DK319987A - Fremgangsmaade til behandling af kobberoexid paa trykte kredsloebsplader - Google Patents
Fremgangsmaade til behandling af kobberoexid paa trykte kredsloebspladerInfo
- Publication number
- DK319987A DK319987A DK319987A DK319987A DK319987A DK 319987 A DK319987 A DK 319987A DK 319987 A DK319987 A DK 319987A DK 319987 A DK319987 A DK 319987A DK 319987 A DK319987 A DK 319987A
- Authority
- DK
- Denmark
- Prior art keywords
- ooxide
- printed circuit
- circuit plates
- treating copper
- copper
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
- C23C22/63—Treatment of copper or alloys based thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Chemical Treatment Of Metals (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/790,999 US4717439A (en) | 1985-10-24 | 1985-10-24 | Process for the treatment of copper oxide in the preparation of printed circuit boards |
PCT/US1986/002007 WO1987002856A1 (en) | 1985-10-24 | 1986-09-24 | Copper oxide treatment in printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
DK319987D0 DK319987D0 (da) | 1987-06-23 |
DK319987A true DK319987A (da) | 1987-06-23 |
Family
ID=25152358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK319987A DK319987A (da) | 1985-10-24 | 1987-06-23 | Fremgangsmaade til behandling af kobberoexid paa trykte kredsloebsplader |
Country Status (9)
Country | Link |
---|---|
US (1) | US4717439A (da) |
EP (1) | EP0245305A4 (da) |
KR (1) | KR880700615A (da) |
AU (1) | AU6401086A (da) |
BR (1) | BR8606936A (da) |
DK (1) | DK319987A (da) |
IL (1) | IL80219A0 (da) |
PT (1) | PT83600A (da) |
WO (1) | WO1987002856A1 (da) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4911785A (en) * | 1987-02-04 | 1990-03-27 | Andus Corporation | The method of forming a thin film artwork compounds |
US4775444A (en) * | 1987-08-26 | 1988-10-04 | Macdermid, Incorporated | Process for fabricating multilayer circuit boards |
MY104191A (en) * | 1988-09-06 | 1994-02-28 | Mitsubishi Gas Chemical Co | Process for producing multilayer printed wiring board |
US5573632A (en) * | 1989-02-23 | 1996-11-12 | Fuji Xerox Co., Ltd. | Multilayer printed-circuit substrate, wiring substrate and process of producing the same |
US5078812A (en) * | 1990-10-09 | 1992-01-07 | Rca Thomson Licensing Corp. | Method for darkening a color-selection electrode |
US5106454A (en) * | 1990-11-01 | 1992-04-21 | Shipley Company Inc. | Process for multilayer printed circuit board manufacture |
US5167992A (en) * | 1991-03-11 | 1992-12-01 | Microelectronics And Computer Technology Corporation | Selective electroless plating process for metal conductors |
US5164332A (en) * | 1991-03-15 | 1992-11-17 | Microelectronics And Computer Technology Corporation | Diffusion barrier for copper features |
US5492595A (en) * | 1994-04-11 | 1996-02-20 | Electrochemicals, Inc. | Method for treating an oxidized copper film |
US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
USD413861S (en) * | 1997-11-07 | 1999-09-14 | Li-Chun Lai | Electrical plug |
US6294220B1 (en) | 1999-06-30 | 2001-09-25 | Alpha Metals, Inc. | Post-treatment for copper on printed circuit boards |
US6117250A (en) * | 1999-02-25 | 2000-09-12 | Morton International Inc. | Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions |
US6444140B2 (en) | 1999-03-17 | 2002-09-03 | Morton International Inc. | Micro-etch solution for producing metal surface topography |
JP2001073182A (ja) * | 1999-07-15 | 2001-03-21 | Boc Group Inc:The | 改良された酸性銅電気メッキ用溶液 |
US20040099637A1 (en) * | 2000-06-16 | 2004-05-27 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
US20030178391A1 (en) * | 2000-06-16 | 2003-09-25 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
DE10302596A1 (de) * | 2002-01-24 | 2003-08-28 | Shipley Company Marlborough | Behandlung von Metalloberflächen mit einer modifizierten Oxidaustauschmasse |
US9345149B2 (en) | 2010-07-06 | 2016-05-17 | Esionic Corp. | Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards |
KR101958606B1 (ko) | 2010-07-06 | 2019-03-14 | 아토테크 도이칠란드 게엠베하 | 인쇄회로기판의 제조 방법 |
KR20140085559A (ko) * | 2011-10-25 | 2014-07-07 | 유니-픽셀 디스플레이스, 인코포레이티드 | 고해상도 도전성 패턴의 광학적 특성을 변화시키는 방법 |
CN117597469A (zh) | 2021-06-09 | 2024-02-23 | 德国艾托特克有限两合公司 | 铜层与有机层的复合物及其制造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1327401A (en) * | 1919-08-05 | 1920-01-06 | Winchester Repeating Arms Co | Process of surface-coloring articles of copper alloy |
US1327400A (en) * | 1919-08-05 | 1920-01-06 | Winchester Repeating Arms Co | Surface-colored article of copper alloy |
US1672180A (en) * | 1926-03-17 | 1928-06-05 | Expanded Metal | Treatment of metal surfaces |
US2398202A (en) * | 1943-02-08 | 1946-04-09 | Shell Dev | Anticorrosive |
US2878149A (en) * | 1955-10-31 | 1959-03-17 | Walter A Mason | Product for effecting a cold chemical oxidation of copper and its alloys |
US2933422A (en) * | 1957-05-31 | 1960-04-19 | Walter A Mason | Product and method for coating metals with copper-tellurium compound |
US2990300A (en) * | 1957-12-16 | 1961-06-27 | Mc Graw Edison Co | Protective device |
US3087778A (en) * | 1961-02-17 | 1963-04-30 | Chemical Construction Corp | Corrosion inhibiting |
US3546775A (en) * | 1965-10-22 | 1970-12-15 | Sanders Associates Inc | Method of making multi-layer circuit |
US3464855A (en) * | 1966-09-06 | 1969-09-02 | North American Rockwell | Process for forming interconnections in a multilayer circuit board |
US3677828A (en) * | 1970-07-30 | 1972-07-18 | Olin Corp | Tarnish resistant copper and copper alloys |
AT322318B (de) * | 1972-12-13 | 1975-05-12 | Metallwerk Moellersdorf | Verfahren zum schutz von kupferoberflaechen gegen korrosion |
US3833433A (en) * | 1973-06-14 | 1974-09-03 | Olin Corp | Method of producing tarnish resistant copper and copper alloys and products thereof |
GB1515361A (en) * | 1975-07-09 | 1978-06-21 | Electrofoils Ltd | Metal finishing of metallic foils by electrodeposition |
US4121949A (en) * | 1976-04-30 | 1978-10-24 | P. R. Mallory & Co. Inc. | Method of making a cathode electrode for an electrolytic capacitor |
DE2713393C3 (de) * | 1977-03-23 | 1980-02-28 | Ruwel-Werke Spezialfabrik Fuer Hochfrequenzbauteile Gmbh, 4170 Geldern | Verfahren zum Herstellen von gedruckten Schaltungen |
US4190474A (en) * | 1977-12-22 | 1980-02-26 | Gould Inc. | Method of making a printed circuit board having mutually etchable copper and nickel layers |
-
1985
- 1985-10-24 US US06/790,999 patent/US4717439A/en not_active Expired - Fee Related
-
1986
- 1986-09-24 AU AU64010/86A patent/AU6401086A/en not_active Abandoned
- 1986-09-24 KR KR870700531A patent/KR880700615A/ko not_active Application Discontinuation
- 1986-09-24 WO PCT/US1986/002007 patent/WO1987002856A1/en not_active Application Discontinuation
- 1986-09-24 EP EP19860906162 patent/EP0245305A4/en not_active Withdrawn
- 1986-09-24 BR BR8606936A patent/BR8606936A/pt unknown
- 1986-10-02 IL IL80219A patent/IL80219A0/xx unknown
- 1986-10-22 PT PT83600A patent/PT83600A/pt not_active Application Discontinuation
-
1987
- 1987-06-23 DK DK319987A patent/DK319987A/da not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
DK319987D0 (da) | 1987-06-23 |
EP0245305A1 (en) | 1987-11-19 |
PT83600A (pt) | 1987-05-29 |
KR880700615A (ko) | 1988-03-15 |
US4717439A (en) | 1988-01-05 |
IL80219A0 (en) | 1987-01-30 |
BR8606936A (pt) | 1987-11-03 |
EP0245305A4 (en) | 1989-05-23 |
WO1987002856A1 (en) | 1987-05-07 |
AU6401086A (en) | 1987-05-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AHB | Application shelved due to non-payment |