EP0092005B1 - Tête d'imprimeur thermique - Google Patents

Tête d'imprimeur thermique Download PDF

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Publication number
EP0092005B1
EP0092005B1 EP19820302017 EP82302017A EP0092005B1 EP 0092005 B1 EP0092005 B1 EP 0092005B1 EP 19820302017 EP19820302017 EP 19820302017 EP 82302017 A EP82302017 A EP 82302017A EP 0092005 B1 EP0092005 B1 EP 0092005B1
Authority
EP
European Patent Office
Prior art keywords
heater
layer
thermal head
width
finger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP19820302017
Other languages
German (de)
English (en)
Other versions
EP0092005A1 (fr
Inventor
Susumu Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to EP19820302017 priority Critical patent/EP0092005B1/fr
Priority to DE8282302017T priority patent/DE3262754D1/de
Publication of EP0092005A1 publication Critical patent/EP0092005A1/fr
Application granted granted Critical
Publication of EP0092005B1 publication Critical patent/EP0092005B1/fr
Expired legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/3351—Electrode layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/33515—Heater layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/33525—Passivation layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/3353—Protective layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/33535—Substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33545—Structure of thermal heads characterised by dimensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/3355—Structure of thermal heads characterised by materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33555—Structure of thermal heads characterised by type
    • B41J2/3357—Surface type resistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors

Definitions

  • This invention relates to a thermal head for a thermal printer, and in particular to such a head which operates at higher temperature and at a high power rating, for providing clearer and more rapid printing.
  • thermal printer which has a thermal head and a thermal printing paper, and operates on the principle that a thermal head, heated to a high temperature according to the pattern of a desired character to be printed, selectively changes the colour of the thermal paper.
  • a thermal printer has the advantage that it can print not only a predetermined pattern of characters, but also any desired pattern including pictures, Chinese characters, and/or Arabian characters.
  • a thermal printer is a kind of dot printer which composes the pattern to be printed as a plurality of dots, and a thermal head has a plurality of heat cells arranged, for example, in a straight line for printing these dots. As the thermal paper moves in a direction perpendicular to the straight line of heat cells, the heat cells are selectively heated, so that the colour of the thermal paper is selectively changed. Thus the desired pattern is printed on the thermal paper.
  • Fig. 1 of the accompanying drawings shows the cross-section of a prior thermal head disclosed in the above-mentioned US patent and possessing the features in accordance with the preamble of claim 1.
  • a glazed alumina substrate 10 has a glazed layer 15 of 40-80 ⁇ m thickness.
  • a heater layer 30 has a thickness of 1000 A to 2000 A and is made of, for example, tantalum nitride (Ta 2 N).
  • a conductive layer 40 is attached to the heater layer 30 for providing electrical coupling of the heater line to an external circuit.
  • An Si0 2 layer 50 which has a thickness of 1-3 pm, prevents oxidation of the heater line.
  • a protection layer 60 reduces wear on the heaters due to friction with the thermal paper.
  • the layer 60 is made of, for example, Ta 2 0 5 with a thickness of 3-10 pm.
  • the structure of Fig 1 has the advantages that fluctuation in the resistance of a heater layer is small, and the life-time of the head is long, provided the power applied to the head is small.
  • the power capacity of the head is low. That is to say, the prior thermal head cannot have a high power capacity, and cannot, therefore, provide a high temperature. Operation at a high temperature is essential for high speed printing.
  • the highest power consumption of a prior thermal head is up to 1.2 watts when the width of the heater layer is 100 um, the length of the heater layer is 215 um, the sheet resistance of the heater layer is 17 ohms/square.
  • the heater layer is heated for 30 minutes with a pulse signal having a pulse width of 1 msec and a period of 50 msec. If that prior thermal head is heated with a power higher than 1.2 watts, the heater is damaged.
  • Fig. 2 is an explanatory drawing of a sheet resistance, in which a rectangular heater 30 has a side length L, and conductors 100 and 102 have a width L.
  • the resistance between conductors 100 and 102 is independent of the length L, but depends solely upon the thickness of the heater 30 and the material of which the heater 30 is made. Therefore, the sheet resistance of the heater 30 is defined by the resistance between the conductors 100 and 102, and is expressed as R ohms/square, if the resistance appearing between the conductors 100 and 102 is R ohms.
  • a thermal head comprising a dielectric plane substrate; a plurality of heater layers, each having an elongated finger, insulated from one another; conductive layers attached to both extreme ends of the fingers of the heater layers the width of each finger of the heater layers at the region between the conductive layers being less than 30 pm; and an insulation layer on the heater layers; is characterised by an insulation layer made of Si0 2 (silicon dioxide) between the substrate and the heater layers.
  • Fig. 3 shows the cross section of one form of the present thermal head, in which a glazed alumina substrate 10 has a glazed layer 15 of 40-80 pm thickness.
  • An Si0 2 layer 20 has a thickness of 1-6 pm and is provided for improving the thermal characteristics of the head.
  • a heater layer 30 has a thickness of 1000 A to 2000 A, and is made of, for instance, tantalum nitride (Ta 2 N).
  • a conductive layer 40 is connected to the heater layer 30 for providing electrical coupling of the heater line to an external circuit.
  • An Si0 2 layer 50 with a thickness of 1-3 ⁇ m prevents oxidation of the heater line.
  • a protection layer 60 reduces wear of the heaters due to friction with a thermal paper.
  • the protection layer 60 is made of, for instance, Ta 2 0 5 with a thickness of 3-10 ⁇ m.
  • Fig. 3 The feature of the structure of Fig. 3 as compared with that of Fig. 1 is the presence of the thin Si0 2 layer 20 between the glazed layer 15 and the heater layer 30, so that the heater layer 30 is enclosed between a pair of Si0 2 layers 20 and 50.
  • the heater layer 30 can take more power and can, therefore, provide a high temperature.
  • the effect of the presence of the lower Si0 2 layer 20 depends upon the width of the heater layer, as described later.
  • Table 1 below shows experimental results for three samples of thermal heads with the cross section of Fig. 3.
  • the above experiments are accomplished by applying, for 30 minutes, a pulse signal with a pulse width of 1 msec and a period of 50 msec, and the power consumption shows the power of that pulse signal for which a heater layer is damaged within the 30 minute period.
  • the density of the heater layer is 8 dots/mm
  • the sheet resistance of the heater layer is 17 ohms/square
  • the thickness of the Si0 2 layers 20 and 50 is 2 pm.
  • Example 2 of the above table is accomplished for a similar heater layer to that of Fig. 5, but the width d 1 is 30 pm, and the spacings d 2 and d 3 are 10 ⁇ m.
  • Example 1 when a power of 2.4 watts is applied to the heater layer, the heater layer is red-heated, and that red-heated layer is visible through the protection layer 60. Also, in Example 2, a red-heated heater layer is visible. Therefore, it should be noted in Examples 1 and 2 that the power capacity is large. In case of Example 3 in which the width of the heater layer is large, the power consumption is not increased.
  • Fig. 4 is a plan view of a thermal head of Example 3, in which heater layers 30a-30d are straight, as shown in the figure, and the width d of each heater is 110 ⁇ m.
  • the spacing between adjacent heaters is 10 ⁇ m, and the length A of each heater is 215 ⁇ m.
  • the power consumption in the experiment 3 is only 1.2 watts, which is considerably lower than that of the other Examples. Therefore, the conclusion is reached that it is preferable for the width of the heater line to be less than 30 ⁇ m.
  • Fig. 6 is a plan view of another embodiment of the present thermal head, in which a heater layer is in a meandering or tortuous configuration with a slit S in the layer.
  • the dot density of a thermal head is not so dense, the width of the heater layer is rather wide, and it cannot be less than 30 ⁇ m. In that case, the slit S is provided in the tortuous pattern.
  • Fig. 7 is another plan view of a thermal head, or a conductive layer of the thermal head, according to the present invention.
  • the conductive layer 30a extends as two fingers 30a-1 and 30a-4, between which a pair of fingers 30a-2 and 30a-3 are positioned.
  • the layer 30a is coupled to a confronting layer 30b through the fingers 30a-1, 30a-2 and 30a-3, and through the finger 30a-4, and fingers 30b-2 and 30b-1.
  • the width of each layer 30a or 30b is divided into four spaced-apart fingers.
  • the width of each finger is only one-seventh of the width of the layer 30a or 30b. Therefore, even when the layer 30a or 30b is wide, the width of a divided finger can be less than 30 ⁇ m for providing high temperature operation.
  • the important features of the present thermal head are that a thin Si0 2 layer is provided between a heater layer and the substrate, and that the width of a finger of the heater layer is less than 30 pm.
  • Figs. 8 and 9 show experimental curves which prove the above features.
  • Fig. 8 shows the curves of a step stress test on a thermal head, in which a pulse signal with a period of 20 msec and a pulse width of 0.5 msec is applied to each finger of a heater layer through a pair of conductive layers, and the structure of the heater layer is such that the width of each finger is 22 pm, the spacing between adjacent fingers is 19.5 pm, and the length of the tortuous portion of the heater is 230 ⁇ m, as shown in the figure.
  • the horizontal axis of Fig. 8 shows the power of the pulse signal applied to each heater, and the vertical axis of Fig. 8 shows the ratio ⁇ R/R in which R is the initial resistance of a heater, and ⁇ R is the change in resistance from the initial value.
  • the test is carried out for 30 minutes for each input power, and each dot in the curve shows the result after a corresponding test of 30 minutes duration.
  • the curve in Fig. 8 shows the test results for a thermal head which has an Si0 2 layer between the heater layer and the substrate, the thickness of the Si0 2 layer being 2 ⁇ m. It should be appreciated from the curve of Fig. 8 that the sample being tested is not destroyed by the heat until the input power reaches 3.5 watts.
  • Fig. 9 shows another test result, in which the pulse period is 20 msec, the pulse width is 2.5 msec and the width of the heater layer is 110 pm.
  • the horizontal axis shows the input power and the vertical axis shows the ratio ⁇ R/R.
  • the test is carried out for 30 minutes for each input power.
  • the curve (2) in Fig. 9 shows the test result where an Si0 2 layer is provided between the heater layer and the substrate, and the curve (1) in Fig. 9 shows the test result where no such Si0 2 layer is provided, i.e. the heater layer is located directly on the substrate.
  • the temperature and the life time of a thermal head are improved by providing an Si0 2 layer between the heater layer and the substrate, and designing the width of a finger of the heater to be less than 30 pm.
  • the material of the heater layer is preferably tantalum nitride with a view to improving the operational temperature of the thermal head.

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  • Electronic Switches (AREA)

Claims (4)

1. Tête thermique qui comprend un substrat diélectrique plan (10,15); un certain nombre de couches chauffantes (30), ayant chacune un doigt allongé (31 a, 31d), les doigts étant isolés l'un de l'autre; dés couches conductrices (40) reliées aux deux extrémités des doigts des couches chauffantes, la largeur de chaque doigt des couches chauffantes dans la région comprise entre les couches conductrices étant inférieure à 30 µm; et, une couche isolante (50) sur les couches chauffantes; caractérisée par une couche isolante (20) faite de Si02 (bioxyde de silicium) entre le substrat et les couches chauffantes.
2. Tête thermique selon la revendication 1, caractérisée en ce que la couche chauffante (30) est faite de nitrure de tantale.
3. Tête thermique selon la revendication 1 ou 2, caractérisée en ce que chaque doigt (31a-31d) des couches chauffantes a une configuration tortueuse.
4. Tête thermique selon l'une quelconque des revendications précédentes, caractérisée en ce que la largeur de chaque doigt des couches chauffantes est supérieure à 30 µm et en ce que le doigt a une fente longitudinale (S) le long de son centre qui le sépare en deux parties (32a, 33a-32d, 33d), la largeur de chaque partie séparée étant inférieure à 30 pm (figure 6).
EP19820302017 1982-04-20 1982-04-20 Tête d'imprimeur thermique Expired EP0092005B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP19820302017 EP0092005B1 (fr) 1982-04-20 1982-04-20 Tête d'imprimeur thermique
DE8282302017T DE3262754D1 (en) 1982-04-20 1982-04-20 A thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19820302017 EP0092005B1 (fr) 1982-04-20 1982-04-20 Tête d'imprimeur thermique

Publications (2)

Publication Number Publication Date
EP0092005A1 EP0092005A1 (fr) 1983-10-26
EP0092005B1 true EP0092005B1 (fr) 1985-03-27

Family

ID=8189642

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19820302017 Expired EP0092005B1 (fr) 1982-04-20 1982-04-20 Tête d'imprimeur thermique

Country Status (2)

Country Link
EP (1) EP0092005B1 (fr)
DE (1) DE3262754D1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59187870A (ja) * 1983-04-08 1984-10-25 Canon Inc 液体噴射記録装置
JPS60184858A (ja) * 1984-03-02 1985-09-20 Hitachi Ltd サ−マルヘツド
JPS60219075A (ja) * 1984-04-16 1985-11-01 Hitachi Ltd サ−マルヘツド
US4768038A (en) * 1985-05-17 1988-08-30 Konishiroku Photo Industry Co., Ltd. Thermal printhead integrated circuit device
JPS6490768A (en) * 1987-09-30 1989-04-07 Toshiba Corp Thermal recording head
JP7001388B2 (ja) * 2017-08-09 2022-01-19 ローム株式会社 サーマルプリントヘッドおよびサーマルプリントヘッドの製造方法
JP7204492B2 (ja) * 2018-02-26 2023-01-16 ローム株式会社 サーマルプリントヘッド

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE431805B (sv) * 1976-04-05 1984-02-27 Oki Electric Ind Co Ltd Termiskt skrivarhuvud
US4169032A (en) * 1978-05-24 1979-09-25 International Business Machines Corporation Method of making a thin film thermal print head

Also Published As

Publication number Publication date
DE3262754D1 (en) 1985-05-02
EP0092005A1 (fr) 1983-10-26

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