EP0374429B1 - Procédé de reproduction d'un corps plat structuré - Google Patents
Procédé de reproduction d'un corps plat structuré Download PDFInfo
- Publication number
- EP0374429B1 EP0374429B1 EP89119817A EP89119817A EP0374429B1 EP 0374429 B1 EP0374429 B1 EP 0374429B1 EP 89119817 A EP89119817 A EP 89119817A EP 89119817 A EP89119817 A EP 89119817A EP 0374429 B1 EP0374429 B1 EP 0374429B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- electrically conductive
- electrically insulating
- structured body
- structured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000000203 mixture Substances 0.000 claims abstract 7
- 239000000463 material Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 229920001169 thermoplastic Polymers 0.000 claims description 11
- 239000004416 thermosoftening plastic Substances 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 5
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 5
- 239000004793 Polystyrene Substances 0.000 claims description 4
- 229930182556 Polyacetal Natural products 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 229920006324 polyoxymethylene Polymers 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 2
- 239000004800 polyvinyl chloride Substances 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims 6
- 238000003825 pressing Methods 0.000 abstract description 5
- 238000002604 ultrasonography Methods 0.000 abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 239000002131 composite material Substances 0.000 description 14
- 229910052759 nickel Inorganic materials 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910021592 Copper(II) chloride Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000010327 methods by industry Methods 0.000 description 1
- 230000027272 reproductive process Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
Definitions
- the invention relates to a method for reproducing a structured, plate-shaped body, in particular a microstructured body, according to the preamble of the main claim.
- DE-PS 35 37 483 discloses a method for producing a multiplicity of plate-shaped microstructure bodies made of metal, in which negative molds of the microstructures are produced by repeated molding of a tool having the microstructures with an electrically insulating impression material and are galvanically filled with a metal, after which the negative forms are removed.
- the electrically insulating impression compound is connected to a further layer of electrically conductive impression compound, the thickness of the electrically insulating impression compound corresponding to the height of the microstructures in such a way that the electrically conductive impression compound contacts the end faces of the microstructures of the tool during the molding process.
- the tool is pressed into the layer of electrically insulating impression material until the end face of the microstructures of the tool touch the layer of electrically conductive impression material.
- FIG. 13 shows that the microstructures are pressed into the composite layer at 110 ° C. and the tool is only removed after the microstructures or the tool have cooled.
- the described method is particularly uneconomical for mass production, since the temperature cycle for pressing in the microstructures means additional process engineering and time expenditure.
- the layer height of the impression material must be exactly matched to the height of the microstructures of the tool.
- the pressing-in can only take place in the liquid or viscous state of the electrically insulating layer with a relatively large force development, since otherwise the risk of damage to the microstructures of the tool increases. Demoulding after the polymer solidifies requires a similarly high level of force. Therefore, release agents are usually added to the polymer. Since the polymer is in the solidified state during removal from the mold, an extremely precise movement of the tool is necessary in order to enable removal from the mold without damaging the tool and the negative mold and to reduce the removal forces.
- the object of the invention is to avoid the disadvantages mentioned.
- the pressing process of the tool into the impression material and the retraction of the tool should be simplified in such a way that the expenditure of force is significantly reduced and that heating and cooling steps can be dispensed with.
- the condition that the layer thickness of the electrically insulating impression material corresponds to the height of the structures to be molded should be eliminated.
- the object is achieved by the measures described in the characterizing part of the main claim.
- the composite layer is expediently produced in such a way that an electrically conductive layer is applied to a metal plate and is covered by a layer of an electrically insulating thermoplastic.
- the electrically conductive layer can consist of an electrically conductive particles such as. B. graphite-offset thermoplastics or consist of an electrically conductive thermoplastic or of a low-melting metal or a low-melting metal alloy.
- the materials polymethyl methacrylate, polycarbonate, polystyrene, PVC, ABS, polyacetal or polyamide can be used as the thermoplastic.
- thermoplastics can be used in the solidified state. A heating and cooling step is not necessary. The force required to press in and demold the structured body is significantly reduced. This reduces the risk of damage to the structured body and the body can be used for a higher number of reproductive processes. The precision effort for inserting the structured body right up to the interface between the electrically insulating and electrically conductive layer is eliminated; rather, the body is inserted into the composite layer until the end faces of the structure protrude into the electrically conductive layer.
- release agents can be dispensed with in many cases.
- the method according to the invention can thus be carried out considerably faster, less complex and thus more cost-effectively.
- honeycomb network 4 made of nickel, the z. B. was produced by the LIGA process (X-ray depths li thographie micro ga lvanoformung), reproduced many times.
- the honeycomb network has a honeycomb-like structure, the height of the honeycomb being 400 ⁇ m, the wall thickness 10 ⁇ m and the honeycomb width 100 ⁇ m.
- the honeycomb network forms a structured body with the outer dimensions 10 cm x 10 cm.
- the honeycomb network is connected to a stable metal plate 3 made of nickel. This can be done by overgrowing the structure during electroplating of the honeycomb network and covering it with a stable nickel layer.
- the stable metal plate is machined flat on the free side facing away from the honeycomb network.
- the plane-machined side of the stable metal plate is glued or soldered onto the sonotrode 1 of an ultrasonic welding machine that is usually used for welding thermoplastics.
- the solder or adhesive connection 2 of the metal plate and sonotrode is indicated in FIG. 1.
- a composite body is produced.
- This electrically conductive layer is covered with an electrically insulating layer 5 made of non-cross-linked PMMA. The last two layers 5 and 6 form the composite layer.
- PMMA thermoplastic polymethyl methacrylate
- the composite body is placed with its aluminum layer 7 on the anvil 8 of the ultrasonic welding machine.
- the anvil is provided with vacuum suction openings 9.
- the honeycomb network 4 is introduced with ultrasound support through the sonotrode 1 into the composite layers 5 and 6 and then also pulled out of the composite layer again with ultrasound support.
- FIG. 2 shows the impression 10 of the honeycomb network in the composite layer.
- the honeycomb network has penetrated the electrically insulating layer 5 and has penetrated into the electrically conductive layer 6.
- the imprint 10 of the honeycomb network is then galvanically filled with nickel, the composite body with the imprint 10 being connected as the cathode.
- the composite layer is then removed. This can be done, for example, with dichloromethane as the solvent, the graphite particles embedded in the electrically conductive layer 6 being rinsed away.
- the composite layer can also be removed by melting.
- the aluminum layer 7 comes off.
- the method can be modified.
- the composite body is also connected as a cathode.
- copper is first electroplated and only then is nickel.
- the reproduced honeycomb network thus obtained is treated with a means for the selective dissolution of copper, such as. B. a CuCl2 solution treated, the copper is selectively removed with embedded graphite particles.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Switches (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Printing Plates And Materials Therefor (AREA)
- Battery Electrode And Active Subsutance (AREA)
Claims (4)
procédé caractérisé en ce que :
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT89119817T ATE78524T1 (de) | 1988-12-17 | 1989-10-25 | Verfahren zur reproduktion eines strukturierten, plattenfoermigen koerpers. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3842611A DE3842611C1 (fr) | 1988-12-17 | 1988-12-17 | |
DE3842611 | 1988-12-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0374429A1 EP0374429A1 (fr) | 1990-06-27 |
EP0374429B1 true EP0374429B1 (fr) | 1992-07-22 |
Family
ID=6369460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP89119817A Expired - Lifetime EP0374429B1 (fr) | 1988-12-17 | 1989-10-25 | Procédé de reproduction d'un corps plat structuré |
Country Status (5)
Country | Link |
---|---|
US (1) | US4981558A (fr) |
EP (1) | EP0374429B1 (fr) |
JP (1) | JPH02197592A (fr) |
AT (1) | ATE78524T1 (fr) |
DE (1) | DE3842611C1 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19709137B4 (de) * | 1997-03-06 | 2005-12-15 | INSTITUT FüR MIKROTECHNIK MAINZ GMBH | Verfahren zur Herstellung und Magazinierung mindestens eines metallischen Mikrobauteils |
FR2793432B1 (fr) * | 1999-05-10 | 2001-07-06 | Gemplus Card Int | Procede de realisation d'un contact entre deux couches conductrices separees par une couche isolante |
US6422528B1 (en) * | 2001-01-17 | 2002-07-23 | Sandia National Laboratories | Sacrificial plastic mold with electroplatable base |
US7090189B2 (en) * | 2001-01-17 | 2006-08-15 | Sandia National Laboratories | Compliant cantilevered micromold |
DE10106135B4 (de) * | 2001-02-10 | 2005-03-10 | Micromotion Gmbh | Verfahren zur Herstellung von galvanisch abformbaren Negativformen mikrostukturierter Körper,insbesondere Zahnräder |
JP5143045B2 (ja) * | 2008-07-09 | 2013-02-13 | 富士フイルム株式会社 | 微細構造体およびその製造方法 |
DE102012206097A1 (de) | 2012-04-13 | 2013-10-17 | Robert Bosch Gmbh | Verfahren zur Herstellung von Metallstrukturen durch Abformung und Galvanik |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3002910A1 (de) * | 1980-01-28 | 1981-07-30 | Basf Ag, 6700 Ludwigshafen | Verfahren zur herstellung eines formkoerpers aus pulver- bis granulatfoermigem thermoplastischem kunststoff |
DE3206820C2 (de) * | 1982-02-26 | 1984-02-09 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe | Verfahren zum Herstellen von Trenndüsenelementen |
DE3537483C1 (de) * | 1985-10-22 | 1986-12-04 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe | Verfahren zum Herstellen einer Vielzahl plattenfoermiger Mikrostrukturkoerper aus Metall |
-
1988
- 1988-12-17 DE DE3842611A patent/DE3842611C1/de not_active Expired - Fee Related
-
1989
- 1989-10-25 EP EP89119817A patent/EP0374429B1/fr not_active Expired - Lifetime
- 1989-10-25 AT AT89119817T patent/ATE78524T1/de not_active IP Right Cessation
- 1989-12-13 JP JP1321573A patent/JPH02197592A/ja active Pending
- 1989-12-18 US US07/452,030 patent/US4981558A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0374429A1 (fr) | 1990-06-27 |
ATE78524T1 (de) | 1992-08-15 |
DE3842611C1 (fr) | 1990-02-22 |
US4981558A (en) | 1991-01-01 |
JPH02197592A (ja) | 1990-08-06 |
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