EP0234246A1 - Schaltkontaktstücke für Vakuumschaltgeräte und Verfahren zu deren Herstellung - Google Patents
Schaltkontaktstücke für Vakuumschaltgeräte und Verfahren zu deren Herstellung Download PDFInfo
- Publication number
- EP0234246A1 EP0234246A1 EP87100621A EP87100621A EP0234246A1 EP 0234246 A1 EP0234246 A1 EP 0234246A1 EP 87100621 A EP87100621 A EP 87100621A EP 87100621 A EP87100621 A EP 87100621A EP 0234246 A1 EP0234246 A1 EP 0234246A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- additives
- base material
- contact pieces
- melting
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000463 material Substances 0.000 claims abstract description 47
- 239000000654 additive Substances 0.000 claims abstract description 34
- 238000002844 melting Methods 0.000 claims abstract description 15
- 230000008018 melting Effects 0.000 claims abstract description 15
- 230000008569 process Effects 0.000 claims abstract description 11
- 239000000843 powder Substances 0.000 claims abstract description 9
- 238000007792 addition Methods 0.000 claims abstract description 4
- 238000007740 vapor deposition Methods 0.000 claims abstract description 4
- 239000008187 granular material Substances 0.000 claims abstract 2
- 239000012071 phase Substances 0.000 claims description 11
- 229910017629 Sb2Te3 Inorganic materials 0.000 claims description 4
- 229910018030 Cu2Te Inorganic materials 0.000 claims description 3
- 239000007791 liquid phase Substances 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 229910002688 Ag2Te Inorganic materials 0.000 claims description 2
- 229910052684 Cerium Inorganic materials 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000005219 brazing Methods 0.000 claims description 2
- 229910052791 calcium Inorganic materials 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- 229910000765 intermetallic Inorganic materials 0.000 claims description 2
- 238000007733 ion plating Methods 0.000 claims description 2
- 229910052746 lanthanum Inorganic materials 0.000 claims description 2
- 229910052745 lead Inorganic materials 0.000 claims description 2
- 229910052744 lithium Inorganic materials 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229910052711 selenium Inorganic materials 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 229910052714 tellurium Inorganic materials 0.000 claims description 2
- 101100365539 Drosophila melanogaster Sesn gene Proteins 0.000 claims 1
- 229910013856 LiPb Inorganic materials 0.000 claims 1
- 229910005642 SnTe Inorganic materials 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- MFIWAIVSOUGHLI-UHFFFAOYSA-N selenium;tin Chemical compound [Sn]=[Se] MFIWAIVSOUGHLI-UHFFFAOYSA-N 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000010949 copper Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000002800 charge carrier Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- YBNMDCCMCLUHBL-UHFFFAOYSA-N (2,5-dioxopyrrolidin-1-yl) 4-pyren-1-ylbutanoate Chemical compound C=1C=C(C2=C34)C=CC3=CC=CC4=CC=C2C=1CCCC(=O)ON1C(=O)CCC1=O YBNMDCCMCLUHBL-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000002482 conductive additive Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/0203—Contacts characterised by the material thereof specially adapted for vacuum switches
Definitions
- the invention relates to switch contact pieces for vacuum switching devices, consisting of a base material with additions of easily vaporizable components for generating a sufficiently conductive switching path during the switch-off process.
- the invention also relates to methods for producing such contact pieces.
- the object of the invention is therefore to provide switch contact pieces of the type mentioned at the outset which have sufficient overvoltage-free switching behavior with good power switching capacity and are problem-free with regard to the connection technology with contact piece supports made of copper.
- a major advantage of the solution according to the invention is that it can achieve both the desired overvoltage-free switching behavior and a satisfactory power switching capacity. Both are based on the fact that at small and medium-sized switching currents, where the surge-free switching behavior is required, the applied layer of easily evaporable additives takes effect and that at high currents, which require a safe switch-off, the high-energy switching arc pierces the base material and there does not release any other easily evaporable additives that impermissibly impede the extinguishing process.
- Another advantage of the solution according to the invention is that a high quality and ductile base material can be used.
- the known vacuum brazing processes can be retained when connecting to the contact carrier or the contact bolt, i.e. there are no problems with the connection technology.
- a layer of selected additives should be applied to a base body made of a suitable contact material, for example of CuCr melting material:
- the layer thickness should preferably be a few 1/100 mm to a few 1/10 mm. It However, layers of greater thickness (a few mm) can also be used if the layer is mixed with constituents of the base material for procedural reasons.
- Suitable additives are, in particular, intermetallic compounds of the elements Se, Te, Pb, Bi with one another or with Ag, Al, Ba, Ca, Ce, In, La, Li, Sb, Sn, Sr, Ti or Zr or with Cu as the basic material. Mg or Sm are also possible for the formation of such phases. All elements have hitherto been known as additional components, especially for improvements in properties which increase the metal vapor density when subjected to arcing, e.g. to achieve a low breakaway current. For this purpose, reference is made, for example, to US Pat. No. 2,975,255, DE-A-10 81 950, DE-A-12 36 630, US Pat. No. 3 596 027 and DE-PS 21 24 707.
- the melting or softening temperature of the layer should be selected higher than the soldering temperature used (e.g. T 800 ° C).
- layer components with a corresponding melting point are: Ag2Se, Ag2Te. Al2Se3, Al2Te3, Ba2Bi3, Ba2Pb, Bi2Ca3, Bi3Ce4, Bi3La4, BiLi3, Bi2Mg3, Bi2Zr3, Ca2Pb, Ce2Pb, Cu2Se, Cu2Te, In2Se3, LaPb or La2Pb, P, LiTS , SeZn, TeTi, TeZn.
- additives can also be used which react with the base material or a component thereof and on thus create such a layer that is stable at the soldering temperature.
- additives are, for example, InSe, In2Te3, Sb2Se3 or Sb2Te3, which form suitable three-substance systems with Cu, for example, of a base material CuCr. Under no circumstances may the layer contain loosely bound particles, since this will impair the dielectric strength and switching behavior.
- FIGS 1 to 3 show three different examples of manufacturing methods of contact pieces according to the invention.
- the amount of powder is dimensioned such that a layer thickness of approximately 50 to 100 ⁇ m results after the end of the process.
- a protective jacket or an elevated edge 13 of the body 10 prevents the powder from sliding down sideways or flowing down during the melting process.
- the molded body 10 is heated with the powder 12 in a vessel 5 with vacuum (p ⁇ 10 -3 mbar) or in a dilute, high-purity inert gas atmosphere to approx. 950 ° C. and left at this temperature for some time (approx. 10-20 min).
- the Ag2Se powder melts, binds to the CuCr base of the body 10 and forms the desired layer 14. After cooling, the edge 13 of the molded body 10 is twisted off.
- the layer 14 can be used directly, ie without post-processing, as the contact surface of the contact piece thus produced.
- a powder mixture of 20 to 25% Cr, 30 - 40% Sb2Te3 and the rest of Cu is pressed into a flat disc 22 of about 1 - 3 mm in height and applied to the surface 21 of a base body 20 made of CuCr, e.g. CuCr 50, laid with protective jacket 23.
- the arrangement is heated to about 1000 ° C and kept at this temperature for 30 to 60 min.
- a liquid phase sintering of the press disk 22 takes place and the Sb2Te3 melting at approx. 622 ° C preferably converts to Cu2Te.
- An error-free connection to the surface 21 of the base body 20 made of CuCr results from the Sb dissolved in Cu.
- the support 22 can then be machined to the layer 24 with the desired thickness.
- a contact piece 30 made of CuCr e.g. made of CuCr 50
- an approximately 50 ⁇ m thick layer 34 made of PbSe the layer 34 is produced in a known manner by vapor deposition of the additives 32 on the underside 31 of the contact piece 30 in the vacuum vessel 5 according to FIG. 1, for example by sputtering or ion plating.
- Layer 34 can serve as a button without post-processing.
- the proportion of the additives in relation to the base material can be varied in a suitable manner and be, for example, 30%, while in FIG. 1 and FIG. 3 there are pure additional cover layers.
- at least one of such elements is used for the additives whose vapor pressure at 1000 ° C. is above approximately 1 mbar and which form intermetallic phases with one another or with other metals.
- the vapor pressure of these phases is of different orders of magnitude than the vapor pressure of the individual components.
- the intermetallic phase is broken down into components with the appropriate vapor pressure.
- the intermetallic phases formed are not yet broken down, so that only the vapor pressure of these phases is decisive. As a result, there are no impairments in the soldering process due to excessive metal vapor development.
- Table 1 lists some examples of breakaway currents as measured on contact pieces according to the invention, ie on CrCu contact bodies with a layer provided in the manner described:
Landscapes
- Contacts (AREA)
- High-Tension Arc-Extinguishing Switches Without Spraying Means (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Switches (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3602835 | 1986-01-30 | ||
DE3602835 | 1986-01-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0234246A1 true EP0234246A1 (de) | 1987-09-02 |
Family
ID=6292991
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP87100621A Withdrawn EP0234246A1 (de) | 1986-01-30 | 1987-01-19 | Schaltkontaktstücke für Vakuumschaltgeräte und Verfahren zu deren Herstellung |
Country Status (6)
Country | Link |
---|---|
US (1) | US4749830A (enrdf_load_stackoverflow) |
EP (1) | EP0234246A1 (enrdf_load_stackoverflow) |
JP (1) | JPS62184727A (enrdf_load_stackoverflow) |
CN (1) | CN1008954B (enrdf_load_stackoverflow) |
DD (1) | DD253503A5 (enrdf_load_stackoverflow) |
IN (1) | IN170083B (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3842919A1 (de) * | 1988-12-21 | 1990-07-05 | Calor Emag Elektrizitaets Ag | Schaltstueck fuer einen vakuumschalter und verfahren zur herstellung eines solchen schaltstuecks oder eines entsprechend beschaffenen bauteils |
DE19537657A1 (de) * | 1995-10-10 | 1997-04-17 | Abb Patent Gmbh | Verfahren und Vorrichtung zur Herstellung eines Kontaktstückes |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0368860A1 (de) * | 1987-07-28 | 1990-05-23 | Siemens Aktiengesellschaft | Kontaktwerkstoff für vakuumschalter und verfahren zu dessen herstellung |
JP2643037B2 (ja) * | 1991-06-17 | 1997-08-20 | 三菱電機株式会社 | 真空スイッチ管 |
CN100495608C (zh) * | 2006-06-20 | 2009-06-03 | 杭州之江开关股份有限公司 | 断路器动触头辫子线冷挤压工艺 |
CN103824711B (zh) * | 2013-12-20 | 2016-01-20 | 宁波赛特勒电子有限公司 | 一种双层银基复合氧化物电触点材料及其应用 |
CN104103435B (zh) * | 2014-07-21 | 2016-07-13 | 南通万德科技有限公司 | 一种耐电弧烧蚀的钨合金开关触点及其制备方法 |
CN113293320B (zh) * | 2021-06-21 | 2022-03-18 | 福州大学 | 一种Te元素掺杂四方相Sr2Sb材料及其制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH515599A (de) * | 1970-03-26 | 1971-11-15 | Siemens Ag | Verfahren zur Herstellung eines Zweischichten-Kontaktstückes für Hochvakuumleistungsschalter |
GB2105910A (en) * | 1981-09-11 | 1983-03-30 | Siemens Ag | A contact member for vacuum isolating switches |
GB2106141A (en) * | 1981-09-16 | 1983-04-07 | Mitsubishi Electric Corp | Contactor for vacuum type circuit interrupter |
EP0172411A1 (de) * | 1984-07-30 | 1986-02-26 | Siemens Aktiengesellschaft | Vakuumschütz mit Kontaktstücken aus CuCr und Verfahren zur Herstellung dieser Kontaktstücke |
EP0175349A2 (en) * | 1984-09-19 | 1986-03-26 | Hitachi, Ltd. | Vacuum circuit breaker |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL241567A (enrdf_load_stackoverflow) * | 1958-07-24 | |||
GB1020914A (en) * | 1961-11-10 | 1966-02-23 | Gen Electric | Improvements in vacuum circuit interrupter |
JPS4836071B1 (enrdf_load_stackoverflow) * | 1968-07-30 | 1973-11-01 | ||
JPS58108622A (ja) * | 1981-12-21 | 1983-06-28 | 三菱電機株式会社 | 真空開閉器用電極材料 |
JPS58115728A (ja) * | 1981-12-28 | 1983-07-09 | 三菱電機株式会社 | 真空しや断器用接点 |
JPS58165225A (ja) * | 1982-03-26 | 1983-09-30 | 株式会社日立製作所 | 真空しや断器 |
-
1987
- 1987-01-19 EP EP87100621A patent/EP0234246A1/de not_active Withdrawn
- 1987-01-27 JP JP62017144A patent/JPS62184727A/ja active Pending
- 1987-01-28 CN CN87100459.3A patent/CN1008954B/zh not_active Expired
- 1987-01-28 DD DD87299513A patent/DD253503A5/de not_active IP Right Cessation
- 1987-01-30 US US07/008,799 patent/US4749830A/en not_active Expired - Fee Related
- 1987-01-30 IN IN93/CAL/87A patent/IN170083B/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH515599A (de) * | 1970-03-26 | 1971-11-15 | Siemens Ag | Verfahren zur Herstellung eines Zweischichten-Kontaktstückes für Hochvakuumleistungsschalter |
GB2105910A (en) * | 1981-09-11 | 1983-03-30 | Siemens Ag | A contact member for vacuum isolating switches |
GB2106141A (en) * | 1981-09-16 | 1983-04-07 | Mitsubishi Electric Corp | Contactor for vacuum type circuit interrupter |
EP0172411A1 (de) * | 1984-07-30 | 1986-02-26 | Siemens Aktiengesellschaft | Vakuumschütz mit Kontaktstücken aus CuCr und Verfahren zur Herstellung dieser Kontaktstücke |
EP0175349A2 (en) * | 1984-09-19 | 1986-03-26 | Hitachi, Ltd. | Vacuum circuit breaker |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3842919A1 (de) * | 1988-12-21 | 1990-07-05 | Calor Emag Elektrizitaets Ag | Schaltstueck fuer einen vakuumschalter und verfahren zur herstellung eines solchen schaltstuecks oder eines entsprechend beschaffenen bauteils |
DE19537657A1 (de) * | 1995-10-10 | 1997-04-17 | Abb Patent Gmbh | Verfahren und Vorrichtung zur Herstellung eines Kontaktstückes |
Also Published As
Publication number | Publication date |
---|---|
US4749830A (en) | 1988-06-07 |
CN87100459A (zh) | 1987-08-12 |
JPS62184727A (ja) | 1987-08-13 |
IN170083B (enrdf_load_stackoverflow) | 1992-02-08 |
DD253503A5 (de) | 1988-01-20 |
CN1008954B (zh) | 1990-07-25 |
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Legal Events
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH DE FR GB IT LI LU NL SE |
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17P | Request for examination filed |
Effective date: 19880224 |
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17Q | First examination report despatched |
Effective date: 19900709 |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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18D | Application deemed to be withdrawn |
Effective date: 19910618 |
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RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: SCHNOEDT, HANNELORE Inventor name: KIPPENBERG, HORST, DR. Inventor name: PAULUS, IRMO, DR. Inventor name: HESS, RUEDIGER, DR. Inventor name: MUELLER, REINER, DIPL.-ING. |