EP0972321A1 - Kontaktanordnung - Google Patents
KontaktanordnungInfo
- Publication number
- EP0972321A1 EP0972321A1 EP98914833A EP98914833A EP0972321A1 EP 0972321 A1 EP0972321 A1 EP 0972321A1 EP 98914833 A EP98914833 A EP 98914833A EP 98914833 A EP98914833 A EP 98914833A EP 0972321 A1 EP0972321 A1 EP 0972321A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- contact
- insulating body
- contact elements
- bores
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
Definitions
- the contact elements are formed by a film made of conductive material and that on both sides of the insulating body the bore ends are surrounded by recesses into which extensions of the contact elements engage.
- the plated-through holes can be produced galvanically in one operation.
- the contact elements can be attached to the two sides of the insulating body in one work step. This eliminates the cumbersome insertion of the mm-sized button contacts made of tangled wire or wire felt into the holes in the insulating body, as is required in the known solution.
- the contact elements preferably consist of separate sections of a contact element mat. The contact elements can thus be produced together in a simple manner, for example from a film made of spring bronze, aligned on the insulating body and fastened to the latter, as will be explained in more detail below.
- the fastening takes place mechanically in that on both sides of the insulating body the bore ends are surrounded by recesses, into which extensions of the contact elements engage.
- FIG. 1 shows a schematic partial cross section through two carriers of contact points and a contact arrangement according to the invention arranged between them, which is to establish the electrical connection between the contact points,
- FIG. 3 shows a section through the insulating body shown in FIG. 2 along line III-III in FIG. 2,
- Fig. 7 is a partial section through a single contact element along line VII-VII in Fig. 6 and
- Fig. 8 is a plan view corresponding to FIGS. 2 and 4 of an insulating body with two contact elements attached to it.
- 10 and 12 denote two carriers, each having a plurality of contact surfaces 18 and 20 on their flat surfaces 14 and 16 facing each other.
- the diameter and the mutual distance between the contact surfaces 18 and 20 is in the range of 1 mm, so that the contact surfaces 18 and 20 further because of this small extent can be called contact points.
- Several hundred of these contact points 18 and 20 are arranged on the surfaces 14 and 16 in a regular grid dimension.
- the first carrier 10 can be an electronic component, for example a processor, while the second carrier 12 can be a printed circuit board on which the component 10 is to be mounted.
- the contact arrangement 22 comprises an insulating body 24 in the form of a thin plate (FIGS. 2 and 3), in which through bores or holes 26 are formed in an arrangement corresponding to the grid arrangement of the contact points 18 and 20.
- the bores 26 each lie in a field of a grid, which is formed by grooves 28 intersecting at right angles in the two surfaces of the insulating body 24.
- Each bore 26 is surrounded by an annular recess 30 which continues outwards in four short channels 32. In other words, there are four elevations 34 in the four corners of each field, which surround the bore 26 at a distance and are separated from one another by the channels 32.
- the insulating body 24 described so far can be produced as a molded part made of plastic.
- the bores 26 are provided with a plated-through hole 36 (FIGS. 1 and 5). This forms a conductive layer 38 covering the bore wall, which is continued on both sides of the insulating body 24 in a ring 40 that circumvents the bore 26.
- the contact element mat 42 After the contact element mat 42 has been placed on the insulating body 24 provided with the plated-through holes 36, so that the contact elements 46 lie exactly over the grid fields of the insulating body 24 containing the bores 26, they are cut in a single operation with the aid of a punching and pressing tool, not shown the material bridges 48 are separated and the extensions 50 of the individual contact elements 46 are pressed into the channels 32 between the elevations 34 in such a way that the extensions 50 with the pointed claws 52 hook onto the walls delimiting the channels 32.
- the contact elements 46 are firmly attached to the insulating body 24 and rest on the rings 40 of the respective plated-through hole 36.
- the line length between two contact elements assigned to one another is very short.
- the electrical connection is low in induction and has a low capacity.
- the contact arrangement is extremely flexible in use with different distances between the contact points to be contacted, i.e. it is practically irrelevant for the production of the electrical connections whether the insulating body is somewhat thicker or thinner.
- the contact arrangement according to the invention is orders of magnitude cheaper to produce than the known solution described at the outset, in which a separate contact button has to be inserted into each bore, it being necessary to ensure that this contact button leaves the bore to a certain extent protrudes.
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19713661 | 1997-04-02 | ||
DE19713661A DE19713661C1 (de) | 1997-04-02 | 1997-04-02 | Kontaktanordnung |
PCT/DE1998/000634 WO1998044599A1 (de) | 1997-04-02 | 1998-03-03 | Kontaktanordnung |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0972321A1 true EP0972321A1 (de) | 2000-01-19 |
Family
ID=7825270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP98914833A Withdrawn EP0972321A1 (de) | 1997-04-02 | 1998-03-03 | Kontaktanordnung |
Country Status (5)
Country | Link |
---|---|
US (1) | US6196852B1 (de) |
EP (1) | EP0972321A1 (de) |
JP (1) | JP2001517358A (de) |
DE (1) | DE19713661C1 (de) |
WO (1) | WO1998044599A1 (de) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6204065B1 (en) * | 1997-03-27 | 2001-03-20 | Ngk Insulators, Ltd. | Conduction assist member and manufacturing method of the same |
US6957963B2 (en) * | 2000-01-20 | 2005-10-25 | Gryphics, Inc. | Compliant interconnect assembly |
US20040043640A1 (en) * | 2002-08-30 | 2004-03-04 | Self Bob J. | High density interconnect |
JP3923889B2 (ja) * | 2002-12-11 | 2007-06-06 | シチズン電子株式会社 | 表面実装型スプリングコネクタの製造方法 |
TW579104U (en) * | 2003-04-09 | 2004-03-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US20050120553A1 (en) * | 2003-12-08 | 2005-06-09 | Brown Dirk D. | Method for forming MEMS grid array connector |
US7597561B2 (en) * | 2003-04-11 | 2009-10-06 | Neoconix, Inc. | Method and system for batch forming spring elements in three dimensions |
US7244125B2 (en) * | 2003-12-08 | 2007-07-17 | Neoconix, Inc. | Connector for making electrical contact at semiconductor scales |
US20070020960A1 (en) * | 2003-04-11 | 2007-01-25 | Williams John D | Contact grid array system |
US7628617B2 (en) * | 2003-06-11 | 2009-12-08 | Neoconix, Inc. | Structure and process for a contact grid array formed in a circuitized substrate |
US20100167561A1 (en) * | 2003-04-11 | 2010-07-01 | Neoconix, Inc. | Structure and process for a contact grid array formed in a circuitized substrate |
US7113408B2 (en) * | 2003-06-11 | 2006-09-26 | Neoconix, Inc. | Contact grid array formed on a printed circuit board |
US7114961B2 (en) * | 2003-04-11 | 2006-10-03 | Neoconix, Inc. | Electrical connector on a flexible carrier |
US8584353B2 (en) * | 2003-04-11 | 2013-11-19 | Neoconix, Inc. | Method for fabricating a contact grid array |
WO2004093252A2 (en) * | 2003-04-11 | 2004-10-28 | Neoconix, Inc. | Electrical connector and method for making |
US7758351B2 (en) * | 2003-04-11 | 2010-07-20 | Neoconix, Inc. | Method and system for batch manufacturing of spring elements |
US7056131B1 (en) * | 2003-04-11 | 2006-06-06 | Neoconix, Inc. | Contact grid array system |
US6916181B2 (en) * | 2003-06-11 | 2005-07-12 | Neoconix, Inc. | Remountable connector for land grid array packages |
US6957964B2 (en) * | 2003-06-05 | 2005-10-25 | Molex Incorporated | Conductive terminal and electrical connector applying the conductive terminal |
US7070419B2 (en) * | 2003-06-11 | 2006-07-04 | Neoconix Inc. | Land grid array connector including heterogeneous contact elements |
EP1637019B1 (de) * | 2003-06-11 | 2019-01-02 | Neoconix, Inc. | Lga steckverbinder |
TWM249244U (en) * | 2003-07-18 | 2004-11-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US7137827B2 (en) * | 2003-11-17 | 2006-11-21 | International Business Machines Corporation | Interposer with electrical contact button and method |
US20050227510A1 (en) * | 2004-04-09 | 2005-10-13 | Brown Dirk D | Small array contact with precision working range |
US20050205988A1 (en) * | 2004-03-19 | 2005-09-22 | Epic Technology Inc. | Die package with higher useable die contact pad area |
US7347698B2 (en) * | 2004-03-19 | 2008-03-25 | Neoconix, Inc. | Deep drawn electrical contacts and method for making |
US7025601B2 (en) * | 2004-03-19 | 2006-04-11 | Neoconix, Inc. | Interposer and method for making same |
US7090503B2 (en) * | 2004-03-19 | 2006-08-15 | Neoconix, Inc. | Interposer with compliant pins |
CN100589279C (zh) * | 2004-03-19 | 2010-02-10 | 内奥科尼克斯公司 | 批形成三维弹簧元件的方法和系统 |
WO2005091998A2 (en) * | 2004-03-19 | 2005-10-06 | Neoconix, Inc. | Electrical connector in a flexible host |
US7128580B2 (en) * | 2004-04-09 | 2006-10-31 | Hon Hai Precision Ind. Co., Ltd. | Socket connector with supporting housing protrusions |
US7094063B1 (en) * | 2004-04-30 | 2006-08-22 | Agilent Technologies, Inc. | High density interconnect |
US7491101B2 (en) * | 2004-06-17 | 2009-02-17 | Illinois Tool Works Inc. | Self-locking wire terminal and shape memory wire termination system |
US20060000642A1 (en) * | 2004-07-01 | 2006-01-05 | Epic Technology Inc. | Interposer with compliant pins |
US7563107B2 (en) * | 2004-07-19 | 2009-07-21 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector with dual-function protrusions |
US7354276B2 (en) * | 2004-07-20 | 2008-04-08 | Neoconix, Inc. | Interposer with compliant pins |
TWM267656U (en) * | 2004-08-20 | 2005-06-11 | Hon Hai Prec Ind Co Ltd | Land grid array electrical connector |
JP4209369B2 (ja) * | 2004-08-26 | 2009-01-14 | アルプス電気株式会社 | 機能素子及びその製造方法、ならびに前記機能素子を用いた電子機器及びその製造方法 |
US20070050738A1 (en) * | 2005-08-31 | 2007-03-01 | Dittmann Larry E | Customer designed interposer |
US7357644B2 (en) * | 2005-12-12 | 2008-04-15 | Neoconix, Inc. | Connector having staggered contact architecture for enhanced working range |
US8102184B2 (en) * | 2006-01-17 | 2012-01-24 | Johnstech International | Test contact system for testing integrated circuits with packages having an array of signal and power contacts |
US7425134B1 (en) * | 2007-05-21 | 2008-09-16 | Amphenol Corporation | Compression mat for an electrical connector |
DE102008014707B3 (de) * | 2008-03-18 | 2009-07-23 | Hugo Kern Und Liebers Gmbh & Co. Kg | Verfahren zur Herstellung von Federplatinen mit Federzungen |
US7699628B2 (en) * | 2008-06-06 | 2010-04-20 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector having reinforcement member attached to housing |
US8641428B2 (en) | 2011-12-02 | 2014-02-04 | Neoconix, Inc. | Electrical connector and method of making it |
US9680273B2 (en) | 2013-03-15 | 2017-06-13 | Neoconix, Inc | Electrical connector with electrical contacts protected by a layer of compressible material and method of making it |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5007843A (en) * | 1983-05-31 | 1991-04-16 | Trw Inc. | High-density contact area electrical connectors |
US4906198A (en) * | 1988-12-12 | 1990-03-06 | International Business Machines Corporation | Circuit board assembly and contact pin for use therein |
US5173055A (en) * | 1991-08-08 | 1992-12-22 | Amp Incorporated | Area array connector |
US5169320A (en) * | 1991-09-27 | 1992-12-08 | Hercules Defense Electronics Systems, Inc. | Shielded and wireless connector for electronics |
US5152695A (en) * | 1991-10-10 | 1992-10-06 | Amp Incorporated | Surface mount electrical connector |
US5184962A (en) | 1991-12-05 | 1993-02-09 | Burndy Corporation | Electrical spring contact |
US5462440A (en) * | 1994-03-11 | 1995-10-31 | Rothenberger; Richard E. | Micro-power connector |
US5632631A (en) * | 1994-06-07 | 1997-05-27 | Tessera, Inc. | Microelectronic contacts with asperities and methods of making same |
US5802699A (en) * | 1994-06-07 | 1998-09-08 | Tessera, Inc. | Methods of assembling microelectronic assembly with socket for engaging bump leads |
US5615824A (en) * | 1994-06-07 | 1997-04-01 | Tessera, Inc. | Soldering with resilient contacts |
DE19517353C1 (de) * | 1995-05-11 | 1996-04-04 | Siemens Ag | Kontaktfeder |
-
1997
- 1997-04-02 DE DE19713661A patent/DE19713661C1/de not_active Expired - Fee Related
-
1998
- 1998-03-03 EP EP98914833A patent/EP0972321A1/de not_active Withdrawn
- 1998-03-03 US US09/402,417 patent/US6196852B1/en not_active Expired - Fee Related
- 1998-03-03 JP JP54104698A patent/JP2001517358A/ja active Pending
- 1998-03-03 WO PCT/DE1998/000634 patent/WO1998044599A1/de not_active Application Discontinuation
Non-Patent Citations (1)
Title |
---|
See references of WO9844599A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO1998044599A1 (de) | 1998-10-08 |
JP2001517358A (ja) | 2001-10-02 |
US6196852B1 (en) | 2001-03-06 |
DE19713661C1 (de) | 1998-09-24 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 19990917 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE FR GB NL |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: FUJITSU SIEMENS COMPUTERS GMBH |
|
GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
17Q | First examination report despatched |
Effective date: 20010607 |
|
GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
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GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20010810 |