DK120886D0 - Kredsloebsarrangement og fremgangsmaade til fremstilling af samme - Google Patents
Kredsloebsarrangement og fremgangsmaade til fremstilling af sammeInfo
- Publication number
- DK120886D0 DK120886D0 DK120886A DK120886A DK120886D0 DK 120886 D0 DK120886 D0 DK 120886D0 DK 120886 A DK120886 A DK 120886A DK 120886 A DK120886 A DK 120886A DK 120886 D0 DK120886 D0 DK 120886D0
- Authority
- DK
- Denmark
- Prior art keywords
- procedure
- circuit arrangement
- preparing same
- preparing
- same
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Burglar Alarm Systems (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08506897A GB2172438A (en) | 1985-03-16 | 1985-03-16 | Printed circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
DK120886D0 true DK120886D0 (da) | 1986-03-14 |
DK120886A DK120886A (da) | 1986-09-17 |
Family
ID=10576142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK120886A DK120886A (da) | 1985-03-16 | 1986-03-14 | Kredsloebsarrangement og fremgangsmaade til fremstilling af samme |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0195612A3 (da) |
DK (1) | DK120886A (da) |
FI (1) | FI861062A (da) |
GB (1) | GB2172438A (da) |
NO (1) | NO860985L (da) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0903805B1 (en) * | 1997-09-19 | 2003-08-06 | Peter Vernon | Planar antenna device |
US20070281099A1 (en) * | 2006-05-31 | 2007-12-06 | Cabot Corporation | Solderable pads utilizing nickel and silver nanoparticle ink jet inks |
CN103572263B (zh) * | 2012-07-28 | 2016-05-11 | 比亚迪股份有限公司 | 塑料表面金属化的方法和表面具有金属图案的塑料产品 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517507B2 (da) * | 1972-06-29 | 1980-05-12 | ||
GB1574438A (en) * | 1977-04-18 | 1980-09-10 | Plessey Co Ltd | Printed circuits |
WO1980000294A1 (en) * | 1978-07-13 | 1980-02-21 | Tokyo Shibaura Electric Co | Method of fabricating printed circuits |
GB2038101B (en) * | 1978-12-19 | 1983-02-09 | Standard Telephones Cables Ltd | Printed circuits |
US4368281A (en) * | 1980-09-15 | 1983-01-11 | Amp Incorporated | Printed circuits |
US4404237A (en) * | 1980-12-29 | 1983-09-13 | General Electric Company | Fabrication of electrical conductor by replacement of metallic powder in polymer with more noble metal |
US4362903A (en) * | 1980-12-29 | 1982-12-07 | General Electric Company | Electrical conductor interconnect providing solderable connections to hard-to-contact substrates, such as liquid crystal cells |
US4555414A (en) * | 1983-04-15 | 1985-11-26 | Polyonics Corporation | Process for producing composite product having patterned metal layer |
-
1985
- 1985-03-16 GB GB08506897A patent/GB2172438A/en not_active Withdrawn
-
1986
- 1986-03-14 NO NO860985A patent/NO860985L/no unknown
- 1986-03-14 DK DK120886A patent/DK120886A/da unknown
- 1986-03-14 FI FI861062A patent/FI861062A/fi not_active Application Discontinuation
- 1986-03-14 EP EP86301852A patent/EP0195612A3/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP0195612A3 (en) | 1987-09-16 |
GB2172438A (en) | 1986-09-17 |
NO860985L (no) | 1986-09-17 |
GB8506897D0 (en) | 1985-04-17 |
FI861062A0 (fi) | 1986-03-14 |
FI861062A (fi) | 1986-09-17 |
DK120886A (da) | 1986-09-17 |
EP0195612A2 (en) | 1986-09-24 |
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