EA201000689A1 - Полупроводниковая полимерная композиция - Google Patents

Полупроводниковая полимерная композиция

Info

Publication number
EA201000689A1
EA201000689A1 EA201000689A EA201000689A EA201000689A1 EA 201000689 A1 EA201000689 A1 EA 201000689A1 EA 201000689 A EA201000689 A EA 201000689A EA 201000689 A EA201000689 A EA 201000689A EA 201000689 A1 EA201000689 A1 EA 201000689A1
Authority
EA
Eurasian Patent Office
Prior art keywords
polymer composition
semiconductor polymer
weight
strip sample
height
Prior art date
Application number
EA201000689A
Other languages
English (en)
Other versions
EA022474B1 (ru
Inventor
Конрад Нойенс
Марк Де Влесхауэр
Original Assignee
Бореалис Тэкнолоджи Ой
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39146926&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EA201000689(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Бореалис Тэкнолоджи Ой filed Critical Бореалис Тэкнолоджи Ой
Publication of EA201000689A1 publication Critical patent/EA201000689A1/ru
Publication of EA022474B1 publication Critical patent/EA022474B1/ru

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/201—Pre-melted polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F210/00—Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
    • C08F210/02—Ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
    • C08L23/0815—Copolymers of ethene with aliphatic 1-olefins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2500/00—Characteristics or properties of obtained polyolefins; Use thereof
    • C08F2500/12—Melt flow index or melt flow ratio
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)

Abstract

Настоящее изобретение относится к полупроводниковой полимерной композиции, содержащей (а) от 30 до 90 мас.% полимерного компонента, (b) от 10 до 60 мас.% сажи и (с) от 0 до 8 мас.% добавок, при расчете на массу совокупной полупроводниковой полимерной композиции, и где композиция содержит согласно измерению в соответствии с методом анализа гладкости поверхности (АГП) при использовании ленточного образца, состоящего из упомянутой полупроводниковой полимерной композиции, как это определено в ″Способах определения″, менее чем 23 частицы на один м, имеющие ширину, большую чем 150 мкм, на полувысоте упомянутой частицы, выступающей с поверхности ленточного образца, менее чем 10 частиц на один м, имеющих ширину, большую чем 200 мкм, на полувысоте упомянутой частицы, выступающей с поверхности ленточного образца, и предпочтительно приблизительно 0 частиц на один м, имеющих ширину, большую чем 500 мкм, на полувысоте упомянутой частицы, выступающей с поверхности ленточного образца, к способу получения полупроводниковой полимерной композиции, ее использованию и кабелям, содержащим полупроводниковую полимерную композицию.
EA201000689A 2007-10-23 2008-10-22 Полупроводниковая полимерная композиция EA022474B1 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07020735A EP2065900A1 (en) 2007-10-23 2007-10-23 Semiconductive polymer composition
PCT/EP2008/008926 WO2009053042A1 (en) 2007-10-23 2008-10-22 Semiconductive polymer composition

Publications (2)

Publication Number Publication Date
EA201000689A1 true EA201000689A1 (ru) 2010-10-29
EA022474B1 EA022474B1 (ru) 2016-01-29

Family

ID=39146926

Family Applications (1)

Application Number Title Priority Date Filing Date
EA201000689A EA022474B1 (ru) 2007-10-23 2008-10-22 Полупроводниковая полимерная композиция

Country Status (8)

Country Link
US (1) US8425806B2 (ru)
EP (2) EP2065900A1 (ru)
KR (1) KR101573308B1 (ru)
CN (1) CN101849267B (ru)
EA (1) EA022474B1 (ru)
ES (1) ES2623327T3 (ru)
MX (1) MX2010003038A (ru)
WO (1) WO2009053042A1 (ru)

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CN101942142B (zh) * 2010-08-16 2012-08-15 江阴市海江高分子材料有限公司 110kv及以上电压等级电缆用半导电屏蔽料制备方法
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EP3261093B1 (en) * 2016-06-21 2023-08-02 Borealis AG Cable with advantageous electrical properties
CN109328211A (zh) 2016-06-21 2019-02-12 博里利斯股份公司 具有有利的热机械性能和电气特性的用于电线和电缆应用的聚合物组合物
EP3261096A1 (en) 2016-06-21 2017-12-27 Borealis AG Cable and composition
CA3029340C (en) 2016-06-30 2023-09-26 Dow Global Technologies Llc Semiconductive shield free of weld lines and protrusions
MX2019006872A (es) * 2016-12-21 2019-08-22 Dow Global Technologies Llc Composicion semiconductora curable.
BR112019026356B1 (pt) * 2017-06-29 2023-03-28 Dow Global Technologies Llc Composição de poliolefina, método para produzir uma composição de poliolefina, método para curar radicais livres de uma composição de poliolefina, produto de poliolefina reticulado e artigo fabricado
MX2020006325A (es) * 2017-12-18 2020-11-24 Borealis Ag Composicion de polimero semiconductor.
TW202239854A (zh) 2021-03-31 2022-10-16 美商陶氏全球科技有限責任公司 可濕固化半導電調配物
JP2024512912A (ja) 2021-03-31 2024-03-21 ダウ グローバル テクノロジーズ エルエルシー 湿気硬化性半導電性配合物
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Also Published As

Publication number Publication date
ES2623327T3 (es) 2017-07-11
EA022474B1 (ru) 2016-01-29
CN101849267A (zh) 2010-09-29
EP2212892A1 (en) 2010-08-04
KR20100074197A (ko) 2010-07-01
MX2010003038A (es) 2010-07-29
EP2065900A1 (en) 2009-06-03
WO2009053042A1 (en) 2009-04-30
CN101849267B (zh) 2013-02-06
US20100206607A1 (en) 2010-08-19
KR101573308B1 (ko) 2015-12-01
EP2212892B1 (en) 2017-02-15
US8425806B2 (en) 2013-04-23

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