DK3253176T3 - Tykfilm-element coated med substrat og som har høj varmeledningskapacitet - Google Patents

Tykfilm-element coated med substrat og som har høj varmeledningskapacitet Download PDF

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Publication number
DK3253176T3
DK3253176T3 DK16888891.5T DK16888891T DK3253176T3 DK 3253176 T3 DK3253176 T3 DK 3253176T3 DK 16888891 T DK16888891 T DK 16888891T DK 3253176 T3 DK3253176 T3 DK 3253176T3
Authority
DK
Denmark
Prior art keywords
substrate
thermal conductivity
high thermal
thick film
film element
Prior art date
Application number
DK16888891.5T
Other languages
English (en)
Inventor
Weicong Huang
Original Assignee
Guangdong Flexwarm Advanced Materials & Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Flexwarm Advanced Materials & Tech Co Ltd filed Critical Guangdong Flexwarm Advanced Materials & Tech Co Ltd
Application granted granted Critical
Publication of DK3253176T3 publication Critical patent/DK3253176T3/da

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/16—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being mounted on an insulating base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
  • Laminated Bodies (AREA)
DK16888891.5T 2016-02-03 2016-03-26 Tykfilm-element coated med substrat og som har høj varmeledningskapacitet DK3253176T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610075017.2A CN106686770B (zh) 2016-02-03 2016-02-03 一种涂覆基质具有高导热能力的厚膜元件
PCT/CN2016/077439 WO2017133067A1 (zh) 2016-02-03 2016-03-26 一种涂覆基质具有高导热能力的厚膜元件

Publications (1)

Publication Number Publication Date
DK3253176T3 true DK3253176T3 (da) 2020-02-03

Family

ID=58839125

Family Applications (1)

Application Number Title Priority Date Filing Date
DK16888891.5T DK3253176T3 (da) 2016-02-03 2016-03-26 Tykfilm-element coated med substrat og som har høj varmeledningskapacitet

Country Status (10)

Country Link
US (1) US11419186B2 (da)
EP (1) EP3253176B1 (da)
JP (1) JP6315643B1 (da)
CN (1) CN106686770B (da)
DK (1) DK3253176T3 (da)
EA (1) EA037599B1 (da)
ES (1) ES2767804T3 (da)
PL (1) PL3253176T3 (da)
PT (1) PT3253176T (da)
WO (1) WO2017133067A1 (da)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109446623B (zh) * 2018-10-19 2022-11-04 沈阳工业大学 一种基于传热速率平衡的固态蓄热加热特性匹配设计方法
CN111048987B (zh) * 2019-12-31 2021-02-12 哈尔滨工业大学 基于激光管温度多点采集的高频率复现性激光稳频方法与装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
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JPS5152531A (ja) * 1974-10-31 1976-05-10 Kyoto Ceramic Hatsunetsusoshi
EP0360418B1 (en) * 1988-08-25 1995-02-15 Toshiba Lighting & Technology Corporation Strip heater
WO1995016414A1 (fr) * 1993-12-14 1995-06-22 Jury Iosifovich Zelenjuk Element chauffant pour compresse chaude
US5569474A (en) 1994-06-06 1996-10-29 Daiho Industrial Co., Ltd. Mold for injection molding of plastics using thin film electric heater
CN1127976A (zh) * 1994-12-27 1996-07-31 深圳桑普节能技术有限公司 一种中温陶瓷电热膜
JPH1154245A (ja) * 1997-08-07 1999-02-26 Sumitomo Electric Ind Ltd セラミックスヒーター
GB2351894B (en) * 1999-05-04 2003-10-15 Otter Controls Ltd Improvements relating to heating elements
JP2001196152A (ja) * 2000-01-13 2001-07-19 Sumitomo Electric Ind Ltd セラミックスヒータ
JP2001302330A (ja) * 2000-04-24 2001-10-31 Ibiden Co Ltd セラミック基板
JP2004022485A (ja) * 2002-06-20 2004-01-22 Canon Inc 加熱体、加熱装置および画像形成装置
CN1697572A (zh) * 2004-05-12 2005-11-16 环隆电气股份有限公司 电子加热元件
KR101219897B1 (ko) * 2005-01-27 2013-01-09 에스케 카켄 가부시키가이샤 축열체 형성용 조성물, 축열체 및 축열체의 제조 방법
JPWO2007097249A1 (ja) * 2006-02-20 2009-07-09 ダイセル化学工業株式会社 多孔性フィルム及び多孔性フィルムを用いた積層体
JP2007265647A (ja) * 2006-03-27 2007-10-11 Harison Toshiba Lighting Corp ヒータ、加熱装置、画像形成装置
DE102009010437A1 (de) * 2009-02-26 2010-09-02 Tesa Se Beheiztes Flächenelement
CN201936869U (zh) 2010-11-23 2011-08-17 上海旌纬微电子科技有限公司 一种厚膜电路装置
US9994195B2 (en) * 2011-12-20 2018-06-12 Saint-Gobain Glass France Heatable luminaire cover
LU92007B1 (en) * 2012-05-23 2013-11-25 Iee Sarl Polymer thick film device
CN104425053A (zh) 2013-09-06 2015-03-18 湖南利德电子浆料有限公司 基于瓷砖的厚膜电路用电阻浆料及其制备工艺
CN103546998B (zh) * 2013-10-24 2016-01-20 东莞市国研电热材料有限公司 一种大功率陶瓷发热体
KR101602880B1 (ko) * 2014-06-18 2016-03-11 (주)유니플라텍 고분자 수계 에멀전 전도성 조성물을 이용한 피티씨 소자의 제조 방법과, 그 제조 방법에 의해 제조된 피티씨 소자 및 그 피티씨 소자가 구비된 면상 발열체
US20160249413A1 (en) * 2015-02-23 2016-08-25 Electronics And Telecommunications Research Institute Transparent planar heater
US9736888B2 (en) * 2015-03-12 2017-08-15 The Boeing Company Composite panel with integrated heater and associated methods for manufacturing
CN106686773B (zh) * 2016-01-06 2019-09-10 黄伟聪 一种双面高导热能力的厚膜发热元件

Also Published As

Publication number Publication date
EA037599B1 (ru) 2021-04-20
US11419186B2 (en) 2022-08-16
JP2018513521A (ja) 2018-05-24
EP3253176B1 (en) 2019-11-13
EA201790671A1 (ru) 2019-05-31
WO2017133067A1 (zh) 2017-08-10
EP3253176A1 (en) 2017-12-06
PL3253176T3 (pl) 2020-06-15
CN106686770B (zh) 2019-09-10
ES2767804T3 (es) 2020-06-18
CN106686770A (zh) 2017-05-17
PT3253176T (pt) 2020-01-16
EP3253176A4 (en) 2018-07-25
US20180332667A1 (en) 2018-11-15
JP6315643B1 (ja) 2018-04-25

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