DK120986D0 - Fremgangsmaade til fremstilling af et elektrisk kredsloeb - Google Patents
Fremgangsmaade til fremstilling af et elektrisk kredsloebInfo
- Publication number
- DK120986D0 DK120986D0 DK120986A DK120986A DK120986D0 DK 120986 D0 DK120986 D0 DK 120986D0 DK 120986 A DK120986 A DK 120986A DK 120986 A DK120986 A DK 120986A DK 120986 D0 DK120986 D0 DK 120986D0
- Authority
- DK
- Denmark
- Prior art keywords
- preparing
- procedure
- electric circuit
- electric
- circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Burglar Alarm Systems (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8506898A GB2172439B (en) | 1985-03-16 | 1985-03-16 | Electrical circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
DK120986D0 true DK120986D0 (da) | 1986-03-14 |
DK120986A DK120986A (da) | 1986-09-17 |
Family
ID=10576143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK120986A DK120986A (da) | 1985-03-16 | 1986-03-14 | Fremgangsmaade til fremstilling af et elektrisk kredsloeb |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0195611A3 (da) |
DK (1) | DK120986A (da) |
FI (1) | FI861061A (da) |
GB (1) | GB2172439B (da) |
NO (1) | NO860986L (da) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5531020A (en) * | 1989-11-14 | 1996-07-02 | Poly Flex Circuits, Inc. | Method of making subsurface electronic circuits |
GB2295927A (en) * | 1994-12-08 | 1996-06-12 | Gareth Rhys Baron | Mounting of an integrated circuit on a printed circuit board |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3516155A (en) * | 1967-02-02 | 1970-06-23 | Bunker Ramo | Method and apparatus for assembling electrical components |
JPS5517507B2 (da) * | 1972-06-29 | 1980-05-12 | ||
GB1574438A (en) * | 1977-04-18 | 1980-09-10 | Plessey Co Ltd | Printed circuits |
GB1539669A (en) * | 1977-06-14 | 1979-01-31 | Standard Telephones Cables Ltd | Making connections to thick film circuits |
DE2952961C1 (de) * | 1978-07-13 | 1983-03-31 | Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa | Verfahren zur Herstellung einer gedruckten Schaltung |
GB2038101B (en) * | 1978-12-19 | 1983-02-09 | Standard Telephones Cables Ltd | Printed circuits |
US4368281A (en) * | 1980-09-15 | 1983-01-11 | Amp Incorporated | Printed circuits |
US4362903A (en) * | 1980-12-29 | 1982-12-07 | General Electric Company | Electrical conductor interconnect providing solderable connections to hard-to-contact substrates, such as liquid crystal cells |
US4404237A (en) * | 1980-12-29 | 1983-09-13 | General Electric Company | Fabrication of electrical conductor by replacement of metallic powder in polymer with more noble metal |
US4555414A (en) * | 1983-04-15 | 1985-11-26 | Polyonics Corporation | Process for producing composite product having patterned metal layer |
-
1985
- 1985-03-16 GB GB8506898A patent/GB2172439B/en not_active Expired
-
1986
- 1986-03-14 FI FI861061A patent/FI861061A/fi not_active Application Discontinuation
- 1986-03-14 DK DK120986A patent/DK120986A/da not_active Application Discontinuation
- 1986-03-14 NO NO860986A patent/NO860986L/no unknown
- 1986-03-14 EP EP86301850A patent/EP0195611A3/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
FI861061A0 (fi) | 1986-03-14 |
GB8506898D0 (en) | 1985-04-17 |
EP0195611A3 (en) | 1987-09-16 |
DK120986A (da) | 1986-09-17 |
NO860986L (no) | 1986-09-17 |
GB2172439A (en) | 1986-09-17 |
FI861061A (fi) | 1986-09-17 |
GB2172439B (en) | 1989-06-21 |
EP0195611A2 (en) | 1986-09-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A0 | Application filed | ||
AHB | Application shelved due to non-payment |