EP0473786B1 - Substrat pour tete a jet d'encre - Google Patents

Substrat pour tete a jet d'encre Download PDF

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Publication number
EP0473786B1
EP0473786B1 EP91904324A EP91904324A EP0473786B1 EP 0473786 B1 EP0473786 B1 EP 0473786B1 EP 91904324 A EP91904324 A EP 91904324A EP 91904324 A EP91904324 A EP 91904324A EP 0473786 B1 EP0473786 B1 EP 0473786B1
Authority
EP
European Patent Office
Prior art keywords
layer
electrode
ink jet
wiring
jet head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP91904324A
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German (de)
English (en)
Other versions
EP0473786A4 (en
EP0473786A1 (fr
Inventor
Yasutomo Canon Kabushiki Kaisha Watanabe
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Canon Inc
Original Assignee
Canon Inc
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Publication date
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Publication of EP0473786A1 publication Critical patent/EP0473786A1/fr
Publication of EP0473786A4 publication Critical patent/EP0473786A4/en
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Publication of EP0473786B1 publication Critical patent/EP0473786B1/fr
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/14129—Layer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1604—Production of bubble jet print heads of the edge shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14379—Edge shooter
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/03—Specific materials used

Definitions

  • the present invention relates to a substrate for ink jet head for use in an ink jet head for discharging an ink and recording images of characters or the like with the ink discharged.
  • the present invention relates also to an ink jet head in which said substrate for ink jet head is used.
  • the present invention further relates to an ink jet apparatus provided with said ink jet head.
  • the present invention includes a process for producing said substrate for ink jet head.
  • FIG. 3(a) is a schematic plan view
  • FIG. 3(b) is a schematic cross-sectional view taken along line D - D' in FIG. 3(a).
  • FIG. 1(a) is a schematic plan view and FIG. 1(b) is a schematic cross-sectional view of FIG. 1(a).
  • FIG. 2(a) is a schematic plan view and FIG. 2(b) is a schematic cross-sectional view taken along line D-D' in FIG. 2(a).
  • a material layer (two-layered layer) for forming a first electrode contact layer 2 comprising a heat-generating resistor layer composed of, for example, HfB2 and a layer composed of, for example, Ti being stacked in this order from the side of an insulating base member 1 and a material layer for forming a wiring electrode 3 composed of, for example, a good conductive material such as Al are formed on the insulating base member 1 by a thin film-forming technique such as an evaporation method, a sputtering method and a CVD method.
  • a thin film-forming technique such as an evaporation method, a sputtering method and a CVD method.
  • the previously formed material layer for the electrode contact layer 2 and the previously formed material layer for the wiring electrode layer 3 are subjected to patterning by photolithography.
  • the patterned material layer for the wiring electrode layer 3 is subjected to further patterning to expose part of the electrode contact layer 2, whereby forming a heat generating portion 10.
  • the heat generating portion 10 thus formed to be used such that it is in contact with ink as it is, depending upon the kind of a material to constitute it.
  • a protective layer is formed thereon.
  • the head substrate is produced through these production steps.
  • an ink jet apparatus provided with an ink jet head having a plurality of discharge outlets capable of discharging ink in which the above head substrate being used has been commercialized.
  • EP-A-0318982 discloses a liquid jet head comprising an electrothermal transducer having a heat-generating resistor formed using an amorphous alloy containing at least one selected from the group consisting of Ti, Zn, Hf, Nb, Ta and W as well as Fe, Ni and Cr, and a pair of electrodes connected electrically to said heat-generating resistor, a support for supporting said electrothermal transducer and a liquid path formed on said support corresponding to the heat generating portion of said electrothermal transducer formed between said pair of electrodes and communicated to a discharge opening for discharging ink.
  • An object of the present invention is to overcome the foregoing technical problem by providing a wiring electrode portion for an ink jet head of the type in which ink is discharged utilizing thermal energy and to provide an ink jet head with a markedly improved head reliability.
  • the present invention may be arranged to provide an ink jet head wherein the foregoing technical problem relating to reduction in the yield due to the discontinuation caused because of the defects occurred at the electrothermal converting body is solved without a negative influence of thermal energy to the strength of the head by providing an electrothermal converting body having a heat generating resistor layer serving to generate thermal energy to be utilized for discharging ink and an electrode being connected to the heat generating resistor layer.
  • An ink jet head may be provided with numerous electrothermal converting bodies, serving to generate thermal energy to be utilized for discharging ink, being arranged at a high density on a base member wherein the foregoing technical subject, which is liable to reveal in such ink jet head, can be solved by a relatively simple structural contrivance.
  • a full-line type ink jet head may be provided with numerous ink discharging outlets being arranged at a high density in which numerous electrothermal converting bodies are arranged at a high density on a substrate such that they correspond to said numerous ink discharging outlets wherein the foregoing technical subject, which is liable to reveal in such ink jet head, can be solved by a relatively simple structural contrivance.
  • the present invention concerns a substrate for use in the above ink jet head, an ink jet apparatus provided with the above head, and a process for producing a substrate for ink jet head.
  • the present inventor has obtained a knowledge based on the constitution which will be described in the following. That is, in a process of producing the known head substrate, a pair of first wiring electrode layers are disposed on a base member through a first electrode contact layer. In this case, the present inventor has established a stacked structure comprising maltilayers being stacked by disposing further a pair of second wiring electrode layers through a second electrode contact layer thereon, and have made studies about the resultant.
  • the present inventor then has applied the above finding in the production of a head substrate. And as for the resultant head substrate, the situation of occurrence of a discontinuation has been examined. As a results it has been found that the proportion of a discontinuation to be occurred is markedly decreased. Then, an ink jet head has been prepared using the resultant head substrate, and the resultant ink jet head has been set to an apparatus main body to perform image recording by discharging ink. As a result, it has been found that the instant ink jet head is one capable of attaining the above objects of the present invention.
  • the present invention includes an ink jet head in which the above mentioned substrate for ink jet head, an ink jet apparatus provided with said head and a process for producing a substrate for ink jet head.
  • FIGS. 4 through 8 are schematic views illustrating an example of the substrate for ink jet head according to the present invention in accordance with the successive production steps.
  • FIG. 5(a) is a plan view
  • FIG. 5(b) is a cross section view taken along line B - B' in FIG. 5(a)
  • FIG. 5(c) is a cross section view taken along line A - A' in FIG. 5(a).
  • the indication A - A' and the indication B - B' are omitted, but any of them is a drawing of the same portion as in FIG. 5 which is observed from the same direction as in the case of FIG. 5.
  • a material layer as a first electrode contact layer 42 comprising a heat generating resistor layer composed of HfB2, TaAl, TaSi, CrSiO, TiO2, etc. and a layer composed of Ti, Cr, Ni, Mo, W, etc. being stacked in this order on an insulating base member 41 comprising aluminium having a glaze layer on a surface thereof, silicon having a thermally oxidized SiO2 layer on a surface thereof, glass or the like, and a material layer as a first wiring electrode layer 43 composed of Al, Cu, Au, or the like.
  • the same numeral references as those employed in the case after patterning are employed also for the layer as the material layer which is disposed in a solid-like state on the whole surface.
  • a photoresist is applied (not shown in the figure), followed by exposure, development, baking, and the like. Successively, etching and removal of the resist are performed to pattern the material layer for first electrode contact layer 42 and the material layer for first wiring electrode layer 43, thereby forming a pattern of the first electrode contact layer 42 and a pattern of the wiring electrode layer 43.
  • etching and removal of the resist are performed to pattern the material layer for first electrode contact layer 42 and the material layer for first wiring electrode layer 43, thereby forming a pattern of the first electrode contact layer 42 and a pattern of the wiring electrode layer 43.
  • the second electrode contact layer 44 has an etching selectivity against the second wiring electrode layer 45.
  • the second electrode contact layer 44 is formed of a material which is not etched by an etching solution with which the second wiring electrode layer 45 is etched.
  • an exposed portion at the defective portion A'' is covered by the material layer of the second electrode contact layer 44 and the material layer for second wiring electrode layer 45.
  • FIG. 7(a) through FIG. 7(c) there is formed a second wiring electrode layer 45 by a photolithography method in the same manner as described in the above.
  • This second wiring electrode layer 45 is formed through patterning with the use of a photoresist, etching of the material layer of the second wiring electrode layer 45, etching of the material layer of the second electrode contact layer 44, and removal of the photoresist.
  • part of each of the second electrode contact layer 44 and the second wiring electrode 45 is removed by means of etching to form a portion 51 for forming the heat generating portion in advance.
  • the first wiring electrode layer 43 situated in the portion 51 for forming the heat generating portion is etched by a photolithography method in the same manner as described in the above to thereby expose the first electrode contact layer 42 thereunder, whereby a heat generating portion 50 is formed.
  • a defect should occur at the second wiring electrode layer 45 due to a defect or the like of the photoresist, such defect does not extend to the lower layers (the first wiring electrode layer 43 and the first electrode contact layer 42).
  • a SiO2 layer as the protective layer is formed by a sputtering method.
  • combination of the materials to constitute the multilayered structure comprising the first wiring electrode layer/the second electrode contact layer/the second wiring electrode layer can include combination of Al layer/Ti layer/Al layer, combination of Al layer/Cr layer/Al layer, combination of Cu layer/Ti layer/Cu layer, combination of Au layer/Ni layer/Au layer, combination of Al layer/TaSi layer/Cu layer.
  • the combination of Al layer/Ti layer/Al layer is the most desirable.
  • FIG. 9 through FIG. 13 are schematic views illustrating other examples of the substrate for ink jet head according to the present invention in accordance with production steps.
  • FIG. 10(a) is a plan view
  • FIG. 10(b) is a cross section view taken along line B - B' in FIG. 10(a)
  • FIG. 10(c) is a cross section view taken along line A - A' in FIG. 10(a).
  • an insulating base member 21 composed of, for example, the same kind of material as that in the foregoing embodiment, there are formed a material layer for first electrode contact layer 22, composed of Ti, Cr, Ni, Mo, W, etc., and a material layer for first wiring electrode layer 23, composed of Al, Cu, Au, etc.
  • a material layer for first electrode contact layer 22 composed of Ti, Cr, Ni, Mo, W, etc.
  • a material layer for first wiring electrode layer 23 composed of Al, Cu, Au, etc.
  • the same numeral references as those employed in the case after patterning are employed also for the layer as the material layer which is disposed in a solid-like state on the whole area.
  • a photoresist is applied (not shown in the figure), followed by exposure, development, baking, and the like.
  • etching and removal of the photoresist are performed to pattern the material layer for first electrode contact layer 22 and the material layer for first wiring electrode layer 23.
  • a discontinued portion for forming a heat generating portion 31 is formed at part of each of the first electrode contact layer 22 and the first wiring electrode layer 23.
  • A'' there is found such a discontinuation as indicated by A'', caused by a defect or the like of the photoresist, which is present between the first electrode contact layer 22 and the first wiring electrode layer 23.
  • a material layer for second electrode contact layer 24 comprising a heat generating resistor layer composed of HfB2, TaAl, TaSi, CrSiO, TiO2, etc. and a layer composed of Ti, Cr, Ni, Mo, W, etc. being stacked in this order, and a material layer for second wiring electrode layer 25, composed of Al, Cu, Au, etc.
  • the second electrode contact layer 24 has an etching selectivity against the second wiring electrode layer 25.
  • the second electrode contact layer 24 is formed of a material which is not etched by an etching solution with which the second wiring electrode layer 25 is etched.
  • an exposed portion at the defective portion A'' is covered by the material layer for second electrode contact layer 24 and the material layer for second wiring electrode layer 25.
  • FIG. 12(a) through FIG. 12(c) there is formed a second wiring electrode layer 25 by a photolithography method in the same manner as described in the above.
  • This second wiring electrode layer 25 is formed through patterning with the use of a photoresist, etching of the material layer for second wiring electrode layer 25, etching of the material layer for second electrode contact layer 24, and removal of the photoresist.
  • part of the second wiring electrode layer 25 (portion 31 for forming a heat generating portion) is etched by a photolithography method in the same manner as described in the above to thereby expose part of the second electrode contact layer 24, whereby a heat generating portion 30 is formed.
  • the second electrode contact layer 24 is not etched by the etching solution for the second wiring electrode layer 25, the heat generating portion 30 is exposed without causing a defect at the second electrode contact layer 24.
  • a defect should be occurred at the second wiring electrode layer 25 due to a defect or the like of the photoresist, such defect is not extended to the lower layers (the first wiring electrode layer 23 and the first electrode contact layer 22).
  • a SiO2 layer as the protective layer is formed by a sputtering method.
  • the combination of the materials to constitute the multilayered structure comprising the first wiring electrode layer/the second electrode contact layer/the second wiring electrode layer can include combination of Al layer/Ti layer + insulating material layer/Al layer, combination of Al layer/Cr layer + insulating material layer/Al layer, combination of Cu layer/Ti layer + insulating material layer/Cu layer, combination of Au layer/Ni layer + insulating material layer/Au layer, combination of Al layer/TaSi layer/Cu layer, ect.
  • the combination of Al layer/Ti layer + insulating layer/Al layer is the most desirable.
  • the step of performing etching by way of sputtering is carried out prior to forming the material layer for the heat generating insulator layer, the surface on which a film is to be formed is smoothed and cleaned, and because of this, an improvement is provided in the adhesive property of the heat generating insulator layer.
  • a material having an etching selectivity against the second wiring electrode layer specifically, such a material that is not etched by an etching material with which the second wiring electrode layer 45 is etched.
  • each of the first wiring electrode layer 42 and the second wiring electrode layer 45 are composed, and Ti as the constituent material of the second electrode contact layer 44, using a mixed solution of acetic acid, phosphoric acid and nitric acid as the etching solution for the constituent material Al of the second wiring electrode layer 45, and performing reactive plasma etching against the constituent material Ti of the second electrode contact layer 44 with the use of CF4, the constituent material Al of the wiring electrode layer 45 is etched by the above etching mixed solution, whereas the constituent material Ti of the second electrode contact layer 45 is not etched by said etching mixed solution.
  • the second electrode contact layer 44 is etched, whereas the constituent material Al of the first wiring electrode layer 43 is not etched.
  • the first wiring electrode 43 is not etched, for example, even at the defective potion B''. Thus, discontinuation is never occurred at the wiring electrode.
  • the wiring electrode becomes discontinued as a result that etching is caused, for example, in such a state as indicated by the A'' portion shown in FIG. 5 upon forming the first wiring electrode layer.
  • the second wiring electrode layer 45 is formed thereon to cover such defective portion in a state that discontinuation is not occurred at the portion A''.
  • the probability that the defective portion A'' and the defective portion B'' will be occurred at the same position is extremely small at such an extent that can be said to be substantially zero in comparison with that in the case where each of the defective portion A'' and the defective portion B'' will be independently occurred, and because of this, there is not such occasion that a defect occurred at the respective layers maintains its influence till completion of the production.
  • the wiring electrode is made to be substantially free of discontinuation, and in addition to this, the yield in the production steps is markedly improved and the production cost is markedly reduced.
  • FIG. 14 is a schematic slant view illustrating an embodient of an ink jet head, prepared using the substrate for ink jet head obtained in the above.
  • heat generating portions 1103 of electrothermal converting body containing electrode 1104 (protective layer is not shown in the figure), on which ink pathway walls 1105 and a top plate 1106 are disposed.
  • Ink 1112 is supplied from an ink reservoir (not shown in the figure) through an ink supply pipe 1107 into a common ink chamber 1108 of ink jet head 1101.
  • numeral reference 1109 stands for a connector for supplying ink.
  • the ink supplied into the common ink chamber 1108 is supplied into ink pathways 1110 due to a so-called capillary action and it is stably maintained by forming meniscus in discharging outlets 1111 in communication with the ink pathways.
  • the ink present on the heat generating portion 1103 of electrothermal converting body is instantly heated upon heat generation at the heat generating portion 1103 to cause formation of a gas bubble to the ink in the ink pathways, whereby jetting out ink through the discharging outlets 1111.
  • an ink jet head provided with numerous discharging outlets of 128 to 256 in number being arrange with a density of 16 discharging outlets per millimeter.
  • FIG. 15 is a schematic slant view illustrating the principal portion of an embodiment of an ink jet apparatus in which the ink jet head shown in FIG. 14 is installed.
  • This ink jet apparatus is of a so-called real scanning type.
  • ink jet head 208 is detachably mounted onto a carriage 206 which is guided by means of guide shafts 205.
  • the ink jet head is scanned in a direction of substantially perpendicularly intersecting the direction of transporting a record sheet 202.
  • Numeral reference 201 stands for a transportation roller which serves to transport the record sheet 202 to a desired position along a platen 203.
  • Numeral reference 204 stands for a recovering means which serves to maintain the state of the discharging outlet as desired at a home position Hp.
  • This recovering means includes a flexible cap capable of covering the discharging outlet, a vacuum pump capable of aspirating ink from the discharging outlet, and the like.
  • FIG. 16 is a schematic slant view illustrating an embodiment of a full-line type ink jet recording head provided with more than 1000 discharging outlets along the entire width of the recording area of a sheet on which an image is to be recorded.
  • a substrate 111 for ink jet head provided with a plurality of semiconductor devices 112, specifically, a plurality of driving ICs for example, is arranged together with a flexible cable 104 on a supporting member 102, and they are fastened through a pressure rubber member 107 comprising a thin plate-like flexible body by means of a flexible cable pressure member 105 having a rigidity and four setscrews 106 such that the wiring portion of the substrate 111 and the flexible cable 104 are mechanically fixed while being electrically connected with each other.
  • Numeral reference 103 stands for an ink supply pipe, comprising a flexible tube, for supplying ink into the common ink chamber of the head through its both sides.
  • the common ink chamber indicated by numeral reference 1108 and the ink pathways indicated by numeral reference 1110 respectively found in FIG. 14 are formed respectively as a concave portion at an ink pathway forming member 104.
  • the discharging outlets indicated by numeral reference 1111 which are found in FIG. 14 are arranged in series at the portion indicated by numeral reference 101 in the figure.
  • the ink jet head is realized by fixing these on the substrate 111.
  • FIG. 17 is a schematic slant view illustrating an outline of an ink jet recording apparatus in which the full-line type ink jet recording head is installed.
  • numeral reference 365 stands for a transportation belt for transporting a member on which record is to be made such as paper.
  • This transportation belt 365 serves to transport a member on which record is to be made (not shown in the figure) upon revolution of transportation rollers 364.
  • the lower face of an ink jet recording head 332 is so designed as to form a discharging outlet face at which a plurality of discharging outlets being arranged so as to correspond to the recording area of a member on which record is to be made.
  • a Si single crystal support member 41 having a SiO2 film (film thickness : 2.75 um) on the surface thereof which was formed by thermal oxidation there was formed a HfB2 layer (layer thickness : 1000 ⁇ ) to be the heat generating resistor layer by sputtering HfB2 (of more than 99.9% in purity) as the target in a vacuum chamber.
  • the sputtering conditions in this case were made as follows :
  • the area of the target 8 inch in diameter high frequency power : 1500 W set temperature of the base member : 100 °C film formation period of time : 20 minutes base pressure : less than 1 x 10 ⁇ 5 Pa sputtering gas : argon gas sputtering gas pressure : 0.5 Pa Then, the above sputtering procedures were repeated, except that the target was replaced by a target comprising Ti (of more than 99.9% in purity) and the film formation period of time was changed to one minute, to perform sputtering process, whereby a Ti layer (layer thickness : 50 ⁇ ) was formed.
  • the stacked constitution comprising these HfB2 layer and Ti layer being stacked becomes to be the first electrode contact layer 42.
  • etching solution comprising a mixed solution comprising acetic acid, phosphoric acid and nitric acid (9% by weight of acetic acid, 73% by weight of phosphoric acid, 2% by weight of nitric acid, and 16% by weight of the residual) to etch the Al layer.
  • patterning was completed (pattern width : 12 ⁇ m, the number of patterns : 4736).
  • high frequency power 450 W etching period of time : 5 minutes base pressure : less than 1 x 10 ⁇ 3 Pa etching gas : BCl3 etching gas pressure : 3 Pa (as these steps, see, FIG. 5(a) through FIG. 5(b)).
  • sputtering was performed using Ti (of more than 99.9% in purity) as a target in a vacuum chamber under the foregoing sputtering conditions except for changing the film formation period of time to four minutes, to thereby form a Ti layer (layer thickness : 200 ⁇ ) to be the second electrode contact layer 44.
  • the same kind of photoresist as in the above was applied onto the Al layer to form a layer (layer thickness : 1.3 ⁇ m), which was followed by subjecting to conventional exposure, development and baking.
  • the resultant was subjected to etching with the use of the same etching solution as in the above to etch the Al layer.
  • the resultant was subjected to reactive etching in a vacuum chamber to etch the Ti layer under the foregoing reactive etching conditions except for changing the etching period of time to four minutes and the etching gas to CF4, and the photoresist was removed.
  • patterning was completed (pattern width : 8 ⁇ m the number of patterns : 4736). (as for these steps, see, FIG. 7(a) through FIG. 7(b))
  • patterning by photolithography was performed in the following manner. That is, the same kind of photoresist as in the above was applied onto the Al layer to form a layer (layer thickness : 1.3 ⁇ m), which was followed by subjecting to conventional exposure, development and baking, successively followed by etching with the use of the foregoing etching solution to thereby etch the Al layer. The photoresist was removed.
  • 4736 heat generating portions each being 20 ⁇ m x 100 um insize (as for these steps, see, FIG. 8(a) through FIG. 8(c)).
  • This ink jet head had 4736 discharging outlets corresponding to the foregoing heat generating portions.
  • a Ti layer (layer thickness : 50 ⁇ ) to be the first electrode contact layer 22 by sputtering Ti (of more than 99.9% purity) as the target in a vacuum chamber.
  • the sputtering conditions in this case were made as follows :
  • the area of the target 8 inch in diameter high frequency power : 1500 W set temperature of the base substrate member : 100 °C film formation period of time : one minute base pressure : less than 1 x 10 ⁇ 5 Pa sputtering gas : argon gas sputtering gas pressure : 0.5 Pa.
  • sputtering was performed using a target comprising Al (of more than 99.9% purity) in stead of the above target under the above sputtering conditions except for changing the high frequency power to 5000 W and the film formation period of time to six minutes, to thereby form an Al layer (film thickness : 4500 ⁇ ) to be the first wiring electrode layer 23 (as for these steps, see, FIG. 9(a) through FIG. 9(b)).
  • patterning by photolithography was performed in the following manner. Firstly, photoresist of the same kind as in Example 1 was applied onto the Al layer to form a layer (layer thickness : 1.3 ⁇ m), which was followed by subjecting to conventional exposure, development and baking. The resultant was subjected to etching with the use of an etching solution of the same kind as in Example 1 to etch the Al layer. After removing the photoresist therefrom, the resultant was subjected to sputter-etching in a vacuum chamber to pattern the Ti layer (pattern width : 8 ⁇ m, the number of patterns : 4736).
  • HfB2 of more than 99.9% purity
  • sputtering was performed using HfB2 (of more than 99.9% purity) as a target in a vacuum chamber under the foregoing sputtering conditions except for changing the film formation period of time to twenty minutes, to thereby form a HfB2 layer (layer thickness : 200 ⁇ ) to be the heat generating resistor layer.
  • the stacked constitution of these HfB2 layer and Ti layer was made to be the second electrode contact layer 24.
  • sputtering was performed using a target comprising Al (of more than 99.9% purity) in stead of the above target under the foregoing sputtering conditions except for changing the high frequency power to 5000 W and the film formation period of time to two minutes, to thereby form an Al layer (film thickness : 1500 ⁇ ) to be the second wiring electrode layer 25 (as for these steps, see, FIG. 11(a) through FIG. 11(c)).
  • the Al layer to be the first wiring electrode layer 23 patterning by photolithography was performed in the following manner. That is, photoresist of the same kind as in the foregoing case was applied onto the Al layer to form a layer (layer thickness : 1.3 ⁇ m), which was followed by subjecting to conventional exposure, development and baking, successively followed by etching with the use of the foregoing etching solution to thereby etch the Al layer. The photoresist was removed. Thus, there were formed 4736 heat generating portions each being 20 ⁇ m x 100 ⁇ m insize (as for these steps, see, FIG. 13(a) through FIG. 13(c)).
  • This ink jet head had 4736 discharging ports corresponding to the foregoing heat generating portions.
  • Example 1 The procedures of Example 1 were repeated, except that neither the second electrode contact layer 44 nor the second wiring electrode layer 45 were formed and the layer thickness of the first wiring electrode layer 43 was made to be 6000 ⁇ , to thereby obtain a substrate for ink jet head and an ink jet head provided with said substrate.
  • Example 2 The procedures of Example 2 were repeated, except that neither the second electrode contact layer 24 nor the second wiring electrode layer 25 were formed and the layer thickness of the first wiring electrode layer 23 was made to be 6000 ⁇ , to thereby obtain a substrate for ink jet head and an ink jet head provided with said substrate.
  • Example 1 or 2 As for the 100 ink jet heads obtained in each of Examples 1 to 2 and Comparative Examples 1 to 2, observation was made about the situation of occurrence of discontinuation at the wiring electrode. As a result, it was found that the incidence of discontinuation in Example 1 or 2 is about half that in Comparative Example 1 or 2.
  • the present invention provides marked effects in a recording head and a recording apparatus of the system in which ink is discharged utilizing thermal energy.
  • the liquid (ink) is discharged through a discharging outlet to form at least one droplet.
  • the driving signal of pulse shape such driving signal as disclosed in U.S. Patent No. 4,463,359 or U.S. Patent No. 4,345,262 is suitable. Additionally, in the case where those conditions disclosed in U.S. Patent No. 4,313,124, which relates to the invention concerning the rate of temperature rise at the heat acting face, are adopted, further improved recording can be performed.
  • the present invention includes, other than those constitutions of the discharging outlets, liquid pathways and electrothermal converting bodies in combination (linear liquid flow pathway or perpendicular liquid flow pathway) which are disclosed in each of the above patent specifications, the constitutions using such constitution in which a heat acting portion is disposed in a curved region which is disclosed in U.S. Patent No. 4,558,333 or U.S. Patent No. 4,459,600.
  • the present invention may effectively take a constitution based on the constitution in which a slit common to a plurality of electrothermal converting bodies is used as a discharging portion of the electrothermal converting bodies which is disclosed in Japanese Unexamined Patent Publication No. 123670/1984 or other constitution based on the constitution in which an opening for absorbing a pressure wave of thermal energy is made to be corresponding to a discharging portion which is disclosed in Japanese Unexamined Patent Publication No. 138461/1984.
  • the full-line type recording head having a length corresponding to the width of a maximum record medium which can be recorded by a recording apparatus
  • the present invention is effective also in the case where a recording head of the exchangeable chip type wherein electric connection to an apparatus body or supply of ink from the apparatus body is enabled when it is mounted on the apparatus body or other recording head of the cartridge type wherein an ink tank is integrally provided on the recording head itself is employed.
  • capping means, cleaning means, pressurizing or attracting means, preliminary heating means including an electrothermal converting body or a separate heating element or a combination of these for the recording head, and to employ a preparatory discharging mode in which discharging is performed separately from recording, are also effective in order to achieve stable recording.
  • the present invention is extremely effective not only in a recording apparatus which has, as the recording mode, a recording mode of a main color such as black but also in an apparatus which includes a plurality of different colors or at least one of full-colors by color mixture, in which a recording head is integrally constituted or a plurality of recording heads are combined.
  • inks having a property of being liquefied, for the first time with thermal energy, such as ink that can be liquefied and discharged in liquid state upon application of thermal energy depending upon a record signal or other ink that can start its solidification beforehand at the time of its arrival at a recording medium in order to prevent the temperature of the head from raising due to thermal energy by purposely using thermal energy as the energy for a state change of ink from solid state to liquid state or in order to prevent ink from being vaporized by solidifying the ink in a state of being allowed to stand.
  • thermal energy such as ink that can be liquefied and discharged in liquid state upon application of thermal energy depending upon a record signal or other ink that can start its solidification beforehand at the time of its arrival at a recording medium in order to prevent the temperature of the head from raising due to thermal energy by purposely using thermal energy as the energy for a state change of ink from solid state to liquid state or in order to prevent ink from being vaporized by solidifying the ink in a state of being

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Electronic Switches (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Magnetic Heads (AREA)
  • Optical Head (AREA)

Claims (11)

  1. Substrat pour tête à jet d'encre comprenant un substrat (41) de base ayant une couche (42) d'électrode, une résistance génératrice de chaleur, et une couche (43) de câblage pour fournir du courant à la résistance,
       caractérisé en ce qu'on utilise au moins deux couches (43, 45) de câblage qui sont mutuellement superposées, et séparées du substrat de base par ladite couche (42) d'électrode et qui sont séparées l'une de l'autre par une seconde couche (44) d'électrode, dans lequel l'une ou l'autre desdites couches d'électrodes contient ladite résistance (50), et dans lequel les deux couches de câblage sont électriquement connectées à ladite résistance par l'intermédiaire de celle qui convient desdites couches d'électrodes, de sorte que, lors du fonctionnement, un courant est appliqué à ladite résistance par application d'une tension auxdites deux couches de câblage afin qu'une discontinuité apparaissant dans lesdites couches de câblage ne provoque pas de défaut de fonctionnement de ladite résistance.
  2. Substrat pour tête à jet d'encre selon la revendication 1, caractérisé en ce que la seconde couche (44) d'électrode présente une sélectivité vis-à-vis d'une attaque chimique contre la seconde couche (45) d'électrode de câblage par le fait que la seconde couche (43) de contact d'électrode n'est pas attaquée chimiquement par une solution d'attaque chimique qui effectue une attaque chimique de ladite seconde couche (45) de câblage d'électrode.
  3. Substrat pour tête à jet d'encre selon la revendication 1 ou 2, caractérisé en ce que la première couche (42) d'électrode présente une structure empilée contenant la couche de résistance génératrice de chaleur.
  4. Substrat pour tête à jet d'encre selon la revendication 3, caractérisé en ce que la combinaison de matériaux destinés à former la structure empilée comprenant la première couche d'électrode de câblage/la seconde couche de contact d'électrode/la seconde couche d'électrode de câblage, est une couche d'Al/couche de Ti/couche d'Al ; une couche d'Al/couche de Cr/couche d'Al; une couche de Cu/couche de Ti/couche de Cu; une couche d'Au/couche de Ni/couche d'Au; ou une couche d'Al/couche de TaSi/couche de Cu.
  5. Substrat pour tête à jet d'encre selon la revendication 1 ou 2, caractérisé en ce que la seconde couche de contact (44) d'électrode a une structure empilée contenant la couche de résistance génératrice de chaleur.
  6. Substrat pour tête à jet d'encre selon la revendication 5, caractérisé en ce que la combinaison de matériaux destinée à former la structure empilée comprenant la première couche d'électrode de câblage/la seconde couche de contact d'électrode/la seconde couche d'électrode de câblage est une couche d'Al/couche de Ti + une couche de matériau résistant/couche d'Al; une couche d'Al/couche de Cr + une couche de matériau résistant/couche d'Al; une couche de Cu/couche de Tr + une couche de matériau résistant/couche de Cu; une couche d'Au/couche de Ni + une couche de matériau résistant/couche d'Au; ou une couche d'Al/couche de TaSi/couche de Cu.
  7. Tête à jet d'encre comprenant le substrat selon l'une quelconque des revendications 1 à 6, comportant une buse comprenant un orifice (1111) d'éjection pour éjecter de l'encre, et un trajet (1110) d'encre en communication avec ledit orifice d'éjection, ledit trajet d'encre étant disposé de façon à correspondre à la partie (1103) génératrice de chaleur de la résistance génératrice de chaleur, l'encre étant éjectée par l'intermédiaire dudit orifice d'éjection par utilisation d'énergie thermique produite par application d'un signal à ladite partie génératrice de chaleur.
  8. Tête à jet d'encre selon la revendication 7, caractérisée en ce que la tête à jet d'encre est du type pleine largeur, c'est-à-dire qui comporte un ensemble de buses s'étendant sur toute la largeur d'une région d'enregistrement d'un élément sur lequel un enregistrement doit être fait.
  9. Dispositif à jet d'encre comprenant une tête à jet d'encre selon la revendication 7 ou 8, comportant un moyen (201) de transport pour transporter un élément (202) d'enregistrement.
  10. Procédé pour produire un substrat pour tête à jet d'encre, comprenant les étapes :
       d'utilisation d'un élément (41) de base,
       de formation d'une première couche (42) de contact d'électrode comportant une résistance génératrice de chaleur sur ledit élément (41) de base,
       de formation d'une première couche (43) d'électrode de câblage sur ladite première couche (42) d'électrode,
       de formation, sur ladite première couche (43) d'électrode de câblage, d'une seconde couche (44) de contact d'électrode,
       de formation d'une seconde couche (45) de câblage sur ladite seconde couche (44) de contact d'électrode de façon superposée à ladite première couche (43) de câblage, et
       d'élimination de parties de ladite seconde couche (45) de câblage, de ladite seconde couche (44) de contact d'électrode, et de ladite première couche (43) de câblage, pour exposer une partie de ladite première couche d'électrode qui joue le rôle de ladite résistance.
  11. Procédé pour produire un substrat pour tête à jet d'encre, ledit procédé comprenant les étapes :
       d'utilisation d'un élément (41) de base,
       de formation d'une première couche (42) de contact d'électrode sur ledit élément (41) de base,
       de formation d'une première couche (43) d'électrode de câblage sur ladite première couche (42) d'électrode,
       de formation, sur ladite première couche (43) d'électrode de câblage, d'une seconde couche (44) de contact d'électrode comportant une résistance génératrice de chaleur,
       de formation d'une seconde couche (45) de câblage sur ladite seconde couche (44) de contact d'électrode, de façon superposée à ladite première couche (43) de câblage, et
       d'élimination de parties de ladite seconde couche (45) de câblage pour exposer une partie de ladite première couche d'électrode qui joue le rôle de ladite résistance.
EP91904324A 1990-02-26 1991-02-26 Substrat pour tete a jet d'encre Expired - Lifetime EP0473786B1 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP4252890 1990-02-26
JP4252990 1990-02-26
JP42529/90 1990-02-26
JP42528/90 1990-02-26
PCT/JP1991/000249 WO1991012967A1 (fr) 1990-02-26 1991-02-26 Substrat pour tete a jet d'encre

Publications (3)

Publication Number Publication Date
EP0473786A1 EP0473786A1 (fr) 1992-03-11
EP0473786A4 EP0473786A4 (en) 1992-04-15
EP0473786B1 true EP0473786B1 (fr) 1996-06-05

Family

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Application Number Title Priority Date Filing Date
EP91904324A Expired - Lifetime EP0473786B1 (fr) 1990-02-26 1991-02-26 Substrat pour tete a jet d'encre

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EP (1) EP0473786B1 (fr)
JP (1) JP3045793B2 (fr)
AT (1) ATE138854T1 (fr)
DE (1) DE69120002T2 (fr)
ES (1) ES2087999T3 (fr)
WO (1) WO1991012967A1 (fr)

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Publication number Priority date Publication date Assignee Title
JP5335611B2 (ja) * 2009-08-18 2013-11-06 キヤノン株式会社 液体吐出ヘッド及び液体吐出ヘッドの製造方法
JP2015168120A (ja) * 2014-03-06 2015-09-28 セイコーエプソン株式会社 積層配線の形成方法、液体噴射ヘッドの製造方法、配線実装構造、液体噴射ヘッド及び液体噴射装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60116452A (ja) * 1983-11-30 1985-06-22 Canon Inc インクジェットヘッド
JPS60116451A (ja) * 1983-11-30 1985-06-22 Canon Inc 液体噴射記録ヘツド
JPS60120067A (ja) * 1983-12-01 1985-06-27 Canon Inc 液体噴射記録ヘツド
JPS60204368A (ja) * 1984-03-30 1985-10-15 Canon Inc 液体噴射記録ヘツド
JPH064328B2 (ja) * 1984-11-14 1994-01-19 キヤノン株式会社 インクジエツト記録ヘツド
US4719477A (en) * 1986-01-17 1988-01-12 Hewlett-Packard Company Integrated thermal ink jet printhead and method of manufacture
JPS62201257A (ja) * 1986-02-28 1987-09-04 Canon Inc 液体噴射記録ヘツド
JP2611981B2 (ja) * 1987-02-04 1997-05-21 キヤノン株式会社 インクジエツト記録ヘツド用基板及びインクジエツト記録ヘツド
JP2612580B2 (ja) * 1987-12-01 1997-05-21 キヤノン株式会社 液体噴射記録ヘッド及び該ヘッド用基板
JPH01295857A (ja) * 1988-05-24 1989-11-29 Fuji Xerox Co Ltd インクジェット記録ヘッド

Also Published As

Publication number Publication date
DE69120002T2 (de) 1996-10-31
ES2087999T3 (es) 1996-08-01
ATE138854T1 (de) 1996-06-15
EP0473786A4 (en) 1992-04-15
JP3045793B2 (ja) 2000-05-29
JPH04211958A (ja) 1992-08-03
WO1991012967A1 (fr) 1991-09-05
EP0473786A1 (fr) 1992-03-11
DE69120002D1 (de) 1996-07-11

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