EP0773968A1 - Phosphormodifizierte epoxidharze, verfahren zu ihrer herstellung und ihre verwendung - Google Patents

Phosphormodifizierte epoxidharze, verfahren zu ihrer herstellung und ihre verwendung

Info

Publication number
EP0773968A1
EP0773968A1 EP95927732A EP95927732A EP0773968A1 EP 0773968 A1 EP0773968 A1 EP 0773968A1 EP 95927732 A EP95927732 A EP 95927732A EP 95927732 A EP95927732 A EP 95927732A EP 0773968 A1 EP0773968 A1 EP 0773968A1
Authority
EP
European Patent Office
Prior art keywords
phosphorus
modified epoxy
epoxy resin
formula
resin according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP95927732A
Other languages
German (de)
English (en)
French (fr)
Inventor
Jürgen Huber
Heinrich Kapitza
Hans-Jerg Kleiner
Wolfgang Rogler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoechst AG
Siemens AG
Original Assignee
Hoechst AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoechst AG, Siemens AG filed Critical Hoechst AG
Publication of EP0773968A1 publication Critical patent/EP0773968A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02—Phosphorus compounds
    • C07F9/28—Phosphorus compounds with one or more P—C bonds
    • C07F9/30—Phosphinic acids [R2P(=O)(OH)]; Thiophosphinic acids ; [R2P(=X1)(X2H) (X1, X2 are each independently O, S or Se)]
    • C07F9/32—Esters thereof
    • C07F9/3258—Esters thereof the ester moiety containing a substituent or a structure which is considered as characteristic
    • C07F9/3264—Esters with hydroxyalkyl compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02—Phosphorus compounds
    • C07F9/547—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom
    • C07F9/6564—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms
    • C07F9/6571—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms
    • C07F9/657163—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms the ring phosphorus atom being bound to at least one carbon atom
    • C07F9/657181—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms the ring phosphorus atom being bound to at least one carbon atom the ring phosphorus atom and, at least, one ring oxygen atom being part of a (thio)phosphonic acid derivative
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz

Definitions

  • Phosphorus modified epoxy resins process for their preparation and their use
  • the present invention relates to novel phosphorus-modified epoxy resins, a process for their preparation and their use.
  • the new phosphor modified epoxy resins are characterized as flame retardant additives with very processing-friendly behavior.
  • epoxy resins are widely used for the production of reactive resin molding materials and coatings with a high level of thermal, mechanical and electrical properties as well as for the production of laminates.
  • the low molecular weight or oligomeric starting components can be converted into high-quality thermosetting materials using a wide variety of hardeners, such as, for example, carboxylic anhydrides, amines, phenols or isocyanates or by ionic polymerization.
  • Another advantage of epoxy resins is their processing behavior. In the initial state, they are low molecular weight or oligomeric and show low viscosity at processing temperatures. They are therefore very suitable for potting complex electrical or electronic components as well as for impregnation and impregnation processes. In the presence of more suitable
  • Reaction accelerators have sufficient pot lives. They are also highly fillable with the usual inorganic inert fillers.
  • Epoxy resin molding materials are generally made flame-retardant today using halogen-containing, especially bromine-containing aromatic components. These are mostly storage components, e.g. Molded materials containing filler or glass fabric, which often contain antimony trioxide as a synergist.
  • halogen-containing, especially bromine-containing aromatic components are mostly storage components, e.g. Molded materials containing filler or glass fabric, which often contain antimony trioxide as a synergist.
  • the problem here is that in the event of a malfunction, smoldering or burning causes corrosive decomposition products which are ecologically or toxicologically questionable under unfavorable conditions. Considerable technical effort is required to ensure safe disposal by incineration.
  • organic phosphorus compounds has proven to be an effective way of achieving flame retardancy in the case of resinous substrates. Attempts have already been made to modify epoxy resins with additives based on phosphoric acid esters, such as triphenyl phosphate (DE 1 287 312). However, these compounds migrate from the molded materials to the surface, especially at elevated temperatures, and influence the dielectric properties and lead to e-corrosion.
  • the object of the invention was therefore to provide new phosphorus-containing additives for epoxy resins which, in addition to being flame-retardant, also have high storage stability, allow variations in the phosphorus content, are simple and inexpensive to produce and which are particularly suitable for use in electronics and electrical engineering, where high filler contents are concerned are common.
  • the present invention now relates to new phosphorus-modified epoxy resins of the formula (I) and / or of the formula (II)
  • R 1 , R 2 and R 3 independently of one another are a hydrocarbon radical with 1 to
  • R 4 is the residue of a glycidyl group-containing residue of a glycidyl group-containing poly, preferably di-epoxy compound and m integers from 2 to 6, preferably 2 to 4 and in particular 2. Furthermore, the invention relates to a process for the production of such phosphorus-modified epoxy resins and to their use for the production of moldings, coatings and laminates (composite materials) and these objects themselves.
  • the phosphorus-modified epoxy resins according to the invention generally have an average molecular weight M n (number average; determined by means of gel chromatography; polystyrene standard) of up to about 10,000, preferably from about 200 to 5,000 and in particular from about 400 to 2,000.
  • M n number average; determined by means of gel chromatography; polystyrene standard
  • R 1 , R 2 and R 3 are preferably a hydrocarbon radical which has an aliphatic and / or aromatic character and which can be interrupted by heteroatoms or heteroatom groups, in particular a saturated or unsaturated one, straight-chain or branched aliphatic radical, such as alkyl, alkenyl, cycloalkyl, preferably having 1 to 8 carbon atoms, in particular 1 to 4 carbon atoms, such as methyl, ethyl, n- or i-propyl, n-, i- or tert. -Butyl.
  • radicals can also be an aryl or an aralkyl radical, such as unsubstituted or phenyl or naphthyl which is preferably substituted by 1 to 3 alkyl radicals having 1 to 6 C atoms or phenylalkyl having 1 to 6 C atoms in the alkyl radical, for example benzyl.
  • aryl or an aralkyl radical such as unsubstituted or phenyl or naphthyl which is preferably substituted by 1 to 3 alkyl radicals having 1 to 6 C atoms or phenylalkyl having 1 to 6 C atoms in the alkyl radical, for example benzyl.
  • R 4 in these formulas (I) / (II) preferably represents the radical reduced by the glycidyl groups
  • - a polyether, a polyether polyol, a polyester or a polyester polyol;
  • a hydrocarbon radical which has a saturated or unsaturated aliphatic character and / or aromatic character and which is interrupted by heteroatoms, such as oxygen and nitrogen, and by heteroatom groups, such as -NR 1 CO- (R 1 has the same meaning as above) and / or these May contain, this hydrocarbon radical usually at least 6, preferably at least Contains 12 to 30 carbon atoms; these are preferably aryl groups, in particular phenyl groups, which can be substituted but are preferably unsubstituted; or a reaction product of an epoxy compound with polyamines, polyols, polycaprolactone polyols, polyesters containing OH groups,
  • Polyethers polyglycols, hydroxy-, carboxyl- and amino-functional polymer oils, polycarboxylic acids, hydroxy- or amino-functional polytetrahydrofurans.
  • R 4 can also represent various of these residues.
  • R 4 denotes the corresponding residue of a bisphenol A diglycidyl ether, a bisphenol F diglycidyl ether or of their oligomers, or a diglycidyl ester of tetrahydrophthalic, phthalic, isophthalic or terephthalic acid and mixtures of these residues.
  • R 4 can also mean a polyglycidyl ether of phenol / formaldehyde or cresol / formaldehyde novolaks.
  • index m has the meaning given above
  • q represents integers from 0 to 40, preferably 0 to 10
  • the index p has the meaning 0 or 1
  • R 5 is hydrogen and / or the C r to C 10 alkyl radical .
  • R has especially the meaning of (purple), i.e. the particularly preferred phosphorus-modified epoxy resins have the formulas (I ') and (II'):
  • the phosphorus-modified epoxy resins according to the invention can still contain certain amounts, mostly not more than 30% by weight, preferably not more than 20% by weight, based on the total mixture, of other structural units.
  • Such by-products do not significantly affect the appearance of the products according to the invention in the amounts indicated; in general, they even contribute to the flame retardant effect.
  • the phosphorus-modified epoxy resins according to the invention are distinguished in particular by good storage stability.
  • the storage stability expressed by the change in the epoxy value after 96 hours at room temperature and a relative atmospheric humidity of at most 50%, generally does not fall below the value of 90% and is preferably in the range from about 95% to 100%, based on the Initial value with 100%. With some of the phosphorus-modified resins according to the invention, however, these values can only be achieved by
  • the phosphorus-modified epoxy resins according to the invention are expediently prepared by reacting phosphonic anhydrides of the formula (IV) and / or phosphinic anhydrides of the formula (V)
  • R 4 and the index m also have the meaning given above, in an inert solvent (diluent) or, if the reaction is adapted, also in bulk.
  • Suitable phosphonic anhydrides of the formula (IV) are: methanephosphonic anhydride, ethanephosphonic anhydride, n- and / or i-propanephosphonic anhydride, hexanephosphonic anhydride, benzenephosphonic anhydride and tolylphosphonic anhydride or also corresponding mixtures.
  • Dimethylphosphinic anhydride ethylmethylphosphinic anhydride, diethylphosphinic anhydride, dipropylphosphinic anhydride, methylphenylphosphinic anhydride, diphenylphosphinic anhydride, di-p-tolylphosphinic anhydride and di-p-methoxyphenylphosphinic anhydride.
  • the preparation of the phosphinic anhydrides is described, for example, in DE Offenlegungsschrift 2 1 29 583.
  • the anhydrides used according to the invention can contain certain amounts of free acids, depending on their type of preparation, but generally not more than 20% by weight, preferably not more than 15% by weight and in particular not more than 10% by weight.
  • Preferred polyepoxide compounds of the formula (VI) are bisglycidyl ethers based on bisphenol A, bisphenol F and bisphenol S (reaction products of these bisphenols and epichlor (halogen) hydrine) or their oligomers and diglycidyl esters of phthalic, isophthalic, terephthalic, tetrahydrophthalic and / or hexahydrophthalic acid. More suitable
  • solvents are aprotic and preferably have a polar character.
  • examples include: N-methylpyrrolidone; Dimethylformamide; Ethers, such as diethyl ether, tetrahydrofuran, dioxane, ethylene glycol mono- or diether, propylene glycol mono- or diether, butylene glycol mono- or diether of monoalcohols with an optionally branched alkyl radical of 1 to 6 carbon atoms; Ketones such as acetone, methyl ethyl ketone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone and the like; Esters such as ethyl acetate, butyl acetate, ethyl glycol acetate, methoxypropyl acetate; halogenated hydrocarbons; (Cyclo) aliphatic and / or aromatic hydrocarbons; (Cyclo) aliphatic and / or
  • reaction of the glycidyl ethers of the general formula (V) with the anhydrides is generally carried out at temperatures from -20 to 170 ° C, preferably 20 to 1 30 ° C.
  • the phosphorus-modified epoxy resins according to the invention can advantageously be used as flame-retardant additives in many fields of use for the production of moldings, prepregs, coatings or laminates (composite materials), in particular for insulating purposes in the
  • These phosphorus-modified resins can also be used in a mixture with phosphorus-free epoxy resins in amounts of up to 80% by weight, preferably up to 50% by weight.
  • the known epoxy resin hardeners as described, for example, in DE-Offenlegungsschrift 2,743,680 or EP-Offenlegungsschrift 274,646, can be used as hardeners.
  • These materials are suitable, for example, for covering, coating and enveloping electronic components, for insulating electrical windings, for producing insulating components and composite materials with fibrous storage components, in particular laminates for the
  • an epoxy resin prepared by reacting 2 moles of epichlorohydrin with 1 mole of 2,2-bis (4-hydroxyphenyl) propane (bisphenol A) with an epoxy equivalent weight of 1 80 to 1 92 (Beckopox EP 140, epoxy resin from Hoechst ) were heated to 40 ° C. 281 g (1, 32
  • an epoxy resin prepared by reacting 2 mol of epichlorohydrin with 1 mol of 2,2-bis (4-hydroxyphenyl) propane (bisphenol A; epoxy resin DER 332 Dow Epoxy Resins) and 31.5 g (0.159 mol) of ethyl -methyl-phosphinic anhydride were stirred at 150 ° C for 6 hours; then another 20 g (0.1 mol)
  • glass fabric (glass fabric type 7628, basis weight 197 g / m 2 ) was continuously impregnated by means of a laboratory impregnation system and dried in a vertical drying system at temperatures from 50 to 160 ° C.
  • Prepregs produced in this way had a residual gel time of 123 s and were tack-free and at room temperature (at maximum 21 ° C and maximum 50% relative humidity) stable in storage.
  • Thermoset materials for electrical engineering must be flame-retardant.
  • the flame retardance according to UL 94V-0 is usually required.
  • a test specimen is flamed vertically at the bottom with a defined flame. The sum of the burning times of 10 tests must not exceed 50 s.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Molecular Biology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
EP95927732A 1994-08-03 1995-07-26 Phosphormodifizierte epoxidharze, verfahren zu ihrer herstellung und ihre verwendung Withdrawn EP0773968A1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4427456 1994-08-03
DE4427456A DE4427456A1 (de) 1994-08-03 1994-08-03 Phosphormodifizierte Epoxidharze, Verfahren zu ihrer Herstellung und ihre Verwendung
PCT/EP1995/002965 WO1996004327A1 (de) 1994-08-03 1995-07-26 Phosphormodifizierte epoxidharze, verfahren zu ihrer herstellung und ihre verwendung

Publications (1)

Publication Number Publication Date
EP0773968A1 true EP0773968A1 (de) 1997-05-21

Family

ID=6524824

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95927732A Withdrawn EP0773968A1 (de) 1994-08-03 1995-07-26 Phosphormodifizierte epoxidharze, verfahren zu ihrer herstellung und ihre verwendung

Country Status (11)

Country Link
US (1) US5811188A (hu)
EP (1) EP0773968A1 (hu)
JP (1) JPH10503540A (hu)
CN (1) CN1157625A (hu)
CZ (1) CZ31497A3 (hu)
DE (1) DE4427456A1 (hu)
FI (1) FI970433A0 (hu)
HU (1) HU216749B (hu)
PL (1) PL318438A1 (hu)
TW (1) TW448196B (hu)
WO (1) WO1996004327A1 (hu)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19608613C2 (de) * 1996-03-06 2002-01-17 Celanese Ventures Gmbh Lagerstabile, phosphormodifizierte Epoxidharze
US7271225B2 (en) * 2002-05-29 2007-09-18 Nippon Chemical Industrial Co., Ltd. Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the resin, sealant containing the composition, molding material containing the composition, and laminate containing the composition
WO2008016632A1 (en) * 2006-08-01 2008-02-07 University Of Massachusetts Deoxybenzoin-based anti-flammable polyphosphonate and poly(arylate-phosphonate) copolymer compounds, compositions and related methods of use
EP3926024A1 (de) * 2020-06-17 2021-12-22 Clariant International Ltd Phosphorhaltige flammschutzmittelmischungen, ein verfahren zu ihrer herstellung und ihre verwendung sowie epoxidharzformulierungen, die diese flammschutzmittelmischungen enthalten

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FR1503429A (fr) * 1965-12-14 1967-11-24 Ciba Geigy Procédé de préparation d'esters cycliques de l'acide phosphonique
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US4164487A (en) * 1976-12-23 1979-08-14 The Dow Chemical Company Water-thinnable mixtures of base-neutralized products of reaction of H3 PO4 with polyether epoxides and with other type epoxides
CA1113643A (en) * 1976-12-23 1981-12-01 The Dow Chemical Company Method of water-solubilizing high performance polyether epoxide resins, the solubilized resins and thermoset, hydrophobic coatings derived therefrom
DE2743680C2 (de) * 1977-09-28 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Selbstverlöschende Verbundwerkstoffe
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DE4308185A1 (de) * 1993-03-15 1994-09-22 Siemens Ag Phosphormodifizierte Epoxidharze, Verfahren zu ihrer Herstellung sowie deren Verwendung

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Also Published As

Publication number Publication date
HUT77015A (hu) 1998-03-02
HU216749B (hu) 1999-08-30
JPH10503540A (ja) 1998-03-31
FI970433A (fi) 1997-01-31
TW448196B (en) 2001-08-01
US5811188A (en) 1998-09-22
FI970433A0 (fi) 1997-01-31
CZ31497A3 (en) 1997-06-11
CN1157625A (zh) 1997-08-20
WO1996004327A1 (de) 1996-02-15
DE4427456A1 (de) 1996-02-08
PL318438A1 (en) 1997-06-09

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