KR880700615A - 인쇄 회로판의 산화구리 처리방법 - Google Patents

인쇄 회로판의 산화구리 처리방법

Info

Publication number
KR880700615A
KR880700615A KR870700531A KR870700531A KR880700615A KR 880700615 A KR880700615 A KR 880700615A KR 870700531 A KR870700531 A KR 870700531A KR 870700531 A KR870700531 A KR 870700531A KR 880700615 A KR880700615 A KR 880700615A
Authority
KR
South Korea
Prior art keywords
copper oxide
printed circuit
copper
layer
circuit board
Prior art date
Application number
KR870700531A
Other languages
English (en)
Inventor
하주 주안
더블유.베이스 마틴
Original Assignee
하주 주안
엔톤, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 하주 주안, 엔톤, 인코포레이티드 filed Critical 하주 주안
Publication of KR880700615A publication Critical patent/KR880700615A/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63—Treatment of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Chemical Treatment Of Metals (AREA)

Abstract

내용 없음

Description

인쇄 회로판의 산화구리 처리방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (14)

  1. 산화구리를, 산성 산화물을 형성하는 양쪽성 원소를 함유하는 용액과 충분시간동안 접촉시킴을 특징으로 하여 산화구리의 내침출성(leach resistance)을 향상시키는 방법.
  2. 제 1 항에 있어서, 양쪽성 원소가 셀렌, 텔루륨 또는 황인 방법.
  3. 제 2 항에 있어서, 용액이 HCl 또는 H3PO4및 이산화셀렌을 함유하는 방법.
  4. 제 3 항에 있어서, 산이 약 0.15내지 1g/ℓ이고 이산화 셀렌이 약 2내지 5g/ℓ인 방법.
  5. 제 1 항에 있어서, 산화구리가 구리층상에 표면 피복되었고, 구리층이 인쇄 회로 유전기질에 결합되는 방법.
  6. (a)구리층상에 산화구리 피복물을 갖는 구리-유전물질 라미네이트 층을, 산성 산화물을 형성하는 양쪽성 원소를 함유하는 용액과 충분시간동안 접촉시켜 산화 구리층의 내침출성을 증가시키고 ; (b)단계 (a)의 층을, 다층판을 형성하는데 필요한 그밖의 층과 함께 적층하여 다층판을 형성함을 특징으로 하여, 다층 인쇄 회로판을 제조하는 방법.
  7. 제 6 항에 있어서, 양쪽성 원소가 셀렌, 텔루륨 또는 황인 방법.
  8. 제 6 항에 있어서, 산화구리 피복물을 클로라이트 염의 알칼리성 수용액을 산화제로서 사용하여 형성하는 방법.
  9. 제 6 항에 있어서, 양쪽성 원소 함유 용액이 아인산을 함유하는 방법.
  10. 제 9 항에 있어서, 아인산이 인산인 방법.
  11. 제 7 항에 있어서, 용액이 HCl 및 이산화셀렌을 함유하는 방법.
  12. 제11항에 있어서, HCl 이 약 0.15내지 1g/ℓ이고 이산화 셀렌이 2내지 5g/ℓ인 방법.
  13. 제 6 항에 방법에 따라 제조된 다층 인쇄 회로판.
  14. 제 5 항의 방법에 따라 제조된 인쇄 회로판 라미네이드.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR870700531A 1985-10-24 1986-09-24 인쇄 회로판의 산화구리 처리방법 KR880700615A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US790.999 1985-10-24
US06/790,999 US4717439A (en) 1985-10-24 1985-10-24 Process for the treatment of copper oxide in the preparation of printed circuit boards
PCT/US1986/002007 WO1987002856A1 (en) 1985-10-24 1986-09-24 Copper oxide treatment in printed circuit board

Publications (1)

Publication Number Publication Date
KR880700615A true KR880700615A (ko) 1988-03-15

Family

ID=25152358

Family Applications (1)

Application Number Title Priority Date Filing Date
KR870700531A KR880700615A (ko) 1985-10-24 1986-09-24 인쇄 회로판의 산화구리 처리방법

Country Status (9)

Country Link
US (1) US4717439A (ko)
EP (1) EP0245305A4 (ko)
KR (1) KR880700615A (ko)
AU (1) AU6401086A (ko)
BR (1) BR8606936A (ko)
DK (1) DK319987D0 (ko)
IL (1) IL80219A0 (ko)
PT (1) PT83600A (ko)
WO (1) WO1987002856A1 (ko)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4911785A (en) * 1987-02-04 1990-03-27 Andus Corporation The method of forming a thin film artwork compounds
US4775444A (en) * 1987-08-26 1988-10-04 Macdermid, Incorporated Process for fabricating multilayer circuit boards
MY104191A (en) * 1988-09-06 1994-02-28 Mitsubishi Gas Chemical Co Process for producing multilayer printed wiring board
US5573632A (en) * 1989-02-23 1996-11-12 Fuji Xerox Co., Ltd. Multilayer printed-circuit substrate, wiring substrate and process of producing the same
US5078812A (en) * 1990-10-09 1992-01-07 Rca Thomson Licensing Corp. Method for darkening a color-selection electrode
US5106454A (en) * 1990-11-01 1992-04-21 Shipley Company Inc. Process for multilayer printed circuit board manufacture
US5167992A (en) * 1991-03-11 1992-12-01 Microelectronics And Computer Technology Corporation Selective electroless plating process for metal conductors
US5164332A (en) * 1991-03-15 1992-11-17 Microelectronics And Computer Technology Corporation Diffusion barrier for copper features
US5492595A (en) * 1994-04-11 1996-02-20 Electrochemicals, Inc. Method for treating an oxidized copper film
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
USD413861S (en) * 1997-11-07 1999-09-14 Li-Chun Lai Electrical plug
US6294220B1 (en) 1999-06-30 2001-09-25 Alpha Metals, Inc. Post-treatment for copper on printed circuit boards
US6117250A (en) * 1999-02-25 2000-09-12 Morton International Inc. Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions
US6444140B2 (en) 1999-03-17 2002-09-03 Morton International Inc. Micro-etch solution for producing metal surface topography
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
US20040099637A1 (en) * 2000-06-16 2004-05-27 Shipley Company, L.L.C. Composition for producing metal surface topography
US20030178391A1 (en) * 2000-06-16 2003-09-25 Shipley Company, L.L.C. Composition for producing metal surface topography
DE10302596A1 (de) * 2002-01-24 2003-08-28 Shipley Company Marlborough Behandlung von Metalloberflächen mit einer modifizierten Oxidaustauschmasse
JP5946827B2 (ja) 2010-07-06 2016-07-06 イーサイオニック コーポレーション プリント配線板を製造する方法
JP6251568B2 (ja) 2010-07-06 2017-12-20 アトテック ドイチェランド ゲーエムベーハー 金属表面を処理する方法と、この方法によって形成された装置
WO2013063266A1 (en) * 2011-10-25 2013-05-02 Unipixel Displays, Inc. Method of changing the optical properties of high resolution conducting patterns
CN117597469A (zh) 2021-06-09 2024-02-23 德国艾托特克有限两合公司 铜层与有机层的复合物及其制造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1327400A (en) * 1919-08-05 1920-01-06 Winchester Repeating Arms Co Surface-colored article of copper alloy
US1327401A (en) * 1919-08-05 1920-01-06 Winchester Repeating Arms Co Process of surface-coloring articles of copper alloy
US1672180A (en) * 1926-03-17 1928-06-05 Expanded Metal Treatment of metal surfaces
US2398202A (en) * 1943-02-08 1946-04-09 Shell Dev Anticorrosive
US2878149A (en) * 1955-10-31 1959-03-17 Walter A Mason Product for effecting a cold chemical oxidation of copper and its alloys
US2933422A (en) * 1957-05-31 1960-04-19 Walter A Mason Product and method for coating metals with copper-tellurium compound
US2990300A (en) * 1957-12-16 1961-06-27 Mc Graw Edison Co Protective device
US3087778A (en) * 1961-02-17 1963-04-30 Chemical Construction Corp Corrosion inhibiting
US3546775A (en) * 1965-10-22 1970-12-15 Sanders Associates Inc Method of making multi-layer circuit
US3464855A (en) * 1966-09-06 1969-09-02 North American Rockwell Process for forming interconnections in a multilayer circuit board
US3677828A (en) * 1970-07-30 1972-07-18 Olin Corp Tarnish resistant copper and copper alloys
AT322318B (de) * 1972-12-13 1975-05-12 Metallwerk Moellersdorf Verfahren zum schutz von kupferoberflaechen gegen korrosion
US3833433A (en) * 1973-06-14 1974-09-03 Olin Corp Method of producing tarnish resistant copper and copper alloys and products thereof
GB1515361A (en) * 1975-07-09 1978-06-21 Electrofoils Ltd Metal finishing of metallic foils by electrodeposition
US4121949A (en) * 1976-04-30 1978-10-24 P. R. Mallory & Co. Inc. Method of making a cathode electrode for an electrolytic capacitor
DE2713393C3 (de) * 1977-03-23 1980-02-28 Ruwel-Werke Spezialfabrik Fuer Hochfrequenzbauteile Gmbh, 4170 Geldern Verfahren zum Herstellen von gedruckten Schaltungen
US4190474A (en) * 1977-12-22 1980-02-26 Gould Inc. Method of making a printed circuit board having mutually etchable copper and nickel layers

Also Published As

Publication number Publication date
WO1987002856A1 (en) 1987-05-07
BR8606936A (pt) 1987-11-03
IL80219A0 (en) 1987-01-30
PT83600A (pt) 1987-05-29
US4717439A (en) 1988-01-05
AU6401086A (en) 1987-05-19
EP0245305A4 (en) 1989-05-23
EP0245305A1 (en) 1987-11-19
DK319987A (da) 1987-06-23
DK319987D0 (da) 1987-06-23

Similar Documents

Publication Publication Date Title
KR880700615A (ko) 인쇄 회로판의 산화구리 처리방법
KR890006125A (ko) 다층회로를 제작하는 방법
ATE42664T1 (de) Verfahren zur herstellung von gedruckten schaltungen.
KR940006425A (ko) 투명 면상 히터 및 그 제조방법
DE3860511D1 (de) Verfahren zur herstellung von leiterplatten.
KR880004724A (ko) 금속 기판 및 그 제조 방법
ATE139661T1 (de) Verfahren zur herstellung einer mehrschichtigen leiterplatte
EP0178327A4 (en) PROCESS FOR THE MANUFACTURE OF A TRANSPARENT ELECTRODE SUBSTRATE.
JPS56153797A (en) Method of manufacturing multilayer printed circuit board substrate
EP0170703A4 (en) FILM - SHAPED CONNECTOR AND MANUFACTURING METHOD THEREOF.
KR950024971A (ko) 산화구리용 화학적 환원액
KR900005860A (ko) 다층 인쇄된 배선반의 제조방법
JPS6447053A (en) Formation of multilayer interconnection
JPS5618448A (en) Composite electronic part
JPS5815957B2 (ja) 接点付プリント配線基板の製造方法
JPS6484690A (en) Printed wiring board and the production thereof
JPS6453591A (en) Manufacture of flexible circuit board
KR930022934A (ko) 다층프린트 배선판 및 그 제조방법
KR870005460A (ko) 다층 혼성 집적회로 및 그 제조방법
GB2133783A (en) Oxidising compositions
JPS647690A (en) Manufacture of through-hole printed circuit board
KR830004761A (ko) 인쇄회로용 동박(銅箔) 및 그 제조방법
JPS56144553A (en) Manufacture of semiconductor device
JPH0429397A (ja) 多層プリント配線板の製造方法
JPS6489392A (en) Manufacture of printed wiring board

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid