CN115284665B (zh) * 2022-08-17 2023-11-28 南通冠优达磁业股份有限公司 一种锰锌铁氧体磁芯的成型模具

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Also Published As

Publication number Publication date
EP0993358A1 (de) 2000-04-19
CN1266394A (zh) 2000-09-13
DE59902022D1 (de) 2002-08-22
CN1105003C (zh) 2003-04-09
DE19819761C2 (de) 2000-05-31
DE19819761A1 (de) 1999-11-18
KR100340917B1 (ko) 2002-06-20
WO1999056928A1 (de) 1999-11-11
KR20010014171A (ko) 2001-02-26
DK0993358T3 (da) 2002-11-04
ES2180301T3 (es) 2003-02-01
JP2002509499A (ja) 2002-03-26
ATE220604T1 (de) 2002-08-15
JP4356118B2 (ja) 2009-11-04
US6416311B1 (en) 2002-07-09
TW458882B (en) 2001-10-11

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