EP0391903A1 - Dispositif de brasage - Google Patents

Dispositif de brasage

Info

Publication number
EP0391903A1
EP0391903A1 EP88907314A EP88907314A EP0391903A1 EP 0391903 A1 EP0391903 A1 EP 0391903A1 EP 88907314 A EP88907314 A EP 88907314A EP 88907314 A EP88907314 A EP 88907314A EP 0391903 A1 EP0391903 A1 EP 0391903A1
Authority
EP
European Patent Office
Prior art keywords
mask
component
heat
connections
pct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP88907314A
Other languages
German (de)
English (en)
Inventor
Peter Gammelin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP0391903A1 publication Critical patent/EP0391903A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing

Definitions

  • the invention relates to a device for producing or releasing soldered connections between an electronic component provided with a plurality of galvanic connections, e.g. SMD component, and a carrier, with a heat source arranged at a distance from the soldered connection, via which a heat beam with an exchangeable beam guide is directed onto the soldered connection.
  • a device for producing or releasing soldered connections between an electronic component provided with a plurality of galvanic connections, e.g. SMD component, and a carrier, with a heat source arranged at a distance from the soldered connection, via which a heat beam with an exchangeable beam guide is directed onto the soldered connection.
  • electronic assemblies consist of a rigid or flexible carrier provided with conductor tracks, on which electronic components are soldered. Both components with plug-in connecting pins for a so-called plug-in assembly are known, which are soldered in the carrier in fastening holes and in holes for through-plating, as well as components which are soldered directly onto the surface of the conductor tracks for mechanical and electrical connection.
  • the conductor tracks do not have to be pierced or drilled through to accommodate each component. This latter technique is known as Surface Ntounted Assembly.
  • a mixed assembly with plug-in and surface-mounted components is also common for special applications.
  • SMD Surface mount devices
  • resistors for example resistors, capacitors, diodes, transistors, integrated circuits and chip carriers.
  • these components have connecting surfaces or short contact legs which are soldered directly to the circuit board, i.e. without connecting wires.
  • soldering methods that can be used for SMA technology is the so-called reflow soldering, a hot gas hairdryer often being used as the heat source.
  • the invention is based on the object of specifying an invention of the type mentioned at the outset which enables the soldered connections and the component connections to be acted upon precisely without directly stressing the other components.
  • This object is achieved in that a mask made of temperature-resistant material with openings is provided which corresponds to the exact soldering surface positions of a component. Chen, and that there is an interchangeable holder for the mask.
  • a basic idea of the invention consists in dividing the heating beam into individual partial beams and directing them precisely onto the connecting surfaces, connecting legs or connecting elements, so that the heating is limited exclusively to these positions. Since the mask can be manufactured in a ratio of 1: 1 to the actual component dimensions, extremely precise beam guidance is achieved. Basically, the mask need not be limited to a single component. Of course, a configuration with several elements can also be taken into account.
  • the replacement of masks is carried out in a simple and time-saving manner in that several masks are arranged on a flexible strip and that there is a winding and unwinding roller for the flexible strip.
  • the arrangement of the strip on rolls also has the advantage that a large number of different masks are accommodated in a particularly space-saving manner.
  • Copper-clad Kapton foil or thin sheet is particularly suitable as a flexible mask material.
  • the hole configuration can be produced particularly simply by means of photochemical processes as are known for the production of printed circuit boards.
  • the thin sheet can be processed by punching, drilling or laser cutting.
  • ceramic material is also suitable, which has the advantage that it can be processed with relatively simple means. It can also be expedient to carry out the replacement of individual masks with the aid of an interchangeable frame which is brought into the desired position in a sliding guide.
  • the assignment and selection of the individual masks to the components currently to be processed is facilitated in that each mask is provided with an identification mark and in that the device is provided with a reproduction / reading device for the mark.
  • the individual masks can be identified both by an operator and by an electro-optical reader.
  • An essentially automatic mask change is made possible by the fact that a stepper motor is present which interacts with the reading device and an electronic control.
  • a very good beam guidance is already achieved in that a hot air dryer known per se is used as the heating element.
  • Impulse-like exposure to hot air can be achieved by using heated compressed air as the heat carrier, which also ensures a particularly precisely limited application of heat.
  • the heating of a gas serving as a heat carrier expediently takes place in a heating chamber with a heating element, consisting of a web with ribs arranged on both sides, in which several cylindrical heating rods are inserted.
  • a heating element is also to serve as a heat store, it is preferably made of metal. Instead, in view of a short response time and to save energy, it is advantageous that the heating element is made of ceramic material.
  • heating coils are placed or pressed onto the material. With the help of the sintering process, a diverse shape and distribution of the heating coils is possible.
  • a plurality of independently controllable heating wires are preferably provided to regulate the heating.
  • the number of heated wires is varied according to the respective requirements, which can be dependent on the material or assembly
  • the housing be thermally insulated. This is achieved in a particularly simple manner in that the housing is made from Kerzr .ik material. This material is also easy to machine mechanically.
  • the precise positioning of the espresso elements under the mask is simplified in that a light source is arranged behind the mask, so that the mask position is indicated by a light mark.
  • a light source is arranged behind the mask, so that the mask position is indicated by a light mark.
  • the light markings are therefore identical to the area exposed to the heat radiation. If the relevant component connections are therefore bridged to coincide with the light markings, the component is correctly positioned.
  • work on individual parts in particular is extremely efficient, without the need for expensive processing devices.
  • the light source a heating element provided with ribs or openings, and the mask are arranged in a line.
  • the heating element causes light to be scattered, so that uniform, diffuse light emerges from the mask, which is particularly suitable for indicating the position.
  • the light source is arranged laterally next to the heating element.
  • the light can also be directed into this scattering chamber via light-conducting materials.
  • Another advantage of the invention is that the positioning can be carried out with the aid of the IR rays emerging from the mask without any additional design effort.
  • FIG. 1 shows a perspective view of an exploded view of a first soldering device
  • FIG. 2 schematically shows a perspective view of a mask for use in the first soldering device according to FIG. 1;
  • Fig. 3 shows schematically a perspective vertical longitudinal section through a second soldering device
  • Fig. 4 shows schematically a vertical cross section through the second soldering device
  • FIG. 5 schematically shows a perspective view of a heating element
  • Fig. 6 shows schematically a third soldering device
  • a soldering device designated as a whole by 1 comprises, according to FIG. 1, a heat source consisting of a heating chamber 2 with heating elements 3, a fan 4, two light sources 5, a mask holder 6 and a height-adjustable stand 7 with which the soldering device device 1 is mounted such that it can be displaced in height relative to a carriage 8 which is movable in one plane.
  • a mask 9 made of temperature-resistant material is located in the mask holder 6.
  • a module carrier 10 with electronic components is fastened on the carriage 8 in a known manner. In order to keep the representation clear, only a single component is drawn in high magnification on the carrier.
  • a scattering chamber 15 adjoins the heating chamber 2 in the flow direction, at the exit of which the mask holder 6 with the mask
  • the mask 9 contains the exact positions of the soldering areas between the component 11 and the subrack
  • the mask openings represent an exact image of the connection pin configuration of the component 11. Since the hot air moves essentially in a straight line and in a jet shape after it emerges from the mask 9, the individual hot air jets hit the soldering surfaces on the terminal legs 13 exactly with the correspondingly precise positioning of the soldering device 1.
  • the positioning is facilitated by the fact that light is directed via the light sources 5 into the scattering chamber 15 in such a way that it serves as an undirected, uniformly radiating light source.
  • the mask 9 Through the openings of the mask 9, parallel light rays emerge, which are aligned exactly perpendicular to the slide 8 or to the subrack 10.
  • the course of the light rays 16 is identical to the emerging hot air rays.
  • the light beams 16 form luminous spots on the component 11 or on the subrack 10, so that the pins 8 can be positioned precisely below the mask 9 by a sideways displacement of the slide 8.
  • the soldering device 1 is arranged as close as possible to the component 11 by being displaced vertically via a carriage 17 guided on the stand 7.
  • FIG. 2 shows a perspective view of a strip 24 made of a heat-resistant film with several masks 9.
  • the holes 29 of the individual masks correspond to the scale of the arrangement of connecting pins of different components.
  • the strip 24 is held in a rigid frame 30 so that it can be inserted into a rail 31 and moved there for positioning the individual masks 9.
  • the rail 31 is part of the mask holder 6 according to FIG. 1.
  • FIG. 3 shows a vertical longitudinal section of a second soldering device 1 ', which differs in constructional details from the soldering device 1 according to FIG. 1.
  • the light source 5 ⁇ consists of multiple halogen lamps 43, which are disposed above the chamber Schu ⁇ . 2
  • the halogen emitters 43 are each separated from the heating chamber 2 underneath on the light exit side by a translucent diffuser 18, for example made of heat-resistant milk glass
  • the heating elements 3 partially shade the light source 5; Due to the numerous light deflections and reflections on the heating elements 3 and the walls of the heating chamber 2, a uniform light intensity sufficient for positioning the component 11 is nevertheless achieved.
  • the radial fans 14 are arranged laterally above the heating chamber 2 with a certain inclination.
  • the sucked-in air reaches the heating chamber 2 via channels 19, the diffusing disks 18 also serving as a guide surface and being convex to support this function.
  • FIG. 3 shows a conventional radial fan on the left side.
  • an alternative 14 ' is shown in cross section, which can be used when compressed air is to be introduced into the heating chamber 2. It has a hose connection 45 for an external compressed air source (not shown). This is followed in the direction of flow by an insert 44 made of porous sintered metal for distributing compressed air.
  • the heating elements 3 consist of a cuboid ceramic body with a central longitudinal web 32 which runs perpendicular to the plane of the drawing. It carries a plurality of ribs 33 on both sides, which the sucked-in air flows past. In the web there are several cylindrical recesses 34, each of which has a heating element 38 consisting of a heating wire 35 which is burned into a ceramic tube.
  • the heating rods 38 can be exchanged in a simple manner.
  • the mask 9 is located together with a multiplicity of other masks, the hole configuration of which is in each case with the Solder surfaces of different components are covered on a flexible film 20, for example a copper-clad Kapton film or a sheet metal film. By moving the film 20 perpendicular to the plane of the drawing, different masks can be brought into the operating position below the heating chamber 2.
  • the film 20 is contained on a reel and an unwind spool 22.
  • the two coils 22 can be designed in such a way that they are operated by an operator by hand, for example via knurled nuts (not shown), which are connected to the two coils 22 in a rotationally fixed manner.
  • a motor-driven drive can also be present.
  • the motor drive which preferably comprises a stepper motor 23, is controlled by an operator via a key input 26 and a control unit 25 connected downstream.
  • an opto-electronic reading device 27 the sensor of which consists, for example, of a diode row, that mask 9 is determined which is in the working position below the heating chamber 2.
  • a corresponding coding is attached to the film 20 for this purpose.
  • non-encrypted information can be mounted on the slide, which can 'be read by an operator at a window, is guided past which the film 20th
  • a display device is particularly helpful in the case of manual adjustment of the winding / unwinding spools 22.
  • FIG. 5 An alternative heating element 3 'to the heating element 3 shown in the previous figures is illustrated in FIG. 5 in a perspective view. It consists of a plurality of ceramic plates 36 arranged parallel to one another, onto each of which a heating coil 37 was baked using the thick or thin film method. The ceramic plates 36 are connected to one another via spacers 40 and combined to form a unit. The connections 39 of the individual heating coils are guided inside the spacers 40 so that they can be switched on independently of one another.
  • the heat source here consists of an infrared radiator 103 with a large-area radiation outlet 102 directed downward onto a printed circuit board 110.
  • the schematically reproduced infrared rays are designated by 116.
  • the radiation exit 102 is optionally limited by a continuously adjustable mask 109.
  • the mask 109 consists of several displaceable diaphragms 120, which are arranged in pairs. They consist of a thin, flexible and heat-resistant metallic foil material. To reduce heat dissipation, they also have poor thermal conductivity. Films with a thickness of approximately 0.1 mm have proven to be very suitable.
  • a first pair A is guided around the radiator 103 from above to before the beam exit 102.
  • a second pair B is moved transversely to it according to arrow 108.
  • the diaphragms 120, 120 ' are opened or closed in pairs in opposite directions by means of stepper motors 123 and 123' and spindle drives 122 and 122 'which are aligned transversely to one another.
  • the circuit board 110 Below the circuit board 110 is another infrared radiator 104, which is directed towards the underside of the board. In this way, the soldering points on the board surface are preheated to a predetermined temperature which is below a temperature critical for the components 111. The additional heat required for soldering / desoldering the components 111 is supplied in a targeted manner via the infrared radiator 103.
  • the diaphragms 120, 120 ' are arranged in pairs in such a way that they either enlarge or reduce a mask window 121, 121 "in the event of an anti-parallel movement, in that their edges 124 face or face each other This is achieved in that the drive shaft 125 of the spindle drives 122, 122 'engages in opposite threads with two orifice fastenings 126 assigned to the two orifices 120, 120.
  • the orifices 120, 120' are in the rest are guided in horizontal rails or grooves which are arranged laterally next to the radiation outlet 102 in the direction of movement.
  • FIG. 7 shows a partially sectioned plan view of the soldering device 100 according to line VII-VII in FIG. 6.
  • the infrared radiator 103 is not shown in the figure, so that the edges 124 of the panel 120 are unrestricted are visible. If the horizontal diaphragm fasteners 126 are moved outwards, for example, the edges 124 move inwards and reduce the mask window 121.
  • the edges 124 move inwards and reduce the mask window 121.
  • FIG. 7 shows a single pair of diaphragms 120 and the associated stepper motor 123 / spindle drive 122 in FIG. 7. If in practice one only provided such a pair of diaphragms with parallel edges 124, the size of the mask window 121 could only be changed in one direction.
  • a further pair of orifices 120 ' is arranged according to FIG. 8, the directions of movement of the two pairs of orifices 120, 120' being aligned transversely to one another.
  • Each pair of diaphragms is actuated and adjusted independently of one another, each with its own stepper motor and spindle drive, analogously in the manner shown in FIG. 6.7.
  • stepless displacement in both the X and Y directions can be used to set mask windows 121 that can be precisely specified.
  • the mask window is always in the center of the radiation exit 102.
  • the independent control of the panels 120, 120 'arranged in pairs allows a square or rectangular window shape to be set, so that the mask window 121 can be easily matched to the contours of the components 111 (FIG. 1) can be adjusted. It is therefore not necessary to have a fixed set of masks, which is particularly advantageous with regard to future component configurations.
  • FIG. 9 illustrates an example of a continuously adjustable mask 109 ", which consists of two diaphragms 120" which can be moved antiparallel.
  • the edges 124 of the diaphragms 120 "which determine the mask window 121" do not run parallel to one another over their entire width. Rather, they are provided symmetrically to the central axis running in the direction of movement with incisions 127 open to the front in such a way that the incisions 127 of the two relevant panels 120 "complement one another to form a rectangular mask window 121".
  • the incision 127 can also have a different geometric shape if this is expedient for adaptation to the components to be machined.
  • An anti-parallel movement of the two diaphragms 120 "results in a two-dimensional enlargement or reduction of the mask window 121".
  • the shape of the mask window 121 "can be varied even further.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Un dispositif utile pour réaliser ou défaire des jonctions par brasage entre un composant électronique pourvu de plusieurs connexions galvaniques et un support convient en particulier pour le montage en surface. Afin de diriger un courant de gaz chaud ou un rayonnement infra-rouge avec précision sur les connexions du composant et sur les surfaces correspondantes de brasage, un masque est prévu dont les orifices correspondent exactement à la configuration de la surface de brasage. De préférence, dans le cas du fonctionnement à l'air chaud, une source de lumière est agencée derrière le masque, de sorte que la configuration prédéterminée est reproduite exactement sur le substrat, sous forme de points de lumière, à des fins de positionnement.
EP88907314A 1987-11-04 1988-09-08 Dispositif de brasage Pending EP0391903A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3737457 1987-11-04
DE19873737457 DE3737457A1 (de) 1987-11-04 1987-11-04 Loetvorrichtung

Publications (1)

Publication Number Publication Date
EP0391903A1 true EP0391903A1 (fr) 1990-10-17

Family

ID=6339769

Family Applications (2)

Application Number Title Priority Date Filing Date
EP88907314A Pending EP0391903A1 (fr) 1987-11-04 1988-09-08 Dispositif de brasage
EP88201977A Expired - Lifetime EP0315228B1 (fr) 1987-11-04 1988-09-08 Appareil de soudage

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP88201977A Expired - Lifetime EP0315228B1 (fr) 1987-11-04 1988-09-08 Appareil de soudage

Country Status (6)

Country Link
US (1) US5196667A (fr)
EP (2) EP0391903A1 (fr)
JP (1) JPH03501907A (fr)
AT (1) ATE70153T1 (fr)
DE (2) DE3737457A1 (fr)
WO (1) WO1989004589A1 (fr)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4004602A1 (de) * 1990-02-15 1991-08-29 Asea Brown Boveri Verfahren zum vorbeloten eines substrats
US5309545A (en) * 1990-08-27 1994-05-03 Sierra Research And Technology, Inc. Combined radiative and convective rework system
JP2624411B2 (ja) * 1991-10-15 1997-06-25 松下電器産業株式会社 光加熱装置
DE4302976A1 (de) * 1992-07-22 1994-01-27 Bosch Gmbh Robert Vorrichtung und Verfahren zum Auflöten von Bauelementen auf Platinen
US5299279A (en) * 1992-12-01 1994-03-29 Ilc Technology, Inc. Short arc lamp soldering device
US5444814A (en) * 1993-11-01 1995-08-22 Hofius, Sr.; David V. Method of infrared welding on thermoplastic parts utilizing contoured energy reflecting shields
DE4401790C1 (de) * 1994-01-21 1995-04-06 Smt Maschinengesellschaft Mbh Vorrichtung zur Erzeugung einer Gasströmung in einer Lötanlage
US5532457A (en) * 1994-06-22 1996-07-02 International Business Machines Corporation Modified quartz plate to provide non-uniform light source
US5560543A (en) * 1994-09-19 1996-10-01 Board Of Regents, The University Of Texas System Heat-resistant broad-bandwidth liquid droplet generators
DE19542488A1 (de) * 1995-05-15 1997-05-22 Hainsberger Metallwerk Gmbh Verfahren und Vorrichtung zum Heißgasschweißen von Kunststoffolien
AU695731B2 (en) 1995-06-21 1998-08-20 Illinois Tool Works Inc. Infrared shield for capacitors
FI101138B (fi) * 1997-02-06 1998-04-30 Softeco Oy Sovitelma tuulilasin välikalvon muotoilulaitteistossa
US5960158A (en) 1997-07-11 1999-09-28 Ag Associates Apparatus and method for filtering light in a thermal processing chamber
US6247630B1 (en) * 1997-12-17 2001-06-19 Sun Microsystems, Inc. Apparatus and method for uniformly melting the solder attaching a surface mount device to a printed circuit board
DE10133217A1 (de) 2001-07-09 2003-01-23 Seho Systemtechnik Gmbh Verfahren und Vorrichtung zum Verlöten von elektrischen Bauteilen auf Kunststofffolie
US6799383B2 (en) * 2001-07-20 2004-10-05 3Sae Technologies, Inc. Multi-step fiber stripping
US6768083B2 (en) * 2002-09-19 2004-07-27 Speedline Technologies, Inc. Reflow soldering apparatus and method for selective infrared heating
US7026582B2 (en) * 2003-05-07 2006-04-11 Visteon Global Technologies, Inc. Vector transient reflow of lead free solder for controlling substrate warpage
WO2005055690A1 (fr) * 2003-12-03 2005-06-16 Rewatronik Gmbh Dispositif de chauffage et procede de chauffage pour des composants electroniques montes en surface
DE102004014749B3 (de) * 2003-12-03 2005-09-08 Rewatronik Gmbh Heizvorrichtung und Heizverfahren für oberflächenmontierte elektronische Bauelemente
JP2006173282A (ja) * 2004-12-14 2006-06-29 Denso Corp 電子部品のはんだ付け方法及びその装置
CN103028806A (zh) * 2011-09-30 2013-04-10 上海共联通信信息发展有限公司 一种集成电路板自动拆卸控制装置
US10563920B2 (en) * 2014-12-08 2020-02-18 Raytheon Company Oven-style nozzle for reworking operations involving bottom-side terminated components or other components
DE102017010550A1 (de) * 2017-11-14 2019-05-16 Roland Barkhoff Vorrichtung zum thermischen Verschweißen von Kunststoffteilen sowie Anordnung enthaltend eine solche Vorrichtung
US10864588B2 (en) * 2017-11-27 2020-12-15 Conbraco Industries, Inc. Ball valve retainer with soldering paste seal and method
CN110238475B (zh) * 2019-06-10 2021-04-27 吴招杰 一种废弃电路板的自动拆解装置

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3020714A (en) * 1956-07-03 1962-02-13 Snecma Device for controlling the jet of a reaction propulsion motor
CH392864A (de) * 1962-04-05 1965-05-31 Fischer Ag Georg Verschlussvorrichtung
US3230338A (en) * 1962-07-02 1966-01-18 Ibm Selective heating apparatus
US3194014A (en) * 1962-12-19 1965-07-13 Jr Walter B Wilson Variable thrust and variable direction nozzle
US3267249A (en) * 1963-09-26 1966-08-16 George J Veth Optical soldering technique and apparatus
US3457386A (en) * 1965-11-30 1969-07-22 Western Electric Co Soldering with radiant energy
US3516155A (en) * 1967-02-02 1970-06-23 Bunker Ramo Method and apparatus for assembling electrical components
US3520055A (en) * 1967-04-26 1970-07-14 Western Electric Co Method for holding workpieces for radiant energy bonding
US3586813A (en) * 1967-08-31 1971-06-22 Western Electric Co Simultaneous multiple lead bonding
DE1279150B (de) * 1967-10-05 1968-10-03 Telefonbau & Normalzeit Gmbh Verfahren zum Verbinden von Bauelementen mit Leiterplatten
DE2343235B2 (de) * 1973-08-28 1978-09-28 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zur Befestigung und Kontaktierung von elektrischen Subminiatur-Bauelementen auf gedruckten Schaltungen
US3868765A (en) * 1973-11-09 1975-03-04 Gen Motors Corp Laminated template for semiconductor device bonding
US4156124A (en) * 1977-04-14 1979-05-22 Optical Engineering, Inc. Image transfer laser engraving
FR2435884A1 (fr) * 1978-09-07 1980-04-04 Cit Alcatel Machine a souder un connecteur a une plaque de circuit imprime
US4321738A (en) * 1979-05-07 1982-03-30 International Business Machines Corp. Apparatus and method for rework dressing of a chip site
DE3118938A1 (de) * 1981-05-13 1982-12-02 Datograf Apparatebau Gmbh & Co, 7100 Heilbronn Vorrichtung zur markierung von oberflaechen durch laserstrahlung
JPS5929496A (ja) * 1982-08-10 1984-02-16 松下電器産業株式会社 多脚電子部品のハンダ付け方法
IL66817A0 (en) * 1982-09-16 1982-12-31 Gaz Moshe Special visual and sound effects in cinematography using beam lasers on positive and negative copies
JPS59110462A (ja) * 1982-12-14 1984-06-26 Matsushita Electric Ind Co Ltd はんだ付け方法
US4506820A (en) * 1983-07-29 1985-03-26 Brucker John P Desoldering device
JPH063816B2 (ja) * 1983-09-09 1994-01-12 株式会社日立製作所 半導体素子のはんだ付け装置
US4620659A (en) * 1984-04-02 1986-11-04 Pace, Incorporated Device for attaching modular electronic components to or removing them from an insulative substrate
JPH0227970Y2 (fr) * 1985-05-08 1990-07-27
JPH0773790B2 (ja) * 1985-10-11 1995-08-09 ソニー株式会社 リフロー半田付装置
CA1268022A (fr) * 1986-02-13 1990-04-24 Philip J. Bois Station et methode de reparation de cartes de circuits a composants montes en surface
US4961154A (en) * 1986-06-03 1990-10-02 Scitex Corporation Ltd. Three dimensional modelling apparatus
JPS62296958A (ja) * 1986-06-16 1987-12-24 Ushio Inc ハンダ付け方法
US4789096A (en) * 1987-05-04 1988-12-06 Unisys Corporation Method of soldering joints by moving them through a target area on which a stream of hot gas is focused
JPS63296296A (ja) * 1987-05-27 1988-12-02 Nippon Inter Electronics Corp 混成集積回路の製造方法
US4750664A (en) * 1987-07-20 1988-06-14 Furtek Edward J Apparatus and method for the repair of printed circuit boards

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO8904589A1 *

Also Published As

Publication number Publication date
EP0315228B1 (fr) 1991-12-04
DE3866678D1 (de) 1992-01-16
US5196667A (en) 1993-03-23
JPH03501907A (ja) 1991-04-25
WO1989004589A1 (fr) 1989-05-18
EP0315228A1 (fr) 1989-05-10
DE3737457A1 (de) 1989-05-18
ATE70153T1 (de) 1991-12-15

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