EP0654831A2 - Procédé de fabrication de cellules solaires - Google Patents
Procédé de fabrication de cellules solaires Download PDFInfo
- Publication number
- EP0654831A2 EP0654831A2 EP94308381A EP94308381A EP0654831A2 EP 0654831 A2 EP0654831 A2 EP 0654831A2 EP 94308381 A EP94308381 A EP 94308381A EP 94308381 A EP94308381 A EP 94308381A EP 0654831 A2 EP0654831 A2 EP 0654831A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- paste
- layer
- solar cell
- compound semiconductor
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 150000001875 compounds Chemical class 0.000 claims abstract description 30
- 239000011521 glass Substances 0.000 claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 238000001035 drying Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000002156 mixing Methods 0.000 claims abstract description 4
- 229910004613 CdTe Inorganic materials 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 12
- 238000007639 printing Methods 0.000 claims description 12
- 238000007650 screen-printing Methods 0.000 claims description 8
- 239000007921 spray Substances 0.000 claims description 5
- 238000002161 passivation Methods 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 61
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 25
- CJOBVZJTOIVNNF-UHFFFAOYSA-N cadmium sulfide Chemical compound [Cd]=S CJOBVZJTOIVNNF-UHFFFAOYSA-N 0.000 description 22
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 11
- 229910052799 carbon Inorganic materials 0.000 description 10
- 230000006872 improvement Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- YKYOUMDCQGMQQO-UHFFFAOYSA-L cadmium dichloride Chemical compound Cl[Cd]Cl YKYOUMDCQGMQQO-UHFFFAOYSA-L 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000010422 painting Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 238000009210 therapy by ultrasound Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000002301 combined effect Effects 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007591 painting process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1828—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIBVI compounds, e.g. CdS, ZnS, CdTe
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/543—Solar cells from Group II-VI materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- This invention relates to a method of manufacturing a solar cell of compound semiconductors by way of coating and burning.
- solar cells of compound semiconductors of n-CdS/p-CdTe have been practiced commercially, with relatively low material cost, conversion efficiency as high as 10%, less deterioration in long run, and relatively simple manufacturing process suitable for mass production consisting of repeated printing, drying, burning (sintering or baking) resulting in possible high density arrangement on a glass plate and realization of high voltage without outer wire connection as well as large area cells.
- a typical solar cell of II-V group semiconductor of which a sectional view is shown in Fig. 1, comprises a glass substrate 1 of high light transmittance and electrical insulation is provided on one surface thereof with a n-type CdS layer 2, a p-type CdTe layer 3, a current collecting carbon electrode layer 4, an Ag ⁇ In electrode which is the positive terminal 5, and an Ag ⁇ In electrode which is the negative terminal 6 formed by stacking with printing and baking for each step.
- a current collecting carbon electrode layer 4 an Ag ⁇ In electrode which is the positive terminal 5
- an Ag ⁇ In electrode which is the negative terminal 6 formed by stacking with printing and baking for each step.
- thus prepared solar cell element is provided on both the Ag ⁇ In electrodes, with a copper paste deposited, dried and baked for easy soldering of lead wires. The remaining part is then covered all over with a passivation layer of a thermosetting resin such as epoxy deposited and baked.
- Light including that of the sun, falls on the surface of the glass substrate 1 opposite to the surface having the above solar cell element layers, to generate electric power by photoelectric conversion.
- a heat-resistant barium borosilicate glass is employed, which has very low alkaline metal content and high softening point.
- each of the n-type compound semiconductor layer, p-type compound semiconductor layer, and electrode layer must have uniform thickness, smooth surface, and no pin-hole.
- the n-type CdS semiconductor layer laied directly on the substrate is uniform, smooth and non-porous, the adherence of the layer to the substrate is improved, resulting in increase of the light transmittance, decrease of the sheet resistance, and, further, increase of the photo-current and improvement of the characteristics of the cell.
- the paste of the powdered compound semiconductor or elements therefor and the electroconducting agent and a viscous agent mixed together was kept under reduced pressure to remove bubbles therein and, after the deposition, the substrate was held horizontally at about 50°C or such, which was lower than the drying temperature of the viscous agent, to reduce the viscousity of the viscous agent and uniformly precipitate the raw material powders to bring about high density.
- the bubbles were removed from the paste before painting, it sometimes happened in the painting process in screen printing that bubbles were brought in from the surrounding atmosphere to results in uneven deposition or pin-holes.
- the raw material powders did not always uniformly precipitate, and the bubbles were not sufficiently removed, resulting in each layer not flat, not of uniform thickness.
- the pin-holes left after painting and baking in the layers caused the increase of sheet resistance; especially, if pin-holes were formed in the p-type CdTe layer, the carbon particles of the carbon electrode layer laid thereon penetrated into the pin-holes up to the CdS layer under the CdTe layer, to cause internal short circuitting or current leakage, fatally damaging the battery performance.
- a method of manufacturing a solar cell according to the present invention comprises step of forming a layer of n-type compound semiconductor, a layer of p-type compound semiconductor, and a layer of electrode on a glass substrate, wherein one of said step of forming the layer of compound semiconductor comprises preparing a paste by mixing a raw semiconductor material and a viscous agent, applying said paste, drying said paste to harden, and burning said paste, and giving vibration to said substrate while or after the application of the paste.
- Fig. 1 is a schematic sectional view of a II-VI group compound semiconductor solar cell of n-CdS/p-CdTe type.
- Fig. 2 is a microscopic photograph of a section of sintered CdS layer on a glass substrate.
- Fig. 3 are graphs of the open circuit voltages, short circuit currents, fill factors, and intrinsic photo-electric conversion efficiencies of solar cells fabricated according to the present invention as well as to the conventional method.
- a paste was prepared by mixing cadmium sulphide (CdS) fine powder, cadmium chloride (CdCl2) and propylene glycol (PG), the CdCl2 being a flux and the PG being a viscous agent.
- CdS cadmium sulphide
- CdCl2 cadmium chloride
- PG propylene glycol
- the paste was applied on a substrate of barium borosilicate glass by screen printing to form a coating layer of 60 ⁇ m thickness.
- the glass substrate was given vibration of 20 ⁇ m amplitude, 28kHz ultrasonic frequency by contacting a horn of piezoelectric vibrator on the outer end of the substrate for 5 seconds, whereby the roughness of the layer due to the screen net disapeared and the bubbles in the layer were removed, as observed.
- the substrate with the layer was dried in the atmosphere at 120°C (PG was removed by vaporization), and sintered at 690°C.
- a substrate with the layer was fabricated by similar method but without the application of vibration.
- the CdS layer (B) on the substrate prepared without vibration has projections and dents on the surface and void spaces and/or pin-holes and the thickness is not uniform. Moreover, it is not sufficiently adherent to the substrae. On the contrary, the CdS layer of the sample (A) fabricated with vibration has little voids and/or pin-holes and uniform thickness as well as a smooth surface, sticking fully to the substrate. Numerically, Table 1 indicates improvements of the light transmittance by 5% and reduction of the sheet resistance by 15%. Thus it is expected the CdS layer with the vibration would have superior characteristics as the window material of solar cells.
- Cd ⁇ Te paste was prepared by kneading well a equi-mol powder mixture of cadmium (Cd) and tellurium (Te) with addition of CdCl2 and PG, and the paste was applied on the above CdS sintered layer by screen printing by 30 ⁇ m thickness, dried in the atmosphere, and sintered at 620°C, to form the CdTe layer.
- a carbon paste prepared by kneading carbon powder and a viscous agent of organic solvent solution of a resin, is applied on the CdTe layer, to make the CdTe layer a p-type semiconductor having a n-CdS/p-CdTe heterojunction with the CdS layer, and to form a electricity collecting electrode.
- the carbon electrode layer 4 and the CdS layer 2 were provided with a positive terminal 5 and a negative terminal 6 of Ag ⁇ In by depositing Ag ⁇ In paste with screen printing and drying and baking, the Ag ⁇ In paste being prepared by kneading powders of silver(Ag) and indium(In) with a viscous agent of an organic solvent solution of a resin.
- the vibration was given by 20 ⁇ m amplitude and 22kHz frequency for 10 seconds by pressing the hone of the ultrasonic oscillator to the reverse side of the glass substrate; the reverse side means the surface on which the semiconductor layers are not piled.
- the other conditions were the same.
- the measurements for the sample D show the contribution of the vibration after the carbon paste application to the improvement of I SC and FF. It is thought that the contact resistance between the carbon electrode layer and the CdTe layer has been reduced by the vibration.
- the characteristics of the solar cells are improved by a simple measure to give vibration to the glass substrate after the applications of the pastes, without accompanying any considerable change of the process or manufacturing installation.
- the method of application of the various pastes is not confined to the screen printing as referred to in the above explanation.
- Various other methods can be employed; plotting printing to push out paste from a nozzle and print a figure of a desired pattern on a glass substrate adjusting the distance between the tip of the nozzle and the surface of the substrate to change the paint thickness; relief and intaglio printing; spray printing to spray paste with a spray gun shielding the non-desirous part by a mask.
- Table 2 shows how the spread of unevennes of the surface (the difference between the maximum thickness and the minimum thickness) and the yields in production change depending upon employing or not the ultrasonic treatment on every layer of cells.
- a solar cell when a solar cell is fabricated by forming n-type and p-type compound semiconductor layers, electrode layers et al. in stack on a glass substrate, the layers become free of bubbles, and the surfaces flat, if vibration is given to the glass substrate while or after the paste of the raw material and viscous agent for the layer are applied; and drying and burning thereafter bring dense layers of uniform thickness and in good contact with the next layer, and a solar cell with improved, uniform characteristics.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31447893 | 1993-11-18 | ||
JP314478/93 | 1993-11-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0654831A2 true EP0654831A2 (fr) | 1995-05-24 |
EP0654831A3 EP0654831A3 (fr) | 1998-01-14 |
Family
ID=18053804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP94308381A Withdrawn EP0654831A3 (fr) | 1993-11-18 | 1994-11-14 | Procédé de fabrication de cellules solaires |
Country Status (2)
Country | Link |
---|---|
US (1) | US5538903A (fr) |
EP (1) | EP0654831A3 (fr) |
Cited By (6)
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WO2008061131A2 (fr) * | 2006-11-15 | 2008-05-22 | Innovalight, Inc. | Procédé permettant de fabriquer un film mince de nanoparticules densifiées comprenant un ensemble de pores bouchés |
WO2010097040A1 (fr) | 2009-02-27 | 2010-09-02 | Byd Company Limited | Procédé de préparation de film cds |
US7923368B2 (en) | 2008-04-25 | 2011-04-12 | Innovalight, Inc. | Junction formation on wafer substrates using group IV nanoparticles |
US7943846B2 (en) | 2006-04-21 | 2011-05-17 | Innovalight, Inc. | Group IV nanoparticles in an oxide matrix and devices made therefrom |
WO2011110231A1 (fr) | 2010-03-12 | 2011-09-15 | Q-Cells Se | Procédé et système de fabrication en ligne pour la fabrication de cellules solaires |
US20220310854A1 (en) * | 2021-03-02 | 2022-09-29 | Azur Space Solar Power Gmbh | Solar cell contact arrangement |
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US5985691A (en) * | 1997-05-16 | 1999-11-16 | International Solar Electric Technology, Inc. | Method of making compound semiconductor films and making related electronic devices |
US6268014B1 (en) | 1997-10-02 | 2001-07-31 | Chris Eberspacher | Method for forming solar cell materials from particulars |
US20060057766A1 (en) * | 2003-07-08 | 2006-03-16 | Quanxi Jia | Method for preparation of semiconductive films |
US20070163639A1 (en) * | 2004-02-19 | 2007-07-19 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer from microflake particles |
US7663057B2 (en) * | 2004-02-19 | 2010-02-16 | Nanosolar, Inc. | Solution-based fabrication of photovoltaic cell |
US8846141B1 (en) | 2004-02-19 | 2014-09-30 | Aeris Capital Sustainable Ip Ltd. | High-throughput printing of semiconductor precursor layer from microflake particles |
US7605328B2 (en) * | 2004-02-19 | 2009-10-20 | Nanosolar, Inc. | Photovoltaic thin-film cell produced from metallic blend using high-temperature printing |
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US8329501B1 (en) | 2004-02-19 | 2012-12-11 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer from inter-metallic microflake particles |
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US20090032108A1 (en) * | 2007-03-30 | 2009-02-05 | Craig Leidholm | Formation of photovoltaic absorber layers on foil substrates |
US8541048B1 (en) | 2004-09-18 | 2013-09-24 | Nanosolar, Inc. | Formation of photovoltaic absorber layers on foil substrates |
US8927315B1 (en) | 2005-01-20 | 2015-01-06 | Aeris Capital Sustainable Ip Ltd. | High-throughput assembly of series interconnected solar cells |
US20060180198A1 (en) * | 2005-02-16 | 2006-08-17 | Sharp Kabushiki Kaisha | Solar cell, solar cell string and method of manufacturing solar cell string |
JP5324222B2 (ja) * | 2005-08-22 | 2013-10-23 | キュー・ワン・ナノシステムズ・インコーポレイテッド | ナノ構造およびそれを実施する光起電力セル |
WO2007025062A2 (fr) * | 2005-08-25 | 2007-03-01 | Wakonda Technologies, Inc. | Modele photovoltaique |
JP4290747B2 (ja) * | 2006-06-23 | 2009-07-08 | シャープ株式会社 | 光電変換素子およびインターコネクタ付き光電変換素子 |
KR101528382B1 (ko) * | 2007-10-17 | 2015-06-12 | 헤레우스 프레셔스 메탈즈 노스 아메리카 콘쇼호켄 엘엘씨 | 단면 후면 컨택 태양 전지용 유전성 코팅물 |
JP2011503847A (ja) * | 2007-11-02 | 2011-01-27 | ワコンダ テクノロジーズ, インコーポレイテッド | 結晶質薄膜光起電力構造およびその形成方法 |
US7772505B2 (en) * | 2008-02-22 | 2010-08-10 | Laird Technologies, Inc. | Electromagnetic interference (EMI) shielding apparatus and related methods |
US8236603B1 (en) | 2008-09-04 | 2012-08-07 | Solexant Corp. | Polycrystalline semiconductor layers and methods for forming the same |
WO2010088366A1 (fr) * | 2009-01-28 | 2010-08-05 | Wakonda Technologies, Inc. | Structures de film mince cristallin à gros grains, et dispositifs et procédés de formation de telles structures |
TW201123483A (en) * | 2009-12-30 | 2011-07-01 | Auria Solar Co Ltd | Thin film solar cell and manufacturing method thereof |
CN102347377A (zh) * | 2010-07-29 | 2012-02-08 | 比亚迪股份有限公司 | 太阳能电池背电场、其制作方法和电池片及其制作方法 |
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JPS58118171A (ja) * | 1982-01-07 | 1983-07-14 | Agency Of Ind Science & Technol | 光起電力素子の製造方法 |
JPH04188623A (ja) * | 1990-11-19 | 1992-07-07 | Matsushita Electric Ind Co Ltd | 保護膜の形成方法 |
JPH05154441A (ja) * | 1991-12-09 | 1993-06-22 | Nkk Corp | 塗膜の平滑化方法 |
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JPS4826976A (fr) * | 1971-08-14 | 1973-04-09 | ||
JPS6033278A (ja) * | 1983-07-27 | 1985-02-20 | 鳴海製陶株式会社 | 封着用ガラス層の形成方法 |
JPS6230318A (ja) * | 1985-07-31 | 1987-02-09 | Fujitsu Ltd | 半導体装置の製造方法 |
JPH01235116A (ja) * | 1988-03-15 | 1989-09-20 | Nec Kansai Ltd | 樹脂塗布方法 |
-
1994
- 1994-11-14 EP EP94308381A patent/EP0654831A3/fr not_active Withdrawn
- 1994-11-18 US US08/342,445 patent/US5538903A/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS58118171A (ja) * | 1982-01-07 | 1983-07-14 | Agency Of Ind Science & Technol | 光起電力素子の製造方法 |
JPH04188623A (ja) * | 1990-11-19 | 1992-07-07 | Matsushita Electric Ind Co Ltd | 保護膜の形成方法 |
JPH05154441A (ja) * | 1991-12-09 | 1993-06-22 | Nkk Corp | 塗膜の平滑化方法 |
Non-Patent Citations (5)
Title |
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PATENT ABSTRACTS OF JAPAN vol. 007, no. 229 (E-203), 12 October 1983 & JP 58 118171 A (KOGYO GIJUTSUIN;OTHERS: 0J), 14 July 1983, * |
PATENT ABSTRACTS OF JAPAN vol. 016, no. 508 (E-1282), 20 October 1992 & JP 04 188623 A (MATSUSHITA ELECTRIC IND CO LTD), 7 July 1992, * |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7943846B2 (en) | 2006-04-21 | 2011-05-17 | Innovalight, Inc. | Group IV nanoparticles in an oxide matrix and devices made therefrom |
WO2008061131A2 (fr) * | 2006-11-15 | 2008-05-22 | Innovalight, Inc. | Procédé permettant de fabriquer un film mince de nanoparticules densifiées comprenant un ensemble de pores bouchés |
WO2008061131A3 (fr) * | 2006-11-15 | 2008-12-24 | Innovalight Inc | Procédé permettant de fabriquer un film mince de nanoparticules densifiées comprenant un ensemble de pores bouchés |
US7923368B2 (en) | 2008-04-25 | 2011-04-12 | Innovalight, Inc. | Junction formation on wafer substrates using group IV nanoparticles |
WO2010097040A1 (fr) | 2009-02-27 | 2010-09-02 | Byd Company Limited | Procédé de préparation de film cds |
EP2382653A1 (fr) * | 2009-02-27 | 2011-11-02 | BYD Company Limited | Procédé de préparation de film cds |
EP2382653A4 (fr) * | 2009-02-27 | 2013-04-10 | Byd Co Ltd | Procédé de préparation de film cds |
WO2011110231A1 (fr) | 2010-03-12 | 2011-09-15 | Q-Cells Se | Procédé et système de fabrication en ligne pour la fabrication de cellules solaires |
US20220310854A1 (en) * | 2021-03-02 | 2022-09-29 | Azur Space Solar Power Gmbh | Solar cell contact arrangement |
Also Published As
Publication number | Publication date |
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US5538903A (en) | 1996-07-23 |
EP0654831A3 (fr) | 1998-01-14 |
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