EP0522542A1 - Procédé pour la fabrication de bandes sans fin en fil sans soudure - Google Patents

Procédé pour la fabrication de bandes sans fin en fil sans soudure Download PDF

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Publication number
EP0522542A1
EP0522542A1 EP92111614A EP92111614A EP0522542A1 EP 0522542 A1 EP0522542 A1 EP 0522542A1 EP 92111614 A EP92111614 A EP 92111614A EP 92111614 A EP92111614 A EP 92111614A EP 0522542 A1 EP0522542 A1 EP 0522542A1
Authority
EP
European Patent Office
Prior art keywords
band
ring
loop
wire
loops
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP92111614A
Other languages
German (de)
English (en)
Other versions
EP0522542B1 (fr
Inventor
Dieter Dr. Seifert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WACKER-SILTRONIC GESELLSCHAFT FUER HALBLEITERMATER
Original Assignee
Wacker Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic AG filed Critical Wacker Siltronic AG
Publication of EP0522542A1 publication Critical patent/EP0522542A1/fr
Application granted granted Critical
Publication of EP0522542B1 publication Critical patent/EP0522542B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B5/00—Extending closed shapes of metal bands by rolling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S76/00—Metal tools and implements, making
    • Y10S76/12—Diamond tools

Definitions

  • the invention relates to a method for producing seamless ribbon and wire loops with a strength that is constant over their entire circumference and a high degree of shape precision.
  • the invention further relates to a device for producing such band and wire loops, and their use as cutting tools in band and wire saws.
  • brittle hard workpieces for example rods or blocks made from semiconductor materials such as silicon or from compound semiconductor materials such as gallium arsenide, are sawn into thin disks.
  • the slices (wafers) with thicknesses of 0.1 mm to 1 mm serve as the starting product for the production of various electronic components or for the production of solar cells.
  • a low cut loss, a high geometric quality of the sawn off discs combined with high sawing rates are the most important requirements to be met for an economical sawing process.
  • Hole, wire and band saws are the most commonly used sawing machines when it comes to cutting brittle hard workpieces with high precision. So far, internal hole saws have been used in particular to saw rods made of silicon single crystals into wafers. However, the saw blades of the internal hole saws can no longer follow the unbroken trend towards single crystals with ever larger diameters - the technology has now mastered the pulling of crystals with diameters of 300 mm in the required quality. Larger saw blades can only be stabilized with a thickness reinforcement so that discs with the required geometric quality are obtained. With the inevitably wider cutting edges, higher cutting losses have to be accepted.
  • the lost material is a high-quality semiconductor material that is produced in a complex manner, the economy of the wafer production is severely impaired.
  • Another disadvantage of the sawing process arises from the effort for the design of the machine and the sawing tool, which increases with the workpiece diameter.
  • Wire and band saws with fixed abrasive grain form an alternative to hole saws, especially for workpieces with large diameters.
  • Wire saws with loose lapping grain can also be used for smaller workpieces, in which the wire is wound several times over deflection rollers, so that a large number of wafers can be produced at the same time.
  • Band saw blades for sawing hard-brittle material are usually provided with cutting plates along one edge or continuously with a cutting surface from which the fixed cutting grains of diamond or boron nitride protrude. The tapes are on their ends welded into ribbon loops. Such belt loops are guided in a circle over deflection rollers. The workpiece is fed against the cutting edge perpendicular to the direction of movement of the belt.
  • the circulating speeds of wire or belt loops with fixed cutting grains reach considerable values, depending on the material.
  • hard-brittle semiconductor material such as silicon
  • these are preferably between 20 m / s and 120 m / s.
  • the loops must be tensioned with a high tensile force so that the lateral deflection of the saw blade remains within a tolerance range of a few ⁇ m due to the influence of the sawing forces.
  • the loop material has to be extremely resistant to bending.
  • Particularly suitable materials for saw bands and wires are steels and special alloys due to their high tensile strength and elastic limits.
  • the object of the invention was therefore to provide a manufacturing method for heavy-duty, precise tape and wire loops of any required size, which have as constant a strength as possible over their entire circumference. Furthermore, it was the object of the invention to provide a device for producing such ribbon and wire loops.
  • a device for cold rolling seamless metal rings into seamless belt loops consisting of an arrangement of work, auxiliary and backup rolls built into a machine frame, characterized in that the rolling forces exert outwards through the returning part of the belt loop the machine frame are supported.
  • steel materials in the form of strips or plates can be formed into very thin, dimensionally accurate strips or foils.
  • the rolling work is usually divided into several rolling stands, which the material passes through one after the other.
  • cold rolling that is, in material processing by rolling without the addition of heat, a special hardening of the material occurs in addition to the deformation. This effect is used in technology, among other things, for the manufacture of heavy-duty spring steel strips.
  • Steel strips manufactured using this method have tensile strengths of up to 2200 N / mm2. Special alloys can reach even higher values.
  • the method according to the invention makes seamless belt loops with these favorable material properties accessible.
  • a rollable starting ring is first produced from a ring-shaped, seamless metal blank and then cold-rolled with the device according to the invention into a thin band loop.
  • the band loop is divided into narrower band or wire loops, if necessary. If necessary, these are then provided with a cutting surface.
  • FIG. 1 a) -d) is schematically the progress of the treatment of a blank for Rollable output ring shown.
  • FIG. 2 shows a schematic embodiment of a possible embodiment for a cold rolling mill in which the metal ring is expanded to form a seamless strip loop.
  • the blanks are made from basic bodies by machining or non-cutting measures. Rings which are separated from seamless metal tubes, separated from metal plates or produced from perforated cylindrical base bodies are particularly suitable. Of course you can also pour the blanks. Under certain circumstances, it is advisable to first widen the inner ring diameter by hot rolling or by forging.
  • the choice of material is independent of the weldability and basically expandable to all rollable materials. Steels that are also used to manufacture springs and other materials that achieve high strength after rolling have proven to be particularly advantageous.
  • the geometry of the belt loop to be produced is largely predetermined.
  • the ring circumference of the starting ring is increased and the jacket thickness is reduced accordingly.
  • the blank must be reworked into an exit ring with a jacket thickness of approx. 0.48 mm.
  • the inner diameter of the annular blank (1) is first expanded, for example by grinding, to a cylindrical seat (2) to a width greater than the desired band loop width.
  • this ring part is separated from the rest and, as shown in Fig. 1 c), mounted on a precisely fitting mandrel (3).
  • mandrel it is also possible to insert the mandrel first and then remove the remaining piece.
  • the rollable exit ring (4) with the calculated wall thickness results.
  • This stage is indicated in Fig. 1 d).
  • the diameter of the exit ring can be freely selected within wide limits.
  • the ring width essentially depends on the application for which the resulting band loop is intended and, in the case of use in band saws or wire saws, on how many partial loops the loop is to be divided. However, it must be ensured that very wide rings can still be rolled precisely.
  • Output rings with a width of 5 mm to 400 mm are processed with particular advantage. As shown above, the remaining dimensions for the exit ring are crucially based on the circumference and the strip thickness of the strip loop to be produced.
  • the rolling device according to the invention is particularly suitable for the production of belt loops.
  • Figure 2 shows the exit ring (4) and the widening band loop (5) in the rolling device.
  • the roller arrangement in the machine frame (6) is shown in the form customary in rolling technology.
  • the rolling process and the associated work hardening of the workpiece takes place between two opposing thin work rolls (7a, 7b), generally made of smooth, hardened steel. They form a gap through which the metal loop is pulled or pressed as a result of a rotational movement of the rollers.
  • Auxiliary rolls (8a, 8b) with a larger diameter rest on the work rolls (7a, 7b). They are partially driven and transfer the movement to the adjacent rollers.
  • the work roll (7b) located inside the belt loop is supported with the aid of auxiliary rolls (8b) through the belt loop onto support rolls (9) mounted in the frame (6).
  • the outer work roll (7a) is preferably surrounded by a total of five auxiliary rolls (8a). Two of them are touching the work roll, the other three form a further layer of surrounding rolls.
  • the delivery of the work rolls is preferably possible by changing the position of the outer support rolls (9). These rollers with an even larger diameter also limit the deflection of the thinner rollers when the rolling forces are transferred to the workpiece.
  • the support rollers belonging to the upper work roll are expediently used for the infeed.
  • the support rollers of the lower work roller are shown in the illustration especially for processing the belt loop Form of a Y rotated by 180 °.
  • the use of several layers of supporting rolls makes it possible to use work rolls with small diameters, for example 4 mm, so that even high-strength materials can be rolled.
  • roller arrangements are also possible.
  • tape guide rollers that adapt to the widening circumference of the workpiece are not shown in FIG. 2. Nevertheless, such rolls are expedient on a large scale, in particular in the production of belt loops. Likewise, conventional bearings and support devices for securing the positional stability of the roller arrangement and devices for lubricating the strip known from rolling technology are missing in the illustration.
  • the rolled tape loop is optionally subjected to some post-treatment measures known in the art. In particular, it can be hardened, tempered and straightened.
  • the rolled band loop is brought to the same width over its entire circumference and, if necessary, divided.
  • it is preferably mounted on a set of rollers, advantageously formed from 2 to 3 rollers, tensioned and ground on the edges.
  • the tape loop is then, for example by cut-offs, into smaller loops or into wires.
  • the belt loop expediently runs around the roller set while the rotating saw edge of the cutting tool is guided against it. Multi-blade saws with narrow saw blade spacing are particularly suitable for wire loop production. A large number of high-strength wire loops can be created from a seamless belt loop.
  • the separation steps required can be carried out in such a way that a harp is formed from wires at the intervals required for the cutting process.
  • the rollers of the roller set are provided with guide grooves for receiving the wires. When the band loop is cut up, the tensioned wires automatically slide into these guide grooves.
  • the band loop is optionally provided with a cutting surface along one edge, so that the cut is made in the plane of the band.
  • the cutting surface is possibly applied to the outer wire circumference.
  • the cutting line of the saw wire is therefore perpendicular to that of the saw band.
  • the cutting surface is preferably deposited electrochemically, the strip edge or wire side to be covered being immersed in the deposition bath. This is particularly advantageous when the tape or wire loops are already installed on the reel set. By covering the wire areas that are not to be covered when coating with the diamond coating, it may be ensured that the coating is only applied to the cut side of the wire.
  • the finished sawing tool can then be used immediately together with the roller set in the sawing machine without a large number of wire loops having to be placed individually on the rollers of the machine. Worn pads can be renewed and the cutting tools can be reused. If necessary, the production of the wire loops can also from the belt loop and the covering with the cutting surface with the roller set already in the sawing machine. It goes without saying that the band loops according to the invention can also be equipped to form saw bands with other abrasive edges, such as teeth, which are common in technology. They too are to be understood as cutting surfaces in the sense of the invention.
  • the band and wire loops without a cutting surface are also used as tools in fusion cutting and lapping processes.
  • the belt loops without cutting pads can also be used as heavy-duty belts for transport tasks.
  • the ribbon and wire loops produced by the process according to the invention are notable for their particular strength, so that even brittle hard material, such as silicon, can be cut precisely with a very small sawing gap and correspondingly low cutting loss.
  • the manufacturing process avoids complex measures and allows the sawing tools to be easily installed and removed from the sawing machine.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
EP92111614A 1991-07-12 1992-07-09 Procédé pour la fabrication de bandes sans fin en fil sans soudure Expired - Lifetime EP0522542B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4123095A DE4123095A1 (de) 1991-07-12 1991-07-12 Verfahren und vorrichtung zur herstellung von nahtlosen band- und drahtschlaufen, und deren verwendung als trennwerkzeuge in band- und drahtsaegen
DE4123095 1991-07-12

Publications (2)

Publication Number Publication Date
EP0522542A1 true EP0522542A1 (fr) 1993-01-13
EP0522542B1 EP0522542B1 (fr) 1995-09-27

Family

ID=6435988

Family Applications (1)

Application Number Title Priority Date Filing Date
EP92111614A Expired - Lifetime EP0522542B1 (fr) 1991-07-12 1992-07-09 Procédé pour la fabrication de bandes sans fin en fil sans soudure

Country Status (7)

Country Link
US (1) US5287774A (fr)
EP (1) EP0522542B1 (fr)
JP (1) JPH05192816A (fr)
KR (1) KR950015116B1 (fr)
DE (2) DE4123095A1 (fr)
FI (1) FI923185A (fr)
TW (1) TW235931B (fr)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5616065A (en) * 1995-03-23 1997-04-01 Wacker Siltronic Gesellschft fur Halbleitermaterialien Aktiengesellschaft Wire saw and method for cutting wafers from a workpiece
US5771876A (en) * 1995-05-26 1998-06-30 Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag Wire saw for and method of cutting off slices from a workpiece
US6773333B2 (en) 2001-05-10 2004-08-10 Siltronic Ag Method for cutting slices from a workpiece
WO2011023297A1 (fr) 2009-08-26 2011-03-03 Siltronic Ag Procédé de production d'une plaquette de semi-conducteur
DE102009051008A1 (de) 2009-10-28 2011-05-05 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
DE102010005904A1 (de) 2010-01-27 2011-07-28 Siltronic AG, 81737 Verfahren zur Herstellung einer Halbleiterscheibe
DE102010013520A1 (de) 2010-03-31 2011-10-06 Siltronic Ag Verfahren zur beidseitigen Politur einer Halbleiterscheibe
DE102010014874A1 (de) 2010-04-14 2011-10-20 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
DE102011005512A1 (de) 2011-03-14 2012-01-19 Siltronic Ag Verfahren zur beidseitigen Politur einer Halbleiterscheibe
DE102011008400A1 (de) 2011-01-12 2012-07-12 Siltronic Ag Verfahren zur Kühlung eines Werkstückes aus Halbleitermaterial beim Drahtsägen
CN101517710B (zh) * 2006-09-22 2012-10-03 信越半导体股份有限公司 切断方法以及外延晶片的制造方法
DE102011082366B3 (de) * 2011-09-08 2013-02-28 Siltronic Ag Einlagiges Wickeln von Sägedraht mit fest gebundenem Schneidkorn für Drahtsägen zum Abtrennen von Scheiben von einem Werkstück
DE102012221904A1 (de) 2012-11-29 2014-06-05 Siltronic Ag Verfahren zur Wiederaufnahme des Drahtsägeprozesses eines Werkstückes nach einer unplanmäßigen Unterbrechung
DE102013219900B3 (de) * 2013-10-01 2015-02-26 Siltronic Ag Verfahren zum Rillieren der Drahtführungsrollen für Drahtsägen zum Abtrennen von Scheiben von einem Werkstück
DE102013223344B3 (de) * 2013-11-15 2015-05-07 Siltronic Ag Verfahren zum Zersägen eines temperierten Werkstückes mit einer Drahtsäge
DE102013225104A1 (de) 2013-12-06 2015-07-02 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück mittels einer Drahtsäge
DE102015204275B3 (de) * 2015-03-10 2016-05-12 Siltronic Ag Verfahren zur Wiederaufnahme eines Drahttrennläppvorgangs mit strukturiertem Sägedraht nach Unterbrechung
DE102016222899A1 (de) 2016-11-21 2018-05-24 Siltronic Ag Vorrichtung und Verfahren zum Zersägen eines Werkstückes mit einer Drahtsäge
DE102016224640A1 (de) 2016-12-09 2018-06-14 Siltronic Ag Verfahren zum Zersägen eines Werkstückes mit einer Drahtsäge

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2928632B1 (fr) 2012-12-04 2021-06-30 Precision Surfacing Solutions GmbH Système de gestion de fil
JP6578412B1 (ja) * 2018-06-08 2019-09-18 株式会社アマダホールディングス 環状帯鋸刃の製造方法及び製造装置
CN110695270B (zh) * 2019-09-20 2020-09-29 太原科技大学 一种立式小辊径工作辊辗环装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE201166C (fr) *
DE372377C (de) * 1920-10-01 1923-03-27 Siegfried Gumpel Verfahren zur Herstellung endloser Saegebaender ohne Naht
US2029751A (en) * 1933-06-07 1936-02-04 Jr James L Adams Metal rolling mill
GB2055643A (en) * 1979-08-13 1981-03-11 Gersan Ets A method of and apparatus for manufacturing a saw blade of a band saw
WO1985000765A1 (fr) * 1983-08-08 1985-02-28 Wilkes Donald F Bandes minces, ainsi qu'un procede et un appareil pour produire celles-ci
WO1987002286A1 (fr) * 1984-04-18 1987-04-23 Bror Elofson Lame de scie sans fin et sans raccord et son procede de production

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL169428C (nl) * 1977-06-28 1983-11-16 Volvo Car Bv Trekwalsinrichting voor het uitwalsen van eindloze metalen banden.
JPS60158902A (ja) * 1984-01-30 1985-08-20 Amada Co Ltd バンドソ−マシンにおける極薄肉のエンドレスバンドの製造方法
JPS61132206A (ja) * 1984-11-30 1986-06-19 Aisin Warner Ltd 金属製無端バンドの圧延装置
JPS61284317A (ja) * 1985-06-07 1986-12-15 Sanwa Daiyamondo Kogyo Kk 硬質物切断用無端帯鋸
SE453222B (sv) * 1985-08-15 1988-01-18 Tri Innovations Ab Vermebehandlingsugn
JPS6348603A (ja) * 1986-08-15 1988-03-01 Hitachi Ltd 光磁気デイスク装置用電磁コイル
JPH0311841A (ja) * 1989-06-09 1991-01-21 Nec Corp ローカルエリアネットワーク
JP4089620B2 (ja) * 2004-01-15 2008-05-28 株式会社デンソー 車両制御システム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE201166C (fr) *
DE372377C (de) * 1920-10-01 1923-03-27 Siegfried Gumpel Verfahren zur Herstellung endloser Saegebaender ohne Naht
US2029751A (en) * 1933-06-07 1936-02-04 Jr James L Adams Metal rolling mill
GB2055643A (en) * 1979-08-13 1981-03-11 Gersan Ets A method of and apparatus for manufacturing a saw blade of a band saw
WO1985000765A1 (fr) * 1983-08-08 1985-02-28 Wilkes Donald F Bandes minces, ainsi qu'un procede et un appareil pour produire celles-ci
WO1987002286A1 (fr) * 1984-04-18 1987-04-23 Bror Elofson Lame de scie sans fin et sans raccord et son procede de production

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5616065A (en) * 1995-03-23 1997-04-01 Wacker Siltronic Gesellschft fur Halbleitermaterialien Aktiengesellschaft Wire saw and method for cutting wafers from a workpiece
US5771876A (en) * 1995-05-26 1998-06-30 Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag Wire saw for and method of cutting off slices from a workpiece
US6773333B2 (en) 2001-05-10 2004-08-10 Siltronic Ag Method for cutting slices from a workpiece
DE10122628B4 (de) * 2001-05-10 2007-10-11 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück
CN101517710B (zh) * 2006-09-22 2012-10-03 信越半导体股份有限公司 切断方法以及外延晶片的制造方法
WO2011023297A1 (fr) 2009-08-26 2011-03-03 Siltronic Ag Procédé de production d'une plaquette de semi-conducteur
DE102009038941A1 (de) 2009-08-26 2011-03-10 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
US8343873B2 (en) 2009-08-26 2013-01-01 Siltronic Ag Method for producing a semiconductor wafer
DE102009051008A1 (de) 2009-10-28 2011-05-05 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
US8685270B2 (en) 2009-10-28 2014-04-01 Siltronic Ag Method for producing a semiconductor wafer
DE102010005904A1 (de) 2010-01-27 2011-07-28 Siltronic AG, 81737 Verfahren zur Herstellung einer Halbleiterscheibe
US8529315B2 (en) 2010-01-27 2013-09-10 Siltronic Ag Method for producing a semiconductor wafer
DE102010013520A1 (de) 2010-03-31 2011-10-06 Siltronic Ag Verfahren zur beidseitigen Politur einer Halbleiterscheibe
US8721390B2 (en) 2010-03-31 2014-05-13 Siltronic Ag Method for the double-side polishing of a semiconductor wafer
WO2011128217A1 (fr) 2010-04-14 2011-10-20 Siltronic Ag Procédé de fabrication d'une plaquette à semi-conducteurs
DE102010014874A1 (de) 2010-04-14 2011-10-20 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
US8968054B2 (en) 2011-01-12 2015-03-03 Siltronic Ag Method for cooling a workpiece made of semiconductor material during wire sawing
DE102011008400A1 (de) 2011-01-12 2012-07-12 Siltronic Ag Verfahren zur Kühlung eines Werkstückes aus Halbleitermaterial beim Drahtsägen
DE102011005512A1 (de) 2011-03-14 2012-01-19 Siltronic Ag Verfahren zur beidseitigen Politur einer Halbleiterscheibe
DE102011082366B3 (de) * 2011-09-08 2013-02-28 Siltronic Ag Einlagiges Wickeln von Sägedraht mit fest gebundenem Schneidkorn für Drahtsägen zum Abtrennen von Scheiben von einem Werkstück
US9427888B2 (en) 2012-11-29 2016-08-30 Siltronic Ag Method for resuming a wire sawing process of a workpiece after an unplanned interruption
DE102012221904A1 (de) 2012-11-29 2014-06-05 Siltronic Ag Verfahren zur Wiederaufnahme des Drahtsägeprozesses eines Werkstückes nach einer unplanmäßigen Unterbrechung
DE102012221904B4 (de) 2012-11-29 2018-05-30 Siltronic Ag Verfahren zur Wiederaufnahme des Drahtsägeprozesses eines Werkstückes nach einer unplanmäßigen Unterbrechung
DE102013219900B3 (de) * 2013-10-01 2015-02-26 Siltronic Ag Verfahren zum Rillieren der Drahtführungsrollen für Drahtsägen zum Abtrennen von Scheiben von einem Werkstück
DE102013223344B3 (de) * 2013-11-15 2015-05-07 Siltronic Ag Verfahren zum Zersägen eines temperierten Werkstückes mit einer Drahtsäge
DE102013225104A1 (de) 2013-12-06 2015-07-02 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück mittels einer Drahtsäge
US9662804B2 (en) 2013-12-06 2017-05-30 Siltronic Ag Method for slicing wafers from a workpiece by means of a wire saw
DE102013225104B4 (de) * 2013-12-06 2019-11-28 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück mittels einer Drahtsäge
DE102015204275B3 (de) * 2015-03-10 2016-05-12 Siltronic Ag Verfahren zur Wiederaufnahme eines Drahttrennläppvorgangs mit strukturiertem Sägedraht nach Unterbrechung
DE102016222899A1 (de) 2016-11-21 2018-05-24 Siltronic Ag Vorrichtung und Verfahren zum Zersägen eines Werkstückes mit einer Drahtsäge
DE102016224640A1 (de) 2016-12-09 2018-06-14 Siltronic Ag Verfahren zum Zersägen eines Werkstückes mit einer Drahtsäge
DE102016224640B4 (de) 2016-12-09 2024-03-28 Siltronic Ag Verfahren zum Zersägen eines Werkstückes mit einer Drahtsäge

Also Published As

Publication number Publication date
US5287774A (en) 1994-02-22
DE59203806D1 (de) 1995-11-02
DE4123095A1 (de) 1993-01-14
TW235931B (fr) 1994-12-11
KR950015116B1 (ko) 1995-12-22
EP0522542B1 (fr) 1995-09-27
FI923185A0 (fi) 1992-07-10
FI923185A (fi) 1993-01-13
JPH05192816A (ja) 1993-08-03

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