EP0704864B1 - Widerstand auf einer keramischen Platte - Google Patents

Widerstand auf einer keramischen Platte Download PDF

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Publication number
EP0704864B1
EP0704864B1 EP19950115134 EP95115134A EP0704864B1 EP 0704864 B1 EP0704864 B1 EP 0704864B1 EP 19950115134 EP19950115134 EP 19950115134 EP 95115134 A EP95115134 A EP 95115134A EP 0704864 B1 EP0704864 B1 EP 0704864B1
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EP
European Patent Office
Prior art keywords
resistor
glass
overcoat
circuit board
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP19950115134
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English (en)
French (fr)
Other versions
EP0704864A2 (de
EP0704864A3 (de
Inventor
Masashi c/o Sumitomo Metal Ceramics Inc. Fukaya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal SMI Electronics Device Inc
Original Assignee
Sumitomo Metal SMI Electronics Device Inc
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Publication date
Application filed by Sumitomo Metal SMI Electronics Device Inc filed Critical Sumitomo Metal SMI Electronics Device Inc
Publication of EP0704864A2 publication Critical patent/EP0704864A2/de
Publication of EP0704864A3 publication Critical patent/EP0704864A3/de
Application granted granted Critical
Publication of EP0704864B1 publication Critical patent/EP0704864B1/de
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing

Definitions

  • the present invention relates to a ceramic circuit board having on its surface an external resistor covered with a glass overcoat. More particularly, the present invention is concerned with a ceramic circuit board having an external resistor which stably maintains an accurate resistance value obtained by trimming.
  • a ceramic circuit board for use in integral circuits is provided with a circuit comprising an external resistor and a conductor pattern printed on the surface of the ceramic circuit board, which contributes toward imparting an advanced function to the ceramic circuit board and reducing the production cost.
  • a conductive substance is added to a glass composition, rendered pasty, printed and sintered into the desired resistor.
  • printing is effected so as to cover the resistor with a glass material and fired to thereby form an overcoat in order to protect the resistor from climatic changes or other environmental influences.
  • the obtained resistor has its resistance value finely adjusted by laser trimming.
  • a resistor used in a ceramic circuit board is formed by firing a resistor at 800 to 900°C, printing an overcoat paste comprising a low-melting point glass thereon, and firing at 500 to 600°C.
  • the ceramic substrate is also provided in multilayer form to comply with higher-density packaging.
  • use is made of substrate materials which have a low coefficient of thermal expansion in conformity with that of silicon chips to be mounted thereon. Under such circumstance, low-temperature firable substrates are used for circuit boards.
  • a resistor capable of being co-fired with the overcoat is desirably employed in a multilayer structure or a ceramic circuit board of a low thermal expansion coefficient.
  • Such a co-firing leads to a reduction in the production steps and in the plant and equipment investment.
  • such a co-firing of the resistor and the overcoat brings about the tendency that the glass of the overcoat confines the bubbles generated from the resistor in the external resistor, thereby causing the bubbles to remain within the fired resistor.
  • the problem occurs such that a very close access of a trimming edge to the bubble at the time of laser trimming produces cracks therebetween, resulting in the formation of a resistor lacking in stability in resistance values.
  • Fig. 1 is a plan of one form of a conventional external resistor disposed on a substrate of a ceramic circuit board
  • Fig. 2 is a sectional view thereof.
  • a wiring material such as a metal paste is printed on a ceramic substrate surface 1, thereby forming a conductor pattern 2 on the surface.
  • Part thereof constitutes an electrode for a resistor 3.
  • the resistor 3 is composed of glass components having a conductive material such as a metal added thereto.
  • the upper part thereof is covered with an overcoat 4 composed of glass materials.
  • the resistor 3 and the overcoat 4 constitute an external resistor 7.
  • the overcoat 4 may either cover each individual resistor 3 a little wider than the same or uniformly cover a wide area of not only a plurality of resistors 3 but also a conductor pattern 2.
  • An object of the present invention is to resolve the above drawbacks of the prior art and specifically to provide a ceramic circuit board having an external resistor obtained by the co-firing of a resistor and an overcoat which does not permit bubbles to remain in the resistor and thereby prevent the cracking during laser trimming or thereafter attributed to the bubbles remaining in the resistor.
  • the inventors have made intensive studies to find out that the above objects can be attained by using a overcoat glass satisfying specific requirements described in detail hereinafter.
  • the term "deformation temperature” as used in the present invention refers to the softening temperature of a glass material at which the thermal expansion thereof, which has been increasing linearly as the glass material is heated, comes to stop and then begins to decrease.
  • the method of measuring the thermal expansion itself is stipulated in the Japanese Industrial Standards.
  • the present invention has been arrived at on the basis of the above finding.
  • the present invention provides ceramic circuit boards with the following constructions (1) to (5).
  • Fig. 1 is a view illustrating a conventional external resistor.
  • Fig. 2 is a sectional view of the resistor of Fig. 1.
  • Fig. 3-10 show the change in resistivity versus the difference in deformation temperature between the glass used in a resistor and the glass used in an overcoat.
  • Fig. 11-18 show the change in resistivity versus the number of bubbles remaining in resistors.
  • the deformation temperature of the glass of the resistor of the external resistor is rendered equal to or lower than that of the glass of the overcoat to provide an excellent low-bubbling resistor, even if the glass overcoat and the resistor are co-fired.
  • the glass of the resistor has a deformation temperature equal to or lower than that of the overcoat by adding 0 to less than 1% of an Ag component to the resistor, so that the sintering of the resistor is accelerated to thereby allow the generated bubbles to escape to the side of the glass overcoat, or because, in addition to an electric resistance component such as RuO 2 -based or Bi 2 Ru 2 O 7 -based component, Ag is positively added in an amount of at least 1% to the resistor, so that Ag combines with the resistor materials to thereby promote sintering with the same result that the sintering of the resistor is accelerated to thereby allow generated bubbles to escape from the side of the glass overcoat.
  • an electric resistance component such as RuO 2 -based or Bi 2 Ru 2 O 7 -based component
  • the ceramic circuit board of the present invention may have any monolayer or multilayer construction as long as a ceramic is used as an insulator.
  • a multilayer ceramic circuit board can be produced by, for example, the green sheet lamination process or the printing lamination process.
  • a circuit may be provided only on one side of the substrate or on both sides thereof.
  • the ceramic material composing the ceramic substrate for use in the present invention is not particularly limited, examples thereof including alumina (Al 2 O 3 ), aluminum nitride (AlN), silicon carbide (SiC) and various ceramics composed mainly thereof.
  • a low-temperature firing ceramic can be used which is a mixture of alumina powder with glass powder.
  • the conductor material used in the inner layers is varied depending on the substrate material.
  • the substrate material is alumina or aluminum nitride
  • use is made of a high-melting point metal such as molybdenum or tungsten.
  • a metal such as gold, silver, silver-palladium alloy, copper or nickel.
  • a ceramic circuit board in which W or Mo is used as a wiring conductor on a substrate of alumina, aluminum nitride or the like and of which the co-firing is conducted in a reducing atmosphere for preventing the oxidation of the conductor is known as an example of the co-fired ceramic circuit boards produced by co-firing a ceramic green sheet and a wiring conductor paste.
  • this encounters the problem that conductor oxidation cannot be avoided in the formation of RuO 2 -type or Bi 2 Ru 2 O 7 -type resistors of high reliability which must be fired in the air.
  • a low-temperature firable multilayer ceramic circuit board in which use is made of an Ag-based conductor which has a low circuit resistance and can be fired in the air, such as Ag, Ag-Pd, Ag-Pt or Ag-Pd-Pt, and in which a ceramic material capable of being fired at temperatures not higher than the melting point of the above conductor material (900 to 1200°C) is used as an insulator has been developed, which is especially preferred as the ceramic circuit board of the present invention.
  • a ceramic board to be fired at about 1200°C or below is called a "low-temperature firable ceramic board", in which, for example, an Ag-based, Au-based or Cu-based conductor is used as conductors on inner layers and surface layers.
  • a ceramic material which can be fired at temperatures lower than the melting point of, for example, inserted Ag conductor material is preferably employed as the low-temperature firable ceramic insulator material.
  • an Ag conductor or an Ag alloy conductor in which the contents of Pd and Pt are low because the melting point of such a metal formed in multiple layers is as low as about 900 to 1200°C, it is necessary to employ a material which can be fired at 800 to 1100°C.
  • Such materials include a mixture of the powder of a glass such as a borosilicate glass or a glass further containing some oxides (e.g., MgO, CaO, Al 2 O 3 , PbO, K 2 O, Na 2 O, ZnO, Li 2 O, etc.) with the powder of a ceramic such as alumina or quartz, and a crystallizable glass powder which undergoes cordierite or ⁇ -spodumene crystallization.
  • a glass such as a borosilicate glass or a glass further containing some oxides (e.g., MgO, CaO, Al 2 O 3 , PbO, K 2 O, Na 2 O, ZnO, Li 2 O, etc.)
  • a ceramic such as alumina or quartz
  • crystallizable glass powder which undergoes cordierite or ⁇ -spodumene crystallization.
  • the above material can be used not only in the monolayer form mentioned above but also in the multilayer form.
  • the multilayer substrate can be produced according to the green sheet lamination process in which a plurality of green sheets are employed.
  • a powdery ceramic insulator material is mixed with additives, such as a solvent, resin, etc., and molded according to the doctor blade method into green sheets of about 0.1 to 0.5 mm in thickness.
  • a paste of a conductor material such as Ag, Ag-Pd, Ag-Pt or Ag-Pd-Pt is screen printed on one of the green sheets to thereby give a desired wiring pattern.
  • Through holes each of about 0.1 to 2.0 mm in diameter are formed in the green sheet by means of blanking dies or a punching machine so as to enable connection to another conductor layer. Also, wiring via holes are formed and filled with an Ag conductor material. In the same manner, wiring patterns are printed on other green sheets as many as required for forming the desired circuit. These green sheets are accurately laminated one upon another with the use of tooling holes respectively formed in the green sheets and unified by thermocompression bonding effected at 80 to 150°C under 10 to 250 kg/cm 2 .
  • an RuO 2 system, or Bi 2 Ru 2 O 7 system resistor is formed which is fired in the air. In that case, it is printed together with terminals therefor on the green sheet for forming an inner layer.
  • the obtained structure is co-fired in the air, thereby providing a ceramic multilayer board with built-in conductors.
  • the present invention has been described with the low-temperature firable ceramic as an example. Although it is a preferred embodiment of the present invention, the present invention is not limited thereto.
  • the resistors used in the present invention include those composed of a RuO 2 -based or Bi 2 Ru 2 O 7 -based electric resistance component and a glass component and, generally, is printed in the form of a paste on a ceramic substrate surface according to the thick-film process. Further, an overcoat composition comprising, for example, a CaO-Al 2 O 3 -SiO 2 -Cr 2 O 3 -B 2 O 3 system glass is printed on the printed resistor, generally by the thick film process. In the present invention, the resistor and glass overcoat are co-fired. The firing is conducted in the air.
  • a ceramic circuit board was prepared with the use of a low-temperature firable ceramic prepared according to the following procedure.
  • 60% by weight of glass powder composed of, in weight percentages, 27% of CaO, 5% of Al 2 O 3 , 59% of SiO 2 and 9% of B 2 O 3 was mixed with 40% by weight of Al 2 O 3 powder having an average particle size of 1.0 ⁇ m to prepare a powder component.
  • the above powder component was mixed with, in weight percentage, 10% of acrylic resin, 30% of toluene, 10% of isopropanol and 5% of dibutyl phthalate with respect to 100% by weight of the powder component in a ball mill and formed into a green sheet of 0.4 mm in thickness according to the doctor blade process.
  • This green sheet was punched at given positions by means of dies and an Ag paste was screen printed to fill the holes therewith.
  • the sheet was dried and the Ag paste was screen printed on the sheet to thereby form a wiring pattern.
  • other green sheets having printed wiring patterns were prepared.
  • a given number of obtained sheets were laminated one upon another and caused to undergo thermocompression bonding.
  • the resultant laminate was fired by holding it at 900°C for 20 min. Thus, a ceramic circuit substrate was obtained.
  • each of the resistor compositions having the chemical compositions specified in Table 1 was printed on the ceramic substrate so as to form a resistor of 1 mm in width and 2 mm in length.
  • the overcoat was formed by printing on the above resistor, each overcoat composition including each of the glass compositions A to H of Table 2 having respective deformation temperatures indicated in the table, with which Al 2 O 3 powder was mixed.
  • the RuO 2 content in the resistor material indicated in Table 1 means the weight % based on the total weight of the resistor including Ag and glass components.
  • the Ag content means the weight % based on the total weight of the resistor including glass components, RuO 2 and Ag..
  • the load test indicated in Table 4 means the maximum of the percentage of change in resistivity with respect to the laser-trimmed resistivity, observed after 1000-hrs continuous application of 1/32 W load.
  • Figs. 3-10 show the relationship between the percentage of the change in resistivity and the difference in deformation temperature between the glasses used in the resistors and the overcoats.
  • the difference was obtained by subtracting the deformation temperature of a glass used in a resistor from the deformation temperature of a glass used in an overcoat (i.e., the deformation temperature of a glass used in an overcoat minus the deformation temperature of a glass used in a resistor).
  • the test results are indicated by the solid circle symbol ( ⁇ ) and region A (hatched with thin lines) is an acceptable range.
  • Table 4 gives the load test results in terms of the maximum of the percentages of change of resistivity.
  • Table 5 lists the number of bubbles of at least 5 ⁇ m in diameter contained in a section of 300 ⁇ m x 15 ⁇ m which was measured by an electron microscope observation of a section of each resistor.
  • Figs. 11-18 show the relationship between the percentage of the change in resistivity and the number of bubbles remaining in the resistor.
  • the examples of the present invention in which the deformation temperature of the glass of the resistor is not higher than that of the overcoat glass are combinations of glass overcoat A with resistors 1 to 14, glass overcoat B with resistors 3 to 8, 13 and 14, glass overcoat C with resistors 1 to 14, glass overcoat D with resistors 3 to 8 and 11 to 14, glass overcoat E with resistors 3 to 8 and 11 to 14, glass overcoat F with resistors 1 to 14, 16, 18, 21 and 23, glass overcoat G with resistors 1 to 14, and glass overcoat H with resistors 5 to 8, 13 and 14.
  • the examples exerting the same effects as at the deformation temperature of the glass of the resistor minus 10°C, by virtue of the addition of at least 1.0% of Ag, are combinations of glass overcoat A with resistors 15, 17, 19, 20, 22 and 24, glass overcoat B with resistors 15, 17, 19, 20, 22 and 24, glass overcoat C with resistors 15, 17, 19, 20, 22 and 24, glass overcoat D with resistors 15, 17, 19, 20, 22 and 24, glass overcoat E with resistors 15, 17, 19, 20, 22 and 24, glass overcoat F with resistors 15, 17, 19, 20, 22 and 24, glass overcoat G with resistors 15, 17, 19, 20, 22 and 24, and glass overcoat H with resistors 17 and 24.
  • the other combinations are comparative examples to the present invention.
  • the present invention provides a ceramic circuit board having an external resistor formed by co-firing a resistor and an overcoat, prevents the cracking of the resistor at the time of trimming and thereafter, and realizes the provision of a resistance performance that ensures excellent weather resistance and stability.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Claims (4)

  1. Keramikschaltplatte mit einem externen Widerstand, hergestellt durch gemeinsames Brennen eines Widerstands und einer Glasdeckschicht, wobei der Widerstand des extemen Widerstandes ein Widerstand mit wenig Blasen ist,
    wobei der Widerstand Ag in einer Menge von 0 bis weniger als 1 Gew.-% enthält und das Glas des Widerstands eine Verformungstemperatur hat, die nicht höher ist als die des Glases der Deckschicht.
  2. Keramikschaltplatte mit einem externen Widerstand, hergestellt durch gemeinsames Brennen eines Widerstands und einer Glasdeckschicht, wobei der Widerstand des externen Widerstandes ein Widerstand mit wenig Blasen ist,
    wobei der Widerstand Ag in einer Menge von mindestens 1 Gew.-% enthält und das Glas des Widerstands eine solche Verformungstemperatur hat, dass die Verformungstemperatur minus 10°C nicht höher ist als die des Glases der Deckschicht.
  3. Keramikschaltplatte nach Anspruch 1 oder 2, in der das Glas des Widerstandes Glas des Systems CaO-Al2O3-SiO2-B2O3 ist.
  4. Keramikschaltplatte nach Anspruch 1 oder 2, in der das Glas der Deckschicht 60 bis 90 Gew.-% Glas des Systems CaO-Al2O3-SiO2-B2O3 und 10 bis 40 Gew.-% Aluminiumoxid umfasst, wobei das Glas eine Verformungstemperatur von 720 bis 740°C hat.
EP19950115134 1994-09-28 1995-09-26 Widerstand auf einer keramischen Platte Expired - Lifetime EP0704864B1 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP23336594 1994-09-28
JP23336594 1994-09-28
JP233365/94 1994-09-28
JP49723/95 1995-03-09
JP07049723A JP3093601B2 (ja) 1994-09-28 1995-03-09 セラミック回路基板
JP4972395 1995-03-09

Publications (3)

Publication Number Publication Date
EP0704864A2 EP0704864A2 (de) 1996-04-03
EP0704864A3 EP0704864A3 (de) 1996-10-23
EP0704864B1 true EP0704864B1 (de) 2002-11-13

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Application Number Title Priority Date Filing Date
EP19950115134 Expired - Lifetime EP0704864B1 (de) 1994-09-28 1995-09-26 Widerstand auf einer keramischen Platte

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EP (1) EP0704864B1 (de)
JP (1) JP3093601B2 (de)
DE (1) DE69528802T2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH068801U (ja) * 1991-10-29 1994-02-04 自動車電機工業株式会社 アクチュエータ
KR100516043B1 (ko) * 1997-03-06 2005-09-26 라미나 세라믹스, 인크. 수동 소자들이 내재된 세라믹 다층 인쇄 회로 기판
US6259151B1 (en) * 1999-07-21 2001-07-10 Intersil Corporation Use of barrier refractive or anti-reflective layer to improve laser trim characteristics of thin film resistors
JP4624754B2 (ja) * 2003-09-29 2011-02-02 日本特殊陶業株式会社 薄膜電子部品用セラミック基板及びその製造方法並びにこれを用いた薄膜電子部品
JP4690000B2 (ja) * 2003-09-29 2011-06-01 日本特殊陶業株式会社 薄膜電子部品用セラミック基板及びこれを用いた薄膜電子部品
DE102006060634A1 (de) * 2006-12-21 2008-06-26 Robert Bosch Gmbh Verfahren zur Herstellung eines elektrischen Widerstands auf einem Substrat

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT967290B (it) * 1972-09-08 1974-02-28 S E C I Spa Resistore elettrico e procedimento di fabbricazione
JPS56147405A (en) * 1980-04-17 1981-11-16 Matsushita Electric Ind Co Ltd Method of manufacturing thick film varistor
JPH01120003A (ja) * 1987-11-02 1989-05-12 Narumi China Corp 厚膜抵抗体組成物
JPH01212402A (ja) * 1988-02-19 1989-08-25 Toyobo Co Ltd 厚膜抵抗体焼成ペースト
JP2644017B2 (ja) * 1988-12-12 1997-08-25 昭和電工株式会社 抵抗ペースト

Also Published As

Publication number Publication date
JP3093601B2 (ja) 2000-10-03
DE69528802T2 (de) 2003-04-10
JPH08153945A (ja) 1996-06-11
EP0704864A2 (de) 1996-04-03
EP0704864A3 (de) 1996-10-23
DE69528802D1 (de) 2002-12-19

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