EP0000412A2 - Semiconductor injection laser or intensifier - Google Patents

Semiconductor injection laser or intensifier Download PDF

Info

Publication number
EP0000412A2
EP0000412A2 EP78200074A EP78200074A EP0000412A2 EP 0000412 A2 EP0000412 A2 EP 0000412A2 EP 78200074 A EP78200074 A EP 78200074A EP 78200074 A EP78200074 A EP 78200074A EP 0000412 A2 EP0000412 A2 EP 0000412A2
Authority
EP
European Patent Office
Prior art keywords
strip
layer
shaped
passive
refractive index
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP78200074A
Other languages
German (de)
French (fr)
Other versions
EP0000412B1 (en
EP0000412A3 (en
Inventor
Tullio Ernesto Rozzi
Johannes Hendrik Cornelis Van Heuven
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV, Koninklijke Philips Electronics NV filed Critical Philips Gloeilampenfabrieken NV
Publication of EP0000412A2 publication Critical patent/EP0000412A2/en
Publication of EP0000412A3 publication Critical patent/EP0000412A3/en
Application granted granted Critical
Publication of EP0000412B1 publication Critical patent/EP0000412B1/en
Expired legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/50Amplifier structures not provided for in groups H01S5/02 - H01S5/30
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/223Buried stripe structure
    • H01S5/2231Buried stripe structure with inner confining structure only between the active layer and the upper electrode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/50Amplifier structures not provided for in groups H01S5/02 - H01S5/30
    • H01S5/5009Amplifier structures not provided for in groups H01S5/02 - H01S5/30 the arrangement being polarisation-insensitive

Definitions

  • the invention relates to a semiconductor device for generating or intensifying coherent electromagnetic radiation, comprising a semiconductor body having an active semiconductor layer which comprises a p-n junction and which is bounded on either side by first and second passive semiconductor layers having a lower refractive index for the said radiation than the active layer, one of the passive layers comprising a strip-shaped electrode structure for supplying current to a strip-shaped region of the active layer in a direction substantially perpendicular to the layer so as to produce or intensify the said radiation therein, at least the first passive layer comprising a strip-shaped zone which, in projection, extends fully within the said strip-shaped region and which has a different structure from the parts of the said passive layer adjoining same, said strip-shaped zone having a width which is at most equal to that of the said strip-shaped region.
  • a semiconductor device as described above is disclosed in United States Patent Specification No. 3,883,821.
  • the said p-n junction may extend between two parts of the active layer parallel to the interfaces of the layer with the adjoining passive layers.
  • the p-n junction may alternatively be formed between the active layer and one of the two passive layers adjoining same.
  • the said strip-shaped region of the active layer while neglecting possibly occurring lateral spreading of the current, it is to be understood to mean herein that region of the active layer which in projection is bounded by the outline of the strip-shaped electrode structure.
  • Lasers Semiconductor devices for generating coherent electromagnetic radiation (lasers) or for the intensification (amplification) thereof (traveling wave intensifiers) are known in many constructions.
  • the intensification occurs in a thin layer, the active layer, of which, at least in the case of lasers, a part is situated within a resonant cavity which is formed either between two reflective surfaces extending perpendicular to the direction of propagation of the radiation, or differently, for example in the laser with reduced feedback coupling which is described in Applied Physics Letters, Vol. 18, February 15, 1971, pp. 152-T54.
  • the number of transversal modes in which the emanating beam oscillates can be restricted by making the strip-shaped electrode configuration very narrow.
  • the number of transversal modes can even be restricted to one.
  • the use of very narrow electrode structures has for its disadvantage that the current density can easily become so high that damage to the laser structure occurs.
  • several modes of oscillation may nevertheless occur in the case of currents which are considerably above the threshold current.
  • the radiation is restricted to one transversal mode by making the active layer in a double hetero junction laser having a strip-shaped electrode not homogeneous in thickness but providing therein below the strip-shaped electrode a strip-shaped zone having a larger thickness than the remaining part of the active layer.
  • a disadvantage of this known device is that technologically it is particularly difficult to provide the required very small and very narrow thickening in the active layer without thereby adversely influencing the operation of the laser/intensifier.
  • the required processes etching and growing after the etching step
  • the thin active layer within which the intensification mechanism of the device occurs is the most vulnerable part of the device. Therefore, after providing the active layer said layer should be subjected to the least possible number of further treatments.
  • the thicker central region of the active layer underlying the strip- shaped electrode will pass less current and will hence become active less rapidly. This has a detrimental influence on the stability of operation and on the intensification.
  • the threshold current is reached first in the thinner parts of the strip-shaped region of the active layer underlying the electrode on either side of the thickening.
  • in principle first a higher mode and only then the fundamental mode can be impulsed upon switching on the device. And finally transversal higher-order modes in a direction perpendicular to the active layer can more easily occur in the thicker region of the active layer.
  • One of the objects of the invention is to provide a semiconductor device for generating or intensifying coherent radiation with strip-shaped electrode geometry, in which the emanating beam oscillates only in the fundamental transversal mode also at current values above the threshold current, which device moreover can be manufactured with a greater reproducibility than known devices.
  • the invention is based inter alia on the recognition that wave guidance below the strip-shaped electrode can be obtained when an active layer is used which has substantially the same thickness and preferably the same doping everywhere, by means of measures which relate only to the construction and composition of a passive layer.
  • a semiconductor device of the kind described in the preamble is characterized in that the active layer has substantially the same thickness everywhere, that at least the first passive layer comprises a first portion having a refractive index n 1 and a second portion having a refractive index n 2 different from n 1 for the said radiation, said second portion being of the same semiconductor material and having the same conductivity type as the first portion, the active layer adjoining said first portion at least within said strip-shaped zone, and that the condition is satisfied wherein d 1 is the thickness of the first portion from the active layer to the second portion within the strip-shaped zone, and d 2 is the thickness of the first portion in the region of the first passive layer adjoining the strip-shaped zone.
  • n 1 - n 2 (d 1 - d 2 )) 0 indicates that either n 1 must be > n 2 and also d 1 must be d 2 or n 1 must be > n 2 and also d 1 must be > d 2 .
  • the strip-shaped zone By making the strip-shaped zone narrower than the strip-shaped electrode structure, the operation of the laser (or intensifier) in the fundamental mode becomes more stable. According to an important preferred embodiment, therefore, the strip-shaped zone has a width less than said strip-shaped region of the active layer. Since the electrode width need not be extremely small, a comparatively larger power can be generated without degradation of the device. Furthermore, the emanating beam in this case has a satisfactorily flat wave front so that the beam is little astigmatic, which makes the optical coupling to, for example, a glass fibre simple.
  • the strip-shaped zone of higher refractive index is provided so as to be slightly asymmetrical with respect to the electrode structure, the occurrence of more than one oscillation mode can be suppressed to a much more considerable extent in the case of a symmetrical structure. Therefore, according to an important preferred embodiment, the strip-shaped zone is provided so as to be symmetrical with respect to the strip-shaped region.
  • the strip-shaped zone can be realised in a number of different manners in the structure of the first passive semiconductor layer.
  • the first passive semiconductor layer in the regions adjoining the strip-shaped zone consists entirely of the portion having the lower refractive index.
  • the desired zone can be formed in a comparatively simple manner technologically by doping a narrow strip-shaped part of said layer.
  • This may be done, for example, by diffusion or by ion implantation, in which a passive layer which consists, for example, of a ternary semiconductor mixed crystal, for example Ga i-x AlxAsp is locally given a slightly different composition having a .higher refractive index by a suitable doping.
  • a passive layer which consists, for example, of a ternary semiconductor mixed crystal, for example Ga i-x AlxAsp is locally given a slightly different composition having a .higher refractive index by a suitable doping.
  • a strip-shaped zone of higher refractive index can simply be formed which extends from the surface of the first passive semiconductor layer remote from the active layer over a part of the thickness of the layer, in which latter case the strip-shaped zone consists entirely of the portion having the higher refractive index.
  • a "buried" strip-shaped zone of higher refractive index can also be obtained in a simple manner in the first passive semiconductor layer which is surrounded, within the passive semiconductor layer,entirely by the portion having the lower refractive index.
  • the active and passive layers need not be flat and in some cases it may be preferred, also in connection with the manufacturing method to be followed, to provide one or more layers so as to be not flat and one or both passive layers to have an inhomogeneous thickness.
  • a preferred embodiment in which the active layer in the strip-shaped zone adjoins the material having the lower refractive index (so n 1 n 2 and d 1 d 2 ) is characterized in that the first passive layer is provided on a substrate which locally has a strip-shaped raised portion, the first passive layer at the area of said raised portion showing a smaller overall thickness than beside the raised portbn.
  • a preferred embodiment in which the active layer in the strip-shaped zone adjoins the material having the higher refractive index (so n 1 > n 2 and d 1 > d 2 ) is characterized in that the first passive layer is provided on a substrate which locally has a strip-shaped depressed portion, the first passive layer at the area of said depressed portion showing a larger overall thickness than beside the depressed portion.
  • strip-shaped electrode structure As regards the strip-shaped electrode structure, several known configurations may be used which may be situated either on one side or on the other side of the active layer, or theoretically on both sides, although this may provide cooling problems.
  • Fig. 1 shows partly as a perspective view and partly as a cross-sectional view a semiconductor device according to the invention for intensifying or generating coherent electromagnetic radiation.
  • the device comprises a semiconductor body 1 having an active semiconductor layer 2 which comprises a p-n junction 3 and is bounded on either side by first and second passive semiconductor layers (4, 11) and 5 both having a lower refractive index for the radiation to be generated or intensified than the active layer 2.
  • One of the passive layers, the layer (4, 11) has a strip-shaped electrode structure.
  • this is a strip-shaped metal layer 7 which is provided on a semiconductor contact layer 7 having the same conductivity type as but a lower resistivity than the passive layer (4, 11).
  • Current can be supplied to a strip-shaped region 8 (situated between the broken lines) of the active layer 2 by the electrode 6 in a direction perpendicular to the layer.
  • the other electrode (9) is situated on a readily conductive substrate 10, on which the passive layer 5 is present, and extends on the whole surface thereof.
  • a suitable voltage between the electrodes 6 and 9 via a current source 20, shown diagrammatically in Fig. 1, current is supplied to the region 8 in a direction substantially perpendicular to the layer 2,namely in the forward direction of the p-n junction 3, which current serves in known manner to generate in the active layer 2 coherent electromagnetic radiation according to the laser principle (if the strip-shaped region 8 is provided in a resonant cavity) or to intensify it (if this is not the case).
  • the first passive layer (4, 11) has a strip-shaped zone (4A, 11) extending in projection entirely within the strip-shaped region 8 and having a different structure than the adjoining parts (4) of the layer as will be described in detail hereinafter.
  • Said strip-shaped zone (4A, 11) has a width which is at most equal to, and in this example is smaller than, that of the strip-shaped region 8.
  • the active layer (2) everywhere has about the same thickness, while at least the first passive layer comprises a first portion (4, 4A) having a refractive index n 1 , and a second portion 11 of the same semiconductor material and the same conductivity type as the first portion and having a refractive index n 2for said radiation which is different from n 1 .
  • the active layer 2 at least within the strip-shaped zone (4A, 11) (and in this example also outside the strip-shaped zone) adjoins the first portion (4, 4A).
  • n 2 n 1
  • the thickness d 1 of the first portion 4A from the active layer 2 to the second portion 11 within the strip-shaped zone (4A, 11) is less than the thickness d 2 of the first portion 4 in the region of the first passive layer which adjoins the strip-shaped zone.
  • the emanating radiation emanates in the direction of the arrow in Fig. 1, and the entering radiation enters in the same direction through the oppositely located end face, the emanating radiation of wavelength 0.9 micron being intensified with respect to the entering radiation of the same wavelength.
  • the passive layer 4 in the regions adjoining the strip-shaped zone consists entirely of the material of lower refractive index
  • the strip-shaped zone of the layer 4 in Fig. 2 consisting entirely of the material of the higher refractive index, in other words the zone 11 extends over the whole thickness of the layer 4.
  • the portion 11 of higher refractive index is surrounded entirely by the portion 4 of lower refractive index.
  • the region 11 also has a higher refractive index than the remainder of the layer (4, 11).
  • the region 11 adjoins the active layer 2; so in these devices it holds that n 1 > n 2 and d 1 > d 2 .
  • the region of lower refractive index adjoins the active layer 2 in the device shown in Fig. 6 where the region of lower refractive index adjoins the active layer 2, it holds on the contrary that n 1 ⁇ n 2 and d 1 ⁇ d 2 .
  • the device according to the invention both as regards relative power intensification and as regards horizontal concentration and relative astigmatism, shows a considerable improvement as compared with devices in which the passive layer 4 is homogeneous in thickness and composition and in which thus the region 11 is lacking, Also for the above-mentioned reasons, the device is technologically better realisable than that described in United States Patent Specification 3,883,821, since the active layer 2 has substantially the same thickness everywhere and mechanical or physical-chemical treatments need not be carried out on or in said layer after the growth thereof.
  • Figs. 7 to 11 show various embodiments for the strip-shaped electrode structure which are all known per se.They may be used in the structure shown in Fig. 1, as shown in the drawing, but also in any other device according to the invention.
  • an electrode layer is provided on the upper side of the device over the whole surface, which layer, however, contacts the semiconductor surface only via a slot-shaped aperture in the insulating layer 12 situated on the surface.
  • a contact layer is provided on the p- conductive passive layer 4 and consists of a strip-shaped part 13 of E -type gallium arsenide and beside it n-type gallium arsenide regions 14, so that in the forward direction current flows only through the p-n junction 3 via the region 13.
  • Fig. 7 shows various embodiments for the strip-shaped electrode structure which are all known per se.They may be used in the structure shown in Fig. 1, as shown in the drawing, but also in any other device according to the invention.
  • an electrode layer is provided on the upper side of the device over the whole surface, which layer
  • a strip-shaped electrode 6 is provided directly on the passive layer 4.
  • the strip-shaped electrode structure is provided in contact with the passive layer 5 by restricting the current to a strip-shaped region by means of the buried p-type GaAs regions 15 between the n-type GaAlAs layer 5 and the n-type GaAs substrate 10.
  • the current is restricted to a strip-shaped region by providing insulating zones 16 (crosswise shading),for example, by a proton bombardment.
  • the first passive layer 4 that is, the passive layer comprising the strip-shaped zone according to the invention, is provided on a substrate 10 which locally has a strip-shaped raised portion 10A, in which the first passive layer 4 at the area of said raised portion shows a smaller overall thickness than beside the raised portion.
  • a substrate 10 which locally has a strip-shaped raised portion 10A, in which the first passive layer 4 at the area of said raised portion shows a smaller overall thickness than beside the raised portion.
  • the electrode 6 again has a width of approximately 9 microns
  • the raised portion 10A has a width of approximately 4 microns and a height of approximately 2 microns
  • the lowermost portion of the passive layer 4 consists of n-type Ga 1-x Al x As having such a composition that its refractive index n 2 is approximately 3.50
  • the uppermost portion of the layer 4 adjoining the active layer 2 consists of n-type Ga 1-y Al y As having such a composition that its refractive index n 1 is approximately 3.40
  • the passive layer 5 also has a refractive index 3.40.
  • the thickness d 1 is approximately 0.4 micron
  • the thickness d 2 at the indicated place is approximately 0.8 micron.
  • the thickness of the active layer 2 (n-type GaAs, refractive index approximately 3.61)is approximately 0.2 micron everywhere, that of the passive layer 5 (p-type Ga 1-x Al y As) is approximately 1.5 microns.
  • An electrode layer 9 is provided on the substrate 10 consisting of n-type GaAs and having a low resistivity and refractive index 3.61.
  • a laser or intensifier structure as shown in Fig. 13 may also be obtained.
  • the first passive layer 4 is provided on a substrate 10 which locally shows a strip-shaped depressed portion 10B in which the layer 4 at the area of said depressed portion shows a larger overall thickness than beside the depressed portion.
  • the depressed portion 10B has a width of approximately 4 microns and a height of approximately 3 microns.
  • the thickness d 1 is approximately 0.25 micron
  • the thickness d 2 is approximately 0.1 micron.
  • the active layer 2 has substantially the same thickness everywhere.
  • the devices shown in Figs. 12 and 13 may be manufactured, for example, by using epitaxial growth methods as described in Journal of Applied Physics, Volume 47, No. 10, October 1976, pp. 4578-4589.
  • the desired structure is obtained both in Fie. 12 and in Fig. 13 by direct epitaxial growth of the successive layers from the liquid phase without it being necessary to carry out further operations after the growth of the layer 4 thereon so as to obtain the desired strip-shaped inhomogeneity.
  • the successive epitaxial growth of semiconductor layers of different compositions is generally known in the technology of the hetero junction lasers and is described in detail in the technical literature on various occasions. In this connection reference may be had to the book by D. Elwell and J.J. Scheel, Crystal Growth from High Temperature Solutions, Academic Press 1975, pp. 433-467, hereby incorporated by reference. So the manufacture of the devices described need not be further entered into.
  • the portions of different refractive indices in the passive layer 4 (Figs. 1 to 11) can be obtained by first growing a layer of homogeneous refractive index and then introducing into a portion of said layer, while using a suitable masking, a material which increases the refractive index (Figs.
  • the refractive index can be increased in p-type Ga Al As by the addition of an acceptor, such as Zn or Ge. This could also be done by increasing the content of gallium. Conversely the refractive index can be reduced by increasing the content of aluminium.
  • the invention is not restricted to the embodiments described.
  • suitable semiconductor materials other than GaAs and Ga 1-x Al x As may alternatively be used.
  • the conductivity type of the active layer is not of essential importance; in the embodiments described the layer 3 may be both n-conductive and p-conductive.
  • a portion of the layer 2 may be n-conductive and a portion may be p-conductive, said portions constituting a p-n junction parallel to the faces of the layer 2.
  • a strip-shaped zone of different construction which in the embodiments described occurs only in the first passive layer 4, may be provided, if desired, both in the first passive layer 4 and in the second passive layer 5.
  • the structures of said two zones need not be the same; for example, a region 11 in the layer 4 of Fig. 2 may be combined with a region 11' according to one of the structures of Figs. 3 to 6 in the layer 5.
  • Fig. 4 serves as an illustration in which an n-type region 11' of higher refractive index than the remainder of the layer 5 is provided in the n-type passive layer 4 and the reference numerals otherwise have the same meaning as in Fig. 7.
  • the strip-shaped zones in the layers 4 and 5 have the same construction and it can be calculated that to an approximation double the effect occurs with respect to the device shown in Fig. 7.
  • the strip-shaped electrode structure may be situated at the side of the layer 4, but alternatively, instead thereof, at the side of the layer 5.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Semiconductor Lasers (AREA)

Abstract

A semiconductor laser or traveling wave intensifier having an active layer between two passive semiconductor layers, and a strip-shaped electrode geometry. According to the invention the active layer is uniform in thickness. while at least one of the passive layers within the strip-shaped geometry comprises a strip-shaped zone of deviating construction and is built up from portions having different refractive indices n, and n2. According to the invention it holds that
Figure imga0001
wherein n, is the refractive index of the portion which at least within said strip-shaped zone adjoins the active layer, d, is the thickness thereof within the strip-shaped zone, and d2 is the thickness thereof beside the strip-shaped zone.

Description

  • The invention relates to a semiconductor device for generating or intensifying coherent electromagnetic radiation, comprising a semiconductor body having an active semiconductor layer which comprises a p-n junction and which is bounded on either side by first and second passive semiconductor layers having a lower refractive index for the said radiation than the active layer, one of the passive layers comprising a strip-shaped electrode structure for supplying current to a strip-shaped region of the active layer in a direction substantially perpendicular to the layer so as to produce or intensify the said radiation therein, at least the first passive layer comprising a strip-shaped zone which, in projection, extends fully within the said strip-shaped region and which has a different structure from the parts of the said passive layer adjoining same, said strip-shaped zone having a width which is at most equal to that of the said strip-shaped region.
  • A semiconductor device as described above is disclosed in United States Patent Specification No. 3,883,821.
  • It should be stressed that, where in this specification the expression "refractive index" is used, this relates to the reel part of the (generally complex) refractive index for the relevant radiation.
  • The said p-n junction may extend between two parts of the active layer parallel to the interfaces of the layer with the adjoining passive layers. However, the p-n junction may alternatively be formed between the active layer and one of the two passive layers adjoining same.
  • It is furthermore to be noted that the said strip-shaped region of the active layer, while neglecting possibly occurring lateral spreading of the current, it is to be understood to mean herein that region of the active layer which in projection is bounded by the outline of the strip-shaped electrode structure.
  • Semiconductor devices for generating coherent electromagnetic radiation (lasers) or for the intensification (amplification) thereof (traveling wave intensifiers) are known in many constructions. The intensification occurs in a thin layer, the active layer, of which, at least in the case of lasers, a part is situated within a resonant cavity which is formed either between two reflective surfaces extending perpendicular to the direction of propagation of the radiation, or differently, for example in the laser with reduced feedback coupling which is described in Applied Physics Letters, Vol. 18, February 15, 1971, pp. 152-T54.
  • The requirements which are imposed in many cases upon a laser intensifier of the said kind are:
    • a) Low threshold current (that is the minimum current strength at which stimulated radiation emission and intensification, respectively, occur should be as low as possible);
    • b) A cross-section which is as small as possible of the emanating beam both in a direction perpendicular to the active layer and in a direction parallel thereto;
    • c) Oscillation in only one mode, preferably the fundamental (lowest-order) transversal mode.

    In order to obtain a low threshold current and a small beam cross-section parallel to the activelayer, the current, through a strip-shaped electrode structure, i4 limited to a narrow region of the active layer. The beam cross-section in a vertical direction, perpendicular to the active layer, is restricted by providing the active layer between two passive layers of lower refractive index (larger band gap) than the active layer. For this purpose, a passive semiconductor layer having a composition differing from that of the active layer is usually provided on one or on both sides of the active layer, said passive layer forming a so-called hetero junction with the active layer.
  • The number of transversal modes in which the emanating beam oscillates can be restricted by making the strip-shaped electrode configuration very narrow. Herewith the number of transversal modes can even be restricted to one. However, the use of very narrow electrode structures has for its disadvantage that the current density can easily become so high that damage to the laser structure occurs. In addition, several modes of oscillation may nevertheless occur in the case of currents which are considerably above the threshold current.
  • In the above device known from United States Patent Specification 3,883,821, the radiation is restricted to one transversal mode by making the active layer in a double hetero junction laser having a strip-shaped electrode not homogeneous in thickness but providing therein below the strip-shaped electrode a strip-shaped zone having a larger thickness than the remaining part of the active layer. By suitable choosing the ratio between the height and the width of the said thickened part of the active layer a radiation beam oscillating only in one transversal mode can be obtained.
  • However, a disadvantage of this known device is that technologically it is particularly difficult to provide the required very small and very narrow thickening in the active layer without thereby adversely influencing the operation of the laser/intensifier. First of all, the required processes (etching and growing after the etching step) are difficult to carry out in a reproducible manner while maintaining the required crystal perfection. In addition, the thin active layer within which the intensification mechanism of the device occurs, is the most vulnerable part of the device. Therefore, after providing the active layer said layer should be subjected to the least possible number of further treatments.
  • In addition to the said technological problems a few further disadvantages are associated with the said known structure. For example, the thicker central region of the active layer underlying the strip- shaped electrode will pass less current and will hence become active less rapidly. This has a detrimental influence on the stability of operation and on the intensification. As a result of this, the threshold current is reached first in the thinner parts of the strip-shaped region of the active layer underlying the electrode on either side of the thickening. As a result of this, in principle first a higher mode and only then the fundamental mode can be impulsed upon switching on the device. And finally transversal higher-order modes in a direction perpendicular to the active layer can more easily occur in the thicker region of the active layer.
  • One of the objects of the invention is to provide a semiconductor device for generating or intensifying coherent radiation with strip-shaped electrode geometry, in which the emanating beam oscillates only in the fundamental transversal mode also at current values above the threshold current, which device moreover can be manufactured with a greater reproducibility than known devices.
  • For that purpose the invention is based inter alia on the recognition that wave guidance below the strip-shaped electrode can be obtained when an active layer is used which has substantially the same thickness and preferably the same doping everywhere, by means of measures which relate only to the construction and composition of a passive layer.
  • According to the invention, a semiconductor device of the kind described in the preamble is characterized in that the active layer has substantially the same thickness everywhere, that at least the first passive layer comprises a first portion having a refractive index n1 and a second portion having a refractive index n2 different from n1 for the said radiation, said second portion being of the same semiconductor material and having the same conductivity type as the first portion, the active layer adjoining said first portion at least within said strip-shaped zone, and that the condition is satisfied
    Figure imgb0001
    wherein d1 is the thickness of the first portion from the active layer to the second portion within the strip-shaped zone, and d2 is the thickness of the first portion in the region of the first passive layer adjoining the strip-shaped zone.
  • The condition (n1 - n2) (d1 - d2)) 0 indicates that either n1 must be > n2 and also d1 must be
    d2 or n1 must be > n2 and also d1 must be > d2.
  • In the semiconductor device according to the invention, after the growth of the active layer said layer is not further subjected to treatments which might detrimentally influence the properties thereof, since the measures to obtain the desired wave guidance are restricted to the passive semiconductor layer or layers.
  • By making the strip-shaped zone narrower than the strip-shaped electrode structure, the operation of the laser (or intensifier) in the fundamental mode becomes more stable. According to an important preferred embodiment, therefore, the strip-shaped zone has a width less than said strip-shaped region of the active layer. Since the electrode width need not be extremely small, a comparatively larger power can be generated without degradation of the device. Furthermore, the emanating beam in this case has a satisfactorily flat wave front so that the beam is little astigmatic, which makes the optical coupling to, for example, a glass fibre simple.
  • Although higher transversal oscillation modes can be suppressed already to a considerable extent when the strip-shaped zone of higher refractive index is provided so as to be slightly asymmetrical with respect to the electrode structure, the occurrence of more than one oscillation mode can be suppressed to a much more considerable extent in the case of a symmetrical structure. Therefore, according to an important preferred embodiment, the strip-shaped zone is provided so as to be symmetrical with respect to the strip-shaped region.
  • The strip-shaped zone can be realised in a number of different manners in the structure of the first passive semiconductor layer. According to an important preferred embodiment, the first passive semiconductor layer in the regions adjoining the strip-shaped zone consists entirely of the portion having the lower refractive index. In this case, during the manufacture there may be started from a first passive semiconductor layer having a homogeneous composition, after which the desired zone can be formed in a comparatively simple manner technologically by doping a narrow strip-shaped part of said layer. This may be done, for example, by diffusion or by ion implantation, in which a passive layer which consists, for example, of a ternary semiconductor mixed crystal, for example Ga i-x AlxAsp is locally given a slightly different composition having a .higher refractive index by a suitable doping.
  • In this manner a strip-shaped zone of higher refractive index can simply be formed which extends from the surface of the first passive semiconductor layer remote from the active layer over a part of the thickness of the layer, in which latter case the strip-shaped zone consists entirely of the portion having the higher refractive index. When ion implantation is used, a "buried" strip-shaped zone of higher refractive index can also be obtained in a simple manner in the first passive semiconductor layer which is surrounded, within the passive semiconductor layer,entirely by the portion having the lower refractive index.
  • All the above-mentioned preferred embodiments have the advantage of being realisable technologically in a comparatively simple manner.
  • The active and passive layers need not be flat and in some cases it may be preferred, also in connection with the manufacturing method to be followed, to provide one or more layers so as to be not flat and one or both passive layers to have an inhomogeneous thickness. A preferred embodiment in which the active layer in the strip-shaped zone adjoins the material having the lower refractive index (so n1 n2 and d1 d2) is characterized in that the first passive layer is provided on a substrate which locally has a strip-shaped raised portion, the first passive layer at the area of said raised portion showing a smaller overall thickness than beside the raised portbn. Conversely, a preferred embodiment in which the active layer in the strip-shaped zone adjoins the material having the higher refractive index (so n1 > n2 and d1 > d2) is characterized in that the first passive layer is provided on a substrate which locally has a strip-shaped depressed portion, the first passive layer at the area of said depressed portion showing a larger overall thickness than beside the depressed portion.
  • As regards the strip-shaped electrode structure, several known configurations may be used which may be situated either on one side or on the other side of the active layer, or theoretically on both sides, although this may provide cooling problems.
  • The invention will now be described in greater detail with reference to a few embodiments and the drawing, in which
    • Fig. 1 is a partly perspectkre and partly diagrammatic cross-sectional view of a device according to the invention;
    • Figs. 2 to 6 are diagrammatic cross-sectional views through the active parts of modified embodiments of devices according to the invention;
    • Figs 7 to 11 are diagrammatic cross-sectional views of the device shown in Fig. 1 with different strip-shaped electrode structures;
    • Figs. 12 and 13 are diagrammatic cross-sectional views of the active parts of two other modified embodiments of the device according to the invention, and
    • Fig. 14 is a diagrammatic cross-sectional view of a modified embodiment of the device shown in Fig. 7.
  • The figures are diagrammatic and not drawn to scale for clarity. In the cross-sectional views, regions of the same conductivity type are as a rule shaded in the same direction. Corresponding parts are generally referred to by the same reference numerals.
  • Fig. 1 shows partly as a perspective view and partly as a cross-sectional view a semiconductor device according to the invention for intensifying or generating coherent electromagnetic radiation. The device comprises a semiconductor body 1 having an active semiconductor layer 2 which comprises a p-n junction 3 and is bounded on either side by first and second passive semiconductor layers (4, 11) and 5 both having a lower refractive index for the radiation to be generated or intensified than the active layer 2. One of the passive layers, the layer (4, 11) has a strip-shaped electrode structure. In this example this is a strip-shaped metal layer 7 which is provided on a semiconductor contact layer 7 having the same conductivity type as but a lower resistivity than the passive layer (4, 11). Current can be supplied to a strip-shaped region 8 (situated between the broken lines) of the active layer 2 by the electrode 6 in a direction perpendicular to the layer. The other electrode (9) is situated on a readily conductive substrate 10, on which the passive layer 5 is present, and extends on the whole surface thereof. By applying a suitable voltage between the electrodes 6 and 9 via a current source 20, shown diagrammatically in Fig. 1, current is supplied to the region 8 in a direction substantially perpendicular to the layer 2,namely in the forward direction of the p-n junction 3, which current serves in known manner to generate in the active layer 2 coherent electromagnetic radiation according to the laser principle (if the strip-shaped region 8 is provided in a resonant cavity) or to intensify it (if this is not the case).
  • The first passive layer (4, 11) has a strip-shaped zone (4A, 11) extending in projection entirely within the strip-shaped region 8 and having a different structure than the adjoining parts (4) of the layer as will be described in detail hereinafter. Said strip-shaped zone (4A, 11) has a width which is at most equal to, and in this example is smaller than, that of the strip-shaped region 8.
  • According to the invention the active layer (2) everywhere has about the same thickness, while at least the first passive layer comprises a first portion (4, 4A) having a refractive index n1, and a second portion 11 of the same semiconductor material and the same conductivity type as the first portion and having a refractive index n 2for said radiation which is different from n1. The active layer 2, at least within the strip-shaped zone (4A, 11) (and in this example also outside the strip-shaped zone) adjoins the first portion (4, 4A). In this example n2) n1, while the thickness d1 of the first portion 4A from the active layer 2 to the second portion 11 within the strip-shaped zone (4A, 11) is less than the thickness d2 of the first portion 4 in the region of the first passive layer which adjoins the strip-shaped zone.
  • Since n2> n1 and d2 > d1, the condition is satisfied that
    Figure imgb0002
  • The dimensions and compositions of the various layers are as follows:
    • Substrate 10: n-type gallium arsenide (GaAs); thickness approximately 80 microns; refractive index approximately 3.61;resistivity approximately 0.001 Ohm.cm.
    • Passive layer 5: n-type gallium aluminium arsenide (Ga0.7Al0.3As); thickness approximately 3 microns; refractive index approximately 3.40.
    • Active layer 2: p-type GaAs; thickness approximately 0.5 micron; refractive index approximately 3.61.
    • Passive layer 4: Outside the zone 11: E-type Ga0.7Al0.3As; thickness approximately 1.5 microns; refractive index approximately 3.40.
    • Zone 11: zinc-doped or germanium-doped p-type Ga0.7Al0.3As, d1 (Fig. 1) = 0.1 micron; refractive index approximately 3.41.
    • Contact layer 7: p- type GaAs; thickness approximately 1.5 microns; refractive index approximately 3.61; resistivity approximately 0.003 Ohm. cm.

    Width b of electrode layer 6: approximately 9 microns. The device may operate as a laser or as a traveling wave intensifier. When used as a laser, for example reflective surfaces are provided in the usual manner perpendicular to the strip-shaped electrode 6; for this purpose may serve, for example, the end faces of the crystal which are. then constructed as cleavage surfaces, or periodic structures as described in the above-mentioned article in Applied Physics Letters. The generated laser radiation in the device described then has a wavelength (in vacuum) of approximately 0.9 micron and emanates in the direction of the arrow in Fig. 1.
  • When used as a traveling wave intensifier, no reflective surfaces are used; the emanating radiation emanates in the direction of the arrow in Fig. 1, and the entering radiation enters in the same direction through the oppositely located end face, the emanating radiation of wavelength 0.9 micron being intensified with respect to the entering radiation of the same wavelength.
  • In both applications, with the device described, for different widths a in microns of the strip-shaped zone (see Fig. 1) the following results are calculated for d1 = 0.1 micron:
    Figure imgb0003
  • The indicated values apply to a strip length L (see Fig. 1) of 300 microns with the given current densities in kA/cm2.
    Figure imgb0004
    Figure imgb0005
    Figure imgb0006
    in which the relative phase is, for example, chosen with respect to the phase in the-centre of the strip-shaped region 8. Many modifications of the embodiment shown in Fig. 1 are possible;the principal modifications are shown in Figs. 2 to 6 as cross-sectional views in so far as the layers 4, 2 and 5 are concerned. 11 is always the region having the higher refractive index, while the remaining part of the layer 4 has a lower refractive index. The strip-shaped zone in all these cases is provided symmetrically with respect to the strip-shaped region 8. In the devices shown in Figs. 1, 2 and 3 the passive layer 4 in the regions adjoining the strip-shaped zone consists entirely of the material of lower refractive index, the strip-shaped zone of the layer 4 in Fig. 2 consisting entirely of the material of the higher refractive index, in other words the zone 11 extends over the whole thickness of the layer 4. In Fig. 3 the portion 11 of higher refractive index is surrounded entirely by the portion 4 of lower refractive index.
  • In Figs. 4 to 6 the region 11 also has a higher refractive index than the remainder of the layer (4, 11). In the devices shown in Figs. 4 and 5 the region 11 adjoins the active layer 2; so in these devices it holds that n1 > n2 and d1 > d2. In the device shown in Fig. 6 where the region of lower refractive index adjoins the active layer 2, it holds on the contrary that n1 < n2 and d1 < d 2.
  • For the devices shown in Figs. 2 to 6 the same results hold to an approximation as indicated in Table 1 for the device shown in Fig. 1. For example, the results shown in Table II are obtained for the device shown in Fig. 2.
    Figure imgb0007
    in which the abbreviations have the same meaning as in Table I.
  • From the above it appears that the device according to the invention, both as regards relative power intensification and as regards horizontal concentration and relative astigmatism, shows a considerable improvement as compared with devices in which the passive layer 4 is homogeneous in thickness and composition and in which thus the region 11 is lacking, Also for the above-mentioned reasons, the device is technologically better realisable than that described in United States Patent Specification 3,883,821, since the active layer 2 has substantially the same thickness everywhere and mechanical or physical-chemical treatments need not be carried out on or in said layer after the growth thereof.
  • It should be stressed that both in Table I B. (for a
    Figure imgb0008
    9µm) and in Table II A. (for a
    Figure imgb0009
    6µm) and in Table II B. (for a ≈ 6/um) there is an optimum value for R.I.; in Table I B. this is the case for H.C. as well. In the calculatbn of these values losses at the edge of the strip-shaped active laser region have not been taken into account. If these losses are taken into account in a more complicated calculation, the resulting values are slightly different and one finds that there is always an optimum value which occurs for values of a which are in the order of the width b of the said strip-shaped region of the layer 2.
  • Figs. 7 to 11 show various embodiments for the strip-shaped electrode structure which are all known per se.They may be used in the structure shown in Fig. 1, as shown in the drawing, but also in any other device according to the invention. In Fig. 7, an electrode layer is provided on the upper side of the device over the whole surface, which layer, however, contacts the semiconductor surface only via a slot-shaped aperture in the insulating layer 12 situated on the surface. In Fig. 8, a contact layer is provided on the p- conductive passive layer 4 and consists of a strip-shaped part 13 of E-type gallium arsenide and beside it n-type gallium arsenide regions 14, so that in the forward direction current flows only through the p-n junction 3 via the region 13. In Fig. 9 a strip-shaped electrode 6 is provided directly on the passive layer 4.In Fig. 10 the strip-shaped electrode structure is provided in contact with the passive layer 5 by restricting the current to a strip-shaped region by means of the buried p-type GaAs regions 15 between the n-type GaAlAs layer 5 and the n-type GaAs substrate 10. In Fig. 11 finally the current is restricted to a strip-shaped region by providing insulating zones 16 (crosswise shading),for example, by a proton bombardment.
  • In the devices described so far, all the successive layers were bounded by substantially flat surfaces. That this is not necessary is illustrated with reference to the examples of Figs. 12 and 13. For clarity, these figures only show the small active part of the device as diagrammatic cross-sectional view perpendicular to the strip-shaped configuration.
  • In the device shown in Hg. 12 the first passive layer 4, that is, the passive layer comprising the strip-shaped zone according to the invention, is provided on a substrate 10 which locally has a strip-shaped raised portion 10A, in which the first passive layer 4 at the area of said raised portion shows a smaller overall thickness than beside the raised portion. In the structure shown in Fig. 12 the electrode 6 again has a width of approximately 9 microns, the raised portion 10A has a width of approximately 4 microns and a height of approximately 2 microns, and the lowermost portion of the passive layer 4 consists of n-type Ga1-xAlxAs having such a composition that its refractive index n2 is approximately 3.50, while the uppermost portion of the layer 4 adjoining the active layer 2 consists of n-type Ga1-yAlyAs having such a composition that its refractive index n1 is approximately 3.40. The passive layer 5 also has a refractive index 3.40. The thickness d1 is approximately 0.4 micron, the thickness d2 at the indicated place is approximately 0.8 micron. The thickness of the active layer 2 (n-type GaAs, refractive index approximately 3.61)is approximately 0.2 micron everywhere, that of the passive layer 5 (p-type Ga 1-xAlyAs) is approximately 1.5 microns. An electrode layer 9 is provided on the substrate 10 consisting of n-type GaAs and having a low resistivity and refractive index 3.61.
  • Conversely, a laser or intensifier structure as shown in Fig. 13 may also be obtained. In this figure the first passive layer 4 is provided on a substrate 10 which locally shows a strip-shaped depressed portion 10B in which the layer 4 at the area of said depressed portion shows a larger overall thickness than beside the depressed portion. The depressed portion 10B has a width of approximately 4 microns and a height of approximately 3 microns. The layer 4 consists of a lowermost portion of n-type Ga1-yAlyAs having a refractive index n2 = 3.40, and an uppermost portion of n-type Ga Al As having a refractive index n1 = 3.50 and adjoining the active layer 2. The regions and layers 10, 2 and 5,for example, have the same thickness and composition as in Fig. 12. The thickness d1 is approximately 0.25 micron, the thickness d2 is approximately 0.1 micron. As in the example of Fig. 12, it now also holds that
    Figure imgb0010
    Both in the device shown in Fig. 12 and in that shown in Fig. 13 the active layer 2 has substantially the same thickness everywhere. The devices shown in Figs. 12 and 13 may be manufactured, for example, by using epitaxial growth methods as described in Journal of Applied Physics, Volume 47, No. 10, October 1976, pp. 4578-4589. In these methods use is made of the fact that upon depositing an epitaxial layer from the liquid phase on a substrate having an unevenness, the layer grows thinner on a raised portion and grows thicker in a depressed portion than beside it, in which thus in both cases a certain "equalisation effect" occurs. According as the unevenness on which the layer is grown is less pronounced, the grown layer.becomes more uniform in thickness. In addition gallium arsenide proves to demonstrate the effect to a smaller extent than does gallium arsenide.As a result of this,both in the structure of Fig. 12 and in that of Fig. 13 an active layer 2 of gallium arsenide of substantially uniform thickness can be grown on the passive layer 4 of gallium aluminium arsenide.
  • In this manner, by starting from the substrates in question, the desired structure is obtained both in Fie. 12 and in Fig. 13 by direct epitaxial growth of the successive layers from the liquid phase without it being necessary to carry out further operations after the growth of the layer 4 thereon so as to obtain the desired strip-shaped inhomogeneity.
  • The successive epitaxial growth of semiconductor layers of different compositions is generally known in the technology of the hetero junction lasers and is described in detail in the technical literature on various occasions. In this connection reference may be had to the book by D. Elwell and J.J. Scheel, Crystal Growth from High Temperature Solutions, Academic Press 1975, pp. 433-467, hereby incorporated by reference. So the manufacture of the devices described need not be further entered into. The portions of different refractive indices in the passive layer 4 (Figs. 1 to 11) can be obtained by first growing a layer of homogeneous refractive index and then introducing into a portion of said layer, while using a suitable masking, a material which increases the refractive index (Figs. 1 to 3, 6 to 11) or a material which reduces the refractive index (Fig. 4 and 5), for example, by diffusion or by ion implantation. As a result of this the forbidden bandgap of the layer is locally reduced (so as to increase the refractive index) or increased (so as to reduce the refractive index).For example, the refractive index can be increased in p-type Ga Al As by the addition of an acceptor, such as Zn or Ge. This could also be done by increasing the content of gallium. Conversely the refractive index can be reduced by increasing the content of aluminium.
  • The invention is not restricted to the embodiments described. For example, suitable semiconductor materials other than GaAs and Ga 1-xAlxAs may alternatively be used. Furthermore, the conductivity type of the active layer is not of essential importance; in the embodiments described the layer 3 may be both n-conductive and p-conductive. Alternatively, a portion of the layer 2 may be n-conductive and a portion may be p-conductive, said portions constituting a p-n junction parallel to the faces of the layer 2.
  • It is furthermore of importance to note that a strip-shaped zone of different construction which in the embodiments described occurs only in the first passive layer 4, may be provided, if desired, both in the first passive layer 4 and in the second passive layer 5. The structures of said two zones need not be the same; for example, a region 11 in the layer 4 of Fig. 2 may be combined with a region 11' according to one of the structures of Figs. 3 to 6 in the layer 5. Fig. 4 serves as an illustration in which an n-type region 11' of higher refractive index than the remainder of the layer 5 is provided in the n-type passive layer 4 and the reference numerals otherwise have the same meaning as in Fig. 7. In this case the strip-shaped zones in the layers 4 and 5 have the same construction and it can be calculated that to an approximation double the effect occurs with respect to the device shown in Fig. 7.
  • The strip-shaped electrode structure may be situated at the side of the layer 4, but alternatively, instead thereof, at the side of the layer 5.
  • Finally it is to be noted that, although the invention has been described with reference to embodiments relating to lasers or intensifiers having hetero junctions, the invention may in principle also be applied to lasers or intensifiers which are constructed from a semiconductor body which is built up entirely of the same semiconductor material and the same semiconductor compound, respectively, without showing hetero junctions between different semiconductor materials.

Claims (10)

1. A semiconductor device for generating or intensifying coherent electromagnetic radiation, comprising a semiconductor body having an active semiconductor layer which comprises a p-n junction and which is bounded on either side by first and second passive semiconductor layers having a lower refractive index for the said radiation than the active layer, one of the passive layers comprising a strip-shaped electrode structure for supplying current to a strip-shaped region of the active layer in a direction substantially perpendicular to the layer so as to generate or intensify therein the said radiation, at least the first passive layer comprising a strip-shaped zone which, in projection, extends fully within the said strip-shaped region and which has a different structure from the parts of the said passive layer adjoining same, said strip-shaped zone having a width which is at most equal to that of the said active strip-shaped region, characterized in that the active layer has substantially the same thickness everywhere, that at least the first passive layer comprises a first portbn having a refractive index n1 and a second portion having a refractive index n2 different from n1 for the said radiation, said second portion being of the same semiconductor material and having the same conductivity type as the first portion, the active layer adjoining said first portion at least within said strip-shaped zone, and that the condition is satisfied
Figure imgb0011
wherein d1 is the thickness of the first portion from the active layer to the second portion within the strip-shaped zone, and d2 is the thickness of the first portion in the region of the first passive layer adjoining the strip-shaped zone.
2. A semiconductor device as claimed in Claim 1, characterized in that the strip-shaped zone has a width less than said strip-shaped region of the active layer.
3. A semiconductor device as claimed in Claim 1 or 2, characterized in that the strip-shaped zone is provided so as to be symmetrical with respect to the strip-shaped region.
4. A semiconductor device as claimed in anyone of the preceding Claims, characterized in that the first passive semiconductor layer in the regions adjoining the strip-shaped zone consists entirely of the portion having the lower refractive index.
5. A semiconductor device as claimed in anyone of the preceding Claims, characterized in that the portion having the higher refractive index extends within the strip-shaped zone from the surface of the first passive semiconductor layer remote from the active layer over at least a part of the thickness of said layer.
6. A semiconductor device as claimed in Claims 4 and 5, characterized in that the strip-shaped zone consists entirely of the material having the higher refractive index.
7. A semiconductor device as claimed in Claim 4, characterized in that the strip-shaped zone comprises a region of the portion having the higher refractive index surrounded entirely by the portion having the lower refractive index.
8. A semiconductor device as claimed in Claim 1 in which n1 < n2 and d1 < d2, characterized in that the first passive layer is provided on a substrate which locally has a strip-shaped raised portion, the first passive layer at the area of said raised portion showing a smaller overall thickness than beside the raised portion.
9. A semiconductor device as claimed in Claim 1 in which n1 > n2 and d1 > dz,characterized in that the first passive layer is provided on a substrate which locally has a strip-shaped depressed portion, the first passive layer at the area of said depressed portion having a larger overall thickness than beside the depressed portion.
10. A semiconductor device as claimed in anyone of the preceding claims, characterized in that said second passive layer also comprises two portions having different refractive indices, a said strip-shaped zone being equally provided in said second passive layer.
EP78200074A 1977-07-12 1978-07-03 Semiconductor injection laser or intensifier Expired EP0000412B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL7707720A NL7707720A (en) 1977-07-12 1977-07-12 SEMICONDUCTOR LASER OR AMPLIFIER.
NL7707720 1977-07-12

Publications (3)

Publication Number Publication Date
EP0000412A2 true EP0000412A2 (en) 1979-01-24
EP0000412A3 EP0000412A3 (en) 1979-02-07
EP0000412B1 EP0000412B1 (en) 1981-03-18

Family

ID=19828859

Family Applications (1)

Application Number Title Priority Date Filing Date
EP78200074A Expired EP0000412B1 (en) 1977-07-12 1978-07-03 Semiconductor injection laser or intensifier

Country Status (7)

Country Link
US (1) US4376307A (en)
EP (1) EP0000412B1 (en)
JP (1) JPS5419688A (en)
CA (1) CA1124375A (en)
DE (1) DE2860540D1 (en)
IT (1) IT1096919B (en)
NL (1) NL7707720A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495383A1 (en) * 1980-11-28 1982-06-04 Western Electric Co SUPERRADIANCE ELECTROLUMINESCENT DIODE HAVING HIGH COUPLING EFFICIENCY WITH OPTICAL WAVEGUIDE
GB2124024A (en) * 1982-06-10 1984-02-08 Kokusai Denshin Denwa Co Ltd Semiconductor laser and manufacturing method therefor
EP0356189A2 (en) * 1988-08-26 1990-02-28 AT&T Corp. Semiconductor optical amplifier with shortened gain recovery time

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5598884A (en) * 1978-12-30 1980-07-28 Fujitsu Ltd Semiconductor light emitting device
JPS55108789A (en) * 1979-01-18 1980-08-21 Nec Corp Semiconductor laser
JPS55123191A (en) * 1979-03-16 1980-09-22 Fujitsu Ltd Semiconductor light emitting device
JPS5618484A (en) * 1979-07-24 1981-02-21 Nec Corp Manufacture of semiconductor laser
JPS5627989A (en) * 1979-08-14 1981-03-18 Fujitsu Ltd Semiconductor light emitting device
JPS5654083A (en) * 1979-10-05 1981-05-13 Nec Corp Semiconductor laser apparatus
JPS5792885A (en) * 1980-12-01 1982-06-09 Sharp Corp Semiconductor laser element
JPS57153489A (en) * 1981-03-17 1982-09-22 Sharp Corp Manufacture of semiconductor laser element
JPS5956785A (en) * 1982-09-24 1984-04-02 Sanyo Electric Co Ltd Semiconductor laser
JPS6021588A (en) * 1983-07-16 1985-02-02 Univ Kyoto Magnetoelectric photo effect photo amplifier
JPS5994485A (en) * 1983-10-24 1984-05-31 Hitachi Ltd Semiconductor laser device
GB2156585B (en) * 1984-03-16 1987-10-21 Hitachi Ltd Light-emitting device electrode
USRE34378E (en) * 1984-03-16 1993-09-14 Hitachi, Ltd. Light emitting device with improved electrode structure to minimize short circuiting
US4794346A (en) * 1984-11-21 1988-12-27 Bell Communications Research, Inc. Broadband semiconductor optical amplifier structure
JPS62260120A (en) * 1986-05-07 1987-11-12 Kokusai Denshin Denwa Co Ltd <Kdd> Semiconductor external light modulator
US4772854A (en) * 1986-12-24 1988-09-20 Bell Communications Research, Inc. All optical repeater
JPH0410705Y2 (en) * 1987-06-22 1992-03-17
US5019787A (en) * 1989-10-30 1991-05-28 David Sarnoff Research Center, Inc. Optical amplifier
US5131001A (en) * 1990-12-21 1992-07-14 David Sarnoff Research Center, Inc. Monolithic semiconductor light emitter and amplifier
US5337176A (en) * 1992-03-25 1994-08-09 U. S. Philips Corporation Optical amplifier with improved linearity

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51138393A (en) * 1975-05-26 1976-11-29 Fujitsu Ltd Semiconductor light emission device
US3978428A (en) * 1975-06-23 1976-08-31 Xerox Corporation Buried-heterostructure diode injection laser
JPS609355B2 (en) * 1975-08-30 1985-03-09 富士通株式会社 Manufacturing method of semiconductor light emitting device
JPS5245296A (en) * 1975-10-07 1977-04-09 Nippon Telegr & Teleph Corp <Ntt> Semiconductive phototransmission pass and semiconductor emission devic e used it
JPS5286093A (en) * 1976-01-12 1977-07-16 Hitachi Ltd Striped semiconductor laser
US4099999A (en) * 1977-06-13 1978-07-11 Xerox Corporation Method of making etched-striped substrate planar laser
GB2046983B (en) * 1979-01-18 1983-03-16 Nippon Electric Co Semiconductor lasers

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495383A1 (en) * 1980-11-28 1982-06-04 Western Electric Co SUPERRADIANCE ELECTROLUMINESCENT DIODE HAVING HIGH COUPLING EFFICIENCY WITH OPTICAL WAVEGUIDE
GB2124024A (en) * 1982-06-10 1984-02-08 Kokusai Denshin Denwa Co Ltd Semiconductor laser and manufacturing method therefor
EP0356189A2 (en) * 1988-08-26 1990-02-28 AT&T Corp. Semiconductor optical amplifier with shortened gain recovery time
EP0356189A3 (en) * 1988-08-26 1990-10-17 American Telephone And Telegraph Company Semiconductor optical amplifier with shortened gain recovery time

Also Published As

Publication number Publication date
IT1096919B (en) 1985-08-26
JPS5419688A (en) 1979-02-14
NL7707720A (en) 1979-01-16
IT7825470A0 (en) 1978-07-07
EP0000412B1 (en) 1981-03-18
CA1124375A (en) 1982-05-25
JPS5755309B2 (en) 1982-11-24
EP0000412A3 (en) 1979-02-07
DE2860540D1 (en) 1981-04-16
US4376307A (en) 1983-03-08

Similar Documents

Publication Publication Date Title
EP0000412B1 (en) Semiconductor injection laser or intensifier
US3978428A (en) Buried-heterostructure diode injection laser
US4328469A (en) High output power injection lasers
US4033796A (en) Method of making buried-heterostructure diode injection laser
US4635268A (en) Semiconductor laser device having a double heterojunction structure
EP0025362B1 (en) A semiconductor light emitting device
US4278949A (en) Semiconductor laser structure and manufacture
EP0033137B1 (en) Semiconductor laser device
US4329660A (en) Semiconductor light emitting device
US4321556A (en) Semiconductor laser
US4340967A (en) Semiconductor lasers with stable higher-order modes parallel to the junction plane
GB2252872A (en) Laser diode and method of manufacture
US4341570A (en) Process for producing an injection laser and laser obtained by this process
Botez et al. Constricted double‐heterostructure (AlGa) As diode lasers
US4916709A (en) Semiconductor laser device
US4677634A (en) Double heterojunction semiconductor laser having improved high-frequency characteristics
US4309668A (en) Stripe-geometry double heterojunction laser device
US4377865A (en) Semiconductor laser
US4375686A (en) Semiconductor laser
US4517674A (en) Zinc-diffused narrow stripe AlGaAs/GaAs double heterostructure laser
US4841535A (en) Semiconductor laser device
EP0284684A2 (en) Inverted channel substrate planar semiconductor laser
US4429396A (en) Semiconductor laser having a doped surface zone
US4521887A (en) W-shaped diffused stripe GaAs/AlGaAs laser
EP0032401B1 (en) Semiconductor laser

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Designated state(s): DE FR GB NL SE

AK Designated contracting states

Designated state(s): DE FR GB NL SE

17P Request for examination filed
GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Designated state(s): DE FR GB NL SE

REF Corresponds to:

Ref document number: 2860540

Country of ref document: DE

Date of ref document: 19810416

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Effective date: 19810704

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Effective date: 19820201

NLV4 Nl: lapsed or anulled due to non-payment of the annual fee

Effective date: 19820201

EUG Se: european patent has lapsed

Ref document number: 78200074.9

Effective date: 19820209

REG Reference to a national code

Ref country code: FR

Ref legal event code: CD

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 19960701

Year of fee payment: 19

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 19960724

Year of fee payment: 19

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 19960924

Year of fee payment: 19

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19970703

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 19970703

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19980331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19980401

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT