EP0695641B1 - Disposition pour organes d'actionnement piézoélectriques et procédé de fabrication - Google Patents
Disposition pour organes d'actionnement piézoélectriques et procédé de fabrication Download PDFInfo
- Publication number
- EP0695641B1 EP0695641B1 EP95250165A EP95250165A EP0695641B1 EP 0695641 B1 EP0695641 B1 EP 0695641B1 EP 95250165 A EP95250165 A EP 95250165A EP 95250165 A EP95250165 A EP 95250165A EP 0695641 B1 EP0695641 B1 EP 0695641B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- plate
- piezoactuator
- electrodes
- piezoactuators
- individual
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 claims description 34
- 239000012528 membrane Substances 0.000 claims description 28
- 238000001465 metallisation Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- IHQKEDIOMGYHEB-UHFFFAOYSA-M sodium dimethylarsinate Chemical class [Na+].C[As](C)([O-])=O IHQKEDIOMGYHEB-UHFFFAOYSA-M 0.000 claims description 7
- 238000010276 construction Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 3
- 238000010329 laser etching Methods 0.000 claims description 3
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 238000005488 sandblasting Methods 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 11
- 238000005245 sintering Methods 0.000 description 7
- 239000011888 foil Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000007772 electrode material Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000007630 basic procedure Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 235000019219 chocolate Nutrition 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14379—Edge shooter
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
Definitions
- the invention relates to an arrangement and a production method for a piezo actuator plate, which is intended in particular for ink print heads which are composed of ink print modules in a stacked construction.
- Ink printheads of this type are used in small, fast printers, which in turn are part of modern machines for franking postal matter or for printing addresses.
- these machines print as a single franking imprint in one pass of the mail.
- Corresponding to this substantially larger printing width - approximately 25.4 mm or one inch - the number of ink nozzles to be arranged one below the other and thus also the number of piezo actuators in an ink print head is considerably larger than in the case of ink print heads for office printers.
- print resolutions of approximately 200 dpi (dots per inch) are required, which means ink printheads with at least the same number of nozzles or piezo actuators depending on the printhead installation position with a print width of 25.4mm - one inch -.
- Such ink printheads are inevitably designed in planar or stacked construction, on the one hand for reasons of the permissible dimensions and thus the packing density to be achieved and on the other hand for reasons of economical production, see also DE 42 25 799 A1.
- piezo actuators are usually used as piezo actuators in which a piezoelectric material, for example lead zirconate titanate (PZT), is arranged between two metal electrodes.
- PZT lead zirconate titanate
- the carrier plate - at the same time membrane plate over the ink pressure chambers - for the piezo actuators can consist of glass, ceramic, plastic or metal. In the latter case, an electrode could be omitted, but then a conductive adhesive is required.
- PZT lead zirconate titanate
- a planar ink print head which is composed of metal plates, compare DE 37 10 654 A1.
- One of the plates is a membrane plate made of nickel with a plate thickness of 0.03 mm, on which, according to the number of nozzles, piezo plates with a diameter of approximately 1 mm are arranged as drive elements for the pressure chambers.
- a pressure chamber plate made of nickel with a plate thickness of 0.2 mm adjoins the membrane plate; this corresponds to the desired height of the pressure chambers.
- the piezoplates are individually glued or soldered onto the membrane plate in the areas above the pressure chambers. The assembly and adjustment effort for this is considerable.
- a piezoelectric ink print head with a monolithic piezoceramic body is known, compare DE 38 05 279 A1, which has transducers arranged parallel to one another.
- Each transducer has a planar, piezoelectric drive element, a pressure chamber, an ink channel and a nozzle.
- the pressure chambers, the ink channels and the nozzles are designed as cavities in a piezoceramic body.
- Each drive element has an outer electrode, an inner electrode and an active piezoceramic layer arranged between the electrodes.
- the drive elements are acoustically separated from one another by cuts in the active piezoceramic layer. In other words, the incisions are intended to prevent crosstalk between the individual drive elements.
- piezoceramic raw foils are stacked on top of one another, pressed under vacuum and sintered.
- a piezoceramic raw foil is structured by etching; the resulting cavities correspond to the shape of the pressure chambers, the pressure chamber exits and the ink channels. The etching is done by spray etching or laser etching.
- An intermediate raw foil made of piezoceramic, which is metallized on one side, is placed on the structured piezoceramic raw foil. After sintering, the piezoceramic of the intermediate raw film forms the pressure chamber walls, the metallization being on the side facing away from the pressure chambers.
- the metallization is produced by printing the intermediate raw foil with a metal paste.
- An upper piezoceramic raw film is arranged on the intermediate raw film, from which the active piezoceramic layers are formed after sintering.
- the openings of the ink channels are exposed by material removal during mechanical processing.
- the outer electrodes are applied to the outer side of the active piezoceramic layers by sputtering using a mask or by screen printing.
- the converters are then polarized and the drive elements separated.
- the resulting piezoceramic body is contacted with connections of a connecting tape and inserted into a housing or a holding frame.
- sintering temperatures are from 1100 to 1300 ° C required in an oxygen atmosphere.
- an electrode material for platinum or metals of the platinum group are suitable for the sintering process used. Both of the latter solutions have the disadvantage that time and energy consuming high temperature processes and expensive Electrode material is required.
- only the finished monolithic piezoceramic body can be polarized. The electrode material must be corrosion resistant to the ink because an electrode is housed in the ink room.
- a method for equipping an ink jet print head with piezo actuators is known, compare DE 38 04 165 A1, in which a piezoceramic plate is first firmly connected to a membrane plate and only then is the piezo actuators separated from the piezoceramic plate.
- the membrane plate is made of glass and is provided with a zinc or nickel oxide layer on the side facing the piezoceramic plate. Both plates are connected with an adhesive.
- the piezo actuators are separated by means of a cutting device, such as a laser beam device or cutting machine. The piezo actuators are expediently separated from the piezoceramic plate before the adhesive connection apart from a connecting web.
- the piezoceramic plate serves as an assembly aid and prevents incorrect polarity.
- the metal oxide layer on the glass plate represents the common electrode for the piezo actuators.
- a conductive adhesive is required in order for there to be a secure contact between the one side of the piezo actuators and the metal oxide layer.
- Metal layers on glass substrates are known to have poor adhesion. Since the joint between the metallized glass membrane and the piezo actuators is subject to strong mechanical loads due to the periodic vibrations, the metal layer can become detached from the glass and the print module can fail.
- the purpose of the invention is to simplify the manufacture of ink printheads regarding the part piezo actuators.
- the invention has for its object an arrangement and a manufacturing method for a piezo actuator plate for ink printheads to create the type mentioned, with which an assembly without special adjustment effort, secure electrode and piezo actuator attachment without touching ink and easy contacting is made possible. On high temperature processes and conductive Adhesive should be avoided. The choice of material for the Membrane plate should be independent of the piezo actuators.
- the proposed solution offers a number of advantages. Since both electrodes are accessible from the same side, contact with connecting lines is possible in the simplest way and in only one joining direction. In addition to bonding and soldering, there is even the possibility of simple pressure contacting.
- the trench-shaped depression between the active and the inactive area brings about good acoustic decoupling between the piezo actuators.
- the design of the piezo actuator plate allows the use of appropriately assembled ribbon cables for control with a connection module. Depending on whether a larger number of piezo actuators or only individual piezo actuators are to be installed, simple assembly without complicated adjustment is possible due to the common connection via the active area.
- the additional space requirement is irrelevant, especially since a finished structuring and assembly of the piezo actuators is also possible before application to the membrane. Since the electrodes are applied directly to the piezoceramic, a connection with a good adhesive effect is achieved and conductive glue can be dispensed with. It is possible to choose the adhesive so that a secure adhesive connection between the piezo actuator and membrane plate is achieved. Since the piezo actuators are separated from the ink chambers by the membrane plate, both the electrodes and the adhesive connection need not be corrosion-resistant to the ink. It is preferably oriented towards a silver alloy. A complicated electrode guide from the inside of the module is not necessary. The solution according to the invention also allows the use of already coated and polarized piezo plates. It is then only necessary to subsequently metallize one end face and to carry out the structuring, although there is also extensive technological freedom.
- a plurality of piezo actuators 2 x 8 x 1 have a common inactive region 12, in which a common electrode 14 extends around an end face 15 from the opposite side.
- the piezo actuators are arranged like bars - like a chocolate bar. In any case, they are all built identically.
- the electrodes 13.01, 13.02 to 13.16 and 14 can be contacted directly with connecting lines of a ribbon cable, not shown, for the control.
- the ribbon cable can be provided with a connection module which has a corresponding recess above the separation area between the active area 11 and the inactive area 12 and the active area 11.
- the piezo actuator plate 1 is seated on the membrane plate of the ink pressure module in such a way that the piezo actuators lie in areas above its ink pressure chambers.
- a plate made of piezoelectric material such as preferably lead zirconate titanate, is metallized at least on its broad sides and one end face by means of a suitable method, the metallization being interrupted continuously on a broad side parallel to the metallized end face.
- a corresponding mask cover is used. Then the now metallized plate 1 is polarized in the usual way by applying a polarization voltage.
- the polarized plate 1 is fastened with its continuously metallized broad side by means of a suitable adhesive, such as a low viscosity epoxy resin adhesive or a UV-curable adhesive, in a layer thickness of 1 to 5 ⁇ m on the membrane plate.
- a suitable adhesive such as a low viscosity epoxy resin adhesive or a UV-curable adhesive
- the plate 1 is then structured using a suitable method so that a desired pattern of individual piezo actuators is present.
- the structured plate 1 with its electrodes 13.01 to 13.16, 14 is contacted in a suitable manner, such as bonding, soldering or pressing, via a connection module with associated connection lines of a ribbon cable.
- a modification of the method described above is in the Possible that the plate 1 is structured after the metallization, then polarized glued to the membrane plate and finally is contacted.
- Another variant is that one is already on the broad sides metallized piezo plate 1 - pre-assembled component - initially is polarized. The structuring then takes place accordingly the desired pattern.
- the end face is metallized, which lies parallel to the dividing line between the active and passive areas, so that the electrode 14 thereby extends into the inactive area 12 of the opposite side.
- the plate 1 is glued to the membrane plate with the continuously metallized broadside as before, and then the electrodes 13.01 to 13.16, 14 are contacted with the associated connecting cables of the ribbon cable.
- the metallization can be carried out by means of galvanization, sputtering, vapor deposition or screen printing.
- a silver alloy is preferably used as the material.
- Aluminum alloys are by no means excluded.
- the structuring can be carried out by sawing, etching, laser etching or sandblasting.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Claims (20)
- Agencement pour une plaque à piézo-actionneurs pour têtes d'impression à encre qui sont composées de modules d'impression à encre avec une plaque à membrane en pile, les différents piézo-actionneurs de la plaque à piézo-actionneurs (1) étant occupés des deux côtés avec des électrodes (13.01 à 13.16,14) et placés sur une plaque à membrane au-dessus des chambres d'impression à encre, les piézo-actionneurs formant une zone active (11) de la plaque à piézo-actionneurs (1), tandis que la partie restante de la plaque à piézo-actionneurs (1) forme une zone inactive (12), une des électrodes (14), laquelle est en même temps l'électrode commune de tous les piézo-actionneurs individuels, s'étendant sur une surface frontale (15) de la plaque à piézo-actionneurs (1) jusqu'au côté opposé, une cavité en forme de fosse étant prévue dans la plaque à piézo-actionneurs (1) entre la zone active (11) et la zone inactive (12).
- Agencement selon la revendication 1, caractérisé en ce que, les électrodes (13.01 à 13.16,14) des piézo-actionneurs sont mises en contact directement avec les fils de branchement d'un câble plat pour le pilotage.
- Agencement selon la revendication 1, caractérisé en ce que, les électrodes (13.01 à 13.16, 14) des piézo-actionneurs sont mises en contact indirectement, via un module de branchement, avec des fils de branchement d'un câble plat confectionné en conséquence pour le pilotage.
- Procédé pour la fabrication d'une plaque à piézo-actionneurs pour têtes d'impression à encre qui sont composées de modules d'impression à encre avec une plaque à membrane en pile, les différents piézo-actionneurs de la plaque à piézo-actionneurs (1) étant occupés des deux côtés avec des électrodes (13.01 à 13.16, 14) et placés sur une plaque à membrane au-dessus des chambres d'impression à encre, les piézo-actionneurs formant une zone active (11) de la plaque à piézo-actionneurs (1), tandis que la partie restante de la plaque à piézo-actionneurs (1) forme une zone inactive (12), une des électrodes (14), laquelle est en même temps l'électrode commune de tous les piézo-actionneurs individuels, s'étendant sur une surface frontale (15) de la plaque à piézo-actionneurs (1) jusqu'au côté opposé, procédé comprenant les étapes suivantes:une plaque en matériau piézo-électrique est métallisée au moyen d'un procédé approprié au moins sur ses côtés larges et un côté frontal (15), la métallisation étant interrompue en continu sur un côté large parallèlement au côté frontal métallisé (15); on procédera subsidiairement, à cet effet, à une protection de masque correspondante,la plaque métallisée est polarisée par l'application d'une tension de polarisation,la plaque polarisée est fixée avec son côté large métallisé en continu sur la plaque à membrane au moyen d'une colle appropriée,la plaque est structurée au moyen d'un procédé approprié engendrant un modèle désiré de piézo-actionneurs individuels (n x 1),la plaque structurée (1) est mise en contact avec ses électrodes (13.01 à 13.16, 14) d'une manière appropriée avec des fils de branchement associés d'un câble plat.
- Procédé pour la fabrication d'une plaque à piézo-actionneurs pour têtes d'impression à encre qui sont composées de modules d'impression à encre avec une plaque à membrane en pile, les différents piézo-actionneurs de la plaque à piézo-actionneurs (1) étant occupés des deux côtés avec des électrodes (13.01 à 13.16,14) et placés sur une plaque à membrane au-dessus des chambres d'impression à encre, les piézo-actionneurs formant une zone active (11) de la plaque à piézo-actionneurs (1), tandis que la partie restante de la plaque à piézo-actionneurs (1) forme une zone inactive (12), une des électrodes (14), laquelle est en même temps l'électrode commune de tous les piézo-actionneurs individuels, s'étendant sur une surface frontale (15) de la plaque à piézo-actionneurs (1) jusqu'au côté opposé, procédé comprenant les étapes suivantes:une plaque en matériau piézo-électrique est métallisée au moyen d'un procédé approprié au moins sur ses côtés larges et un côté frontal (15), la métallisation étant interrompue en continu sur un côté large parallèlement au côté frontal métallisé (15); on procédera subsidiairement, à cet effet, à une protection de masque correspondante,la plaque est structurée au moyen d'un procédé approprié engendrant un modèle désiré de piézo-actionneurs (n x 1),la plaque structurée est polarisée par l'application d'une tension de polarisation,la plaque polarisée structurée (1) est fixée avec son côté large métallisé en continu sur la plaque à membrane au moyen d'une colle appropriée,la plaque structurée (1) est mise en contact avec ses électrodes (13.01 à 13.16, 14) d'une manière appropriée avec des fils de branchement associés d'un câble plat.
- Procédé pour la fabrication d'une plaque à piézo-actionneurs pour têtes d'impression à encre qui sont composées de modules d'impression à encre avec une plaque à membrane en pile, les différents piézo-actionneurs de la plaque à piézo-actionneurs (1) étant occupés des deux côtés avec des électrodes (13.01 à 13.16, 14) et placés sur une plaque à membrane au-dessus des chambres d'impression à encre, les piézo-actionneurs formant une zone active (11) de la plaque à piézo-actionneurs (1), tandis que la partie restante de la plaque à piézo-actionneurs (1) forme une zone inactive (12), une des électrodes (14), laquelle est en même temps l'électrode commune de tous les piézo-actionneurs individuels, s'étendant sur une surface frontale (15) de la plaque à piézo-actionneurs (1) jusqu'au côté opposé, procédé comprenant les étapes suivantes:une plaque en matériau piézo-électrique, pourvue sur ses deux côté larges d'électrodes (13, 14), est polarisée au moyen d'une tension de polarisation,la plaque est structurée au moyen d'un procédé approprié de telle sorte que celle-ci est divisée en une zone active (11) et une zone inactive (12) engendrant un modèle désiré de piézo-actionneurs individuels (n x 1),le côté frontal (15), qui se situe parallèlement et au voisinage de la ligne de séparation entre la zone active et la zone inactive, est métallisé au moyen d'un procédé approprié de telle sorte que, de cette manière, une électrode (14) est étendue dans la zone inactive du côté opposé,la plaque (1) est fixée avec son côté large métallisé en continu sur une plaque à membrane au moyen d'une colle appropriée,la plaque (1) est mise en contact avec ses électrodes (13.01 à 13.16, 14) d'une manière appropriée avec des fils de branchement associés d'un câble plat.
- Procédé selon les revendications 4 à 6, caractérisé en ce que l'on utilise du titanate-circonate de plomb comme matériau piézo-électrique.
- Procédé selon les revendications 4 à 6, caractérisé en ce que la métallisation a lieu par galvanisation.
- Procédé selon les revendications 4 à 6, caractérisé en ce que la métallisation a lieu par pulvérisation cathodique.
- Procédé selon les revendications 4 à 6, caractérisé en ce que la métallisation a lieu par métallisation sous vide.
- Procédé selon les revendications 4 à 6, caractérisé en ce que la métallisation a lieu par sérigraphie d'une pâte métallique.
- Procédé selon les revendications 4 à 11, caractérisé en ce que l'on utilise un alliage d'argent pour la métallisation.
- Procédé selon les revendications 4 à 6, caractérisé en ce que la structuration a lieu par sciage.
- Procédé selon les revendications 4 à 6, caractérisé en ce que la structuration a lieu par gravure.
- Procédé selon les revendications 4 à 6, caractérisé en ce que la structuration a lieu par gravure au laser.
- Procédé selon les revendications 4 à 6, caractérisé en ce que la structuration a lieu par sablage.
- Procédé selon les revendications 4 à 6, caractérisé en ce que l'on utilise comme colle une colle à résine époxy très liquide qui est appliquée en couche de 1 à 5 µm d'épaisseur.
- Procédé selon les revendications 4 à 6, caractérisé en ce que l'on utilise comme colle une colle durcissable au moyen de rayonnement UV.
- Procédé selon les revendications 4 à 6, caractérisé en ce que les électrodes (13.01 à 13.16, 14) de la plaque (1) sont mises en contact avec les fils de branchement associés par bonding.
- Procédé selon les revendications 4 à 6, caractérisé en ce que les fils de branchement du câble plat sont pressés mécaniquement contre les électrodes associées (13.01. à 13.16,14) de la plaquel (1) au moyen d'un module de branchement.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4428847 | 1994-08-03 | ||
DE4428847 | 1994-08-03 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0695641A2 EP0695641A2 (fr) | 1996-02-07 |
EP0695641A3 EP0695641A3 (fr) | 1997-03-12 |
EP0695641B1 true EP0695641B1 (fr) | 2001-04-04 |
Family
ID=6525703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP95250165A Expired - Lifetime EP0695641B1 (fr) | 1994-08-03 | 1995-07-06 | Disposition pour organes d'actionnement piézoélectriques et procédé de fabrication |
Country Status (3)
Country | Link |
---|---|
US (2) | US5729263A (fr) |
EP (1) | EP0695641B1 (fr) |
DE (1) | DE59509149D1 (fr) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3697829B2 (ja) * | 1997-04-09 | 2005-09-21 | ブラザー工業株式会社 | インクジェットヘッドの製造方法 |
JP3546430B2 (ja) | 1997-06-27 | 2004-07-28 | セイコーエプソン株式会社 | 圧電振動子ユニット、及びこれの製造方法、及びインクジェット式記録ヘッド |
EP1046506A1 (fr) * | 1999-04-19 | 2000-10-25 | Océ-Technologies B.V. | Tête d'impression à jet d'encre |
DE10084495T1 (de) | 1999-04-20 | 2002-06-06 | Seagate Technology Llc | Elektrodenstrukturierung für einen Differential-PZT-Aktuator |
US6755511B1 (en) * | 1999-10-05 | 2004-06-29 | Spectra, Inc. | Piezoelectric ink jet module with seal |
US7261735B2 (en) * | 2001-05-07 | 2007-08-28 | Cordis Corporation | Local drug delivery devices and methods for maintaining the drug coatings thereon |
US20060222756A1 (en) * | 2000-09-29 | 2006-10-05 | Cordis Corporation | Medical devices, drug coatings and methods of maintaining the drug coatings thereon |
US8182527B2 (en) | 2001-05-07 | 2012-05-22 | Cordis Corporation | Heparin barrier coating for controlled drug release |
US7195640B2 (en) * | 2001-09-25 | 2007-03-27 | Cordis Corporation | Coated medical devices for the treatment of vulnerable plaque |
WO2004043507A1 (fr) * | 2002-11-07 | 2004-05-27 | Carbon Medical Technologies, Inc. | Revetements de dispositifs medicaux biocompatibles |
US20050206679A1 (en) * | 2003-07-03 | 2005-09-22 | Rio Rivas | Fluid ejection assembly |
US6890067B2 (en) * | 2003-07-03 | 2005-05-10 | Hewlett-Packard Development Company, L.P. | Fluid ejection assembly |
US8491076B2 (en) | 2004-03-15 | 2013-07-23 | Fujifilm Dimatix, Inc. | Fluid droplet ejection devices and methods |
US7281778B2 (en) | 2004-03-15 | 2007-10-16 | Fujifilm Dimatix, Inc. | High frequency droplet ejection device and method |
US7388319B2 (en) * | 2004-10-15 | 2008-06-17 | Fujifilm Dimatix, Inc. | Forming piezoelectric actuators |
US7420317B2 (en) * | 2004-10-15 | 2008-09-02 | Fujifilm Dimatix, Inc. | Forming piezoelectric actuators |
EP1836056B1 (fr) | 2004-12-30 | 2018-11-07 | Fujifilm Dimatix, Inc. | Impression a jet d'encre |
US7540593B2 (en) * | 2005-04-26 | 2009-06-02 | Hewlett-Packard Development Company, L.P. | Fluid ejection assembly |
US7380914B2 (en) * | 2005-04-26 | 2008-06-03 | Hewlett-Packard Development Company, L.P. | Fluid ejection assembly |
US7988247B2 (en) | 2007-01-11 | 2011-08-02 | Fujifilm Dimatix, Inc. | Ejection of drops having variable drop size from an ink jet printer |
US8125120B2 (en) * | 2008-02-15 | 2012-02-28 | Nikon Corporation | Vibration device, antidust device, camera, vibration device inspection method, method for manufacturing vibration device and vibration method |
US9070394B1 (en) | 2013-03-18 | 2015-06-30 | Magnecomp Corporation | Suspension microactuator with wrap-around electrode on inactive constraining layer |
US9330698B1 (en) | 2013-03-18 | 2016-05-03 | Magnecomp Corporation | DSA suspension having multi-layer PZT microactuator with active PZT constraining layers |
US11205449B2 (en) | 2013-03-18 | 2021-12-21 | Magnecomp Corporation | Multi-layer PZT microacuator with active PZT constraining layers for a DSA suspension |
US10607642B2 (en) | 2013-03-18 | 2020-03-31 | Magnecomp Corporation | Multi-layer PZT microactuator with active PZT constraining layers for a DSA suspension |
US9741376B1 (en) | 2013-03-18 | 2017-08-22 | Magnecomp Corporation | Multi-layer PZT microactuator having a poled but inactive PZT constraining layer |
US9224410B1 (en) * | 2013-09-04 | 2015-12-29 | Magnecomp Corporation | Suspension having microactuator grounded to opposite side of metal support layer |
JP6451306B2 (ja) * | 2014-12-23 | 2019-01-16 | ブラザー工業株式会社 | 液体吐出装置及び液体吐出ヘッド |
US10128431B1 (en) | 2015-06-20 | 2018-11-13 | Magnecomp Corporation | Method of manufacturing a multi-layer PZT microactuator using wafer-level processing |
JP7310133B2 (ja) * | 2018-12-26 | 2023-07-19 | セイコーエプソン株式会社 | 液体噴射ユニット |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4551647A (en) * | 1983-03-08 | 1985-11-05 | General Electric Company | Temperature compensated piezoelectric transducer and lens assembly and method of making the assembly |
DE3630206A1 (de) * | 1985-09-06 | 1987-03-19 | Fuji Electric Co Ltd | Tintenstrahldruckkopf |
US4703333A (en) * | 1986-01-30 | 1987-10-27 | Pitney Bowes Inc. | Impulse ink jet print head with inclined and stacked arrays |
DE3628346A1 (de) * | 1986-08-21 | 1988-02-25 | Siemens Ag | Tintendruckkopf in dickschichttechnik |
DE3710654A1 (de) | 1987-03-31 | 1988-10-13 | Siemens Ag | Mehrschichtig aufgebauter tintenschreibkopf |
DE3701470A1 (de) * | 1987-01-20 | 1988-07-28 | Siemens Ag | Verfahren zur herstellung eines wandlerelementes fuer elektroakustische wandler |
DE3725500A1 (de) * | 1987-07-31 | 1989-02-09 | Siemens Ag | Piezoelektrischer tintendruckkopf und verfahren zu seiner herstellung |
DE3725499A1 (de) * | 1987-07-31 | 1989-02-09 | Siemens Ag | Piezoelektrischer tintendruckkopf und verfahren zu seiner herstellung |
DE3733109A1 (de) | 1987-09-30 | 1989-04-13 | Siemens Ag | Verfahren zur herstellung eines piezokeramik-elementes fuer einen tintenstrahlschreiber |
DE3804165A1 (de) | 1988-02-11 | 1989-08-24 | Olympia Aeg | Verfahren zum bestuecken eines tintenstrahldruckkopfes mit piezokristallen |
DE3805279A1 (de) * | 1988-02-19 | 1989-08-31 | Siemens Ag | Piezoelektrischer tintendruckkopf und verfahren zu seiner herstellung |
JPH0292644A (ja) * | 1988-09-30 | 1990-04-03 | Seiko Epson Corp | インクジェットヘッド |
ATE130803T1 (de) * | 1990-08-03 | 1995-12-15 | Canon Kk | Farbstrahlaufzeichnungskopfherstellungsverfahre . |
EP0486256B1 (fr) * | 1990-11-13 | 1997-08-13 | Citizen Watch Co., Ltd. | Tête d'impression pour imprimante à jet d'encre |
JP2728980B2 (ja) * | 1991-01-07 | 1998-03-18 | シャープ株式会社 | インクジェットヘッド装置 |
US5410341A (en) * | 1991-05-28 | 1995-04-25 | Brother Kogyo Kabushiki Kaisha | Droplet jet device |
JP3144949B2 (ja) * | 1992-05-27 | 2001-03-12 | 日本碍子株式会社 | 圧電/電歪アクチュエータ |
DE69314315T2 (de) * | 1992-06-11 | 1998-04-09 | Seiko Epson Corp | Tintenstrahlkopf und verfahren zur herstellung |
DE4225799A1 (de) | 1992-07-31 | 1994-02-03 | Francotyp Postalia Gmbh | Tintenstrahldruckkopf und Verfahren zu seiner Herstellung |
DE9404328U1 (de) * | 1994-03-10 | 1994-05-19 | Francotyp-Postalia Gmbh, 13409 Berlin | Tintenstrahldruckkopf |
-
1995
- 1995-07-06 EP EP95250165A patent/EP0695641B1/fr not_active Expired - Lifetime
- 1995-07-06 DE DE59509149T patent/DE59509149D1/de not_active Expired - Fee Related
- 1995-07-26 US US08/507,214 patent/US5729263A/en not_active Expired - Lifetime
-
1997
- 1997-07-10 US US08/889,961 patent/US5883651A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE59509149D1 (de) | 2001-05-10 |
EP0695641A3 (fr) | 1997-03-12 |
US5883651A (en) | 1999-03-16 |
EP0695641A2 (fr) | 1996-02-07 |
US5729263A (en) | 1998-03-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0695641B1 (fr) | Disposition pour organes d'actionnement piézoélectriques et procédé de fabrication | |
EP0713777B1 (fr) | Agencement de modules individuels d'impression à encre pour une tête d'impression à encre | |
US4879568A (en) | Droplet deposition apparatus | |
DE19639717C2 (de) | Tintenstrahldruckkopf und Verfahren zu seiner Herstellung | |
US5003679A (en) | Method of manufacturing a droplet deposition apparatus | |
DE60313233T2 (de) | Tintenstrahlkopf, Verfahren für dessen Herstellung, und Tintenstrahldrucker | |
DE60107917T2 (de) | Tintenstrahlaufzeichnungskopf und Tintenstrahlaufzeichnungsapparat | |
US5327627A (en) | Method of manufacturing a high-density print head incorporating piezoelectric members | |
JPS6340672B2 (fr) | ||
DE4336416A1 (de) | Face-Shooter-Tintenstrahldruckkopf und Verfahren zu seiner Herstellung | |
US6019458A (en) | Ink-jet printing head for improving resolution and decreasing crosstalk | |
JP3058143B2 (ja) | 圧電アクチュエータおよびその製造方法 | |
DE4435914C2 (de) | Piezoelektrischer Antrieb für einen Tintenstrahlaufzeichnungskopf und Verfahren zu dessen Herstellung | |
US7009327B2 (en) | Piezoelectric element formation member, method of manufacturing the same, piezoelectric actuator unit and liquid ejection head incorporating the same | |
DE602004010579T2 (de) | Vorrichtung für die Abgabe von Flüssigkeiten | |
EP0713775B1 (fr) | Agencement pour une tête d'impression à jet d'encre modulaire | |
US7524038B2 (en) | Liquid-jet head and liquid-jet apparatus | |
EP1062098A1 (fr) | Applicateur par gouttelettes et procede de fabrication | |
EP1748500B1 (fr) | Élément piézo-électrique, tête d'éjection de gouttelettes et dispositif d'éjection de gouttelettes | |
DE602004008689T2 (de) | Tintenstrahlkopf und verfahren zum herstellen desselben | |
EP0713776B1 (fr) | Module pour tête d'impression à encre | |
DE69822928T2 (de) | Tintenstrahldruckkopf | |
US5793149A (en) | Arrangement for plate-shaped piezoactuators and method for the manufacture thereof | |
US6959490B2 (en) | Method of manufacturing silicon device, method of manufacturing liquid jet head and liquid jet head | |
EP1366903B1 (fr) | Tête d'impression à jet d'encre et méthode de fabrication |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): CH DE FR GB IT LI |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: FRANCOTYP-POSTALIA AKTIENGESELLSCHAFT & CO. |
|
RAP3 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: FRANCOTYP-POSTALIA AKTIENGESELLSCHAFT & CO. |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): CH DE FR GB IT LI |
|
17P | Request for examination filed |
Effective date: 19970410 |
|
17Q | First examination report despatched |
Effective date: 19980129 |
|
GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): CH DE FR GB IT LI |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: NV Representative=s name: ROTTMANN, ZIMMERMANN + PARTNER AG Ref country code: CH Ref legal event code: EP |
|
REF | Corresponds to: |
Ref document number: 59509149 Country of ref document: DE Date of ref document: 20010510 |
|
ET | Fr: translation filed | ||
ITF | It: translation for a ep patent filed |
Owner name: STUDIO JAUMANN P. & C. S.N.C. |
|
GBT | Gb: translation of ep patent filed (gb section 77(6)(a)/1977) |
Effective date: 20010622 |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: IF02 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed | ||
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PUE Owner name: DIGITAL GRAPHICS INCORPORATION Free format text: FRANCOTYP-POSTALIA AKTIENGESELLSCHAFT & CO.#TRIFTWEG 21-26#16547 BIRKENWERDER (DE) -TRANSFER TO- DIGITAL GRAPHICS INCORPORATION#517, DEOKE-DON YANGJU-SHI#KYUNGGI-DO, 482-050 (KR) |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: TP |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: 732E |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: CH Payment date: 20051026 Year of fee payment: 11 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20051110 Year of fee payment: 11 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20060731 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20060731 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: IT Payment date: 20060731 Year of fee payment: 12 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST Effective date: 20070330 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20070730 Year of fee payment: 13 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20070807 Year of fee payment: 13 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20060731 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20080706 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20090203 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20080706 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20070706 |