PT3253176T - Elemento de filme grosso revestido com substrato e com alta capacidade de condução de calor - Google Patents
Elemento de filme grosso revestido com substrato e com alta capacidade de condução de calorInfo
- Publication number
- PT3253176T PT3253176T PT168888915T PT16888891T PT3253176T PT 3253176 T PT3253176 T PT 3253176T PT 168888915 T PT168888915 T PT 168888915T PT 16888891 T PT16888891 T PT 16888891T PT 3253176 T PT3253176 T PT 3253176T
- Authority
- PT
- Portugal
- Prior art keywords
- substrate
- high heat
- thick film
- film element
- element coated
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/16—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being mounted on an insulating base
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610075017.2A CN106686770B (zh) | 2016-02-03 | 2016-02-03 | 一种涂覆基质具有高导热能力的厚膜元件 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PT3253176T true PT3253176T (pt) | 2020-01-16 |
Family
ID=58839125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PT168888915T PT3253176T (pt) | 2016-02-03 | 2016-03-26 | Elemento de filme grosso revestido com substrato e com alta capacidade de condução de calor |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US11419186B2 (pt) |
| EP (1) | EP3253176B1 (pt) |
| JP (1) | JP6315643B1 (pt) |
| CN (1) | CN106686770B (pt) |
| DK (1) | DK3253176T3 (pt) |
| EA (1) | EA037599B1 (pt) |
| ES (1) | ES2767804T3 (pt) |
| PL (1) | PL3253176T3 (pt) |
| PT (1) | PT3253176T (pt) |
| WO (1) | WO2017133067A1 (pt) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109446623B (zh) * | 2018-10-19 | 2022-11-04 | 沈阳工业大学 | 一种基于传热速率平衡的固态蓄热加热特性匹配设计方法 |
| CN111048987B (zh) * | 2019-12-31 | 2021-02-12 | 哈尔滨工业大学 | 基于激光管温度多点采集的高频率复现性激光稳频方法与装置 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5152531A (ja) * | 1974-10-31 | 1976-05-10 | Kyoto Ceramic | Hatsunetsusoshi |
| US5068517A (en) * | 1988-08-25 | 1991-11-26 | Toshiba Lighting & Technology Corporation | Printed strip heater |
| US5760377A (en) * | 1993-12-14 | 1998-06-02 | Zelenjuk; Jury Iosifovich | Heating element of electrical heater |
| US5569474A (en) * | 1994-06-06 | 1996-10-29 | Daiho Industrial Co., Ltd. | Mold for injection molding of plastics using thin film electric heater |
| CN1127976A (zh) * | 1994-12-27 | 1996-07-31 | 深圳桑普节能技术有限公司 | 一种中温陶瓷电热膜 |
| JPH1154245A (ja) * | 1997-08-07 | 1999-02-26 | Sumitomo Electric Ind Ltd | セラミックスヒーター |
| GB2351894B (en) * | 1999-05-04 | 2003-10-15 | Otter Controls Ltd | Improvements relating to heating elements |
| JP2001196152A (ja) * | 2000-01-13 | 2001-07-19 | Sumitomo Electric Ind Ltd | セラミックスヒータ |
| JP2001302330A (ja) * | 2000-04-24 | 2001-10-31 | Ibiden Co Ltd | セラミック基板 |
| JP2004022485A (ja) * | 2002-06-20 | 2004-01-22 | Canon Inc | 加熱体、加熱装置および画像形成装置 |
| CN1697572A (zh) * | 2004-05-12 | 2005-11-16 | 环隆电气股份有限公司 | 电子加热元件 |
| EP1857520A4 (en) * | 2005-01-27 | 2012-10-03 | Sk Kaken Co Ltd | COMPOSITION FOR FORMING A HEAT-STORING OBJECT, HEAT-STORING OBJECT AND MANUFACTURING METHOD FOR A HEAT-STORING OBJECT |
| EP2591912A1 (en) * | 2006-02-20 | 2013-05-15 | Daicel Chemical Industries, Ltd. | Multilayer assembly and composite material comprising same |
| JP2007265647A (ja) * | 2006-03-27 | 2007-10-11 | Harison Toshiba Lighting Corp | ヒータ、加熱装置、画像形成装置 |
| DE102009010437A1 (de) * | 2009-02-26 | 2010-09-02 | Tesa Se | Beheiztes Flächenelement |
| CN201936869U (zh) | 2010-11-23 | 2011-08-17 | 上海旌纬微电子科技有限公司 | 一种厚膜电路装置 |
| KR101600216B1 (ko) * | 2011-12-20 | 2016-03-04 | 쌩-고벵 글래스 프랑스 | 가열 가능한 조명기구 커버 |
| LU92007B1 (en) * | 2012-05-23 | 2013-11-25 | Iee Sarl | Polymer thick film device |
| CN104425053A (zh) | 2013-09-06 | 2015-03-18 | 湖南利德电子浆料有限公司 | 基于瓷砖的厚膜电路用电阻浆料及其制备工艺 |
| CN103546998B (zh) * | 2013-10-24 | 2016-01-20 | 东莞市国研电热材料有限公司 | 一种大功率陶瓷发热体 |
| KR101602880B1 (ko) * | 2014-06-18 | 2016-03-11 | (주)유니플라텍 | 고분자 수계 에멀전 전도성 조성물을 이용한 피티씨 소자의 제조 방법과, 그 제조 방법에 의해 제조된 피티씨 소자 및 그 피티씨 소자가 구비된 면상 발열체 |
| US20160249413A1 (en) * | 2015-02-23 | 2016-08-25 | Electronics And Telecommunications Research Institute | Transparent planar heater |
| US9736888B2 (en) * | 2015-03-12 | 2017-08-15 | The Boeing Company | Composite panel with integrated heater and associated methods for manufacturing |
| CN106686773B (zh) * | 2016-01-06 | 2019-09-10 | 黄伟聪 | 一种双面高导热能力的厚膜发热元件 |
-
2016
- 2016-02-03 CN CN201610075017.2A patent/CN106686770B/zh active Active
- 2016-03-26 PT PT168888915T patent/PT3253176T/pt unknown
- 2016-03-26 US US15/529,086 patent/US11419186B2/en active Active
- 2016-03-26 EA EA201790671A patent/EA037599B1/ru unknown
- 2016-03-26 DK DK16888891.5T patent/DK3253176T3/da active
- 2016-03-26 ES ES16888891T patent/ES2767804T3/es active Active
- 2016-03-26 PL PL16888891T patent/PL3253176T3/pl unknown
- 2016-03-26 WO PCT/CN2016/077439 patent/WO2017133067A1/zh active Application Filing
- 2016-03-26 JP JP2017525114A patent/JP6315643B1/ja active Active
- 2016-03-26 EP EP16888891.5A patent/EP3253176B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN106686770B (zh) | 2019-09-10 |
| ES2767804T3 (es) | 2020-06-18 |
| CN106686770A (zh) | 2017-05-17 |
| EA037599B1 (ru) | 2021-04-20 |
| EP3253176A1 (en) | 2017-12-06 |
| JP2018513521A (ja) | 2018-05-24 |
| JP6315643B1 (ja) | 2018-04-25 |
| EP3253176A4 (en) | 2018-07-25 |
| US20180332667A1 (en) | 2018-11-15 |
| EA201790671A1 (ru) | 2019-05-31 |
| EP3253176B1 (en) | 2019-11-13 |
| US11419186B2 (en) | 2022-08-16 |
| DK3253176T3 (da) | 2020-02-03 |
| PL3253176T3 (pl) | 2020-06-15 |
| WO2017133067A1 (zh) | 2017-08-10 |
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