EP0222232B1 - Dispositif pour la métallisation partielle des languettes de connexion - Google Patents

Dispositif pour la métallisation partielle des languettes de connexion Download PDF

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Publication number
EP0222232B1
EP0222232B1 EP19860114812 EP86114812A EP0222232B1 EP 0222232 B1 EP0222232 B1 EP 0222232B1 EP 19860114812 EP19860114812 EP 19860114812 EP 86114812 A EP86114812 A EP 86114812A EP 0222232 B1 EP0222232 B1 EP 0222232B1
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EP
European Patent Office
Prior art keywords
plating
plating solution
passage
anode
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP19860114812
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German (de)
English (en)
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EP0222232A1 (fr
Inventor
Yasuto Murata
Junichi Tezuka
Kenji Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EEJA Ltd
Original Assignee
Electroplating Engineers of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP60250949A external-priority patent/JPS62211396A/ja
Priority claimed from JP60281217A external-priority patent/JPS62139895A/ja
Application filed by Electroplating Engineers of Japan Ltd filed Critical Electroplating Engineers of Japan Ltd
Publication of EP0222232A1 publication Critical patent/EP0222232A1/fr
Application granted granted Critical
Publication of EP0222232B1 publication Critical patent/EP0222232B1/fr
Expired legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas

Definitions

  • Connector terminals are formed in plurality in the form of comb teeth arranged on a continuous band like member having pilot holes and respectively provided with a pair of projections each having a minute area (e.g. 1 mm2 or less) at the end thereof which has to be plated.
  • a minute area e.g. 1 mm2 or less
  • typical plating devices such as the plating device which dips the whole end portion including the projections in the plating solution contained in a bath to conduct plating by controlling the liquid level to limit plating areas, or the injection plating device which shields the portions not to be plated with a mask and plates unmasked portions by jetting the plating solution on them (refer to Japanese Patent Application laid-open Nos. Sho 59-126784, Sho 57-161084, and Sho 55-83180).
  • the present inventors proposed an improvement for brush plating method (Japanese Patent Application Sho 60-89016) wherein the surface of an insoluble anode is covered with a liquid retaining member which can constantly be supplied with plating solution, the plating device is configured to be in alignment with the interval between adjacent fork-like ends of a connector terminal so that the tip end portions of the connector terminal may be plated while moving in contact with the member retaining the plating solution.
  • the proposed technique is effective in plating only the portions of the connector terminal ends which actually contact with the member on the anode surface, it may be called a minute partial plating method as against the prior art methods which allow only partial plating, achieving a remarkable reduction in precious metal consumption and precise definition of plating area
  • the plating solution supplying member consists of a disc rotating around a horizontal axis, the lower portion of the disc being immersed in a plating solution bath by which it is moistened.
  • the plating areas of the components which are to be plated and which are continuously moving along a passline are brought into contact with the disc, with the contact surface of the disc portion immersed in the solution bath being diametrically opposite to the plating areas.
  • the plating solution absorbed in the plating solution bath is transferred to the plating area.
  • the plating solution and the component are connected with an anode and a cathode, respectively, in a manner known per se.
  • the superfluous solution drips off from the disc while the disc rotates towards the plating areas. I.e. the amount of the applied plating solution depends among other things on the solution retainability and the rotational speed of the disc.
  • the object of the invention is to provide a plating device suitable for constantly supplying the plating areas with an optimum amount of fresh plating solution.
  • the design of the plating device according to the invention allows the plating solution to be continuously supplied to the plating areas by use of a pump means via a supporting member, a passage and a plating solution retaining member.
  • the supplied amount of the plating solution can in a simple way be adjusted and kept constant via the pump.
  • the plating solution retaining member is continuously wound up or payed out by winding means so that an excessive wear of the retaining member is prevented and its solution retainability is kept on the same level.
  • an anode is provided either inside the passage, near the inlet thereof or inside the solution supplying box.
  • a plating solution supplying section can be provided in a manner to be able to constantly supply fresh plating solution in the optimal amount to the corresponding portions of the target plating areas on the passage line.
  • the target areas can be supplied with the plating solution evenly over the whole areas when closely contacting with or approaching the supplying section.
  • the net member is driven to move either continuously or intermittently in the direction intersecting the passage line by the driving rollers and reeled in for an appropriate length. In this manner, a suitable length of fresh sheet of the net member is constantly formed as the supplying section. This helps avoid wear and tear of particular locations of the net member sheet.
  • the plating solution supplying member is configured to have a vertical section shaped substantially like an inverted U in the embodiments shown in FIGs. 1 through 7 while it is configured to have a substantial arrowhead shape having sloped guide planes on both sides in the embodiments shown in FIGs. 8 through 11.
  • first group invention and those shown in FIGs. 8 through 11 as the "second group invention”.
  • Connector terminals 10 which are the subject of plating are formed in plurality in the form of comb-teeth on the lower portion of a continuous band-like member 22 and are respectively provided with fork-like ends extending in the direction perpendicular to the longitudinal direction of the band-like member 22.
  • the areas which have to be plated ll are a pair of tip surfaces of the forked ends which oppose to but apart from each other with an interval which converges at the middle and then again diverges to define a substantial triangle therebetween.
  • the plating area ll is adapted to move along a passage line 23 by a combination of a sprocket 26 and a roller 27 which is pressed against the sprocket 26.
  • the sprocket 26 has pins 25 provided on the circumference thereof to freely fit in pilot holes 24 of a continuous band-like member 22.
  • the roller 27 is connected to a cathode power source 28 to cathodize the connector terminals l0.
  • a plating solution supplying member l3 is arranged along the passage line 23 and comprises a combination of a supporting member l5 and a plating solution retaining member l6 which is erected on a plating solution box l2 with a supporting plate 29.
  • the member l3 has a rectangular shape of a small thickness.
  • the supporting member l5 made of an insulating sheet is thin and yet strong enough as a core to be able to support the plating solution retaining member l6.
  • the member l5 is formed to have plating solution passage l4 of a minute width between adjacent teeth.
  • the supporting member l5 has a vertical section shaped substantially like an inverted letter U to cover the passage l4 in order to reduce the platable area.
  • the member l5 is preferably made of a sheet of Tetron (trademark) or of Mylar (trademark). Spacers 30 are provided inside the supporting member l5 in a space corresponding to the passage l4 for the plating solution to extend vertically in the form of tape.
  • narrow passage l4 is made for plating solution each between adjacent spacers 30.
  • the spacers 30 act as rectifiers for the flow of the plating solution l8 inside the passage l4.
  • the plating solution retaining member l6 is supported by the supporting member l5 to drape over the side surfaces thereof.
  • the member l6 is made of a polypropylene net, but it may be made of porous sheet similar to a net so long as it allows the plating solution l8 supplied thereto via the holes l7 to seep so that the optimal amount of the solution l8, neither more nor less than necessary, is supplied onto the plating area ll which contacts therewith.
  • the plating solution supplying member l3 comprising a solution retaining member l6 held over the supporting member l5 has an extremely narrow thickness (t) to correspond the distance (l) between two opposing plating areas ll,ll of the forked ends of a connector terminal l0 which is as small as 0.38 mm, for example.
  • the passage l4 inside has similarly narrow width (for instance 0.l - 0.2 mm). The thickness is determined so that the plating solution supplying member can be inserted between the opposing areas ll,ll to allow them to contact with the solution retaining member l6 near the top thereof.
  • the solution retaining member l6 is wound around winding devices 3l,32 outside the supporting member l5 so that a new sheet of the member l6 constantly covers the surface of the supporting member l5 as one of the winding devices undoes the sheet while the other winds it.
  • the plating solution supplying member l3 is erected on a box l2 and a supporting plate 29 is used to assemble the supporting member l5 and the solution retaining member l6 draped thereon.
  • the plate 29 is provided with a pair of holder/guides 34 which holds the retaining member l6 on the supporting member l5 from both sides and guides the lower portions 33 of the connector terminals l0 as it moves. The pressure against the member l6 applied by the pair of the holder/guides 34 is released when a new sheet is reeled out as mentioned above.
  • the holder/guides 34 are sloped at the upper portion 35 so as to accommodate the same to the form of the lower portions 33 of the connector terminals l0 as well as to guide them while the connector terminals l0 move.
  • the portions 33 do not necessarily contact with the upper portions 35 of the holder/guides 34 to be guided thereby.
  • anode l9 of platinum in the form of a net which is connected to an anode power source 36.
  • the connector terminal l0 is cathodized and guided via the sprocket 26 and the roller 27 to move in the direction from right upper side toward left lower side in FIG. l, and the plating areas ll,ll move along the passage line 23 to contact with or come very close to the plating solution retaining member l6.
  • the solution l8 inside the box l2 is pumped out by a pump (not shown), the solution l8 is forced to go up in narrow passages inside the passage l4 and between adjacent spacers 30, flow out to the outside of the supporting member l5 from the holes l7 near the top of the member l5, and seep into the pores or mesh of the solution retaining member l6.
  • the tips 20 of the triangles of areas ll,ll are positioned at or close to both sides of the top of the solution retaining member l6 to contact with the plating solution l8 freshly supplied from the holes l7.
  • an optimal amount of the plating solution l8, not more or not less than the necessary amount is supplied substantially evenly on limited locations of the plating areas ll,ll, more particularly the locations near the tips 20, and other locations 2l adjacent thereto.
  • a minute portion of the respective plating areas including the tip 20 of and adjacent locations 21 of the protruding portion can be specifically plated in a substantially even thickness.
  • a platinum anode 19 in a net form is provided with a box 12, in the embodiment 2 in FIG. 4, a platinum net member 37 is interposed as an anode in the solution passage 14 inside the supporting member 15.
  • the net member 37 is connected to an anode power source 36 and is positioned to extend from the inside space 38 of the box 12 to the solution passage 14. Wefts 39 and warps 40 are woven in the inside space 38, but warps 40 alone are erected at a small interval in the solution passage 14 to minimize the thickness of the anode. When pressure is applied on the solution 18 in the space 38, the solution is forced to go up through narrow passages 41 between the solution passage 14 and between the respective warps 40, and to seep onto the surface of the solution retaining member 16 from the holes 17.
  • the warps 40 extend to the holes 17 at the top thereof respectively so that the distance between the "anode” and the plating area ll is kept extremely short. They therefore can have the function of the spacers 30 of the first embodiment, i.e. the function to rectify the flow of the plating solution l8 and minimize the width of the passage l4 when the said passage l4 is formed by folding the insulating sheet into an inverted U letter.
  • FIGs. 5 and 6 show the third embodiment. While the first and second embodiments use a net member 37 as an "anode", a thin plate 43 having vertical slit-like passages 42 in a plural number is employed as an "anode".
  • the thin plate 43 is inserted into the supporting member l5 which is folded like a letter U .
  • the lower portions 44 of the passages 42 communicate with the inside space 38 of the box l2 while the upper portions 45 communicate with the holes l7.
  • the width of the passages 42 is designed to be an extremely small value so as to facilitate the upward flow of the solution l8 from the inside space 38 to the holes l7.
  • the thin plate 43 has the same function as the spacers 30.
  • FIG. 7 shows the fourth embodiment. While the position of an "anode" in the first embodiment is inside the box l2, and in the passage l4 in the second and third embodiments, a platinum net member 46 is arranged near an inlet of the passage l4 as an "anode" in the fourth embodiment.
  • a plating solution supply member lll in a plating device ll0 comprises a support member ll3 mounted and fixed on a plating box ll2, an anode ll4, a net member ll5 and a winding means ll6.
  • the support member ll3 is made of an insulating material and mounted and fixed on a cover plate ll7 of the plating box ll2.
  • the top portion ll9 of the support member is substantially in the form of an arrowhead with two slanted sides forming guide planes ll8.
  • An opening l22 is provided at the tip l20 of the top portion ll9 to allow a plating solution l2l to seep therefrom.
  • a passage l23 for supplying the plating solution communicates with the opening l22 and forms a through-hole within the support member reaching the bottom l24.
  • the passage l23 also communicates with an opening for supply (to be described hereinafter) provided in the plating box ll2.
  • the anode ll4 is made of a reticular material so as not to prevent flow of the plating solution l2l.
  • the anode ll4 is attached to the underside of the cover plate ll7 at the opening l26 in the vicinity of the bottom l24 of the support member ll3 as well as of an inlet port l25 for supplying the plating solution.
  • the net member ll5 covers the top portion ll9 of the support member ll3 at the tip l20 and can freely move to be wound in the direction (indicated by the arrow A) which intersects a pass-line (indicated by the arrow PL in the drawings) to form a supply section l27 for the plating solution l2l.
  • the winding means ll6 each is provided on either side of said pass-line PL and comprises a guide roller l28 which imparts tension to the net member ll5, a rotatable press roller l29 and a drive roller l3l connected to a motor l30 which winds up and pays out the net member ll5 in a direction intersecting (indicated by the arrow A) the pass-line PL so that a fresh sheet of the net member ll5 is constantly supplied to contact with the plating target portions l04 of a connector terminal l02.
  • Reference numerals l32, l33, l34 and l36 respectively denote a pump, a pipe, a plating solution controlling tank and a plating bath. These members are used to pump out, recover and recycle the plating solution l2l.
  • the connector terminal l02 to be plated is cathodized by a means not shown and moved to a position so that the plating solution supply member lll can be interposed between the pair of portions l04 to be plated.
  • the plating solution l2l is in the meantime pumped out by the pump l32 to flow through the energized anode ll4 and seep out via the supply opening l26, passage l23 and opening l22, where the plating solution is soaked by the net member ll5 which covers the opening l22 under tension imparted by the guide roller l28.
  • the portion of the net member ll5 which is disposed at the tip l20 of the top portion ll9 and which corresponds to the passage line PL of the target portions l04 is constantly supplied with an optimum amount of fresh plating solution l2l, constituting the supply section l27 of the plating solution l2l.
  • the net member ll5 is pulled by the roller and is free from so called slackening.
  • the target portions l04 of the connector terminal l02 contact with or approach the net member ll5 under tension constituting the supply section l27 and come in contact with the plating solution l2l seeping out the surface l35 of the net member ll5, whereby uniform plating can be obtained over the entire area of the target portions l04.
  • the drive roller l3l is rotated by the rotation of the motor l30 to move the net member ll5 via the pressing roller l29 in the direction intersecting the passage line PL (the direction of the arrow A) for winding up the net member by a suitable length.
  • This provides the supply section l27 anew.
  • the net member ll5 is wound up intermittently in accordance with the timing of the plating in this embodiment, it is also possible to continuously wind up the net member ll5 during plating to shift the section. In this manner, the net member ll5 can be protected against partial wear occurring at a given portion.
  • FIG. ll shows another embodiment of the support member.
  • the support member l4l used in the plating device l40 has plural openings l44 along the longitudinal direction of the support member l4l in the vicinity of the tip l43 of the top portion l42 of the support l4l.
  • the anode l45 with its lower portion comprising woven warps l46 and wefts l47 and the upper portion warps l46 alone is provided in the passage l23 to function in the same manner as the opening l22 and the anode ll4 of the first embodiment.
  • the anode is disposed in the vicinity of the inlet port l25 of the passage l23 or erected in the passage l23 in the foregoing embodiments, it is also possible to utilize the support ll3 itself as the anode by plating the same with a metal which is insoluble in the plating solution l2l.
  • the plating device of the second group invention with its features will bring about numerous advantageous effects such as the following:

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Claims (13)

  1. Dispositif pour électro-métalliser des zones de dimensions réduites de bornes de connexion qui ont chacune une paire de zones de métallisation devant être métallisées et opposées l'une à l'autre, comprenant un élément d'apport en solution de métallisation qui peut être mouillé par une solution de métallisation et qui est inséré entre les deux parties formant une paire de zones de métallisation pour électro-métalliser ces zones pendant qu'elles se déplacent le long d'une ligne de passage, soit par mise en contact avec l'élément d'apport en solution de métallisation, soit par passage à faible distance de celui-ci, caractérisé en ce que ledit élément d'apport en solution de métallisation (13, 111) comprend un élément de support (15, 113, 141) ayant sensiblement la forme d'un U ou dont la section verticale a sensiblement la forme d'une flèche, qui comporte au moins une ouverture (17, 122, 144) pour permettre l'écoulement de la solution de métallisation, et un passage (14, 123) communiquant avec ladite ouverture (17, 122, 144) pour fournir ladite solution de métallisation par utilisation d'un moyen à pompe (132) à un élément de rétention de solution de métallisation (16, 115) constitué d'une feuille maillée ou poreuse portée par ledit élément de support (15, 113, 141) et enveloppant au moins la partie supérieure (119, 142) de sa surface supérieure, ledit élément de rétention de solution de métallisation (16, 115) pouvant être enroulé dans une direction parallèle à, ou coupant ladite ligne de passage desdites bornes de connexion (10, 102) par un moyen d'enroulement (31, 32; 116).
  2. Dispositif de métallisation selon la revendication 1, caractérisé en qu'une pluralité d'ouvertures (17, 122, 144) est réalisée au niveau ou au voisinage de la partie supérieure (119, 142) de l'élément de support (15, 113, 141).
  3. Dispositif de métallisation selon la revendication 1 ou 2, caractérisé en ce que ledit élément d'apport en solution de métallisation (13, 111) est disposé sur une boîte (12, 112).
  4. Dispositif de métallisation selon l'une quelconque des revendications précédentes, caractérisé en ce que la partie supérieure (119, 142) dudit élément de support ayant sensiblement la forme d'une flèche (15, 113, 141) présente des plans de guidage inclinés (118) sur chacun de ses côtés.
  5. Dispositif de métallisation selon l'une quelconque des revendications précédentes, caractérisé en ce que l'élément de support (15, 113, 141) est muni d'une pluralité d'espaceurs (30) ayant la forme d'un ruban à l'intérieur du passage (14, 123), la largeur du passage (14, 123) étant déterminée en fonction de l'épaisseur d'un espaceur (30) et chaque espaceur (30) jouant le rôle d'un régulateur de l'écoulement de la solution de métallisation à l'intérieur du passage (14, 123).
  6. Dispositif de métallisation selon l'une quelconque des revendications 2 à 5, caractérisé en ce que l'élément d'apport en solution de métallisation (13, 111), lorsqu'il est disposé sur la boîte (12, 112), est maintenu fermement sur chacun de ses côtés par une paire de fixations/guides (34), et en ce que les parties supérieures des fixations/guides (34) ont une forme correspondant à celle des parties inférieures (33) d'une borne de connexion (10, 102) de façon à ce que ses parties inférieures (33) puissent être guidées par les parties supérieures lorsqu'elles se déplacent le long du passage (14, 123).
  7. Dispositif de métallisation selon l'une quelconque des revendications 1 à 6, caractérisé en ce qu une anode (37) est située à l'intérieur du passage (14) pour rectifier l'écoulement de la solution de métallisation dans celui-ci et pour rendre minimale la largeur du passage (14, 123).
  8. Dispositif de métallisation selon l'une quelconque des revendications 2 à 6, caractérisé en ce que l'anode est réalisée sous la forme d'un filet (19) constitué de platine et situé à l'intérieur de la boîte (12, 112).
  9. Dispositif de métallisation selon l'une quelconque des revendications 2 à 7, caractérisé en ce que l'anode est réalisée sous la forme d'un filet (37) constitué de platine et se prolongeant de l'intérieur de la boîte (12, 112) jusqu'à l'intérieur du passage (14, 123).
  10. Dispositif de métallisation selon la revendication 9, caractérisé en ce que l'anode constituée d'un filet de platine (37, 145) comprend des chaînes (40, 146) et des trames (39, 147), les parties desdites chaînes (40, 146) situées à l'intérieur du passage (14, 123) étant disposées verticalement sans les trames (39, 147) pour faciliter l'écoulement vers le haut de la solution de métallisation par des passages étroits (41) formés entre les chaînes adjacentes (40, 146), à l'intérieur du passage (14, 123).
  11. Dispositif de métallisation selon l'une quelconque des revendications 2 à 7, caractérisé en ce que l'anode est réalisée sous la forme d'une plaque mince (43) ayant une pluralité de passages verticaux en forme de fentes (42) se prolongeant de l'intérieur de la boîte (12, 112) jusqu'à l'intérieur du passage (14, 123), et en ce que les passages en forme de fentes (42) communiquent avec l'intérieur de la boîte (12, 112) au niveau de leurs parties inférieures (44) et avec les ouvertures (17, 122, 144) au niveau de leurs parties supérieures (45).
  12. Dispositif de métallisation selon l'une quelconque des revendications 1 à 6, caractérisé en ce que l'élément de support (15, 113, 141) est fait d'un métal insoluble dans la solution de métallisation et constitue l'anode.
  13. Dispositif de métallisation selon l'une quelconque des revendications précédentes, caractérisé en ce que ledit moyen d'enroulement (31, 32, 116) est muni d'un rouleau de guidage (128) pour tendre l'élément de rétention de solution (13, 115) de façon à ce que cet élément vienne au contact étroit de la partie supérieure (119, 142) de l'élément de support (15, 113, 141) et des rouleaux d'entraînement (131) qui reçoivent et débitent librement l'élément de rétention de solution (16, 115).
EP19860114812 1985-11-11 1986-10-24 Dispositif pour la métallisation partielle des languettes de connexion Expired EP0222232B1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP250949/85 1985-11-11
JP60250949A JPS62211396A (ja) 1985-11-11 1985-11-11 コネクタ−端子の微小部分のメツキ装置
JP281217/85 1985-12-16
JP60281217A JPS62139895A (ja) 1985-12-16 1985-12-16 部分メツキ装置

Publications (2)

Publication Number Publication Date
EP0222232A1 EP0222232A1 (fr) 1987-05-20
EP0222232B1 true EP0222232B1 (fr) 1992-01-22

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EP19860114812 Expired EP0222232B1 (fr) 1985-11-11 1986-10-24 Dispositif pour la métallisation partielle des languettes de connexion

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DE (1) DE3683595D1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3839223C2 (de) * 1988-11-19 1994-10-20 Degussa Vorrichtung zur selektiven galvanischen Beschichtung
NL9000098A (nl) * 1990-01-16 1991-08-16 Burndy Electra Nv Inrichting voor het plateren van elektrische contactelementen.
DE4405919A1 (de) * 1994-02-24 1995-08-31 Teves Gmbh Alfred Mit galvanisierten , untereinander über Stanzgitter verbundenen Anschlüssen versehene elektrische Baugruppe sowie Herstellungsverfahren hierzu
EP0698677B1 (fr) * 1994-07-28 2002-10-09 AMI DODUCO GmbH Méthode pour le dorage de produits semi-finis en bandes, en particulier pour cadres de connexion
DE19758513C2 (de) * 1997-02-06 2000-07-13 Schempp & Decker Praezisionste Vorrichtung zum selektiven galvanischen Beschichten von elektrischen Kontaktelementen
CN104313668B (zh) * 2014-09-30 2017-03-15 苏州芯航元电子科技有限公司 电子产线用电化学处理槽
CN104498988A (zh) * 2014-12-04 2015-04-08 谢博 一种电解槽用固定装置

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EP0222232A1 (fr) 1987-05-20
DE3683595D1 (de) 1992-03-05

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