EP0866883A1 - Alliage c11004 - Google Patents

Alliage c11004

Info

Publication number
EP0866883A1
EP0866883A1 EP97905859A EP97905859A EP0866883A1 EP 0866883 A1 EP0866883 A1 EP 0866883A1 EP 97905859 A EP97905859 A EP 97905859A EP 97905859 A EP97905859 A EP 97905859A EP 0866883 A1 EP0866883 A1 EP 0866883A1
Authority
EP
European Patent Office
Prior art keywords
ppm
generally less
oxygen
copper
content generally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97905859A
Other languages
German (de)
English (en)
Other versions
EP0866883A4 (fr
Inventor
Joseph P. Mennucci
Charles R. Mead
Kiran Dalal
Shelley J. Wolf
David Ross
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Materion Brush Inc
Original Assignee
Materion Brush Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Materion Brush Inc filed Critical Materion Brush Inc
Publication of EP0866883A1 publication Critical patent/EP0866883A1/fr
Publication of EP0866883A4 publication Critical patent/EP0866883A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper

Definitions

  • pure copper is notable for its superior electrical conductivity and its exceptional ability to conduct and dissipate heat. For these reasons, pure copper is often a material of choice in the construction of heat sinks for microelectronic packaging.
  • sheeting of pure copper is often bonded to a non-metal such as a ceramic substrate. This is preferably done by a process known as direct bonding.
  • Direct bonding requires that the bonding surface of the copper be oxidized so that covalent bonds can form with the ceramic during thermal bonding.
  • both sides of the sheeting are coated with (or dipped in) a chemical solution that promotes oxidation. This forms a low melting temperature eutectic of copper oxide on each side of the sheeting which, upon heating, bonds the substrate to the sheeting, and the sheeting to adjacent copper layers.
  • the copper may be impregnated with oxygen.
  • Materials of this general description are found for example, in a co-pending patent application, S.N. 08/474,090, filed June 7, 1995, entitled MULTILAYER . LAMINATE PRODUCT AND PROCESS, the disclosure cf which is hereby incorporated by reference in its entirety.
  • Still another object of the present invention is to provide a material with enhanced bonding characteristics.
  • a further object of the present invention is to provide a material that withstands high temperatures while rapidly dissipating heat.
  • a further object of the present invention is to facilitate low cost production of high performance heat sink structures which have acceptable acoustics, cooling rates and pressure drop.
  • Another object of the present invention is to facilitate rapid dissipation of heat from microelectronic packaging.
  • an enhanced bonding copper alloy characterized by an oxygen content generally within a range of 350 ppm to 709 ppm and generally less than about 10 ppm of any one impurity, the balance copper.
  • an enhanced bonding copper alloy characterized by an oxygen content generally within a range of 350 ppm to 709 ppm, an iron content generally less than about 20 ppm, and a zinc content generally less than about 24 ppm, the balance copper.
  • an enhanced bonding copper alloy characterized by an oxygen content generally within a range of 350 ppm to 709 ppm, an iron content generally less than about 20 ppm, a zinc content generally below about 24 ppm, a silicon content generally less than about 31 ppm, generally less than about 31 ppm aluminum, a tin content generally less than about 10 ppm, generally below about 10 ppm lead and about 10 ppm magnesium, a manganese content generally less than about 10 ppm, generally less than about 10 ppm cobalt, generally below about 31 ppm nickel, and a cadmium content of generally less than about 10 ppm, the balance copper.
  • an enhanced bonding copper alloy characterized by an oxygen content generally within a range of 350 ppm to 709 ppm, an iron content generally less than about 20 ppm, a zinc content below about 24 ppm, a silicon content generally less than about 31 ppm, generally less than about 31 ppm aluminum, a tin content generally less than about 10 ppm, generally below about 10 ppm lead and about 10 ppm magnesium, a manganese content generally less than about 10 ppm, generally less than about 10 ppm cobalt, generally below about 31 ppm nickel, a cadmium content generally less than about 10 ppm, less than about 10 ppm calcium, below about 10 ppm beryllium, less than approximately 10 ppm chromium, and generally less than about 10 ppm phosphorus, the balance copper.
  • FIG. 2 is a micrograph of an enhanced bonding copper alloy strip at 120 x magnification containing about 380 ppm oxygen, in accordance with another aspect of the present invention
  • FIG. 3 is a graph for Alloy C11004 showing impurities as a function of oxygen content for cobalt, tin, lead, magnesium, manganese and calcium;
  • FIG. 4 is a graph for Alloy C11004 showing impurities as a function of oxygen content for zinc
  • FIG. 5 is a graph for Alloy C11004 showing impurities as a function of oxygen content for nickel
  • FIG. 6 is a graph for Alloy C11004 showing impurities as a function of oxygen content for silicon
  • FIG. 8 is a graph for Alloy C11004 showing impurities as a function of oxygen content for aluminum.
  • the present invention relates to a discovery of the extraordinary bonding characteristics of Alloy C11000 at relatively high oxygen contents and minimal impurity levels.
  • a higher order copper alloy containing a controlled balance of oxygen and various impurities the alloy being represented by the formula (350-709 ppm 0 2 ) + (0-30 ppm Ni) + (0-19 ppm Fe) + (0-30 ppm Si) + (0-30 ppm Al) + (0-23 ppm Zn) + (0-9 ppm Co) + (0-9 ppm Sn) + (0-9 ppm Pb) + (0-9 ppm Mg) + (0-9 ppm Mn) + (0-9 ppm Ca) + (0-9 ppm Be) + (0-9 ppm Cr) + (0-9 ppm P) , the balance copper.
  • the foregoing formulas indicate the ranges of oxygen and impurities which have consistently yielded acceptable direct bonding of Alloy C11000 to a ceramic substrate, e.g., beryllium oxide, for relatively high performance heat transfer applica ⁇ tions.
  • An exemplary definition of a successful bond is one which gives a minimum of 15 lbs./in. peel strength for a 0.015 in. thick copper sheet direct bonded to a 0.025 in. thick ceramic, e.g., beryllium oxide, using a 90 degree peel strength test.
  • Alloy C11004 Copper alloys with constituents falling within these parameters are hereinafter referred to as Alloy C11004.
  • the oxygen content be controlled to remain within a selected envelope, e.g., generally within a range of 380 ppm and 700 ppm oxygen.
  • the concentration of oxygen is about 700 ppm, as shown in FIG. 1.
  • the oxygen concentration is about 380 ppm.
  • Oxygen appears as heavy black spots at the grain boundaries, as is the case when the material is in the as-cast state. Upon hot working, the oxygen becomes randomly distributed m a new microstructure.
  • Oxygen impregnated copper provides oxygen to the copper- ceramic or copper-copper interface more uniformly than does chemically coated copper. This improves substantially bond integrity and part reliability. Moreover, by eliminating the three chemical baths required to chemically coat copper, there is significant reduction in cost, chemical waste, and health risks alleged to be associated with hauling the waste. The dimensional stability and durability of oxygen impregnated copper is also superior.
  • FIG. 3 Set forth in FIG. 3 is a graph for Alloy C11004 showing maximum acceptable impurity levels for cobalt, tin, lead, magnesium, manganese and calcium as a function of oxygen. Acceptable ranges shown are linear, as illustrated by cross- hatching.
  • FIG. 4 shows maximum acceptable impurity levels of zinc as a function of oxygen. Acceptable ranges are shown by the shaded region below the line. As this demonstrates, the correlation between high oxygen levels and zinc are generally nonlinear and erratic.
  • impurities which may be present in the alloy include, but are limited to, chromium, beryllium, and phosphorus.
  • the level of each additional impurity is preferably well below 10 ppm.
  • the balance of the alloy contents are desirably copper.
  • the embodiments illustrated herein have been shown and described in connection with oxygen-rich copper alloys, e.g., 99.50% Cu (Mill Standard C11000) , it is understood that an analogous process could be practiced on other materials, giving consideration to the purpose for which the present invention is intended.
  • the present invention may be adapted for improving bonding characteristics of other materials such as those containing precious metals, aluminum, titanium, nickel, iron, and their alloys.
  • °2 e __ec-_v. total 0-- ( atomic weight 0 2 ) x [( (Fe/ (atomic weight Fe)) + (Pb/ (atomic weight Pb) ) + (Zn/ (atomic weight Zn) ) + (Sn/(2 x atomic weight Sn) ) ]
  • FeO, PbO, ZnO and SnO are oxides typically present in the copper matrix. Excluded from the equation are those elements and their oxides usually at or beyond detection limits. If other constituents are present in detectable quantities, however, it is considered prudent to include them in the equation. Such materials and their oxides include Be, BeO, Si,
  • Pd thick film and a substantially lower resistivity typically maintains the electrical conductivity within about 5 % of that of pure copper.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

L'invention concerne un alliage de cuivre de liaison améliorée qui se caractérise par une teneur en oxygène généralement comprise entre 350 ppm et 709 ppm, une teneur en fer généralement inférieure à environ 20 ppm, une teneur en zinc généralement inférieure à environ 24 ppm, une teneur en silicium généralement inférieure à environ 31 ppm, et généralement inférieure à environ 31 ppm d'aluminium, une teneur en étain généralement inférieure à environ 10 ppm, et généralement inférieure à environ 10 ppm de plomb et environ 10 ppm de magnésium, une teneur en manganèse généralement inférieure à environ 10 ppm, et généralement inférieure à environ 10 ppm de cobalt, généralement inférieure à environ 31 ppm de nickel, et une teneur en cadmium généralement inférieure à environ 10 ppm, le reste étant du cuivre.
EP97905859A 1996-02-09 1997-02-07 Alliage c11004 Withdrawn EP0866883A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US59961296A 1996-02-09 1996-02-09
US599612 1996-02-09
PCT/US1997/002030 WO1997029216A1 (fr) 1996-02-09 1997-02-07 Alliage c11004

Publications (2)

Publication Number Publication Date
EP0866883A1 true EP0866883A1 (fr) 1998-09-30
EP0866883A4 EP0866883A4 (fr) 1998-12-23

Family

ID=24400340

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97905859A Withdrawn EP0866883A4 (fr) 1996-02-09 1997-02-07 Alliage c11004

Country Status (2)

Country Link
EP (1) EP0866883A4 (fr)
WO (1) WO1997029216A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2012813A (en) * 1978-01-19 1979-08-01 Sumitomo Electric Industries Soft copper alloy conductors and their method of manufacture
JPS60243238A (ja) * 1985-03-19 1985-12-03 Nippon Mining Co Ltd 銅細線の製造方法
JPS62282797A (ja) * 1986-05-29 1987-12-08 Dowa Mining Co Ltd セラミツクス−銅直接接合用銅材
EP0667640A2 (fr) * 1994-01-14 1995-08-16 BRUSH WELLMAN Inc. Produit à multicouches laminé et procédé de fabrication associé

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2183592A (en) * 1939-12-19 Electrical conductor
JPS52131925A (en) * 1976-04-27 1977-11-05 Sumitomo Electric Ind Ltd Heat resisting tough pitch copper for electric wire
JPS6033176B2 (ja) * 1980-11-21 1985-08-01 タツタ電線株式会社 導電用銅合金
JPS5831051A (ja) * 1981-08-18 1983-02-23 Sumitomo Electric Ind Ltd 耐軟化性電線用タフピツチ銅
JPS6057913A (ja) * 1983-09-09 1985-04-03 玉川機械金属株式会社 磁器コンデンサの電極用Ｃｕ合金
JPS61169191A (ja) * 1985-01-21 1986-07-30 Sumitomo Electric Ind Ltd 製缶溶接電極線用銅線
JPH01283333A (ja) * 1987-12-25 1989-11-14 Hiroshi Sasaki 高導電性金属材料
JP2590255B2 (ja) * 1989-03-07 1997-03-12 株式会社神戸製鋼所 セラミックスとの接合性の良い銅材
JP3011433B2 (ja) * 1990-05-25 2000-02-21 株式会社東芝 セラミックス回路基板の製造方法
JPH0529736A (ja) * 1991-07-19 1993-02-05 Tatsuta Electric Wire & Cable Co Ltd フレキシブルプリント回路基板
JPH0547231A (ja) * 1991-08-12 1993-02-26 Tatsuta Electric Wire & Cable Co Ltd 耐熱・耐屈曲・耐摩耗性絶縁電線

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2012813A (en) * 1978-01-19 1979-08-01 Sumitomo Electric Industries Soft copper alloy conductors and their method of manufacture
JPS60243238A (ja) * 1985-03-19 1985-12-03 Nippon Mining Co Ltd 銅細線の製造方法
JPS62282797A (ja) * 1986-05-29 1987-12-08 Dowa Mining Co Ltd セラミツクス−銅直接接合用銅材
EP0667640A2 (fr) * 1994-01-14 1995-08-16 BRUSH WELLMAN Inc. Produit à multicouches laminé et procédé de fabrication associé
US5583317A (en) * 1994-01-14 1996-12-10 Brush Wellman Inc. Multilayer laminate heat sink assembly

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch, Week 8228 Derwent Publications Ltd., London, GB; Class L03, AN 82-58018E XP002082017 -& JP 57 089448 A (TATSUTA DENSEN KK) , 3 June 1982 *
DATABASE WPI Section Ch, Week 8637 Derwent Publications Ltd., London, GB; Class M23, AN 86-241414 XP002082016 -& JP 61 169191 A (SUMITOMO ELECTRIC IND CO), 30 July 1986 *
PATENT ABSTRACTS OF JAPAN vol. 010, no. 120 (C-343), 6 May 1986 -& JP 60 243238 A (NIPPON KOGYO KK), 3 December 1985 *
PATENT ABSTRACTS OF JAPAN vol. 012, no. 164 (M-698), 18 May 1988 -& JP 62 282797 A (DOWA MINING CO LTD), 8 December 1987 *
See also references of WO9729216A1 *

Also Published As

Publication number Publication date
EP0866883A4 (fr) 1998-12-23
WO1997029216A1 (fr) 1997-08-14

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