EP0747913B1 - Composant électronique à montage en surface avec noyau rainuré - Google Patents
Composant électronique à montage en surface avec noyau rainuré Download PDFInfo
- Publication number
- EP0747913B1 EP0747913B1 EP96108606A EP96108606A EP0747913B1 EP 0747913 B1 EP0747913 B1 EP 0747913B1 EP 96108606 A EP96108606 A EP 96108606A EP 96108606 A EP96108606 A EP 96108606A EP 0747913 B1 EP0747913 B1 EP 0747913B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- core
- metal
- electronic component
- windings
- metal film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 59
- 239000002184 metal Substances 0.000 claims description 59
- 238000004804 winding Methods 0.000 claims description 48
- 230000008878 coupling Effects 0.000 claims description 9
- 238000010168 coupling process Methods 0.000 claims description 9
- 238000005859 coupling reaction Methods 0.000 claims description 9
- 239000000696 magnetic material Substances 0.000 claims description 4
- 239000011162 core material Substances 0.000 description 48
- 238000000034 method Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005266 casting Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000010618 wire wrap Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
- H01F17/062—Toroidal core with turns of coil around it
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/36—Electric or magnetic shields or screens
- H01F27/363—Electric or magnetic shields or screens made of electrically conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/36—Electric or magnetic shields or screens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/004—Printed inductances with the coil helically wound around an axis without a core
Definitions
- This invention relates, in general, to transformers or inductors and more particularly, to surface mount components.
- a basic transformer has at least two coupled wire coils around a center core.
- the coils are formed from wires that are insulated from both each other and from the core and are wrapped around the core a predetermined number of turns.
- Planar two dimensional transformers and inductors can be made by a sequence of depositing, patterning, and etching successive layers.
- photolithography techniques to pattern transformers requires that the surfaces be flat and adds tremendous expense versus the hand wound method.
- Figure 1 of US patent 3,319,207 discloses a ferrite toroid having axially disposed grooves thereon to form a continuous spiral-like path, wherein a metal is disposed in the spiral-like path.
- the present invention relates to an electronic component as set out in claim 1.
- Typical surface mount transformers and inductors are formed by winding wire around a core section.
- the size and pitch of the wire and the shape and composition of the core will determine the electrical characteristics of the component.
- Large components are formed by using a mechanical means to wrap the wire by rotating a bobbin of wire through the center of the core.
- Small components that are commonly used in many surface mount applications require that the metal windings be formed by hand wrapping the wire around the core. This is not only a timely and costly procedure, but variation in the tightness of the wrap and spacing between windings is introduced into the component. These variations will limit the precision of the component manufactured.
- the present invention provides for the elimination of hand winding electrical components.
- the metal windings are carved from a sheet of metal that is formed on a core and then patterned with the use of grooves in the surface of the core. These grooves provide for a simplified manufacturing process that improves the precision of the components produced.
- This invention also provides embodiments for fabricating a three dimensional electronic component that operates in a re-entrant mode. By operating in a re-entrant mode, the coupling between windings is improved which reduces the number of windings required and improves the operational bandwidth of the component.
- FIG. 1 is an enlarged view showing part of an electronic component in accordance with the current invention during its fabrication.
- the details for fabricating a toroidal transformer 19 will be provided, however, the same methods can be used to form other electronic components that incorporate a core with wire wrapping such as an inductor or linear transformer.
- a cylindrically shaped core 11 is used to provide the structure of transformer 19.
- the core 11 is formed by a casting process used by those skilled in the art.
- the composition of core 11 will depend on the electrical characteristics of the component fabricated.
- the core material is an iron based magnetic material, but for other applications the core material can consist of a non-magnetic material, ceramic, or plastic.
- Previously known methods for casting the core have formed the core with smooth surfaces.
- the casting process involves filling a mold with the desired core material and heating the mold.
- Core 11 then takes the shape provided by the mold.
- two continuous grooves 12 and 17 are patterned on the surface of core 11 and delineate the two wires of toroidal transformer 19.
- Grooves 12 and 17 are formed from the mold used to cast core 11 and are patterned such that grooves 12 and 17 encompass core 11.
- Groove patterns 12 and 17 are pitched axially off the center of core 11 such that grooves 12 and 17 are essentially parallel to each other and that the pattern does not overlap onto itself.
- Grooves 12 and 17 have several characteristics that can be adjusted to determine the performance of toroidal transformer 19. The depth, shape, or pitch (distance between two adjacent portions of grooves 12 and 17) is predetermined based on required performance of toroidal transformer 19.
- metal wires of the component be insulated from the core. Electrical isolation is provided by an insulating layer formed overlying the surface of core 11 where metal windings 13 and 18 will be shaped. In the present embodiment, the entire surface of core 11 is coated with an insulating material such as paralyne. A metal film is then formed over the insulating layer by any of the techniques used by those skilled in the art.
- the metal film can be any conductive material depending on the electrical properties required of transformer 19. Such materials include copper, silver, aluminum, gold, tungsten, titanium-nitride, titanium-tungsten or nickel.
- the metal film is formed on the insulating layer both in grooves 12 and 17 and overlying the surface of core 11 between adjacent portions of the groove pattern.
- the metal film is then selectively removed by scrapping the exposed surface of core 11.
- the metal film can be removed by chemical etching, mechanical polishing, or the like.
- Metal windings 13 and 18 are formed by a portion of the metal film that is left remaining in grooves 12 and 17 respectively.
- the grooved patterns are used as a guide to remove the metal film from grooves 12 and 17 and form metal windings 13 and 18 on the surface of core 11 which are isolated by bordering portions of the grooved patterns.
- Metal windings 13 and 18 replace the functionality of wires wrapped around a core in previously known methods for forming a transformer. There is no need to hand wind wire and the above mentioned embodiments can be scaled to manufacture a transformer of various sizes.
- Typical surface mount components used in an integrated circuit are formed on cores that have an outer diameter of 1 mm to 100 mm and an inner diameter of 0.5 mm to 98 mm.
- cores that have an outer diameter of 1 mm to 100 mm and an inner diameter of 0.5 mm to 98 mm.
- the entire surface of core 11 need not be patterned with grooves 12 and 17.
- the metal windings 13 and 18 are partially or completely formed by scrapping the surface of core 11 in a rifling pattern. A portion of the surface can be left smooth during the casting process and covered with the insulating layer and the metal film. The metal windings 13 and 18 are then formed by scrapping the smooth surfaces with a rifling pattern such that continuous metal windings 13 and 18 are formed.
- two or more grooves can be formed on the surface of core 11.
- various electrical components can be formed. Possible components include a toroidal transformer 19 if at least 2 wires encircle a magnetic core, a linear transformer if at least two windings are formed around a non-magnetic core, or a plurality of coupled inductors are produced if the core is cylindrical in shape.
- FIG. 2 is a top-down view of an electronic component of the present invention.
- Previously known methods for fabricating transformers for surface mount applications have limitations on the maximum frequency bandwidth that the component will reliably operate in due to the lack of electrical coupling between the wire windings around the core.
- the coupling between windings 13 and 18 is improved so as to electrically seem that wire windings 13 and 18 are closer to each other than they really are.
- the three dimensional electronic component shown in FIG. 2 has two metal windings 13 and 18 formed in grooves 12 and 17 respectively.
- a second insulating layer 14 is formed overlying the two metal windings 13 and 18 and is made from any insulating material used by those skilled in the art such as paralyne.
- a second metal film 16 is formed on insulating layer 14 such that metal film 16 overlaps at least a portion of metal winding 13 and metal winding 18.
- This second metal film 16 can be deposited with a vapor deposition or in the preferred embodiment, formed by electroplating.
- metal film 16 is shown to completely cover the outer surface of core 11.
- Metal film 16 can also be formed to cover a portion of the inner opening or either the top or bottom surface of core 11 as well.
- second metal film 16 is to reduce the capacitive load between metal winding 13 and metal winding 18 relative to the electrical ground voltage. By increasing the surface area second metal film 16 overlaps metal windings 13 and 18, coupling between metal windings 13 and 18 is improved.
- the above mentioned embodiment can be used on any electrical component that has at least two metal windings and is not limited to transformers with windings formed by grooves in the core.
- second metal film 16 the operating bandwidth of an electrical component is widened.
- the lower limit frequency is determined by the coupling of the core material with the metal windings and the upper limit frequency is determined by the re-entrant mode coupling with second metal film 16.
- FIG. 3 is a side view showing how an electronic component incorporating one or more of the above mentioned embodiments is attached to a PC board for surface mount applications.
- Metal windings 13 and 18 (FIG. 1) are terminated on a surface of core 11 to form the bonding pads 22 and 23 respectively.
- Solder or any other conductive material is formed on bonding pads 22 and 23 to provide electrical and physical contact to a PC board (not shown) in a variety of integrated circuit applications.
- This invention presents several embodiments to reduce the cost of manufacturing surface mounted electronic components and that improve the precision of the components.
- An electronic component having metal windings that do not require hand winding is provided.
- By using grooves to pattern a metal film the inaccuracies due to tightness of wrap, number of turns, and the pitch of the turns from hand winding can be eliminated.
- An additional advantage of the invention is that it improves the operational bandwidth by forming a three dimensional re-entrant mode component that improves the coupling between the metal windings of an electronic component.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Claims (4)
- Composant électronique (20) pour un montage en surface dans un circuit intégré comprenant :un noyau (11) comportant une surface, le noyau présentant un diamètre externe de 1 mm à 100 mm ;au moins un motif de gorge continue (12) dans la surface du noyau de telle sorte que le noyau soit encerclé par l'au moins un motif de gorge continue moyennant une distance prédéterminée entre des parties adjacentes de l'au moins un motif de gorge continue (12) ;une première couche isolante qui recouvre la surface du noyau (11) ;un premier film métallique qui recouvre la première couche isolante ;un premier enroulement métallique (18) formé sur la première couche isolante par une partie du premier film métallique de telle sorte que le premier enroulement métallique (18) soit essentiellement parallèle à l'au moins un motif de gorge continue (12) ;un second enroulement métallique (13) formé sur la première couche isolante de telle sorte que le second enroulement métallique (13) soit essentiellement parallèle à l'au moins un motif de gorge continue (12) ;une seconde couche isolante (14) qui recouvre les premier (18) et second (13) enroulements métalliques ; etun second film métallique (16) qui recouvre la seconde couche isolante (14) de telle sorte que le second film métallique (16) chevauche au moins une partie du premier enroulement métallique (18) et du second enroulement métallique (13), dans lequel le second film métallique (16) augmente le couplage capacitif entre les premier (18) et second (13) enroulements métalliques de telle sorte que le composant électronique (20) fonctionne dans un mode ré-entrant.
- Composant électronique (20) selon la revendication 1, dans lequel le noyau est un noyau magnétique réalisé à partir d'un matériau magnétique.
- Composant électronique (20) selon la revendication 1, dans lequel le noyau est réalisé à partir d'un matériau non magnétique.
- Composant électronique (20) selon la revendication 1, dans lequel le second enroulement métallique (13) est formé par une partie du premier film métallique résidant dans l'au moins un motif de gorge continue (12).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US46442195A | 1995-06-05 | 1995-06-05 | |
US464421 | 1995-06-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0747913A1 EP0747913A1 (fr) | 1996-12-11 |
EP0747913B1 true EP0747913B1 (fr) | 2000-10-04 |
Family
ID=23843885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP96108606A Expired - Lifetime EP0747913B1 (fr) | 1995-06-05 | 1996-05-30 | Composant électronique à montage en surface avec noyau rainuré |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0747913B1 (fr) |
JP (1) | JPH08330142A (fr) |
DE (1) | DE69610524T2 (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3622459B2 (ja) * | 1997-11-25 | 2005-02-23 | 松下電工株式会社 | 電磁装置 |
US7113066B2 (en) * | 2001-07-04 | 2006-09-26 | Koninklijke Philips Electronics, N.V. | Electronic inductive and capacitive component |
KR100433188B1 (ko) * | 2001-08-28 | 2004-05-28 | 주식회사 쎄라텍 | 표면실장형 파워 인덕터 및 그 제조방법 |
EP2105937B1 (fr) * | 2008-03-28 | 2016-03-23 | Sercomm Corporation | Appareil de transformateur avec architecture de protection et son procédé de protection |
JP2010182850A (ja) * | 2009-02-05 | 2010-08-19 | Asahi Denki Kenkyusho:Kk | トロイダルコア、トロイダルコアの製造方法及びトロイダルコア製造用の金型 |
JP6106381B2 (ja) * | 2012-08-21 | 2017-03-29 | Art−Hikari株式会社 | トランス及びトランスを搭載した装置 |
JP2016025150A (ja) * | 2014-07-17 | 2016-02-08 | 株式会社村田製作所 | トロイダルコイル |
FR3097366A1 (fr) * | 2019-06-17 | 2020-12-18 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de fabrication d’un dispositif inductif |
JP2024029578A (ja) * | 2022-08-22 | 2024-03-06 | ヤマハ株式会社 | 空芯コイル |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3319207A (en) * | 1963-07-18 | 1967-05-09 | Davis Jesse | Grooved toroidal body with metal filling |
FR2067180A1 (en) * | 1969-11-21 | 1971-08-20 | Int Standard Electric Corp | Electro static shielding of toroidal transformers |
DE2424715A1 (de) * | 1974-05-21 | 1975-12-04 | Messerschmitt Boelkow Blohm | Wechselstromdurchflossene spule |
JPS5878402A (ja) * | 1981-11-04 | 1983-05-12 | Yagi Antenna Co Ltd | インダクタンス素子 |
FR2590400B1 (fr) * | 1985-11-19 | 1987-12-18 | Thomson Csf | Transformateur d'intensite haute frequence a air |
-
1996
- 1996-05-21 JP JP8149892A patent/JPH08330142A/ja active Pending
- 1996-05-30 DE DE69610524T patent/DE69610524T2/de not_active Expired - Fee Related
- 1996-05-30 EP EP96108606A patent/EP0747913B1/fr not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0747913A1 (fr) | 1996-12-11 |
DE69610524D1 (de) | 2000-11-09 |
JPH08330142A (ja) | 1996-12-13 |
DE69610524T2 (de) | 2001-05-17 |
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