DK319987A - Fremgangsmaade til behandling af kobberoexid paa trykte kredsloebsplader - Google Patents

Fremgangsmaade til behandling af kobberoexid paa trykte kredsloebsplader

Info

Publication number
DK319987A
DK319987A DK319987A DK319987A DK319987A DK 319987 A DK319987 A DK 319987A DK 319987 A DK319987 A DK 319987A DK 319987 A DK319987 A DK 319987A DK 319987 A DK319987 A DK 319987A
Authority
DK
Denmark
Prior art keywords
ooxide
printed circuit
circuit plates
treating copper
copper
Prior art date
Application number
DK319987A
Other languages
English (en)
Other versions
DK319987D0 (da
Inventor
Juan Hajdu
Martin W Bayes
Original Assignee
Enthone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone filed Critical Enthone
Publication of DK319987D0 publication Critical patent/DK319987D0/da
Publication of DK319987A publication Critical patent/DK319987A/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63—Treatment of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Chemical Treatment Of Metals (AREA)
DK319987A 1985-10-24 1987-06-23 Fremgangsmaade til behandling af kobberoexid paa trykte kredsloebsplader DK319987A (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/790,999 US4717439A (en) 1985-10-24 1985-10-24 Process for the treatment of copper oxide in the preparation of printed circuit boards
PCT/US1986/002007 WO1987002856A1 (en) 1985-10-24 1986-09-24 Copper oxide treatment in printed circuit board

Publications (2)

Publication Number Publication Date
DK319987D0 DK319987D0 (da) 1987-06-23
DK319987A true DK319987A (da) 1987-06-23

Family

ID=25152358

Family Applications (1)

Application Number Title Priority Date Filing Date
DK319987A DK319987A (da) 1985-10-24 1987-06-23 Fremgangsmaade til behandling af kobberoexid paa trykte kredsloebsplader

Country Status (9)

Country Link
US (1) US4717439A (da)
EP (1) EP0245305A4 (da)
KR (1) KR880700615A (da)
AU (1) AU6401086A (da)
BR (1) BR8606936A (da)
DK (1) DK319987A (da)
IL (1) IL80219A0 (da)
PT (1) PT83600A (da)
WO (1) WO1987002856A1 (da)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4911785A (en) * 1987-02-04 1990-03-27 Andus Corporation The method of forming a thin film artwork compounds
US4775444A (en) * 1987-08-26 1988-10-04 Macdermid, Incorporated Process for fabricating multilayer circuit boards
MY104191A (en) * 1988-09-06 1994-02-28 Mitsubishi Gas Chemical Co Process for producing multilayer printed wiring board
US5573632A (en) * 1989-02-23 1996-11-12 Fuji Xerox Co., Ltd. Multilayer printed-circuit substrate, wiring substrate and process of producing the same
US5078812A (en) * 1990-10-09 1992-01-07 Rca Thomson Licensing Corp. Method for darkening a color-selection electrode
US5106454A (en) * 1990-11-01 1992-04-21 Shipley Company Inc. Process for multilayer printed circuit board manufacture
US5167992A (en) * 1991-03-11 1992-12-01 Microelectronics And Computer Technology Corporation Selective electroless plating process for metal conductors
US5164332A (en) * 1991-03-15 1992-11-17 Microelectronics And Computer Technology Corporation Diffusion barrier for copper features
US5492595A (en) * 1994-04-11 1996-02-20 Electrochemicals, Inc. Method for treating an oxidized copper film
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
USD413861S (en) * 1997-11-07 1999-09-14 Li-Chun Lai Electrical plug
US6294220B1 (en) 1999-06-30 2001-09-25 Alpha Metals, Inc. Post-treatment for copper on printed circuit boards
US6117250A (en) * 1999-02-25 2000-09-12 Morton International Inc. Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions
US6444140B2 (en) 1999-03-17 2002-09-03 Morton International Inc. Micro-etch solution for producing metal surface topography
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
US20040099637A1 (en) * 2000-06-16 2004-05-27 Shipley Company, L.L.C. Composition for producing metal surface topography
US20030178391A1 (en) * 2000-06-16 2003-09-25 Shipley Company, L.L.C. Composition for producing metal surface topography
DE10302596A1 (de) * 2002-01-24 2003-08-28 Shipley Company Marlborough Behandlung von Metalloberflächen mit einer modifizierten Oxidaustauschmasse
CN107072072B (zh) 2010-07-06 2019-10-25 纳美仕有限公司 处理铜表面以增强对印刷电路板中使用的有机衬底的粘着力的方法
KR102042940B1 (ko) 2010-07-06 2019-11-27 아토테크 도이칠란드 게엠베하 인쇄회로기판
KR20140085559A (ko) * 2011-10-25 2014-07-07 유니-픽셀 디스플레이스, 인코포레이티드 고해상도 도전성 패턴의 광학적 특성을 변화시키는 방법
EP4352277A1 (en) 2021-06-09 2024-04-17 Atotech Deutschland GmbH & Co. KG A composite and a method for manufacturing a composite of a copper layer and an organic layer

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1327401A (en) * 1919-08-05 1920-01-06 Winchester Repeating Arms Co Process of surface-coloring articles of copper alloy
US1327400A (en) * 1919-08-05 1920-01-06 Winchester Repeating Arms Co Surface-colored article of copper alloy
US1672180A (en) * 1926-03-17 1928-06-05 Expanded Metal Treatment of metal surfaces
US2398202A (en) * 1943-02-08 1946-04-09 Shell Dev Anticorrosive
US2878149A (en) * 1955-10-31 1959-03-17 Walter A Mason Product for effecting a cold chemical oxidation of copper and its alloys
US2933422A (en) * 1957-05-31 1960-04-19 Walter A Mason Product and method for coating metals with copper-tellurium compound
US2990300A (en) * 1957-12-16 1961-06-27 Mc Graw Edison Co Protective device
US3087778A (en) * 1961-02-17 1963-04-30 Chemical Construction Corp Corrosion inhibiting
US3546775A (en) * 1965-10-22 1970-12-15 Sanders Associates Inc Method of making multi-layer circuit
US3464855A (en) * 1966-09-06 1969-09-02 North American Rockwell Process for forming interconnections in a multilayer circuit board
US3677828A (en) * 1970-07-30 1972-07-18 Olin Corp Tarnish resistant copper and copper alloys
AT322318B (de) * 1972-12-13 1975-05-12 Metallwerk Moellersdorf Verfahren zum schutz von kupferoberflaechen gegen korrosion
US3833433A (en) * 1973-06-14 1974-09-03 Olin Corp Method of producing tarnish resistant copper and copper alloys and products thereof
GB1515361A (en) * 1975-07-09 1978-06-21 Electrofoils Ltd Metal finishing of metallic foils by electrodeposition
US4121949A (en) * 1976-04-30 1978-10-24 P. R. Mallory & Co. Inc. Method of making a cathode electrode for an electrolytic capacitor
DE2713393C3 (de) * 1977-03-23 1980-02-28 Ruwel-Werke Spezialfabrik Fuer Hochfrequenzbauteile Gmbh, 4170 Geldern Verfahren zum Herstellen von gedruckten Schaltungen
US4190474A (en) * 1977-12-22 1980-02-26 Gould Inc. Method of making a printed circuit board having mutually etchable copper and nickel layers

Also Published As

Publication number Publication date
DK319987D0 (da) 1987-06-23
EP0245305A1 (en) 1987-11-19
AU6401086A (en) 1987-05-19
EP0245305A4 (en) 1989-05-23
US4717439A (en) 1988-01-05
PT83600A (pt) 1987-05-29
IL80219A0 (en) 1987-01-30
BR8606936A (pt) 1987-11-03
KR880700615A (ko) 1988-03-15
WO1987002856A1 (en) 1987-05-07

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Legal Events

Date Code Title Description
AHB Application shelved due to non-payment