EP0259069B1 - Bois de charpente de fibres de bois - Google Patents

Bois de charpente de fibres de bois Download PDF

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Publication number
EP0259069B1
EP0259069B1 EP87307378A EP87307378A EP0259069B1 EP 0259069 B1 EP0259069 B1 EP 0259069B1 EP 87307378 A EP87307378 A EP 87307378A EP 87307378 A EP87307378 A EP 87307378A EP 0259069 B1 EP0259069 B1 EP 0259069B1
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EP
European Patent Office
Prior art keywords
panel
lumber
thickness
wafers
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP87307378A
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German (de)
English (en)
Other versions
EP0259069A2 (fr
EP0259069A3 (en
Inventor
Derek Barnes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TRUS JOIST MACMILLAN A LP
Original Assignee
MacMillan Bloedel Ltd
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Filing date
Publication date
Application filed by MacMillan Bloedel Ltd filed Critical MacMillan Bloedel Ltd
Priority to AT87307378T priority Critical patent/ATE83190T1/de
Publication of EP0259069A2 publication Critical patent/EP0259069A2/fr
Publication of EP0259069A3 publication Critical patent/EP0259069A3/en
Application granted granted Critical
Publication of EP0259069B1 publication Critical patent/EP0259069B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27BSAWS FOR WOOD OR SIMILAR MATERIAL; COMPONENTS OR ACCESSORIES THEREFOR
    • B27B1/00Methods for subdividing trunks or logs essentially involving sawing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27NMANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/04Manufacture of substantially flat articles, e.g. boards, from particles or fibres from fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27NMANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08Moulding or pressing
    • B27N3/10Moulding of mats
    • B27N3/14Distributing or orienting the particles or fibres
    • B27N3/143Orienting the particles or fibres

Definitions

  • the present invention relates to waferboard lumber, more particularly the present invention relates to lumber products formed from wafers oriented to be substantially parallel to the longitudinal axis of the lumber product and a method of producing such product.
  • Stofko discusses panel products and lumber products presumably moulded as taught in his patent and emphasizes the importance of slenderness ratio, i.e. the ratio of length to thickness of the wood particles to obtain the desired structural properties at an acceptable density.
  • U.S. patent 3,956,555 issued May 11, 1976 to McKeen describes the manufacture of a laminted beam from a combination of oriented and random wood particles in a press by laying alternative strips of oriented and random particles and then consolidating under pressure to form a panel and splitting the oriented strips to divide the panel in to structures having end side sections that are oriented and would function similar to flanges of an I beam interconnected by a random oriented section that would function as the web of an I beam.
  • This is a relatively complicated structure with limited strength and suitable only for use with the products oriented to be loaded perpendicular to the split faces.
  • the density profile through the panel is such that the skins of the panel have maximum density and the core has the least density.
  • the strength of the skins of the panel is higher than the strength of core, however, since panels are normally used with the core extending along the neutral axis of the bending moment such a density distribution is not a major factor in determining bending strength.
  • the rate of pressure application in a press can be used to change the density profile through the thickness of the panel.
  • the rate of temperature rise coordinated with the rate of pressure application can be used to change the density profile with thickness to the panel.
  • Wafers so produced are generally relatively thin and have a width many times greater than their thickness (thickness being determined by the depth of cut of the blade and the width being determined by the deflection of the cut wafer by the breaker bar of the knife).
  • the present invention relates to a waferboard lumber product and a method of making same, said waferboard lumber product comprising discrete lengths of lumber having thicknesses of at least 1 inch (25 mm) made from a single layer panel formed from wood wafers, said wafers being oriented to have their lengths orientated to the longitudinal length of the panel measured in the major plane of said panel with a mean deviation of 0 to 10 degrees and a mean deviation measured in a minor longitudinal plane through the panel perpendicular to the said major plane of from 0 to 5 degrees, said wafers having an average effective length of at least 8 inches (200 mm) said lengths of lumber having cut edges defined in said panel by cuts extending substantially longitudinally of said panel said cuts being spaced defined the width of said lumber.
  • said wafers will have a maximum average thickness of 0.15 inches (4 mm) and an average width of at least 0.25 inches (6 mm).
  • said lumber product will have a substantially uniform density to thickness profile.
  • Present invention also relates to a method of making a lumber product comprising laying up a single layer panel having a thickness of at least 1 inch (25 mm) from a plurality of wafers, orienting the longitudinal length of said wafers relative to the longitudinal axis of said panel so that the mean deviation of the lengths of said wafers to said longitudinal axis of said panel measured in the major plane of said panel is in the range of 0 to 10 degrees and a mean deviation measured in a longitudinal plane through said panel perpendicular to said major plane of from 0 to 5 degrees, said wafers having an average effective length of at least 8 inches (200 mm) consolidating said layup of wafers under heat and pressure to set adhesive coating said wafers and consolidate said layup into said panel having a substantially uniform density to width profile and cutting the panel along spaced longitudinally extending lines to divide said panel into a plurality of discrete lumber lengths having a width equal to the spacing between said longitudinal cuts.
  • the consolidating conditions will be controlled to yield a panel having a substantially uniform density to thickness profile.
  • the density of the lumber products so produced will be in the order of 25 lb/ft3 (0.4 g/cm3) through 50 lb/ft3 (0.8 g/cm3). Also preferably the density will not deviate more than 3% from the mean through the panel thickness.
  • Figure 1 is a schematic plan view of a plan for carrying out the present invention.
  • Figure 2 is a schematic side elevation of the plan of Figure 1.
  • Figure 3 is a partial plan view of a board or panel constructed in accordance with the present invention, illustrating the lay of wafers therein.
  • Figure 4 is a sectional view along the line 4-4 in Figure 3.
  • Figure 5 is a graph of density versus thickness illustrating a preferred density profile with thickness through the board of Figure 4.
  • Figure 6 is a sectional view along the line 6-6 in Figure 4.
  • wafer used throughout this disclosure is intended to define wood particles formed by a waferizer as distinct from pulp chips, sawdust, particles or lengths cut directly from a round log or formed by clipping veneer.
  • the size of the sliced wafers used with the present invention is critical to obtaining the required strength to provide a lumber product to replace conventional lumber with a product having essentially the same strength as the lumber being replaced and without a significant change in density.
  • adhesive coated wood wafers are brought to the layup forming equipment via a suitable in-feed device wherein the wafers are relatively uniformly laterally spread and are then fed to an orienting device 12 (see for example U.S. Patent 4,494,969 issued January 22, 1985 to Knudson et al) that orients the wafers with their longitudinal dimensions substantially aligned as will be described in more detail here below.
  • an orienting device 12 see for example U.S. Patent 4,494,969 issued January 22, 1985 to Knudson et al
  • the mat 14 so formed has a substantially uniform density to width profile and is either layed on a caul plate and transported to a press such as a multiopening press schematically illustrated in 16 or is carried by a continuous belt or the like to a continuous press 16 and the mat or layup 14 is pressed and consolidated to form a panel 18, say a panel having a total width of 8 feet (2400 mm) and the required thickness (e.g. for nominal 2 inch (50 mm) lumber the consolidated panel must have a 1-1/2 inch (38 mm) thickness). If a continuous press 16 is used panel 18 is continuously moved from the press 16 in the direction of arrow 20, i.e.
  • the press 16 is not a continuous press, i.e. is a multiopening press or the like the mat 14 is carried on a caul plate to be consolidated into a panel, the panel will be withdrawn as indicated by arrow 20, separated from their respective caul plates (not shown) and fed one following the other in the direction of the arrow 20, i.e. with the length of the wafers aligned with the arrow 20 into cutting station 22.
  • Cutting station 22 as schematically illustrated is made up of a purality of spaced circular saws or cutters 24 axially moveably mounted via hubs 26 on a shaft 28. Hubs 26 are mounted in a conventional manner to be driven by the shaft 28 and yet slidable axially on shaft 28 so that the position of the saws 24 may be adjusted thereby adjust the width of the spaces between the saws which determines the width as indicated by the dimensions W1, W2, W3, etc of the lumber products 30 formed from panel 18 (which may be any appropriate width).
  • Figure 2 further provides a schematic illustration of an automatic spacing device adapted to adjust spacing between saws 24 including a yoke 32 that engages its respective hub 26 and is moved along a shaft 34 by a suitable drive bar 36.
  • each drive bar 36 for each yoke 32 and one yoke 32 for each of the blades 24 to in known manner adjust the position of the saw 24 along the shaft 28.
  • the spacing of the saws or cutters 24, i.e. widths W1, W2, etc, will be greater than the thickness T of the panel.
  • the two outermost blades i.e. the top and bottom blade 24 in Figure 1 are used to trim the panel 18 and provide trimmed strips as indicated at 38.
  • a suitable cut off saw schematically indicated at 40 traverses the panel 18 after the appropriate length of cut boards 30 has passed the saws 24 to cut the boards off to the required lengths.
  • the saw 40 will move both transversely and longitudinally so that a square cut is provided across the width the panel 18 (see the arrows 42 and 44 in Figure 1) and where discrete panels 18 are formed on caul plates the cut off saw may not be necessary but may be useful for trimming to length.
  • press 16 be operated as above indicated to provide a panel 18 of adequate strength which requires that wafers having at least an average length of about 8 inches (200 mm) (length is always considered as measured in direction of the grain of the wafer) preferrably an average length of 10 to 24 inches (250-600 mm) be used. Normally such wafers will be cut at an average thickness not exceeding 0.15 inches (4 mm), preferably less than 0.1 inches (2.5 mm) with the thicker wafers normally being used to produce the thicker panel.
  • the wafers will preferably have an average width of at least 0.25 inches (6 mm), more preferably at least 0.5 inches (12 mm) and in many cases will have a width to thickness ratio of over about 10.
  • the wafers must be oriented with their length direction aligned relative to the longitudinal direction of the lumber which as above indicated is formed by cutting substantially parallel to the longitudinal direction of the panel 18 or parallel to the direction of outfeed from the press 16. This orientation will never be 100% in the machine direction, i.e. parallel to the longitudinal axis of the panel 18 and the axial length of the lumber products 30, but will be such that the mean deviation of the wafer lengths (fiber direction) from the longitudinal axis of the panel 18 and thus form the longitudinal axis of the lumber product is within the range of approximately 0 to 10 degrees when measured in the major plane of the panel 18, i.e. measured on say the upper surface of the panel 18 as indicated at 46 in Figures 2 and 3.
  • the mean deviation measured in a plane extending longitudinally to the panel 18 or boards 30 say parallel to the cut faces formed by the saws 24 (i.e. perpendicular to the plane 46) will normally be in the range of 0 to 5 degrees as schematically illustrated by the angle A in Figure 4.
  • the angle A will preferably be small closer to the 0 to 3 degrees since if the angle A is too large and wafers extend almost from one major surface of the panel to the other, a weak product will be produced and this must be avoided.
  • Press cycle will be controlled (including the rate of change of temperature assuming a continuous press) depending on the product to be produced but normally will be such that the density to thickness profile is substantially constant, i.e. a deviation of less than 3% from the mean for a normal lumber product.
  • the faces of the panel 18 contacting the press plates will have a slightly higher density than the central portion of the panels.
  • the uniform profile of density to thickness is significantly more important with the structural lumber product of the present invention which will normally be loaded perpendicular to its cut or edge face, i.e. parallel to the face represented by surface 46 of panel 18 so that the major faces of the panel which contact the platens of the press will be aligned with the load and the center or core of the panel no longer forms the neutral axis when the structural member is being stressed.
  • suitable wafers as above described are first formed in a mat 14 of approximately 4 times the desired finished thickness of the panel 18 which will normally limit the maximum thickness of the panel to about 4 inches (100 mm).
  • the wafers will be precoated with adhesive normally a phenol formaldehyde resin although isocyanates may also be used or any other suitable adhesive.
  • adhesive normally a phenol formaldehyde resin although isocyanates may also be used or any other suitable adhesive.
  • phenol formaldehyde a dried powdered resin will be used although with proper application a wet or liquid resin may also be used. Change in resin may require a change in the pressing schedule to ensure proper curing of the resin when the mat is under pressure.
  • the thickness of the panel 18 will be 1-1/2 inch (40 mm) and the cutters 24 will be separated to cut the panel 18 into strips and to produce a 2 ⁇ 6; 2 ⁇ 8; 2 ⁇ 10; 2 ⁇ 12; or even 2 ⁇ 16 inch; etc, lumber as desired.
  • the wider the width dimension the more valuable the product yet it is as easy to manufacture a 2 ⁇ 16 inch board as it is to manufacture a 2 ⁇ 4 utilizing the present invention and any desired product mix may be made.
  • the length of the boards so formed is determined simply by activation of the cutoff saw 40 to cut the boards to the desired length. If caul plates are used the saw 40 may simply be used to trim the lumber to length or alternatively it could be trimmed at some other stage. In this case the maximum length is determined by the length of the caul plate.
  • a single layer oriented wafer mat was hand felted aspen wafers onto an 8 foot (2400 mm) long caul plate.
  • the wafers used were 12 inches long and 0.025 inches (0.6 mm) thick and 1-1/4 inch (30 mm) wide and were produced at MacMillan Bloedel's Thunder Bay Division. 5% powder phenol formaldehyde resin and 2% slack wax were applied to the wafers.
  • a matching 8 foot caul plate was placed on top of the mat before pressing.
  • the felted wafer mat was then advanced through a hot press (in the Research Centre under lab conditions) in 2 foot stages. Each stage was pressed for 20 minutes at a press temperature of 210°C.
  • the resulting product had a thickness of 1-1/2 inches and an average density of 40 lb/ft3 (0.64 grams/cc).
  • the modulus of elasticity (MOE) of the section so produced was 1,697,000 psi (11.70 GPa) measured while applying forces parallel to the faces formed by the caul plates, i.e. in a direction equivalent to perpendicular to the cut faces of the lumber product.
  • a relatively thin aspen veneer 0.05 inch (1 mm) thick at 10% moisture content was clipped to 12 inch length by 1/2 inch width strips to make an 8 foot long, 11 inch wide by 2-1/2 inch thick oriented lumber billet utilizing a continuous press, microwave heating, 6% powdered phenol formaldehyde resin and 2% slack wax.
  • a mat was formed from wafers precoated with adhesive and oriented to substantially align with the length of the lumber product and passed through the press over a period of 9 minutes.
  • the average density of the resultant lumber was 40 lb/ft3 (0.64 grams/cc) at 12% moisture and the resulting board had an average MOE of 1,650,000 psi add a modulus of rupture (MOR) of 6900 psi.
  • Another board made in a similar manner had a density of 33.75 lb/ft3 (0.54 g/cc), a MOE of 1,500,000 psi and a MOR of 5,500 psi.
  • Examples 1 and 2 clearly demonstrate that it is practical to manufacture lumber products having acceptable physical characteristics for structural lumber applications when made from a species such as aspen which is not a good species for such materials and at a final density that while higher than aspen is similar to that of many species.

Claims (8)

  1. Produit du type bois d'oeuvre présentant une épaisseur d'au moins 25 mm (1 pouce), qui a été découpé à partir d'un panneau fait de particules de bois de forme allongée, orientées avec leur longueur présentant une déviation moyenne de 0-10° par rapport à l'axe longitudinal du panneau, mesurée dans un plan principal du panneau et une déviation moyenne de 0-5°, mesurée dans un plan secondaire s'étendant selon la direction longitudinale du panneau et perpendiculairement au plan principal, le produit du type bois d'oeuvre présentant une paire de bords coupés, espacés l'un de l'autre pour définir sa largeur, et s'étendant sensiblement parallèlement à l'axe longitudinal du panneau à partir duquel le bois d'oeuvre est coupé, produit caractérisé par le fait que les particules de bois sont des tranches formées par une trancheuse et présentant une épaisseur de moins de 2,5 mm (0,1 pouce), une largeur d'au moins 12 mm (0,5 pouce), un rapport largeur-épaisseur supérieur à 10 et une longueur moyenne, mesurée selon le fil, d'au moins 200 mm (8 pouces), ce par quoi le produit du type bois d'oeuvre convient pour emploi comme produit du type bois d'oeuvre de structure présentant un module d'élasticité d'au moins 10,34 GPa (1 500 000 psi) avec une densité équivalente à 643,2 kg/m³ (40 livres par pied cubique).
  2. Produit du type bois d'oeuvre selon la revendication 1, caractérisé par le fait qu'il présente une densité sur la plage de 0,4 - 0,8 g/cm³ (25-50 livre/pied cube)
  3. Produit du type bois d'oeuvre selon la revendication 1 ou la revendication 2, caractérisé par le fait que les tranches ont une épaisseur qui est inférieure à 1,25 mm (0,05 pouce).
  4. Produit du type bois d'oeuvre selon l'une quelconque des revendications 1-3, caractérisé par le fait que les tranches ont une longueur moyenne valant entre 250 et 600 mm (10 et 24 pouces).
  5. Produit du type bois d'oeuvre selon l'une quelconque des revendications 1-4, caractérisé par le fait qu'il a une densité sensiblement uniforme sur toute l'épaisseur.
  6. Produit du type bois d'oeuvre selon l'une quelconque des revendications 1-4, caractérisé par le fait que, sur toute l'épaisseur, sa densité s'écarte de moins de 3% de la densité moyenne.
  7. Procédé de fabrication de produits du type bois d'oeuvre à partir d'un tapis de particules de bois de forme allongée qui sont orientées dans le tapis avec leur longueur présentant une déviation moyenne de 0-10° par rapport à l'axe longitudinal du tapis, mesurée dans son plan principal, et une déviation moyenne de 0-5°, mesurée dans un plan secondaire s'étendant selon la direction longitudinale du tapis et perpendiculairement au plan principal, procédé caractérisé par les étapes suivantes:
    (a) produire les particules de bois sous forme de tranches dans une trancheuse, les tranches présentant une longueur moyenne, mesurée selon le fil, d'au moins 200 mm (8 pouces), une épaisseur de moins de 0,25 mm, une largeur d'au moins 12 mm et un rapport largeur-épaisseur supérieur à 10,
    (b) consolider le tapis par la chaleur et sous pression pour lier ensemble les tranches en utilisant un adhésif pré-appliqué aux tranches, formant ainsi un panneau; et
    (c) couper le panneau dans le sens longitudinal en des positions espacées l'une de l'autre, pour diviser le panneau en une pluralité de produits du type bois d'oeuvre, présentant chacun une largeur déterminée par l'espacement des coupes et une épaisseur déterminée par l'épaisseur du panneau, les coupes longitudinales étant alignées avec l'axe longitudinal du tapis.
  8. Procédé selon la revendication 7, caractérisé par le fait que la consolidation du tapis pour former le panneau se fait dans des conditions permettant de produire un panneau présentant une densité sensiblement uniforme sur toute l'épaisseur du panneau.
EP87307378A 1986-09-03 1987-08-20 Bois de charpente de fibres de bois Expired - Lifetime EP0259069B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT87307378T ATE83190T1 (de) 1986-09-03 1987-08-20 Holzfaserbauholz.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CA000517415A CA1281528C (fr) 1986-09-03 1986-09-03 Bois d'oeuvre fait de copeaux
CA517415 1986-09-03

Publications (3)

Publication Number Publication Date
EP0259069A2 EP0259069A2 (fr) 1988-03-09
EP0259069A3 EP0259069A3 (en) 1989-02-15
EP0259069B1 true EP0259069B1 (fr) 1992-12-09

Family

ID=4133854

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87307378A Expired - Lifetime EP0259069B1 (fr) 1986-09-03 1987-08-20 Bois de charpente de fibres de bois

Country Status (10)

Country Link
EP (1) EP0259069B1 (fr)
JP (1) JP2527761B2 (fr)
CN (1) CN1008076B (fr)
AT (1) ATE83190T1 (fr)
AU (1) AU608237B2 (fr)
CA (1) CA1281528C (fr)
DE (1) DE3782990T2 (fr)
ES (1) ES2106009T3 (fr)
FI (1) FI86822C (fr)
NZ (1) NZ221605A (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5248541A (en) * 1992-03-06 1993-09-28 Tilby Sydney E Board of non-timber hardwood-replacement lumber
DE19858096A1 (de) * 1998-12-16 2000-06-21 Timberex Timber Exports Ltd Vorrichtung und Verfahren zum Streuen von Teilchen zu einem Vlies
DE10037508B4 (de) * 2000-08-01 2016-03-10 Dieffenbacher GmbH Maschinen- und Anlagenbau Verfahren und Anlage zur Herstellung von Holzwerkstoffplatten
US7740929B2 (en) 2004-01-27 2010-06-22 Lignor Limited Hard wood strand products
DE102009021016A1 (de) * 2009-05-13 2010-11-18 Dieffenbacher Gmbh + Co. Kg Verfahren zur Herstellung einer hochdichten Werkstoffplatte aus holz- oder holzähnlichen Rohstoffen, eine Werkstoffplatte und eine Verwendung der Werkstoffplatte
CN102699977A (zh) * 2012-06-21 2012-10-03 衡阳师范学院 一种利用黄花菜秸秆制作刨化板的方法
CN109834776B (zh) * 2019-03-11 2021-10-15 广平凯王压密科技有限公司 一种基于高周波无胶压密技术的碎木压密材料及方法
CN113843873A (zh) * 2021-09-30 2021-12-28 中国热带农业科学院橡胶研究所 一种室内用椰子树木材加工生产方法
EP4286123A1 (fr) * 2022-05-30 2023-12-06 ETH Zurich Matériaux en bois à base de tige

Citations (1)

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Publication number Priority date Publication date Assignee Title
US4255477A (en) * 1978-10-24 1981-03-10 Holman John A Artificial board of lumber

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FR1011675A (fr) * 1949-03-01 1952-06-25 Perfectionnements apportés à la fabrication et à l'application de matériaux en bois agglomérés
US4122236A (en) * 1977-05-09 1978-10-24 Holman John A Artificial board of lumber and method for manufacturing same
US4241133A (en) * 1979-04-02 1980-12-23 Board Of Control Of Michigan Technological University Structural members of composite wood material and process for making same
JPS55164141A (en) * 1979-06-09 1980-12-20 Masao Takahashi Veneer for use in plywood, dress board and the like
US4492726A (en) * 1982-06-16 1985-01-08 Macmillan Bloedel Limited High wet strength waferboard
JPS5950509A (ja) * 1982-09-14 1984-03-23 Nec Corp コイル線材
US4494919A (en) * 1982-09-20 1985-01-22 Macmillan Bloedel Limited Apparatus for laying a mat of wood strands
DE3323639A1 (de) * 1983-06-30 1985-01-03 Bison-Werke Bähre & Greten GmbH & Co KG, 3257 Springe Verfahren und vorrichtung zur kompensation von dickenschwankungen beim kontinuierlichen pressen von platten
US4610913A (en) * 1986-02-14 1986-09-09 Macmillan Bloedel Limited Long wafer waferboard panels
US4751131A (en) * 1986-02-14 1988-06-14 Macmillan Bloedel Limited Waferboard lumber

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Publication number Priority date Publication date Assignee Title
US4255477A (en) * 1978-10-24 1981-03-10 Holman John A Artificial board of lumber

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Thomas M. MALONEY "Modern Particleboard & Dry-process Fiberboard Manufacturing", 1977, MILLER FREEMAN PUBLICATIONS, pages 178-216 *

Also Published As

Publication number Publication date
FI86822B (fi) 1992-07-15
EP0259069A2 (fr) 1988-03-09
DE3782990D1 (de) 1993-01-21
CA1281528C (fr) 1991-03-19
ES2106009T3 (es) 1997-11-01
NZ221605A (en) 1991-02-26
FI873811A (fi) 1988-03-04
CN87106342A (zh) 1988-04-13
JP2527761B2 (ja) 1996-08-28
EP0259069A3 (en) 1989-02-15
AU7719787A (en) 1988-03-10
FI86822C (fi) 1992-10-26
DE3782990T2 (de) 1993-04-29
CN1008076B (zh) 1990-05-23
AU608237B2 (en) 1991-03-28
FI873811A0 (fi) 1987-09-02
ATE83190T1 (de) 1992-12-15
JPS63107507A (ja) 1988-05-12

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