EP0924970A3 - Reinigungslösung für elektronische Bauteile sowie Verfahren für ihre Verwendung - Google Patents

Reinigungslösung für elektronische Bauteile sowie Verfahren für ihre Verwendung Download PDF

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Publication number
EP0924970A3
EP0924970A3 EP98124184A EP98124184A EP0924970A3 EP 0924970 A3 EP0924970 A3 EP 0924970A3 EP 98124184 A EP98124184 A EP 98124184A EP 98124184 A EP98124184 A EP 98124184A EP 0924970 A3 EP0924970 A3 EP 0924970A3
Authority
EP
European Patent Office
Prior art keywords
cleaning solution
electronic materials
liter
same
ammonia
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP98124184A
Other languages
English (en)
French (fr)
Other versions
EP0924970B1 (de
EP0924970A2 (de
Inventor
Hiroshi c/o Kurita Water Ind. Ltd. Morita
Junichi c/o Kurita Water Ind. Ltd. Ida
Tetsuo c/o Kurita Water Ind. Ltd. Mizuniwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kurita Water Industries Ltd
Original Assignee
Kurita Water Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP35340397A external-priority patent/JP3375052B2/ja
Priority claimed from JP01393898A external-priority patent/JP3436295B2/ja
Application filed by Kurita Water Industries Ltd filed Critical Kurita Water Industries Ltd
Priority to EP01110701A priority Critical patent/EP1122301B1/de
Publication of EP0924970A2 publication Critical patent/EP0924970A2/de
Publication of EP0924970A3 publication Critical patent/EP0924970A3/de
Application granted granted Critical
Publication of EP0924970B1 publication Critical patent/EP0924970B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/0005—Other compounding ingredients characterised by their effect
    • C11D3/0042—Reducing agents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/39—Organic or inorganic per-compounds
    • C11D3/3947—Liquid compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/06—Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/10—Salts
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
EP98124184A 1997-12-22 1998-12-21 Reinigungslösung für elektronische Bauteile sowie Verfahren für ihre Verwendung Expired - Lifetime EP0924970B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP01110701A EP1122301B1 (de) 1997-12-22 1998-12-21 Reinigungslösung für elektronische Bauteile sowie Verfahren für ihre Verwendung

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP35340397A JP3375052B2 (ja) 1997-12-22 1997-12-22 電子材料用洗浄水
JP35340397 1997-12-22
JP01393898A JP3436295B2 (ja) 1998-01-27 1998-01-27 電子材料用洗浄水
JP1393898 1998-01-27

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP01110701A Division EP1122301B1 (de) 1997-12-22 1998-12-21 Reinigungslösung für elektronische Bauteile sowie Verfahren für ihre Verwendung

Publications (3)

Publication Number Publication Date
EP0924970A2 EP0924970A2 (de) 1999-06-23
EP0924970A3 true EP0924970A3 (de) 2000-03-08
EP0924970B1 EP0924970B1 (de) 2003-03-19

Family

ID=26349793

Family Applications (2)

Application Number Title Priority Date Filing Date
EP01110701A Expired - Lifetime EP1122301B1 (de) 1997-12-22 1998-12-21 Reinigungslösung für elektronische Bauteile sowie Verfahren für ihre Verwendung
EP98124184A Expired - Lifetime EP0924970B1 (de) 1997-12-22 1998-12-21 Reinigungslösung für elektronische Bauteile sowie Verfahren für ihre Verwendung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP01110701A Expired - Lifetime EP1122301B1 (de) 1997-12-22 1998-12-21 Reinigungslösung für elektronische Bauteile sowie Verfahren für ihre Verwendung

Country Status (5)

Country Link
US (2) US6372699B1 (de)
EP (2) EP1122301B1 (de)
KR (1) KR100319119B1 (de)
DE (2) DE69820495T2 (de)
TW (1) TW405176B (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6372699B1 (en) * 1997-12-22 2002-04-16 Kurita Water Industries Ltd. Cleaning solution for electronic materials and method for using same
KR100867287B1 (ko) 2000-06-16 2008-11-06 카오카부시키가이샤 세정제 조성물
GB0017549D0 (en) * 2000-07-18 2000-09-06 Reckitt & Colmann Prod Ltd Improvements in or relating to chemical compositions and their use
US7156111B2 (en) * 2001-07-16 2007-01-02 Akrion Technologies, Inc Megasonic cleaning using supersaturated cleaning solution
US6610599B1 (en) * 2002-06-19 2003-08-26 Lucent Technologies Inc. Removal of metal veils from via holes
JP4319445B2 (ja) * 2002-06-20 2009-08-26 大日本スクリーン製造株式会社 基板処理装置
US7655094B2 (en) * 2004-07-07 2010-02-02 Nano Om, Llc Systems and methods for charging a cleaning solution used for cleaning integrated circuit substrates
US7731800B2 (en) * 2004-07-07 2010-06-08 Nano Om, Llc Systems and methods for single integrated substrate cleaning and rinsing
US20060078850A1 (en) * 2004-10-13 2006-04-13 Suraj Puri Systems, methods and compositions for promoting oral hygiene
US20060142689A1 (en) * 2004-10-13 2006-06-29 Suraj Puri Systems, methods and compositions for cleaning wounds
US20090288688A1 (en) * 2005-03-11 2009-11-26 Ron Rulkens Non-corrosive chemical rinse system
US20070068558A1 (en) * 2005-09-06 2007-03-29 Applied Materials, Inc. Apparatus and methods for mask cleaning
KR101319273B1 (ko) * 2005-12-29 2013-10-16 엘지디스플레이 주식회사 인쇄판 스테이지, 인쇄시스템 및 그를 이용한 액정표시소자제조방법
JP2008300429A (ja) * 2007-05-29 2008-12-11 Toshiba Corp 半導体基板洗浄方法、半導体基板洗浄装置、及び液中気泡混合装置
CN102956450B (zh) * 2011-08-16 2015-03-11 中芯国际集成电路制造(北京)有限公司 一种制作半导体器件的方法
US10935896B2 (en) * 2016-07-25 2021-03-02 Applied Materials, Inc. Cleaning solution mixing system with ultra-dilute cleaning solution and method of operation thereof
JP6752693B2 (ja) * 2016-11-18 2020-09-09 オルガノ株式会社 水処理方法および装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3954645A (en) * 1971-11-11 1976-05-04 Basf Wyandotte Corporation Additive for an acid cleaning bath for metal surfaces
JPS60239028A (ja) * 1984-05-11 1985-11-27 Nec Corp 表面清浄化方法
JPH04107923A (ja) * 1990-08-29 1992-04-09 Fujitsu Ltd 半導体基板の洗浄方法
EP0560324A1 (de) * 1992-03-11 1993-09-15 Mitsubishi Gas Chemical Company, Inc. Reinigungsflüssigkeit für Halbleitersubstrate
JPH06163495A (ja) * 1992-11-20 1994-06-10 Toshiba Corp 半導体ウエハ処理液
JPH07283182A (ja) * 1994-04-12 1995-10-27 Nippon Steel Corp 半導体基板の洗浄方法
EP0789071A1 (de) * 1995-07-27 1997-08-13 Mitsubishi Chemical Corporation Verfahren zur behandlung einer substratoberfläche und behandlungsmittel hierfür
JPH104074A (ja) * 1996-03-25 1998-01-06 Fujitsu Ltd 基板又は膜の洗浄方法及び半導体装置の製造方法
GB2323850A (en) * 1997-04-03 1998-10-07 Nec Corp Washing solution for a semiconductor device

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Publication number Priority date Publication date Assignee Title
SE360571B (de) * 1971-02-09 1973-10-01 Electrolux Ab
US4136023A (en) * 1973-11-06 1979-01-23 Airco, Inc. Methods and apparatus for treating wastewater
US5409544A (en) * 1990-08-20 1995-04-25 Hitachi, Ltd. Method of controlling adhesion of fine particles to an object in liquid
US5414144A (en) * 1993-09-21 1995-05-09 Asahi Kasei Kogyo Kabushiki Kaisha Propylene glycol cyclohexyl ether derivatives, method of producing same and uses thereof
JP2857042B2 (ja) * 1993-10-19 1999-02-10 新日本製鐵株式会社 シリコン半導体およびシリコン酸化物の洗浄液
DE19549139A1 (de) * 1995-12-29 1997-07-03 Asea Brown Boveri Verfahren und Apparateanordnung zur Aufwärmung und mehrstufigen Entgasung von Wasser
US6372699B1 (en) * 1997-12-22 2002-04-16 Kurita Water Industries Ltd. Cleaning solution for electronic materials and method for using same
US6346505B1 (en) * 1998-01-16 2002-02-12 Kurita Water Industries, Ltd. Cleaning solution for electromaterials and method for using same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3954645A (en) * 1971-11-11 1976-05-04 Basf Wyandotte Corporation Additive for an acid cleaning bath for metal surfaces
JPS60239028A (ja) * 1984-05-11 1985-11-27 Nec Corp 表面清浄化方法
JPH04107923A (ja) * 1990-08-29 1992-04-09 Fujitsu Ltd 半導体基板の洗浄方法
EP0560324A1 (de) * 1992-03-11 1993-09-15 Mitsubishi Gas Chemical Company, Inc. Reinigungsflüssigkeit für Halbleitersubstrate
JPH06163495A (ja) * 1992-11-20 1994-06-10 Toshiba Corp 半導体ウエハ処理液
JPH07283182A (ja) * 1994-04-12 1995-10-27 Nippon Steel Corp 半導体基板の洗浄方法
EP0789071A1 (de) * 1995-07-27 1997-08-13 Mitsubishi Chemical Corporation Verfahren zur behandlung einer substratoberfläche und behandlungsmittel hierfür
JPH104074A (ja) * 1996-03-25 1998-01-06 Fujitsu Ltd 基板又は膜の洗浄方法及び半導体装置の製造方法
GB2323850A (en) * 1997-04-03 1998-10-07 Nec Corp Washing solution for a semiconductor device

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch Week 199428, Derwent World Patents Index; Class E19, AN 1994-228307, XP002125851 *
PATENT ABSTRACTS OF JAPAN vol. 010, no. 095 (E - 395) 12 April 1986 (1986-04-12) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 347 (E - 1240) 27 July 1992 (1992-07-27) *
PATENT ABSTRACTS OF JAPAN vol. 096, no. 002 29 February 1996 (1996-02-29) *
PATENT ABSTRACTS OF JAPAN vol. 098, no. 005 30 April 1998 (1998-04-30) *

Also Published As

Publication number Publication date
TW405176B (en) 2000-09-11
EP0924970B1 (de) 2003-03-19
US6450181B1 (en) 2002-09-17
DE69812298T2 (de) 2003-11-20
EP0924970A2 (de) 1999-06-23
KR19990063297A (ko) 1999-07-26
US6372699B1 (en) 2002-04-16
KR100319119B1 (ko) 2002-06-20
DE69812298D1 (de) 2003-04-24
DE69820495T2 (de) 2004-10-21
EP1122301A1 (de) 2001-08-08
DE69820495D1 (de) 2004-01-22
EP1122301B1 (de) 2003-12-10

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