KR930022934A - 다층프린트 배선판 및 그 제조방법 - Google Patents

다층프린트 배선판 및 그 제조방법 Download PDF

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Publication number
KR930022934A
KR930022934A KR1019930006671A KR930006671A KR930022934A KR 930022934 A KR930022934 A KR 930022934A KR 1019930006671 A KR1019930006671 A KR 1019930006671A KR 930006671 A KR930006671 A KR 930006671A KR 930022934 A KR930022934 A KR 930022934A
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KR
South Korea
Prior art keywords
inner layer
connection hole
substrate
outer layer
wiring board
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KR1019930006671A
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English (en)
Inventor
마스오 마쓰모도
후사오 비루가와
다까조 다끼하시
Original Assignee
나까야마 노보루
니혼시엠케이 가부시끼가이샤
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Application filed by 나까야마 노보루, 니혼시엠케이 가부시끼가이샤 filed Critical 나까야마 노보루
Publication of KR930022934A publication Critical patent/KR930022934A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

다층프린트 배선판에서의 내층기판의 랜드와 외층기판의 랜드와의 도통의 신로성을 향상시키는 것을 목적으로 하며, 내층기판(1)의 랜드(20), (28), (33)에 접속구멍(17), (26), (32)를 형성하고, 접속구멍(17), (26), (32)에 대응한 외층기판(2) 및 (3)에 접속구멍(17),(26),(32)에 대응한 외층기판(2) 및 (3)에 접속구멍(15), (24), (30) 및 (16), (25), (31)을 형성하고, 내층기판(1)과 외층기판(2), (3)을 접착시이트(8)로 접착한후 각 접속구멍내에 도전페이스트(37)을 충전한다. 내층기판(1)의 접속구멍(17), (26), (32)에 대하여 외층기판(2), (3)의 접속구멍(15), (24), (30)및 (16), (25), (31)의 구멍크기를 크게하고, 내층기판(1)의 랜드(20), (28), (33)의 노출면적을 크게하여 랜드(20), (28), (33)과 도전 페이스트(37)과의 접촉면적이 증대하여 도통의 신뢰성이 향상된다.

Description

다층프린트 배선판 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예1의 제조공정의 블록도, 제2도는 실시예1의 적층이전의 단면도, 제3도는 실시예1의 단면도, 제4도는 실시예2의 단면도.

Claims (5)

  1. 내층기판 및 외층기판에 연통상태로 형성된 접속구멍내에 충전된 도전페이스트에 의해 양기판의 랜드가 도통하는 다층 프리트배선판에 있어서, 상기 다층기판의 접속구멍에 대하여 외층기판의 접속구멍이 더 크게 되어 있는 것을 특징으로 하는 다층 프린트 배선판.
  2. 제1항에 있어서, 도전페이스트 충전시의 공기도피 구멍을 갖고 있는 것을 특징으로 하는 다층 프린트 배선판.
  3. 내층기판의 랜드에 접속구멍을 형성함과 동시에 이 접속구멍 보다도 큰 접속구멍을 외층기판의 랜드에 형성하는 공정과 상기 내층기판의 접속구멍과의 대향부위에 이 접속구멍보다 큰 구멍부가 형성된 접착시이트를 끼워 양기판의 접속구멍을 연통시키도록 내층기판과 외층기판을 적층하는 공정과, 연통상태의 접속구멍내에 도전페이스트를 공정을 갖추고 있는 것을 특징으로 하는 다층 프린트 배선판의 제조방법.
  4. 랜드를 형성한 내층기판에 외층기판을 적층하는 공정, 이 적층상태의 기판을 관통하는 관통구멍을 상기 내층기판의 랜드부분에 형성하는 공정, 상기 외층기판에 랜드를 형성한 후, 이 랜드의 내측부분의 외층기판의 절연층을 제거하여 내층 기판의 랜드를 노출시키는 접속구멍을 형성하는 공정과, 이 접속구멍내에 도전 페이스트를 충전하는 공정을 갖추고 있는 것을 특징으로 하는 다층 프린트 배선판의 제조방법.
  5. 제3항 또는 제4항에 있어서, 접속구멍에 도전재를 삽입한 후, 반전이 충전되는 것을 특징으로 하는 다층 프린트 배선판의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930006671A 1992-04-22 1993-04-21 다층프린트 배선판 및 그 제조방법 KR930022934A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12963792A JP3179564B2 (ja) 1992-04-22 1992-04-22 多層プリント配線板およびその製造方法
JP92-129637 1992-04-22

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KR930022934A true KR930022934A (ko) 1993-11-24

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EP (1) EP0567306A2 (ko)
JP (1) JP3179564B2 (ko)
KR (1) KR930022934A (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69730629T2 (de) 1996-12-26 2005-02-03 Matsushita Electric Industrial Co., Ltd., Kadoma Leiterplatte und Elektronikkomponente
JP2000012723A (ja) * 1998-06-23 2000-01-14 Nitto Denko Corp 回路基板の実装構造体およびそれに用いる多層回路基板
US8453322B2 (en) * 2008-08-14 2013-06-04 Ddi Global Corp. Manufacturing methods of multilayer printed circuit board having stacked via

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4258468A (en) * 1978-12-14 1981-03-31 Western Electric Company, Inc. Forming vias through multilayer circuit boards
US4935584A (en) * 1988-05-24 1990-06-19 Tektronix, Inc. Method of fabricating a printed circuit board and the PCB produced
US5079065A (en) * 1990-04-02 1992-01-07 Fuji Xerox Co., Ltd. Printed-circuit substrate and method of making thereof
JP2881963B2 (ja) * 1990-05-25 1999-04-12 ソニー株式会社 配線基板及びその製造方法

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JPH05299844A (ja) 1993-11-12
EP0567306A2 (en) 1993-10-27
EP0567306A3 (ko) 1994-04-06
JP3179564B2 (ja) 2001-06-25

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