EP0451939B1 - Appareil d'enregistrement dont la tête d'enregistrement est munie d'un substrat de câblage - Google Patents

Appareil d'enregistrement dont la tête d'enregistrement est munie d'un substrat de câblage Download PDF

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Publication number
EP0451939B1
EP0451939B1 EP91301490A EP91301490A EP0451939B1 EP 0451939 B1 EP0451939 B1 EP 0451939B1 EP 91301490 A EP91301490 A EP 91301490A EP 91301490 A EP91301490 A EP 91301490A EP 0451939 B1 EP0451939 B1 EP 0451939B1
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EP
European Patent Office
Prior art keywords
layer
sub
recording head
electrically conductive
conductive portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP91301490A
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German (de)
English (en)
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EP0451939A3 (en
EP0451939A2 (fr
Inventor
Yasutomo Canon Kabushiki Kaisha Watanabe
Hideo Canon Kabushiki Kaisha Tamura
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Canon Inc
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Canon Inc
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Filing date
Publication date
Priority claimed from JP2042533A external-priority patent/JP2726137B2/ja
Priority claimed from JP2049873A external-priority patent/JP2771008B2/ja
Application filed by Canon Inc filed Critical Canon Inc
Publication of EP0451939A2 publication Critical patent/EP0451939A2/fr
Publication of EP0451939A3 publication Critical patent/EP0451939A3/en
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Publication of EP0451939B1 publication Critical patent/EP0451939B1/fr
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/14129—Layer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1604—Production of bubble jet print heads of the edge shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/19—Assembling head units

Definitions

  • the present invention relates to a recording system applicable to copying machines, facsimile apparatuses, word processors, printers as an output terminal for a computer or the like which system performs recording by discharging a recording ink through a discharge portion, a recording head used for the above-described recording system and a wiring substrate suitable for the recording head.
  • an insulated substrate 3 on which there are arranged a plurality of semiconductor devices 2 such as electro-thermal converting elements and their wire bondings and an IC for driving them is placed in a row together with a flexible cable 4 on a support plate 5.
  • the substrate 3 and the cable 4 are pressed onto the support plate 5 by a rigid holding member 6 for holding the flexible cable and five screws 7 through a rubber holder 8 so that a wiring portion of the substrate 3 and the flexible cable 4 can be fixed mechanically and connected electrically to each other.
  • Reference numeral 9 denotes an ink feed pipe for feeding ink from both sides into a common liquid chamber 10.
  • the ink feed pipe is composed of an elastic tube.
  • a part of the common liquid chamber 10 is formed by providing a member or top plate 11 composed of a resin or the like with depressions, and a part of an ink discharge portion or orifice 12 is similarly formed thereby. By bonding these on the substrate 3 a space for flowing ink therein and openings for discharging ink therethrough are formed, thus constructing the ink jet head 1.
  • Fig. 2 is a schematic perspective view illustrating a serial scanning type ink jet recording apparatus.
  • the head 1 having, for example, 16 to 256 discharge portions is detachably mounted on a carriage 21 which is guided on a guide shaft 20, and in this state is scanned in a direction perpendicular to the direction in which recording paper 22 is conveyed.
  • Reference numeral 23 denotes a belt conveyor for scanning the carriage 21.
  • Reference numeral 24 denotes a conveyor roll and reference numeral 25 denotes a platen. These convey the recording paper 22 to a desired position.
  • reference numeral 26 denotes a discharge recovering apparatus for maintaining the discharge portions in good conditions, which includes an elastic cap, an aspirator and the like.
  • the system of the above-described example is constructed such that signal outputs for driving the recording paper conveying means, head scanning means and discharge recovering means as well as those for driving the recording head can be controlled by controlling means based on instruction put out from CPU of the main body of the ink jet recording apparatus.
  • the present invention is suitable for an apparatus of a type which discharges ink by utilizing thermal energy.
  • an electro-thermal converting element which generates thermal energy utilized for discharging ink and a wiring portion for connecting the electro-thermal converting element to the semiconductor device 2 such as IC for driving.
  • a bump electrode to be connected to a solder bump provided in the semiconductor device.
  • Figs. 3A to 3E an example of the structure of the bump electrode in the conventional film wiring substrate will be explained according to its production procedures.
  • a protective layer 31 composed of an inorganic insulating layer such as a SiO2 or SiN layer or an organic insulating layer such as a polyimide layer and having a circular through hole 31a.
  • a barrier metal layer 32 made of, for example, Cr, Ti, Ni or the like and a solder connecting layer 33 made of, for example, Cu, Au, Cu-Au alloy or the like.
  • a photoresist layer 34 Over the entire surface of the substrate 3 provided with the electrode 30, the protective layer 31, the barrier metal layer 32 and the solder connecting layer 33 is coated a photoresist layer 34 by a spin coating method, a roll coating method, a dipping method, a printing method or the like, and then exposure treatment and development treatment are performed.
  • solder connecting layer 31 and the metal layer 32 are etched using the photoresist layer 34 as a mask.
  • the photoresist layer 34 is peeled off to complete the procedures.
  • a circular concave portion 33a of, for example, several centimeters or more in depth exists in the solder connecting layer 33 above the through hole 31a of the protective layer 31.
  • it tends to become more difficult at every pitch of a groove of a grooved coating roll (especially, at thread portions of the roll) to carry out coating of the photoresist layer 34, resulting in that there has been a possibility that in a subsequent etching step the through hole portions of the metal layer (i.e., the solder connecting layer 33 and in addition the barrier metal layer 32) of the concave portion 34a could be etched out where coating has been carried out incompletely.
  • electro-thermal converting elements in conventional thin film wiring substrates are constructed as follows.
  • Electro-thermal converting elements have heating units which convert electric energy to thermal energy to be used for discharging ink. As shown in Figs. 4A and 4B, in order to construct an electro-thermal converting element, at first an HfB2 film 40 serving as a heat generating resistor layer and an Al film serving as an electrode 41 are formed on the substrate plate 3, for example, by sputtering or the like, followed by patterning to form an electro-thermal converting element.
  • an SiO2 film serving as an antioxidation film 42 and a Ta film serving as anti-cavitation film 43 for the electro-thermal converting element are formed, for example, by sputtering or the like, followed by patterning.
  • the second layer i.e., Al conductive layer 41
  • the second layer i.e., Al conductive layer 41
  • a common electrode 45 which is Cu-plated.
  • the SiO2 layer 42 and the photosensitive polyimide layer 44 underlying the common electrode 45 function as an interlayer insulator layer.
  • a plate 11 having a concave portion for forming a common liquid chamber 10 as a passage for a recording liquid and individual liquid paths 46 is bonded, and a wiring to be connected to a driving circuit which generates driving signals for driving the electro-thermal converting element is electrically connected, thus producing a liquid spray recording head.(not shown).
  • Fig. 4A the heat generating resistor layer 40, the electrode 41 and the common electrode 45 are illustrated but the protective layers 42, 43 and 44 and the plate 11 are omitted.
  • the electrode 41 opposite to the common electrode i.e., segment electrode
  • the above-described bump electrode through which the electrode 41 is connected to a semiconductor device. It should be noted that the same is true in the case where the semiconductor device is connected to the end on the side of the common electrode 45.
  • the common electrode 45 is placed outside the plate 11, more specifically outside the liquid paths of the recording head and therefore the part of the electrode 41 on the side of the common electrode 45 must have a length of M2 as shown in Figs. 4A and 4B which is considerably larger than the length M1 of the part of the electrode 41 within the plate 11 and thus a considerably long high density wiring is necessary.
  • This makes severer disadvantages involved in production such as low yield due to short circuit, disconnection or the like. That is, repeated driving of the conventional device under application of a large amount of electric current which can generate heat enough to discharge liquid causes short circuit or disconnection, resulting in that the durability of the recording head decreases unacceptably.
  • EP-A-0344809 discloses a recording head for recording by liquid emission in which a wiring pattern for connecting to a heat-generating resistor portion, comprises a conductive electrode covered by an anti-oxidation protective insulating layer and an ink-resistant protective insulating layer. For connecting a common electrode to the conductive layer, holes are formed in the protective insulating layers and the common electrode is formed to contact the conductive layer through the holes. Arrangements are disclosed in which the hole in one of the insulating protective layers is larger than the hole in the other insulating protective layer, so that the edge of the hole is stepped.
  • EP-A-0352142 discloses a wiring substrate for an ink jet recording unit, in which bump-shaped electrodes are formed in contact with an underlying conductive layer through holes in upper and lower insulating layers.
  • the upper insulating layer lines the inside of the hole in the lower insulating layer. The relative positions of the edges of the holes in the insulating layers and the edges of the conductive layers is not discussed, and is not shown precisely.
  • JP-A-56-19639 proposes a square electrode pad provided by two aluminium films and holes in two insulating films.
  • a wiring line in the lower aluminium film is expanded into a square at the pad.
  • the upper aluminium film is a larger square extending over and beyond the square pad in the lower aluminium film.
  • a square opening in the lower insulating film is larger than both aluminium film squares, so that the lower insulating film does not overlap either aluminium film square.
  • the upper insulating film has a square opening which is smaller than the square of the upper aluminium film but larger than the square of the lower aluminium film, so that the upper insulating layer overlaps the edges of the upper aluminium film but does not overlap the square of the lower aluminium film.
  • This construction is intended to flatten the edge of the pad in order to allow good contact between the exposed part of the upper aluminium film and a metal part which is to be bonded to it.
  • an electrical wiring pattern according to claim 1.
  • Claims 2 to 8 disclose optional features.
  • the invention also provides a recording head using the wiring pattern as set out in claims 9 to 13, and the invention also provides a recording apparatus having the recording head.
  • This embodiment relates to a wiring substrate having an improved bump electrode portion.
  • Figs. 5A to 5G are intended to illustrate the thin film wiring substrate according to one embodiment of the present invention and are each a cross section showing the production procedure of the bump electrode of the wiring substrate.
  • the Al electrode 30 is formed on the insulated substrate 3.
  • a protective layer 35 is formed which is provided with a through hole 35a of a quadrilateral shape and having a size larger than the outer size of the Al electrode 30.
  • a protective layer 36 is formed.
  • the protective layer 36 is provided with a through hole 36a of a circular shape and having a size smaller than the outer size of the Al electrode 30.
  • the thicknesses of the protective layers 35 and 36 may be enough to protect portions excepting the through hole portion of the Al electrode 30 when they are several micrometers (mm) in total, and the thickness of the protective layer 36 can be made considerably smaller than that of the protective layer 35. Therefore, the thickness of the protective layer to be formed on the Al electrode 30 can naturally be made small enough.
  • the barrier metal layer 32 and the solder connecting layer 33 are deposited by a known method.
  • the photoresist layer 34 is coated by a roll coating method, exposed to light and developed. Upon coating the photoresist, as shown in Fig. 5D and Fig.
  • the protective layer on the Al electrode 30 can be made formed to a small thickness even when it has a construction such that the thickness of the through hole portion (the thickness of the laminate within the through hole, i.e., the thicknesses of the barrier metal layer 32 + the solder connecting layer 33 + the photoresist layer 34) is the same in total as that of the conventional ones, resulting in that the circular concave portion 33a of the solder connecting layer 33 positioned within the through hole portion where it has hitherto been difficult to coat photoresists can be made extremely small in depth. Therefore, coating performance can be improved greatly by reducing the difference in height, or depth, of the concave portion 33a of the solder connecting layer 33.
  • the protective layer of a two-layer structure makes it possible to design the shape of through holes freely; through holes may have different shapes one from another. Accordingly, the through hole in the lower layer may be of a shape corresponding to the contour of the electrode and the one in the upper layer may be of a shape suitable for the bump electrode portion.
  • This construction increases the area of the through hole in the upper layer and further the area of the concave portion 33a in the solder connecting layer 33, thus making it possible to increase coating area of the photoresist and solving the problem that coating of photoresist is impossible in the conventional circular through hole portion.
  • the protective layer for the Al electrode is laminated in at least two layers, number of defects such as pin-holes in the protective layer is negligibly small and it is now unnecessary to increase the thickness of the coating film excessively as has been required in protective layers of a single layer construction conventionally used, resulting in that the film thickness can be made smaller than ever, which decreases cost of materials and prevents curling or other undesirable phenomena of the substrate which could otherwise occur due to lamination of the substrate material with different kinds of materials.
  • etching of the metal layer 32 is carried out, and finally, as shown in Fig. 5G, the photoresist layer 34 is peeled off to complete the procedure.
  • the through hole in the upper protective layer 36 is made of a circular form and the through hole in the lower protective layer 35 is made of a quadrilateral form as shown in Fig. 6, they may be made in reverse relation, that is, the through hole in the protective layer 36 is quadrilateral and the through hole in the protective layer 35 is circular as shown in Figs. 7A and 7B.
  • the quadrilateral shape of the through hole may be selected freely; for example, it may be constructed such that the hole in one of the protective layers (the protective layer 36) is formed continuously for a plurality of electrodes 30 (Fig. 8).
  • the through hole in either one of the protective layers 35 and 36 is made of a size larger than the outer size of the Al electrode 30, basically no problem will occur if it has the same size as the outer size of the Al electrode 30.
  • the protective layer is made of a multilayer construction, thus maintaining as a whole a film thickness sufficient for protecting the electrode while at least one among plural layers covers the electrode around the periphery of the through hole portion.
  • the kind of materials for the protective layers 35 and 36 and any type of inorganic or organic insulating film may be used.
  • the substrate is constructed as follows.
  • the protective layer 35 is formed of the same material and has the same film thickness as the antioxidation layer such as SiO2, SiN, SiC or the like on the heat generating resistor layer 40, and at the same time the protective layer 36 is formed of the same material and has the same film thickness as the ink resistant layer made of polyimide resin, epoxy resin or the like.
  • This construction makes it easy to form the bump electrode 37 for efficiently connecting the substrate to the electrode (not shown) of a semiconductor device 2 in the same step, and also makes it possible to form an ink jet recording head having such bump electrode.
  • a recording head as shown in Fig. 1 can be constructed. Further, a recording apparatus as shown in Fig. 2 can be constructed using such recording head.
  • the protective layer for the Al electrode is laminated in at least two layers, number of defects such as pin-holes in the protective layer is negligibly small and it is now unnecessary to increase the thickness of the coating film excessively as has been required in protective layer of a single construction conventionally used, resulting in that the film thickness can be made smaller than ever, which decreases cost of materials and prevents curling or other undesirable phenomena of the substrate which could otherwise occur due to lamination of the substrate material with different kinds of materials
  • one layer out of the two protective layers may be formed from layer having low-pattern density and low-accuracy of pattern.
  • one layer out of the two protective layers may be formed by low-cost patterning method such as screen printing method.
  • an SiO2 film film thickness: 2.75 mm
  • an HfB2 layer layer thickness: 1,000 ⁇
  • HfB2 purity: 99.9% or higher
  • Target area 8 inch f
  • High frequency power 1,500 W.
  • Base pressure 1 X 10 ⁇ 5 Pa or lower
  • Sputtering gas argon Sputtering gas pressure: 0.5 Pa
  • the target was changed to Ti (purity: 99.9% or higher) and sputtering was carried out under the same conditions as above excepting the following: Film forming time: 1 hour to form a Ti layer (layer thickness: 50 ⁇ , not shown) serving as a contact layer.
  • the target was changed to Al (purity: 99.9% or higher) and sputtering was carried out under the same conditions as above excepting the following: High frequency power: 5,000 W Film forming time: 6 minutes to form an Al layer (layer thickness: 4,500 ⁇ ) serving as the electrode 30.
  • etching of the Al layer was carried out using a mixture of acetic acid, phosphoric acid and nitric acid (acetic acid: 9%, phosphoric acid: 73% and nitric acid: 2%) as an etching solution.
  • etching of the lamination of the HfB2 layer and the Ti layer was carried out by reactive etching in a vacuum chamber to remove the photoresist, thus completing the patterning.
  • the reactive etching was performed under the following conditions:
  • Etching power 450 W Etching time: 5 minutes
  • Base pressure 1 X 10 ⁇ 3 Pa
  • Gas species BCl3
  • Gas pressure 3 Pa
  • an SiO2 layer (layer thickness: 1.3 mm) serving as the protective layer 35 having mainly an antioxidation function was formed by sputtering in a vacuum chamber using SiO2 (purity: 99.9% or higher) as a target. Conditions of the sputtering were as follows:.
  • Target area 8 inch f
  • High frequency power 2,000 W.
  • Base pressure 8 X 10 ⁇ 4 Pa or lower
  • Sputtering gas argon Sputtering gas pressure: 0.5 Pa
  • the target was changed to Ta (purity 99.9% or higher) and sputtering was carried out under the same conditions as SiO2 excepting the following: High frequency power: 1,500 W
  • Film forming time 30 minutes to form a Ta layer (layer thickness: 0.5 mm) serving as the protective layer 37a having mainly an anti-cavitation function.
  • patterning was performed by lithography as described below relative to the SiO2 layer and the Ta layer.
  • the same photoresist as described above was coated as a layer (layer thickness: 1.3 mm) on the Al layer, which was exposed to light, developed and baked by conventional methods.
  • chemical etching of the Ta layer was carried out to form a pattern of the protective layer 37a, followed by removal of the photoresist. Conditions of the chemical etching were as follows:
  • Etching power 600 W Etching time: 8 minutes Base pressure : 1 Pa Gas species: CF4 (flow rate: 200 sccm) Gas species: O2 (flow rate: 100 sccm) Gas pressure: 15 Pa Thereafter, the same photoresist as described above was coated as a layer (layer thickness: 2.6 mm), which was exposed to light, developed and baked by conventional methods. Then, reactive etching of the SiO2 layer was carried out to form a pattern of the protective layer 35 including a through hole, followed by removal of the photoresist. Conditions of the reactive etching were as follows:
  • Etching power 950 W Etching time: 33 minutes
  • Base pressure 5 X 10 ⁇ 3 Pa
  • Gas pressure 2 Pa
  • a polyimide (trade name: UR3100, produced by Toray Corporation) was coated by a roll coating method to form a pattern of 2.5 mm in thickness, which was pre-baked, exposed to light, developed and post-cured by conventional methods to complete formation of the protective layer 36.
  • the target was changed to Ti (purity: 99.9% or higher) and sputtering was carried out under the same conditions as described above excepting the following: Film forming time: 10 minutes to form a Ti layer (layer thickness: 500 ⁇ ) serving as the barrier metal layer.32.
  • the target was changed to Cu (purity: 99.9% or higher) and sputtering was carried out under the same conditions as the Ti formation excepting the following: High frequency power: 5,000 W Film forming time: 4 minutes to form a Cu layer (layer thickness: 3,000 ⁇ ) serving as the solder connecting layer 33. Subsequently, patterning of lamination between the Ti layer and the Cu layer was carried out by lithography as described below. Firstly, the same photoresist as described above was coated as a layer (layer thickness: 1.3 mm) by a roll coating method, which layer was exposed to light, developed and baked by conventional methods.
  • etching of the Cu layer was carried out for 30 seconds using 10% by weight ammonium persulfate solution as an etching solution to form the solder connecting layer 33.
  • etching of the Ti layer was carried out for 20 seconds using 2% by weight hydrofluoric acid solution as an etching solution to form the barrier metal layer 32, and thereafter the photoresist was removed.
  • the plate 11 made of glass and provided with a concave portion serving as a wall of the passage for ink communicated to discharge portions.
  • a wiring electrode (not shown) provided on the surface of the driving substrate 2 with a semiconductor cable was connected to the solder connecting layer 33 through the bump electrode 37 to form an ink jet head as shown in Fig. 9.
  • the ink jet head had several thousands of discharge portions each corresponding to a plurality of heat generating portions.
  • the ink jet head was fitted to the main body of an ink jet apparatus and recording was performed with actually discharging ink. As a result, it was confirmed that the ink jet head obtained in this example was very excellent both from a point of view of recording quality and of durability.
  • the laminate structure including a bump electrode as described in Embodiment 1 is formed so that the bump electrode is positioned on the corresponding substrate plate in the common ink chamber. Thereafter, a protective layer is formed on the bump electrode using an organic material such as photosensitive polyimide to make a substrate for the ink jet head according to this embodiment.
  • the above-described wiring substrate, recording head and recording apparatus of the present invention are desirably applied to apparatuses of types utilizing basic operational principle disclosed, for example, in U.S. Patents Nos. 4,723129 and 4,749,796
  • the principle is applicable to a so-called on-demand type recording system and a continuous type recording system, particularly it is suitable for the on-demand type because the principle is such that at least one driving signal is applied to an electro-thermal converting element disposed on liquid (ink) retaining sheet or ink passage, the driving signal being enough to provide such a quick temperature rise beyond a departure from nucleation boiling point, by which the thermal energy is provided by the electro-thermal converting element to produce film boiling on the heating portion of the recording head, whereby a bubble can be formed in the liquid (ink) corresponding to each of the driving signals.
  • the liquid (ink) is discharged through an discharge portion to produce at least one droplet.
  • the driving signal is preferably in the form of a pulse because the development and collapse of the bubble can be effected instantaneously, and therefore, the liquid (ink) is discharged with quick response.
  • the driving signal in the form of the pulse is preferably such as disclosed in U.S. Patent Nos. 4,463,359 and 4,345,262.
  • the temperature increasing rate of the heating surface is preferably such as disclosed in U.S. Patent No. 4,313,124.
  • the structure of the recording head may be as shown in U.S. Patent Nos. 4,558,333 and 4,459,600 wherein the heating portion is disposed at a bent portion in addition to the structure of the combination of the discharging portion, liquid passage and the above-described patents.
  • the present invention is applicable to the structure disclosed in Japanese Patent Application Laying-Open No. 123670/1984 wherein a common slit is used a discharge portion for plural electro-thermal converting elements, and to the structure disclosed in Japanese Patent Application Laying-Open No. 138461/1984 wherein an opening for absorbing pressure wave of the thermal energy is formed corresponding to the discharge portion.
  • Such a recording head may comprise a single recording head integrally formed and a plurality recording heads combined to cover the entire width.
  • the present invention is applicable to a serial type recording head wherein the recording head is fixed on the main assembly, to a replaceable chip type recording head which is connected electrically with the main apparatus and can be supplied with the ink by being mounted in the main assembly, or to a cartridge type recording head having an integral ink container.
  • the recovery means and the auxiliary means for the preliminary operation are preferred because they can further stabilize the effect of the present invention.
  • a single head corresponding to a single color ink may be equipped, or a plurality of heads corresponding, respectively, to a plurality of ink materials having different recording color or density may be equipped.
  • the present invention is effectively applicable to an apparatus having at least one of a monochromatic mode solely with main color such as black and a multi-color mode with different color ink materials or a full-color mode by color mixture.
  • the multi-color or full-color mode may be realized by a single recording head unit having a plurality of head formed integrally or by a combination of a plurality of recording heads.
  • the form of the ink jet recording apparatus to which the present invention is applicable may be the one which can be used as an image output terminal for information processor such as computers and the like and in addition thereto a copying apparatus combined with a reader or the like as well as a facsimile apparatus having transmission and receiving functions.
  • the ink has been liquid. It may, however, be an ink material solidified at room temperature or below and liquefied at room temperature. Since in the ink jet recording system, the ink is controlled within the temperature not less than 30°C and not more than 70°C to stabilize the viscosity of the ink to provide the stabilized discharging, in usual recording apparatus of this type, the ink is such that it is liquid within the temperature range when the recording signal is applied. In addition, the temperature rise due to the thermal energy is positively prevented by consuming it for the state change of the ink from the solid state to the liquid state, or the ink material is solidified when it is left is used to prevent the evaporation of the ink.
  • the ink may be liquefied, and the liquefied ink may be discharged.
  • the ink may start to be solidified at the time when it reaches the recording material.
  • the present invention is applicable to such an ink material as is liquefied by the application of the thermal energy.
  • Such an ink material may be retained as a liquid or solid material on through holes or recesses formed in a porous sheet as disclosed in Japanese Patent Application Laying-Open No. 56847/1979 and Japanese Patent Application Laying-Open No. 71260/1985.
  • the sheet is faced to the electro-thermal converting elements.
  • the most effective one for the ink materials described above is the film boiling system.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Facsimile Heads (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)

Claims (14)

  1. Motif de câblage électrique pour une tête d'enregistrement à jets d'encre, dans lequel une première partie électriquement conductrice (30) est prévue sur un substrat (3) et une couche isolante, comportant des première et seconde sous-couches (35, 36), est formée sur la première partie électriquement conductrice (30), les première et seconde sous-couches (35, 36) étant traversées, respectivement, par des trous (35a, 36a), se recouvrant, afin de permettre à la première partie électriquement conductrice (30) d'être connectée à une seconde partie électriquement conductrice (32, 33, 37) par les trous traversants,
       et, le long d'une partie du bord du trou traversant de la première sous-couche, la première sous-couche n'atteint pas la première partie électriquement conductrice (30) ou atteint la première partie électriquement conductrice (30), mais ne la recouvre pas, de manière qu'une portion de la première partie électriquement conductrice (30) s'étende depuis le bord de la première partie électriquement conductrice jusqu'au bord du trou traversant la seconde sous-couche, laquelle portion est recouverte par la seconde sous-couche, mais non par la première sous-couche,
       caractérisé en ce que
       la seconde partie électriquement conductrice (32, 33, 37) s'étend sur la totalité du trou traversant la seconde sous-couche, mais ne recouvre pas la première sous-couche.
  2. Motif de câblage électrique selon la revendication 1, dans lequel la seconde sous-couche est plus mince que la première sous-couche.
  3. Motif de câblage électrique selon la revendication 1 ou la revendication 2, dans lequel la première sous-couche recouvre la seconde sous-couche.
  4. Motif de câblage électrique selon la revendication 1 ou la revendication 2, dans lequel la seconde sous-couche recouvre la première sous-couche.
  5. Motif de câblage électrique selon l'une quelconque des revendications 1 à 4, dans lequel le trou traversant la première sous-couche présente une forme différente de celle du trou traversant la seconde sous-couche.
  6. Motif de câblage électrique selon l'une quelconque des revendications précédentes, dans lequel la seconde partie électriquement conductrice (32, 33, 37) constitue une électrode à bosse pour une connexion à un dispositif semiconducteur (2).
  7. Motif de câblage électrique selon l'une quelconque des revendications précédentes, dans lequel l'une des première et seconde sous-couches (35, 36) comprend une matière inorganique et l'autre comprend une matière organique.
  8. Motif de câblage électrique selon l'une quelconque des revendications précédentes, dans lequel un élément de conversion électrothermique est prévu sur le substrat, la première partie électriquement conductrice (30) constituant une électrode pour l'élément de conversion électrothermique.
  9. Tête d'enregistrement comportant un motif de câblage électrique selon l'une quelconque des revendications précédentes.
  10. Tête d'enregistrement comportant plusieurs motifs de câblages électriques selon la revendication 8, la tête d'enregistrement comportant :
       plusieurs parties de décharge de liquide destinées à décharger un liquide en utilisant de l'énergie thermique générée par les éléments de conversion électrothermique ;
       plusieurs circuits de liquide communiquant avec les parties de décharge de liquide ; et
       une chambre (10) à liquide communiquant avec les circuits de liquide.
  11. Tête d'enregistrement selon la revendication 10, dans laquelle les trous traversants dans les première et seconde sous-couches (35, 36) des motifs de câblages sont dans la chambre (10) à liquide.
  12. Tête d'enregistrement selon la revendication 10, dans laquelle les trous traversants dans les première et seconde sous-couches (35, 36) des motifs de câblages sont à l'extérieur de la chambre (10) à liquide et sur le côté de la chambre (10) à liquide éloigné des parties de décharge de liquide.
  13. Tête d'enregistrement selon l'une quelconque des revendications 10 à 12, dans laquelle un seul trou traversant dans la première sous-couche est commun à plusieurs desdits motifs de câblages ayant chacun un trou traversant respectif dans la seconde sous-couche.
  14. Appareil d'enregistrement comportant une tête d'enregistrement selon l'une quelconque des revendications 9 à 13.
EP91301490A 1990-02-26 1991-02-25 Appareil d'enregistrement dont la tête d'enregistrement est munie d'un substrat de câblage Expired - Lifetime EP0451939B1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2042533A JP2726137B2 (ja) 1990-02-26 1990-02-26 配線電極基板、該配線電極基板を有するインクジェット記録ヘッドおよびインクジェット記録装置
JP42533/90 1990-02-26
JP2049873A JP2771008B2 (ja) 1990-02-28 1990-02-28 記録装置及び記録ヘッド
JP49873/90 1990-02-28

Publications (3)

Publication Number Publication Date
EP0451939A2 EP0451939A2 (fr) 1991-10-16
EP0451939A3 EP0451939A3 (en) 1991-12-11
EP0451939B1 true EP0451939B1 (fr) 1996-01-17

Family

ID=26382245

Family Applications (1)

Application Number Title Priority Date Filing Date
EP91301490A Expired - Lifetime EP0451939B1 (fr) 1990-02-26 1991-02-25 Appareil d'enregistrement dont la tête d'enregistrement est munie d'un substrat de câblage

Country Status (4)

Country Link
EP (1) EP0451939B1 (fr)
AT (1) ATE133111T1 (fr)
DE (1) DE69116414T2 (fr)
ES (1) ES2082129T3 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619639A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Semiconductor device
DE68927268T2 (de) * 1988-06-03 1997-02-20 Canon Kk Aufzeichnungskopf mit Flüssigkeitsausstoss, Substrat hierfür und Aufzeichnungsapparat mit Flüssigkeitsausstoss, welcher besagten Kopf verwendet
JP2761042B2 (ja) * 1988-07-22 1998-06-04 キヤノン株式会社 記録素子駆動ユニット及びその製造方法，並びにインクジェット記録装置
JP2840271B2 (ja) * 1989-01-27 1998-12-24 キヤノン株式会社 記録ヘッド

Also Published As

Publication number Publication date
ES2082129T3 (es) 1996-03-16
DE69116414T2 (de) 1996-06-05
EP0451939A3 (en) 1991-12-11
EP0451939A2 (fr) 1991-10-16
DE69116414D1 (de) 1996-02-29
ATE133111T1 (de) 1996-02-15

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