EP0383910A4 - Method and cassette for abrasive machining of the surface of parts - Google Patents
Method and cassette for abrasive machining of the surface of partsInfo
- Publication number
- EP0383910A4 EP0383910A4 EP19880904709 EP88904709A EP0383910A4 EP 0383910 A4 EP0383910 A4 EP 0383910A4 EP 19880904709 EP19880904709 EP 19880904709 EP 88904709 A EP88904709 A EP 88904709A EP 0383910 A4 EP0383910 A4 EP 0383910A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- parts
- base
- cassette
- housing
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B11/00—Machines or devices designed for grinding spherical surfaces or parts of spherical surfaces on work; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
Definitions
- the means of processing the processed parts are also known :; ⁇ base; ⁇ -
- the height of the housing is equal to the thickness of the casing, the installation and installation of the installation, the thickness of the housing determines the depth of the nest.
- the cradle, the laying and the base of the hard drive are connected between the screws.
- the task at hand resolves that: _, that in the process of abrasive processing .. the detail;:, and at all
- a good solution gives the opportunity to abrasive parts because of the marginally small thickness of the device and significant increase in the volume of the device.
- FIG. 2 schematically illustrates a cassette for an abrasive 10 processing, as per the invention
- Fig. 5 shows the transfer of parts from one cassette to another:
- Fig. ⁇ shows the processing of parts with a total speed of 20 parts.
- the variant of the cassette, according to the invention (Fig. 2), separates the remote washers 13, mounted on the connectors between the hats 7 and the disconnected I.
- ⁇ asse ⁇ z, ⁇ imenyaemaya of s ⁇ s ⁇ be for ⁇ b ⁇ azivn ⁇ ⁇ b ⁇ a- b ⁇ i, s ⁇ glasn ⁇ iz ⁇ b ⁇ e ⁇ eniyu, ⁇ ab ⁇ ae ⁇ ⁇ b ⁇ az ⁇ m follows: on ⁇ ze ⁇ n ⁇ s ⁇ ⁇ b ⁇ ymy 4 ( ⁇ g.Z) without ⁇ ien ⁇ atsii nasy ⁇ ayu ⁇ ⁇ b ⁇ aba ⁇ yvaemye Degas 10 and lib ⁇ ⁇ achz ⁇ elnymi ⁇ adialnym ⁇ ⁇ assegy movements, movements lib ⁇ ⁇ ug ⁇ vymi ⁇ u ⁇ i s ⁇ - s ⁇ bs ⁇ vuyug ⁇ adaniyu de ⁇ aley 10 into slots 9. Those remaining on the surface of the boom 4 degaly dump.
- the components with parts 10 are optimized for abrasive tool 15 (fig. ⁇ ), so that
- a cassette with convenient parts from one part (10) is combined with a similar empty cassette
- the cartridge cassettes are divided. ⁇ measure ⁇ ⁇
- '5 ⁇ azlichnymi is ⁇ dnymi ⁇ lschi ⁇ ami, vys ⁇ avlenie ⁇ b ⁇ iiy 4- ⁇ n ⁇ si ⁇ eln ⁇ ⁇ b ⁇ 2 ⁇ i increase uc ⁇ ⁇ dn ⁇ y ⁇ lschiny s de ⁇ ale ⁇ 10 ⁇ izv ⁇ dya ⁇ ⁇ u ⁇ em umenyieniya ⁇ lschiny ⁇ dis ⁇ an tsi ⁇ nn ⁇ y washer 13 at the same amount or gu na ⁇ b ⁇ .
- the optical glass ⁇ it is convenient.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/SU1988/000039 WO1989007508A1 (en) | 1988-02-17 | 1988-02-17 | Method and cassette for abrasive machining of the surface of parts |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0383910A1 EP0383910A1 (de) | 1990-08-29 |
EP0383910A4 true EP0383910A4 (en) | 1991-04-17 |
Family
ID=21617198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19880904709 Withdrawn EP0383910A4 (en) | 1988-02-17 | 1988-02-17 | Method and cassette for abrasive machining of the surface of parts |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0383910A4 (ja) |
JP (1) | JPH02503174A (ja) |
WO (1) | WO1989007508A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5205082A (en) * | 1991-12-20 | 1993-04-27 | Cybeq Systems, Inc. | Wafer polisher head having floating retainer ring |
US5443416A (en) * | 1993-09-09 | 1995-08-22 | Cybeq Systems Incorporated | Rotary union for coupling fluids in a wafer polishing apparatus |
JP3724869B2 (ja) * | 1995-10-09 | 2005-12-07 | 株式会社荏原製作所 | ポリッシング装置および方法 |
KR100485002B1 (ko) * | 1996-02-16 | 2005-08-29 | 가부시키가이샤 에바라 세이사꾸쇼 | 작업물폴리싱장치및방법 |
US6231428B1 (en) | 1999-03-03 | 2001-05-15 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
US6368189B1 (en) | 1999-03-03 | 2002-04-09 | Mitsubishi Materials Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU592582A1 (ru) * | 1976-01-12 | 1978-02-15 | Ленинградское Особое Конструкторское Бюро Автоматов И Револьверных Станков | Устройство дл установки микрошлифов на доводочных станках |
SU715307A1 (ru) * | 1977-06-27 | 1980-02-15 | Ордена Трудового Красного Знамени Завод Чистых Металлов Им.50-Летия Ссср | Кассета плоскодоводочного станка дл односторонней обработки деталей |
JPS53140698A (en) * | 1978-05-22 | 1978-12-07 | Hitachi Ltd | Method and device for wafer lapping |
SU831580A1 (ru) * | 1979-07-09 | 1981-05-23 | Горьковский Политехнический Институтим.A.A.Жданова | Устройство дл доводки плоскихпОВЕРХНОСТЕй дЕТАлЕй |
JPS59196161A (ja) * | 1983-04-21 | 1984-11-07 | Tohoku Metal Ind Ltd | 研麿方法 |
-
1988
- 1988-02-17 WO PCT/SU1988/000039 patent/WO1989007508A1/ru not_active Application Discontinuation
- 1988-02-17 JP JP50420488A patent/JPH02503174A/ja active Pending
- 1988-02-17 EP EP19880904709 patent/EP0383910A4/de not_active Withdrawn
Non-Patent Citations (4)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 3, no. 16 (M-48) 10 Februar 1979, & JP-A-53 140698 (HITACHI SEISAKUSHO K. K.) 7 Dezember 1978, * |
PATENT ABSTRACTS OF JAPAN vol. 9, no. 63 (M-365)(1786) 20 März 1985, & JP-A-59 196161 (TOUHOKU KINZOKU KOGYO K. K.) 7 November 1984, * |
See also references of WO8907508A1 * |
SOVIET INVENTIONS ILLUSTRATED Derwent Publications Ltd., Section General Week E09, abstract number C4126, E/09 April 14, 1982 & SU-A-831 580 (GORKI POLY) May 23, 1981 * |
Also Published As
Publication number | Publication date |
---|---|
EP0383910A1 (de) | 1990-08-29 |
JPH02503174A (ja) | 1990-10-04 |
WO1989007508A1 (en) | 1989-08-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 19891007 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE FR GB IT SE |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 19910301 |
|
AK | Designated contracting states |
Kind code of ref document: A4 Designated state(s): DE FR GB IT SE |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
18W | Application withdrawn |
Withdrawal date: 19920627 |