CN101942142B - 110kv及以上电压等级电缆用半导电屏蔽料制备方法 - Google Patents
110kv及以上电压等级电缆用半导电屏蔽料制备方法 Download PDFInfo
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- CN101942142B CN101942142B CN2010102548525A CN201010254852A CN101942142B CN 101942142 B CN101942142 B CN 101942142B CN 2010102548525 A CN2010102548525 A CN 2010102548525A CN 201010254852 A CN201010254852 A CN 201010254852A CN 101942142 B CN101942142 B CN 101942142B
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- 239000000463 material Substances 0.000 title claims abstract description 55
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- -1 polyethylene Polymers 0.000 claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000002156 mixing Methods 0.000 claims abstract description 18
- 230000003647 oxidation Effects 0.000 claims abstract description 15
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 15
- 239000003112 inhibitor Substances 0.000 claims abstract description 14
- 229920000573 polyethylene Polymers 0.000 claims abstract description 13
- 239000004698 Polyethylene Substances 0.000 claims abstract description 11
- 238000001816 cooling Methods 0.000 claims abstract description 7
- 229920003020 cross-linked polyethylene Polymers 0.000 claims abstract description 7
- 239000004703 cross-linked polyethylene Substances 0.000 claims abstract description 7
- 238000001035 drying Methods 0.000 claims abstract description 5
- 238000005469 granulation Methods 0.000 claims abstract description 4
- 230000003179 granulation Effects 0.000 claims abstract description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 15
- 239000006229 carbon black Substances 0.000 claims description 12
- 239000007822 coupling agent Substances 0.000 claims description 11
- 229940042795 hydrazides for tuberculosis treatment Drugs 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 11
- 235000006408 oxalic acid Nutrition 0.000 claims description 11
- 125000001639 phenylmethylene group Chemical group [H]C(=*)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 238000001914 filtration Methods 0.000 claims description 10
- XOUQAVYLRNOXDO-UHFFFAOYSA-N 2-tert-butyl-5-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(O)=C1 XOUQAVYLRNOXDO-UHFFFAOYSA-N 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 150000002913 oxalic acids Chemical class 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 5
- 239000012466 permeate Substances 0.000 claims description 4
- 230000018044 dehydration Effects 0.000 claims description 3
- 238000006297 dehydration reaction Methods 0.000 claims description 3
- 238000005453 pelletization Methods 0.000 claims description 3
- 238000007670 refining Methods 0.000 claims description 3
- 230000032683 aging Effects 0.000 abstract description 4
- 238000001125 extrusion Methods 0.000 abstract description 3
- 239000003431 cross linking reagent Substances 0.000 abstract description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract 2
- QLZJUIZVJLSNDD-UHFFFAOYSA-N 2-(2-methylidenebutanoyloxy)ethyl 2-methylidenebutanoate Chemical compound CCC(=C)C(=O)OCCOC(=O)C(=C)CC QLZJUIZVJLSNDD-UHFFFAOYSA-N 0.000 abstract 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 abstract 1
- 239000005042 ethylene-ethyl acrylate Substances 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 229940100242 glycol stearate Drugs 0.000 abstract 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 abstract 1
- 235000019241 carbon black Nutrition 0.000 description 9
- 239000003921 oil Substances 0.000 description 9
- 238000004132 cross linking Methods 0.000 description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 239000001993 wax Substances 0.000 description 6
- 238000009413 insulation Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000003245 working effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000003197 catalytic effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000003712 anti-aging effect Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000007857 degradation product Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Families Citing this family (13)
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CN102157250B (zh) * | 2011-03-29 | 2013-08-07 | 浙江盛洋科技股份有限公司 | 一种同轴电缆的内导体防腐蚀处理工艺 |
CN102254590B (zh) * | 2011-03-30 | 2013-04-17 | 山东七星电气科技发展有限公司 | 一种热缩柔性导电管及其生产工艺 |
CN102922618B (zh) * | 2011-04-01 | 2015-04-08 | 南京工业大学 | 一种炭黑母粒的制备系统装置及其制备方法 |
CN102898718B (zh) * | 2011-07-27 | 2014-08-27 | 上海凯波特种电缆料厂有限公司 | 一种35kv电缆用非eva基材交联型半导电外屏蔽料及其制备 |
CN102898717B (zh) * | 2011-07-27 | 2015-04-15 | 上海凯波特种电缆料厂有限公司 | 一种35kv电缆用非eva基材交联型半导电内屏蔽料及其制备 |
CN104867609A (zh) * | 2014-02-24 | 2015-08-26 | 江苏亨通线缆科技有限公司 | 万兆以太网用抗串扰型高速数据传输缆 |
CN103923377A (zh) * | 2014-04-30 | 2014-07-16 | 威远凤凰高新材料有限责任公司 | 一种阻水型半导电屏蔽料及其制备工艺 |
CN103980599B (zh) * | 2014-05-30 | 2016-03-02 | 江苏德威新材料股份有限公司 | 一种高压直流电缆用半导电屏蔽材料及其制备方法 |
CN106146995B (zh) * | 2015-03-27 | 2019-02-22 | 国家电网公司 | 一种半导电聚烯烃浆料的制备方法 |
CN106750848A (zh) * | 2016-11-23 | 2017-05-31 | 江阴市海江高分子材料有限公司 | 一种易剥离半导电屏蔽料及其制备方法 |
CN107325390A (zh) * | 2017-08-02 | 2017-11-07 | 合肥尚涵装饰工程有限公司 | 一种高压电缆半导电屏蔽料 |
CN107488295A (zh) * | 2017-08-10 | 2017-12-19 | 全球能源互联网研究院 | 一种500kV及以下直流电缆用屏蔽料及其制备方法 |
CN107573574B (zh) * | 2017-09-07 | 2020-08-11 | 南京南瑞集团公司 | ±525kV及以下直流电缆屏蔽材料及其制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6274066B1 (en) * | 2000-10-11 | 2001-08-14 | General Cable Technologies Corporation | Low adhesion semi-conductive electrical shields |
CN1856844A (zh) * | 2003-09-25 | 2006-11-01 | 陶氏环球技术公司 | 可剥离的半导电屏蔽层及其组合物 |
CN101379126A (zh) * | 2006-02-06 | 2009-03-04 | 陶氏环球技术公司 | 半导电组合物 |
CN101585943A (zh) * | 2009-06-18 | 2009-11-25 | 上海交通大学 | 电缆半导电屏蔽材料及其制备方法 |
CN101849267A (zh) * | 2007-10-23 | 2010-09-29 | 博里利斯技术有限公司 | 半导电聚合物组合物 |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6274066B1 (en) * | 2000-10-11 | 2001-08-14 | General Cable Technologies Corporation | Low adhesion semi-conductive electrical shields |
CN1856844A (zh) * | 2003-09-25 | 2006-11-01 | 陶氏环球技术公司 | 可剥离的半导电屏蔽层及其组合物 |
CN101379126A (zh) * | 2006-02-06 | 2009-03-04 | 陶氏环球技术公司 | 半导电组合物 |
CN101849267A (zh) * | 2007-10-23 | 2010-09-29 | 博里利斯技术有限公司 | 半导电聚合物组合物 |
CN101585943A (zh) * | 2009-06-18 | 2009-11-25 | 上海交通大学 | 电缆半导电屏蔽材料及其制备方法 |
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