EP0852414B1 - Connecteur avec assemblage intégré de circuit imprimé - Google Patents

Connecteur avec assemblage intégré de circuit imprimé Download PDF

Info

Publication number
EP0852414B1
EP0852414B1 EP97122940A EP97122940A EP0852414B1 EP 0852414 B1 EP0852414 B1 EP 0852414B1 EP 97122940 A EP97122940 A EP 97122940A EP 97122940 A EP97122940 A EP 97122940A EP 0852414 B1 EP0852414 B1 EP 0852414B1
Authority
EP
European Patent Office
Prior art keywords
circuit
module
pair
disposed
electrical connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP97122940A
Other languages
German (de)
English (en)
Other versions
EP0852414A2 (fr
EP0852414A3 (fr
Inventor
Bernardus L. Paagman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FCI SA
Original Assignee
Berg Electronics Manufacturing BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/784,743 external-priority patent/US6083047A/en
Application filed by Berg Electronics Manufacturing BV filed Critical Berg Electronics Manufacturing BV
Publication of EP0852414A2 publication Critical patent/EP0852414A2/fr
Publication of EP0852414A3 publication Critical patent/EP0852414A3/fr
Application granted granted Critical
Publication of EP0852414B1 publication Critical patent/EP0852414B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs

Definitions

  • the present invention relates to an electrical connector as defined in the preamble of claim 1.
  • the present invention relates specifically to high speed, shielded connectors having one or more integrated PCB assemblies.
  • Connectors having insulative bodies and individual metal terminals are now widely used and available in many different configurations.
  • the usual method of manufacture comprises stitching or insert molding terminals into a suitable housing.
  • the manufacturing process may also include a terminal tail bending operation, especially for right angle connectors.
  • Connectors for high-frequency applications present additional requirements.
  • controlled-impedance terminal sections with ground shielding options are preferred.
  • U.S. Patent No. 4,571,014 shows a different approach for making backplane connectors using one or more PCB assemblies.
  • Each of the PCB assemblies comprises one insulated substrate, one spacer, and one cover plate, all of which are attached to one another.
  • the insulating substrate is provided with a predetermined pattern of conducting tracks, while ground tracks are provided between the conducting tracks.
  • the conducting tracks are connected at one end to a female contact terminal and at the other end to a male contact terminal.
  • Each of the cover plates is a conductive shield member.
  • the circuit substrates are arranged with the sides bearing the conductive tracks all facing in the same direction.
  • the cover plates/shields are each interleaved between adjacent substrates. While such an arrangement produces a plurality of individual shielded tracks, it does not present the possibility for creating impedance matched pairs of conductive tracks through the connector, in a twinax configuration.
  • Twinax connectors are often utilized in combination with twisted pair cable. Such twisted pair cables usually have a plurality of pairs of identical conductors twisted along the signal transmission length.
  • Such a conductor pair has the signal over the two conductors as differential pair; this conductor pair (and possibly several twisted pairs) is enclosed within an outer copper shielding braid to form a cable. Often each twisted pair may have an individual drain wire. Because the electromagnetic flux generated on the twisted pair of a conductor are equal in magnitude and opposite in direction, effectively they cancel each other. Extending this concept to a pair of twinax connector contacts, this can be envisaged as two adjacent, spaced contact elements contained within an outer (rectangular cross-section) grounding shell. This is a relatively inexpensive method to maintain signal quality through an interconnection. Often this is referred to a "balanced pair" interconnection.
  • twinax interconnection termination is often related to the use of cable, but similarly a twinax connector may be terminated on a PCB.
  • the connector instead of the cable twisting, the connector can be mounted on a PCB having pairs of identical tracks which are located spatially adjacent to each other, usually as part of a multi-layered structure.
  • U.S. Patent No. 4,571,014 discloses primarily a backplane interconnection and not a cable-to-cable or cable-to-board interconnection.
  • the object of the present invention is to provide a connector which overcomes the disadvantages described above.
  • ground tracks may be provided between the conducting tracks on a first surface and a ground layer may be provided on a second surface opposite the first surface.
  • the covers are made of insulating material and may hold one or more insulating substrates with conductive traces in opposed relationship to form matched pairs of conductive traces.
  • the covers, together with one or more associated PCB's, may form modules that are assembled in side-by-side relationship in a housing to form a completed connector.
  • the connector may also comprise an insulating connector body accommodating each of said one or more integrated PCB assemblies and provided with a metallized shielding layer on its outer surface. Thereby, the electromagnetic interference caused by such a connector to the environment is further reduced.
  • the connector body desirably includes structure for receiving and securing PCB modules in alignment.
  • the PCB modules include structure for retaining flexible conductors, such as wires or cables, in a position to be secured to traces on the PCB.
  • the covers can include such retaining structures.
  • Figures 1a - 1c generally show manufacturing steps for producing a right angle connector according to the invention in which standard methods of producing printed circuit boards are used.
  • Figure 1a shows an insulating substrate 16, formed for example of conventional flat PCB material provided with several parallel conducting signal tracks 11.
  • Conducting ground tracks 10 may be provided between adjacent tracks 11.
  • the outer most conducting ground track 10 is provided with a ground contact terminal 7 to be connected to ground through the printed circuit board on which the connector is to be mounted.
  • Methods of producing an insulating substrate 16 with parallel conducting tracks 10, 11 are widely known in the field of manufacturing printed circuit boards and need not be explained here.
  • Each of the conducting tracks 11 is connected to board contact terminals 7, the board contact portions 15 of which extending beyond the circuit substrate 16.
  • the board contact portions 15 are shown as press-fit terminals they might be replaced by suitable solder tail terminals.
  • the other ends of the conducting tracks 11 are connected to suitable contact terminals 4.
  • the terminals 4 and 7, respectively are fixed onto suitable solder pads formed at the ends of traces 11. This can be achieved by conventional surface mount soldering techniques.
  • An insulating spacer 17 can be provided having a first series of openings 24 for accommodating the contact terminals 4 and a second series of openings 25 for accommodating at least part of the board contact terminals 7.
  • the recess 2 in the module 1 is formed at the interface of adjacent layers or laminations. That is, the recesses 2, for example, are bounded by the circuit substrate 16, the edges of openings 24 or 25 and the cover 18. This allows the contacts to be secured on substrate 16 by conventional surface mounting or other bonding techniques.
  • the cover 18 and spacer 17 are combined into a single molded part.
  • Figure 1b shows one integrated PCB assembly manufactured from the components shown in Figure 1a, i.e. an insulating substrate 16 to which an insulating spacer 17 is attached and an insulating cover plate 18 attached to the insulating spacer 17.
  • the first series of openings 24 in the insulating spacer 17 form recesses 2, in which the receptacle terminals 4 are disposed to receive contact terminals of a mating connector (not shown).
  • the receptacle terminals 4 shown in Figure 1a may be replaced by pins or hermaphrodite contact terminals.
  • a cover plate could be provided in which suitable recesses are made for accommodating the contact terminals 4 and the board contact terminals 7.
  • Such recesses would serve the same purpose as openings 24, 25 in spacer 17 shown in Figure 1a.
  • such recesses could be provided in substrate 16.
  • Figure 1c shows several integrated PCB modules as shown in Figure 1b arranged parallel, side-by-side relationship for insertion into a connector body 19.
  • the connector body 19 may be made of any insulating material and may be provided with a metallized inner surface to enhance the shielding effectiveness.
  • the connector body 19 may be provided with suitable guiding ridges 23 and one or more guiding extensions 22 for properly connecting the assembled connector to a mating connector (not shown).
  • one or more locating and securing posts 21, receivable within a hole in a printed circuit board to which the connectors to be connected, is provided at the bottom side of the connector body 19.
  • the connector body 19 is provided with suitable lead-in holes 20 in corresponding relationship with each of the contact terminals 4.
  • Each of the lead-in holes 20 is suitable for receiving a mating pin terminal of a mating connector (not shown).
  • the lead-in holes 20 are arranged in columns and rows as is designated by arrows c and r.
  • the PCB assembly 30 comprises an insulating substrate 31 of a material commonly commercially used for making PCBs.
  • the substrate 31 can be a resin impregnated fiber material, such as is sold under the designation FR4, having a thickness 0.4 mm, for example.
  • FR4 resin impregnated fiber material
  • the traces 32 include contact pads at each end adapted to have metal terminals secured to them, as by conventional surface mounting techniques using solder.
  • a plurality of ground or shielding traces 33 are also be applied to the substrate 31.
  • the shielding traces 33 are preferably disposed between each of the circuit traces 32.
  • a terminal such as a contact terminal 34 is mounted at the first end of each trace 32 and a connector mounting side terminal 35 is mounted on the second end of each circuit trace 32.
  • An additional shielding or ground layer 36 may be applied to the remainder of the substrate 31.
  • a ground terminal 37 is fixed onto the ground layer 36, in alignment with the terminals 35.
  • a locating hole 39 may be appropriately placed in the substrate 31.
  • the locating hole 39 preferably comprises a plated through hole for establishing electrical connection with a grounding layer 38 ( Figure 5) that may extend substantially over the entire back surface of the substrate 31.
  • Small vias forming plated through-holes may be disposed in each of the ground tracks 33 so that the ground tracks 33, the shield layer 36 and the back shield layer 38 form a shielding structure for the signal traces 32 and associated terminals. If no shielding or limited shielding is desired, one or more of the shielding structures 33, 36 or 38 can be eliminated.
  • contact terminals 34 are formed as a one-piece stamping and can comprise a dual beam contact having a base section 40 having an opposed pair of upstanding portions 41.
  • a spring section 42 is cantilevered from each of the upstanding portions 41 to define an insertion axis for a mating terminal, such as a pin from a pin header. Such a mating pin would engage the contact portions 43 disposed at the end of each cantilevered arm 42.
  • the contact terminals also include a mounting section, such as the planar member 44, that is adapted to be secured onto the end of the circuit trace 32, typically by solder 46. The latter can be accomplished by conventional surface mounting or other bonding techniques.
  • the cantilevered arms 42 and contact portions 43 define a contact mating or pin insertion axis that is generally parallel to the plane of substrate 31, but is offset from the surface carrying the conductive traces 32.
  • one preferred form of connector mounting terminal 35 includes a press-fit section 48 and a board mounting section 49.
  • the board mounting section 49 includes a generally planar base 50 with an upturned top tang 52 disposed along a top edge. A pair of opposed side tangs 53 are also upturned from the base 50.
  • the mounting portion 49 is retained on the circuit trace 32 by solder fillets 54, again formed by conventional surface mounting solder techniques.
  • the top tang 52 is spaced closely adjacent to or rests on the top surfaces of the side tangs 53 as shown in Figure 5.
  • Figures 6, 6a, 6b, 6c and 6d illustrate an insulative cover/spacer member 56, preferably molded from an appropriate polymeric insulating material.
  • the cover includes a plurality of contact recesses 57 formed along one edge. Each of the recesses 57 includes a contact preload rib 58. A large central recess 59 may also be formed in the cover. A second plurality of terminal recesses 60 is formed along a second edge of the cover. Further, a locating boss 62 is integrally formed with the cover and is sized and shaped to be received, with limited clearance, in the locating opening 39 in the substrate 31.
  • the cover further includes an upper rim 63 extending from the rear of the cover to a location near the recesses 57.
  • a bottom rim or support member 64 is formed on a portion of the bottom surface of the cover.
  • the cover 56 further includes an upper locating and mounting rib 65, preferably in the form of a dove tail rib as shown.
  • a similar but shorter mounting and locating rib 66 is disposed on the bottom edge of the cover.
  • the surfaces 67a and 67b form board rest surfaces against which a substrate 31 is placed.
  • the surfaces 67a and 67b may carry an adhesive or alternately a double sided adhesive coated film (not shown) may be applied to extend from surface 67a to surface 67b.
  • a half of one type of twinax contact module may be formed by associating a PCB assembly 30 with a cover 56 to form a module 69.
  • Figure 7 is substantially an x-ray view through the cover 56 of column terminal module 69.
  • the PCB assembly 30 is located in the vertical direction by the upper and lower rim or mounting members 63, 64 and is located in a longitudinal manner by the locating boss 62 (see also Figure 7e).
  • the contact terminals 34 are located in the contact recesses 57 and the connector mounting terminals 35 are located in the recesses 60.
  • the previously mentioned adhesive or adhesive coated films on surface 67a and 67b maintain the PCB assembly and cover 56 together.
  • Figure 7a is a sectional view taken along line AA of Figure 7 and shows the contact terminals 34 located in the contact recesses 57.
  • the terminals 34 are positioned so that the contact portions 43 bear against the preload ribs 58 to impart a desired preload on the cantilevered spring arms 42.
  • Figure 7b is a sectional view taken along line BB of Figure 7. As shown in Figure 7b, the substrate 31 is essentially located in a vertical position by the rims 63 and 64.
  • each connector mounting terminal 35 has its mounting portion received within a corresponding recess 60.
  • the board mounting terminal is of a type that is likely to have a relatively high axial force applied to it, such as a press-fit terminal
  • the surface 68 ( Figure 6d) of the recess 60 is advantageously located so that it bears against the upturned tang 52 of the terminal.
  • the views in Figures 7c and Figure 9 are taken substantially along section line cc of Figure 7.
  • Figure 7d is a fragmentary cross sectional view taken along line DD of Figure 7, showing the positioning of grounding terminal 37 in a similar fashion to terminals 35 shown in Figures 7c and Figure 9 (discussed below).
  • Figure 7e is a view of the back end of the module 69 showing in phantom views the locating boss 62 and the mounting portion of terminal 37.
  • Figures 8 and 8a illustrate enlarged views of the connector contacts 34 located in recesses 57 of the cover 56.
  • Figure 8a is a cross sectional view taken along line GG of Figure 8 and shows the positioning of the preload rib 58 with respect to the contact portions 43.
  • Figure 9 illustrates the interaction of the cover 56 with the board connection terminal 35 when a downward force F is applied to the top edge of the module 69. That force is transmitted by the cover to the pressing surface 68 formed by the top surface of the recess 60. As a result, a vertical insertion force that is used to push the press-fit 48 section into the hole T is applied directly to the upper tang 52 and the side tangs 53. In this manner, shear stress occurring at the solder connection between the base 50 of the terminal and the circuit trace 32 is minimized. In this manner, loosening or detachment of the terminal 35 is avoided.
  • the surface 68 is designed so that it will engage tang 52 before the rim 63 begins applying a vertical force to the upper edge of the substrate 31.
  • One way to accomplish this is to provide an initial, small clearance between the rim 63 and the adjacent edge of substrate 31.
  • the cover is designed so that a significant proportion of the insertion force is applied directly to terminal 35 so that stress at the terminal/conductive track interface is minimized.
  • the structure disclosed is designed to withstand required press-fit pin insertion forces of 35-50 Newtons per pin.
  • Figure 10 is a cross sectional view taken along line HH of Figure 10a and shows a connector housing 70 having a top wall 72, a bottom wall 76 and a front wall 78.
  • the top wall 72 includes a plurality of locating slots, for example the dove tail slots 73.
  • One or more guiding ridges 74 may be formed on a top surface of the top 72.
  • the bottom 76 also includes locating slots, for example the dove tail slots 77.
  • the front wall 78 includes a plurality of openings 79. Additional shielding can be provided by metallizing appropriate surfaces of the housing 70.
  • Figure 10c shows a bottom view of the housing 70 shown in Figure 10.
  • Figure 11 is a front elevational view of a lead-in face plate 80 having a plurality of tapered lead-in sections 84 arranged in the form of a grid. Each of the lead-in portions 84 extends to a pin insertion port 85. A plurality of sleeves or hollow bosses 86 extend from the rear surface of the face plate 80 and are shaped and sized to be positioned and retained in the openings 79 in the front wall 78 of housing 70.
  • the use of a separate lead-in plate is desirable when the interior surfaces of the housing 70 are to be fully metallized.
  • the housing 70 can also be formed with the lead-in plate integrally molded, where selective metallization or no metallization is utilized.
  • Figure 12 illustrates printed circuit board modules configured to provide connectors having shield pairs of terminals.
  • the module 30 shown in the lower portion of Figure 12 is essentially the same as the module illustrated in Figure 7 wherein the dotted lines illustrate the location of structures on the side of cover 56 located on the reverse side of the cover adjacent PCB 31 ( Figure 7C).
  • traces 32 and 33 have been shown in full line rather than dotted or phantom form.
  • the elements forming the module 30 are the same as those discussed in connection with Figures 2 - 9 and no further description thereof is believed necessary.
  • PCB module 30' includes essentially the same elements as module 30 and these have been designated by the designation.
  • Module 30' differs from module 30 essentially in the aspect that the elements of this module are arranged to constitute a mirror-image with a respect to line L.
  • Figure 13 illustrates a generalized cross-sectional view of modules 30 and 30' arranged in back to back relationship to form a complete shielded pair module that can be placed in side by side relationship with similar modules to form a connector.
  • the back shielding layers 38, 38' of the PCBs 31, 31' are arranged adjacent one another to form the shielded pair module.
  • the modules 30, 30' can be held in the illustrated relationship by insertion into housing 70 ( Figure 10) or, if desired, by a conductive adhesive layer applied to adjacent outer surfaces of shielding layers 38, 38'.
  • the dimension X represents the centerline distance between the terminals 34 and 34', which essentially constitutes the contact pitch between the terminals.
  • the dimension A represents the overall thickness of the shielded pair module. As illustrated, the dimension A is twice the thickness of one of the PCB modules 30, 30. Preferably, the dimension A is chosen so that the terminal pitch X is maintained between adjacent shielded pair modules. Referring to Figure 14, spacers 90 having a thickness represented by the dimension B may be placed between PCB modules 30 and 30' to achieve a desired terminal pitch X.
  • FIG 15 is a rear view of a completed 5 x 6 connector (rows x columns) formed by juxtaposing three shielded pair modules arranged in side by side relationship within housing 70.
  • Each module 90 includes a pair of juxtaposed PCB's 31, 31' on which press-fit terminals (such as shield terminals) 37, 37', are mounted.
  • Each PCB 31, 31' is held by an associated insulative cover 56, 56'.
  • the covers 56, 56' have dove-tail ribs 65, 65' fitted within dove-tail slots 73 in the housing.
  • the dotted squares 92 represent the locations of the terminals 34, 34' and generally correspond to the location of the openings 85 in the face-plate 80 ( Figure 11).
  • the contact pitch X existing between adjacent columns at the intermating face of the connector also exists at the board mounting interface at terminals 37.
  • Each of these shielded pair modules 90 carry five shielded pairs of terminals and terminal leads in the 5 x 6 configuration illustrated in Figure 15.
  • Figure 16 is a rear view of a connector essentially as illustrated in prior co-pending International Application Serial No. PCT/US96/11214 filed 02 July, 1996.
  • the PCB modules 30 are arranged in the connector housing 70 so that all of the PCB assemblies 30 are oriented in the same way, for example, with the cover 56 disposed on the left-hand side and the PCB 31 disposed on the right-hand side.
  • Figures 17a, 17b, and 17c illustrate connectors embodying an aspect of the present invention.
  • Figure 17a illustrates from a rear view one form of twinax connector having shielded pairs of terminals and terminal leads.
  • the terminal pair modules 91 are formed by placing the covers 56, 56' in back to back relationship with the PCB's 31, 31' forming the exterior surfaces of the module.
  • the signal and ground traces 32, 32' and 33, 33', respectively are located in facing mirror-image relationship on the interior surfaces of the PCB's 31, 31', with the outer-shielding layers 38, 38' disposed outwardly.
  • twinax pairs 93 of terminals that are substantially parallel through the conductor and have essentially identical electrical characteristics. These pairs are shown by the dotted enclosures 93 for the left-hand most module 91.
  • FIG 17b The connector shown in Figure 17b is essentially the same arrangement as that shown in Figure 17a, with the exception that instead of two covers 56, 56', a single insulative member 57 is utilized to hold the opposed PCBs 31, 31'. In each of the modules 91 the outer surfaces of the member 57 are configured similarly to the interior surfaces of the covers 56, 56'.
  • Figure 17c essentially illustrates the arrangement previously discussed with respect to Figure 15. Instead of using two PCBs, a single multi-layer PCB 31''may be employed having a centrally located, substantially continuous central shield layer, with the signal and shielding traces formed on opposed sides of the 31 in mirror-image relationship.
  • Figures 18a and 18b are schematic representations designed to illustrate the electrical differences between the Figures 17a-b type of connectors and the Figure 17c type of connector.
  • the pair of interconnection terminals 94 are electrically isolated by a common shield S.
  • each of the interconnections 94 of the pair are individually shielded. In either case, an electrically matched pair of interconnections are formed to maintain essentially a twinax relationship through the interconnection.
  • Figure 19 illustrates an arrangement for cable connectors.
  • Figure 19 shows a cover 100 for use with a circuit board generally of the type previously described.
  • the upper portion of the cover 100 is substantially similar to the cover 56 shown in the previous embodiments. It includes on its upper and lower surfaces dove-tail ribs 165 and 166 that are designed to be received in corresponding dove-tail grooves in a housing, such as housing 70 shown in Figure 10.
  • a printed circuit board has a plated through hole for receiving the locating lug 162.
  • the locating ribs 163 and 164 are the equivalent of locating ribs 63 and 64 shown in Figure 6C and serve to locate the PCB in the same manner.
  • the PCB assembly to be associated with the cover 100 differs from those previously described essentially by the absence of press-fit terminals 35 and 37.
  • the cover 100 includes a retaining structure 102 for retaining a flexible conductor, for example, a cable formed of a plurality of individual wires.
  • the retaining structure 102 includes an opening 104 for receiving the cable.
  • a suitable strain relief element or elements may be provided at the location of opening 104 to enhance cable retention.
  • the retaining structure 102 preferably includes a plurality of routing pegs 106 that are useful to separate individual wires that are to be attached to the PCB. Such individual wires are schematically illustrated by the dotted lines 108 in Figure 19. The ends of the wires 108, 109 may be soldered to contact pads on the PCB that are coincident with the recesses 110 in the cover 100.
  • the PCB is assembled to the cover 100 and the individual wires 108 are arranged between the pegs 106.
  • the cable (not shown) includes one or more drain lines, which can be represented by the line 109, these drain lines can be soldered to the shielding structures of the printed circuit board such as traces 33, layer 36 and 38 by connection at an appropriate location, for example, the right hand at most location of the PCB that in the previous embodiment corresponds to the location of press-fit shield terminal 37.
  • shielded pair modules employ two covers 100, one of which is a mirror-image of the other. Each one of a twisted wire pair is connected to corresponding traces on each of the printed circuit boards.
  • each twisted pair has an individual drain
  • the drain wire can be connected to an appropriate shielding trace 33.
  • FIGS 20a - 20c illustrate the components of a typical cable connector.
  • the connector illustrated is a twinax connector but other configurations are possible by varying the relative orientation and layout of the modules.
  • this connector there are two mirror image PCB's 31 and 31' placed in back to back relationship with shielding layers placed next to each other.
  • Signal wires 108 are each attached to one of the conductive signal traces 32 on each of the PCBs 31 and 31', along a bottom edge of each PCB.
  • conductors from each twisted pair would be attached to corresponding signal traces on each of the PCBs 31 and 31'.
  • a drain or shield 109 is present in the cable, it can be secured to the shield portion 36.
  • the securing of the various wires to the PCB's is accomplished by conventional means, such as soldering or welding.
  • the shield traces 33 and shield portion 36 are interconnected to the shield layers 38 and 38' by plated vias 112 and the plated location hole 39 as previously described.
  • Covers 100 and 100' are secured onto the respective PCBs 31 and 31'.
  • the retainer sections of each cover surround the ends of the wires attached to the PCBs 31 and 31'.
  • the retaining sections include the pegs 106, which provide strain relief and wire support functions.
  • the PCB's 31 and 31' may be held together by a conductive adhesive or may be closely held together by the effect of the dove tail ribs 165 and 165' and corresponding dove tail slots 73 and 77 in the housing 70, as the module is assembled in the housing 70 as shown in Figure 20b.
  • a plurality of modules are arranged in the molded plastic housing 70, the interior surfaces of which may be metallized to provide additional shielding.
  • the face plate 80 is secured to housing 70 to form the completed right angle cable connector shown in Figure 20c.
  • Figures 21a - 21c show essentially the same elements illustrated in Figures 20a - 20c with the exception that the PCBs 33 and 33 ' are configured to provide a cable connection end at the rear edge of the PCB's rather than the bottom edge.
  • the insulating covers 100 and 100 ' are modified correspondingly to situate the cable retaining sections 102 and 102' at the rear edges of the PCBs.
  • the covers include pegs 106 for providing support, organization, and strain relief.
  • the covers 100 and 100' may be secured together at engaging edges along the PCB's and at the retaining sections, for example by adhesives or solvent or heat welding.
  • the modules are then inserted into housing 70 as shown in Figure 21b and are retained in the housing as previously described.
  • a completed straight connector is formed by the insertion of a plurality of modules in side by side relationship into the housing 70 and securing a face plate 80 on the housing, as illustrated in Figure 21c.

Claims (17)

  1. Connecteur électrique comprenant :
    un logement (70) ;
    un module de circuit (1 ; 30) qui peut être monté dans le logement (70), comprenant une paire de conducteurs de signaux essentiellement parallèles (11,32) disposés à l'intérieur du module (1 ; 30), s'étendant chacun depuis une première région du module (1; 30) jusqu'à une seconde région du module (1;30); au moins deux bornes de contact électrique (34), chaque borne (34) étant connectée électriquement à un des conducteurs de signaux (11,32) dans la première région, lesdits conducteurs de signaux (11,32) étant agencés essentiellement symétriquement autour d'un plan longitudinal du module (1; 30), tel que les conducteurs (11,32) forment des images miroirs les uns des autres par rapport audit plan longitudinal.
  2. Connecteur électrique de la revendication 1, dans lequel chacun des conducteurs (11,32) comprend une piste de circuit disposée sur un substrat de circuit (16,31) inclus dans le module (1 ; 30).
  3. Connecteur électrique de la revendication 2, dans lequel les pistes sont des pistes imprimées.
  4. Connecteur électrique de la revendication 2, dans lequel une paire de modules (30; 30') inclut au moins deux substrats de circuit (31,31') et chacune des pistes est disposée sur un des substrats de circuit (31,31'), chaque substrat de circuit étant essentiellement planaire et parallèle à l'autre.
  5. Connecteur électrique de la revendication 2, dans lequel les pistes de circuit (32, 32') sont disposées sur des côtés opposés d'un substrat de circuit unique (16 ; 31).
  6. Connecteur électrique de la revendication 1, dans lequel chaque conducteur (31,32) est substantiellement bordé le long de sa longueur d'une paire de conducteurs écrans (10,33).
  7. Connecteur électrique de la revendication 6, dans lequel les conducteurs de signaux (11,32) et les conducteurs écrans (18,33) comprennent des pistes de circuit sur un substrat de circuit (16,31) et dans lequel le module (1 ; 30) comprend en outre au moins une couche écran métallique (38) disposée entre les pistes conductrices de signaux agencées de manière essentiellement symétrique (11,32).
  8. Connecteur électrique de la revendication 7, dans lequel le module (1 ; 30) comprend en outre une paire de couches écrans opposées (36,38), chaque couche écran (36,38) étant disposée sur une des deux surfaces extérieures opposées du module (1 ; 30).
  9. Connecteur électrique de la revendication 1, dans lequel une paire de modules (30 ; 30') comprend une paire de substrats de circuit (31,31') espacés, supportés de manière à se faire face l'un l'autre, chaque conducteur de signaux (32,32') comprenant une piste de circuit disposée sur une des surfaces se faisant face et dans lequel le module (30; 30') comprend en outre un élément de support commun (64, 67a, 67b) pour supporter lesdits deux substrats de circuit (31,31').
  10. Connecteur électrique de la revendication 4, dans lequel la paire de modules (30; 30') comprend en outre une paire d'éléments de support (64, 67a, 67b) disposés côte à côte, chacun des éléments de support (64, 67a, 67b) portant un des substrats de circuit (31,31') ou dans lequel la paire de modules (30; 30') comprend une paire de substrats de circuit (31,31') disposés côte à côte, présentant chacun une surface extérieure se faisant face et les conducteurs de signaux (32,32') comprennent des pistes de circuit, chacune des piste de circuit étant disposée sur une desdites surfaces extérieures se faisant face, et une paire d'éléments de support (64, 67a, 67b), chaque élément de support (64, 67a, 67b) étant disposé en adjacence par rapport à une des surfaces extérieures se faisant face, ou comprenant au moins un module de circuit additionnel (1; 30) monté sur le logement (70), ledit module de circuit additionnel (1; 30) étant essentiellement similaire au premier module de circuit mentionné (30; 30').
  11. Paire de modules (30; 30') pour un connecteur électrique selon la revendication 4, comprenant :
    (a) un premier substrat de circuit (31) ayant une piste de circuit (32) disposée sur ce dernier, la piste de circuit (32) s'étendant depuis une première région du substrat de circuit (31) jusqu'à une seconde région du substrat de circuit (31) éloignée de la première région ;
    (b) un second substrat de circuit (31') présentant une seconde piste de circuit (32') disposée sur ce dernier et s'étendant depuis une première région du second substrat (31') jusqu'à une seconde région de ce dernier éloignée de la première région, caractérisé en ce que la seconde piste de circuit (32') est essentiellement espacée et se reflète symétriquement par rapport à la première piste de circuit (32), lesdites première et seconde pistes de circuit (32,32') formant une paire twinaxiale de conducteurs.
  12. Paire de modules (30; 30') de la revendication 11, comprenant en outre une structure de protection essentiellement planaire (38,38') pour protéger électriquement les pistes conductrices (32,32') ou dans laquelle le premier substrat (31) et le second substrat (31') comprennent une paire de cartes de circuits, chaque carte de circuit ayant deux faces primaires, avec une desdites pistes de circuit (32,32') disposée sur une desdites faces primaires de chaque carte de circuit et une couche écran (38,38') disposée sur une face primaire opposée de chaque carte de circuit, les cartes de circuits étant agencées dos à dos avec la couche écran (38,38') de chaque carte ou en relation opposée, ou dans laquelle le premier et le second substrat (31,31') comprennent des côtés opposés d'une carte de circuit.
  13. Paire de modules (30; 30') de la revendication 12, dans laquelle la carte de circuit comprend en outre une couche écran (38,38') disposée entre le premier et le second côté.
  14. Paire de modules (30; 30') de la revendication 11, comprenant en outre un élément de support commun (64, 67a, 67b) pour soutenir le premier et le second module dans une dite relation essentiellement opposée, l'élément de support (64, 67a, 67b) incluant une structure (63, 65, 66) pour monter le module dans un logement.
  15. Connecteur électrique selon l'une quelconque des revendications 1 à 10, comprenant :
    une pluralité de modules de cartes de circuit (30), les modules (30) incluant au moins une paire protégée de câbles twinaxiaux de pistes conductrices (32), chaque paire de conducteurs (32) étant située sur un module (30) différent; et
    un moyen pour monter la pluralité de modules de manière à ce qu'ils soient substantiellement côte à côte.
  16. Connecteur électrique de la revendication 15, dans lequel chaque module (30) inclut un élément de couvercle (100) pour soutenir le substrat de circuit (31) et ledit couvercle inclut une structure de retenue (102) pour maintenir les conducteurs flexibles (108) adjacents à une région de la carte de circuit, ladite structure de retenue (102) étant intégralement formée par le couvercle (100).
  17. Connecteur électrique selon une ou plusieurs des revendications 1 à 10 et 15 à 16, comprenant un couvercle (100) pour couvrir chacun des substrats de circuit (31), chaque couvercle incorporant un moyen de retenue (102) pour maintenir les conducteurs flexibles (108) adjacents à une région de chaque carte de circuit.
EP97122940A 1997-01-07 1997-12-29 Connecteur avec assemblage intégré de circuit imprimé Expired - Lifetime EP0852414B1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US3469097P 1997-01-07 1997-01-07
US34690P 1997-01-07
US784743 1997-01-16
US08/784,743 US6083047A (en) 1997-01-16 1997-01-16 Modular electrical PCB assembly connector

Publications (3)

Publication Number Publication Date
EP0852414A2 EP0852414A2 (fr) 1998-07-08
EP0852414A3 EP0852414A3 (fr) 1999-10-27
EP0852414B1 true EP0852414B1 (fr) 2004-11-24

Family

ID=26711259

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97122940A Expired - Lifetime EP0852414B1 (fr) 1997-01-07 1997-12-29 Connecteur avec assemblage intégré de circuit imprimé

Country Status (7)

Country Link
EP (1) EP0852414B1 (fr)
JP (1) JP4565673B2 (fr)
CN (1) CN1190807A (fr)
CA (1) CA2225151C (fr)
DE (1) DE69731719T2 (fr)
SG (1) SG71746A1 (fr)
TW (1) TW385579B (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103959568A (zh) * 2011-11-02 2014-07-30 富加宜（亚洲）私人有限公司 具有减小的法向力的电连接器
US10561351B2 (en) 2011-07-26 2020-02-18 Glysens Incorporated Tissue implantable sensor with hermetically sealed housing
US10561353B2 (en) 2016-06-01 2020-02-18 Glysens Incorporated Biocompatible implantable sensor apparatus and methods
US10638979B2 (en) 2017-07-10 2020-05-05 Glysens Incorporated Analyte sensor data evaluation and error reduction apparatus and methods
US10638962B2 (en) 2016-06-29 2020-05-05 Glysens Incorporated Bio-adaptable implantable sensor apparatus and methods
US10660550B2 (en) 2015-12-29 2020-05-26 Glysens Incorporated Implantable sensor apparatus and methods
US11255839B2 (en) 2018-01-04 2022-02-22 Glysens Incorporated Apparatus and methods for analyte sensor mismatch correction
US11278668B2 (en) 2017-12-22 2022-03-22 Glysens Incorporated Analyte sensor and medicant delivery data evaluation and error reduction apparatus and methods

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6530790B1 (en) * 1998-11-24 2003-03-11 Teradyne, Inc. Electrical connector
NL1012345C2 (nl) * 1999-06-16 2000-12-19 Berg Electronics Mfg Connector and method for manufacturing such a connector.
NL1012361C2 (nl) * 1999-06-16 2000-12-19 Berg Electronics Mfg Connector and contact elements for the same.
EP1190470A2 (fr) * 1999-06-16 2002-03-27 FCI 's-Hertogenbosch B.V. Ensemble connecteur blinde et element de contact utilise dans cet ensemble connecteur
NL1012357C2 (nl) * 1999-06-16 2000-12-19 Berg Electronics Mfg Afgeschermd connectorsamenstel.
WO2000077887A1 (fr) * 1999-06-16 2000-12-21 Fci 's-Hertogenbosch B.V. Connecteur, procede de fabrication d'un tel connecteur, et element de contact pour un connecteur
DE19938782A1 (de) * 1999-08-16 2001-03-22 Tyco Electronics Logistics Ag Geschirmter elektrischer Steckverbinder
WO2001013468A2 (fr) * 1999-08-17 2001-02-22 Litton Systems, Inc. Systeme d'interconnexion electrique haute densite dote de possibilites accrues de mise a la masse et de reduction de la diaphonie
US6267604B1 (en) * 2000-02-03 2001-07-31 Tyco Electronics Corporation Electrical connector including a housing that holds parallel circuit boards
US6824391B2 (en) * 2000-02-03 2004-11-30 Tyco Electronics Corporation Electrical connector having customizable circuit board wafers
CN100459313C (zh) * 2000-03-29 2009-02-04 杨泰和 具有与电磁波隔离壳体结构的导电连接接口装置
US6491545B1 (en) * 2000-05-05 2002-12-10 Molex Incorporated Modular shielded coaxial cable connector
NL1018175C2 (nl) 2001-05-30 2002-12-03 Fci Mechelen N V Stekkerblok en kabelconnector.
CN1269261C (zh) * 2001-08-01 2006-08-09 莫莱克斯公司 具有嵌模端子模块的电连接器组件
US7285018B2 (en) 2004-06-23 2007-10-23 Amphenol Corporation Electrical connector incorporating passive circuit elements
US7553190B2 (en) * 2005-03-31 2009-06-30 Molex Incorporated High-density, robust connector with dielectric insert
CN101335409B (zh) * 2007-06-29 2011-04-27 贵州航天电器股份有限公司 一种带电路板的高速背板连接器
WO2009083460A1 (fr) * 2007-12-28 2009-07-09 Fci Connecteur modulaire
WO2010030631A1 (fr) * 2008-09-09 2010-03-18 Molex Incorporated Guide de connecteur
US8382524B2 (en) 2010-05-21 2013-02-26 Amphenol Corporation Electrical connector having thick film layers
US20110287663A1 (en) 2010-05-21 2011-11-24 Gailus Mark W Electrical connector incorporating circuit elements
CN102694308B (zh) * 2011-03-22 2014-09-24 富士康(昆山)电脑接插件有限公司 电连接器
US8591257B2 (en) 2011-11-17 2013-11-26 Amphenol Corporation Electrical connector having impedance matched intermediate connection points
KR101332810B1 (ko) * 2011-12-28 2013-11-27 삼성전자주식회사 프로브용 커넥터 및 이를 채용한 초음파 진단 장치
CN107369932A (zh) * 2017-08-08 2017-11-21 四川华丰企业集团有限公司 具有多层布线印制板的高速背板连接器
CN112292787A (zh) * 2018-05-16 2021-01-29 雷莫股份公司 高密度连接器
CN109546459B (zh) * 2019-01-09 2023-10-10 四川华丰科技股份有限公司 带金属屏蔽板的母端信号传输模块
CN112909661B (zh) * 2021-01-20 2023-04-18 中航光电科技股份有限公司 一种端子模块及使用该端子模块的连接器
CN115332841B (zh) * 2022-10-14 2022-12-30 深圳市爱特姆科技有限公司 一种便于制造的高频大电流btb连接器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4338717A (en) * 1980-09-02 1982-07-13 Augat Inc. Method for fabricating a light emitting diode display socket
US4705332A (en) * 1985-08-05 1987-11-10 Criton Technologies High density, controlled impedance connectors
DE3938964A1 (de) * 1988-11-24 1990-05-31 Yazaki Corp Mehrfachstufenverbinder
GB9003241D0 (en) * 1990-02-13 1990-04-11 Gore W L & Ass Uk Shielded connector
US5122065A (en) * 1991-08-12 1992-06-16 International Business Machines Corp. Input output connector with coaxial shielding and strain relief
JP2728372B2 (ja) * 1994-12-15 1998-03-18 ケル株式会社 電気コネクタ
EP0752739B1 (fr) * 1995-07-03 2000-10-25 Berg Electronics Manufacturing B.V. Connecteur avec assemblage intégré de circuit imprimé

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10561351B2 (en) 2011-07-26 2020-02-18 Glysens Incorporated Tissue implantable sensor with hermetically sealed housing
CN103959568A (zh) * 2011-11-02 2014-07-30 富加宜（亚洲）私人有限公司 具有减小的法向力的电连接器
CN103959568B (zh) * 2011-11-02 2018-01-26 安费诺富加宜（亚洲）私人有限公司 具有减小的法向力的电连接器
US10736553B2 (en) 2012-07-26 2020-08-11 Glysens Incorporated Method of manufacturing an analyte detector element
US10660550B2 (en) 2015-12-29 2020-05-26 Glysens Incorporated Implantable sensor apparatus and methods
US10561353B2 (en) 2016-06-01 2020-02-18 Glysens Incorporated Biocompatible implantable sensor apparatus and methods
US10638962B2 (en) 2016-06-29 2020-05-05 Glysens Incorporated Bio-adaptable implantable sensor apparatus and methods
US10638979B2 (en) 2017-07-10 2020-05-05 Glysens Incorporated Analyte sensor data evaluation and error reduction apparatus and methods
US11278668B2 (en) 2017-12-22 2022-03-22 Glysens Incorporated Analyte sensor and medicant delivery data evaluation and error reduction apparatus and methods
US11255839B2 (en) 2018-01-04 2022-02-22 Glysens Incorporated Apparatus and methods for analyte sensor mismatch correction

Also Published As

Publication number Publication date
JP4565673B2 (ja) 2010-10-20
EP0852414A2 (fr) 1998-07-08
CA2225151C (fr) 2001-02-27
DE69731719D1 (de) 2004-12-30
EP0852414A3 (fr) 1999-10-27
TW385579B (en) 2000-03-21
SG71746A1 (en) 2000-04-18
CA2225151A1 (fr) 1998-07-07
CN1190807A (zh) 1998-08-19
DE69731719T2 (de) 2005-09-01
JPH10270133A (ja) 1998-10-09

Similar Documents

Publication Publication Date Title
EP0852414B1 (fr) Connecteur avec assemblage intégré de circuit imprimé
US6083047A (en) Modular electrical PCB assembly connector
US5924899A (en) Modular connectors
US6540558B1 (en) Connector, preferably a right angle connector, with integrated PCB assembly
EP0836756B1 (fr) Connecteur a ensemble integre carte a circuits imprimes
US6712646B2 (en) High-speed transmission connector with a ground structure having an improved shielding function
US5228864A (en) Connectors with ground structure
US5664968A (en) Connector assembly with shielded modules
EP0632933B1 (fr) Systeme de raccordement coaxial miniaturise a haute densite comprenant des modules de groupage positionnes en quinconce
US7147512B2 (en) Connector assembly
US5135405A (en) Connectors with ground structure
US6837741B2 (en) Connector and cable positioning member of connector
EP1017134A2 (fr) Connecteur à grande fréquence et méthode de sa fabrication
US6120306A (en) Cast coax header/socket connector system
KR100602961B1 (ko) 모듈식 고속 커넥터
JPH07192815A (ja) 曲げ型または直角型の電気コネクタ，電気レセプタクル，電気ヘッダおよび導電性シールド
KR19990076699A (ko) 케이블 어셈블리
US5141453A (en) Connectors with ground structure
KR19980024994A (ko) 케이블 콘넥터 조립체 및 그 제조 방법
US10868392B2 (en) Ground commoning conductors for electrical connector assemblies
JP2001057274A (ja) シールドコネクタ
KR100558821B1 (ko) 모듈라커넥터
WO2009064887A1 (fr) Connecteur de carte enfichable à haute densité
JPH10228941A (ja) コネクタ

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): BE DE FI FR GB IT NL SE

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

RIC1 Information provided on ipc code assigned before grant

Free format text: 6H 01R 23/68 A, 6H 01R 13/658 B, 6H 05K 1/02 B

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

17P Request for examination filed

Effective date: 20000330

AKX Designation fees paid

Free format text: BE DE FI FR GB IT NL SE

17Q First examination report despatched

Effective date: 20020502

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

RIC1 Information provided on ipc code assigned before grant

Ipc: 7H 05K 1/02 B

Ipc: 7H 01R 13/658 B

Ipc: 7H 01R 12/16 A

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): BE DE FI FR GB IT NL SE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20041124

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20041124

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20041124

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20041124

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20041220

Year of fee payment: 8

REF Corresponds to:

Ref document number: 69731719

Country of ref document: DE

Date of ref document: 20041230

Kind code of ref document: P

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20050119

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20050225

Year of fee payment: 8

RAP2 Party data changed (patent owner data changed or rights of a patent transferred)

Owner name: FCI

REG Reference to a national code

Ref country code: GB

Ref legal event code: 732E

NLT2 Nl: modifications (of names), taken from the european patent patent bulletin

Owner name: FCI

NLV1 Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

ET Fr: translation filed
26N No opposition filed

Effective date: 20050825

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED.

Effective date: 20051229

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20051229

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060701

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20051229

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060831

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20060831