DK2015350T3 - Halvlederkomponent med bufferlag - Google Patents
Halvlederkomponent med bufferlagInfo
- Publication number
- DK2015350T3 DK2015350T3 DK08009987.2T DK08009987T DK2015350T3 DK 2015350 T3 DK2015350 T3 DK 2015350T3 DK 08009987 T DK08009987 T DK 08009987T DK 2015350 T3 DK2015350 T3 DK 2015350T3
- Authority
- DK
- Denmark
- Prior art keywords
- buffer layer
- boundary surface
- zone
- semiconductor component
- concentration
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000005468 ion implantation Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/36—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the concentration or distribution of impurities in the bulk material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
- H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
Landscapes
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Junction Field-Effect Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
- Semiconductor Integrated Circuits (AREA)
- Recrystallisation Techniques (AREA)
- Bipolar Transistors (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007028316A DE102007028316B3 (de) | 2007-06-20 | 2007-06-20 | Halbleiterbauelement mit Pufferschicht und Verfahren zu dessen Herstellung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK2015350T3 true DK2015350T3 (da) | 2012-07-23 |
Family
ID=39727855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK08009987.2T DK2015350T3 (da) | 2007-06-20 | 2008-05-31 | Halvlederkomponent med bufferlag |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8415773B2 (da) |
| EP (1) | EP2015350B1 (da) |
| JP (1) | JP5358129B2 (da) |
| CN (1) | CN101330109B (da) |
| AT (1) | ATE556430T1 (da) |
| DE (1) | DE102007028316B3 (da) |
| DK (1) | DK2015350T3 (da) |
| ES (1) | ES2384280T3 (da) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789287A (zh) * | 2014-12-25 | 2016-07-20 | 无锡华润上华半导体有限公司 | 场截止绝缘栅双极晶体管及其制备方法 |
| JP6846119B2 (ja) * | 2016-05-02 | 2021-03-24 | 株式会社 日立パワーデバイス | ダイオード、およびそれを用いた電力変換装置 |
| CN113555418B (zh) * | 2021-07-21 | 2023-03-10 | 西安电子科技大学 | 基于P区和I区渐变掺杂的4H-SiC PIN微波二极管及制作方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1167786A (ja) * | 1997-08-25 | 1999-03-09 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
| JP2000223720A (ja) | 1999-01-29 | 2000-08-11 | Meidensha Corp | 半導体素子およびライフタイム制御方法 |
| JP4129106B2 (ja) * | 1999-10-27 | 2008-08-06 | 三菱電機株式会社 | 半導体装置 |
| JP3951738B2 (ja) * | 2001-02-23 | 2007-08-01 | 富士電機デバイステクノロジー株式会社 | 半導体装置の製造方法 |
| DE10207522B4 (de) * | 2001-02-23 | 2018-08-02 | Fuji Electric Co., Ltd. | Halbleiterbauelement und Verfahren zu dessen Herstellung |
| JP4539011B2 (ja) * | 2002-02-20 | 2010-09-08 | 富士電機システムズ株式会社 | 半導体装置 |
| JP4000927B2 (ja) * | 2002-07-03 | 2007-10-31 | 富士電機デバイステクノロジー株式会社 | 半導体装置およびその製造方法 |
| DE10243758A1 (de) * | 2002-09-20 | 2004-04-01 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Verfahren zur Herstellung einer vergrabenen Stoppzone in einem Halbleiterbauelement und Halbleiterbauelement mit einer vergrabenen Stoppzone |
| US7728409B2 (en) * | 2005-11-10 | 2010-06-01 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device and method of manufacturing the same |
-
2007
- 2007-06-20 DE DE102007028316A patent/DE102007028316B3/de active Active
-
2008
- 2008-05-31 AT AT08009987T patent/ATE556430T1/de active
- 2008-05-31 ES ES08009987T patent/ES2384280T3/es active Active
- 2008-05-31 EP EP08009987A patent/EP2015350B1/de active Active
- 2008-05-31 DK DK08009987.2T patent/DK2015350T3/da active
- 2008-06-18 JP JP2008159106A patent/JP5358129B2/ja not_active Expired - Fee Related
- 2008-06-19 CN CN2008101251868A patent/CN101330109B/zh active Active
- 2008-06-20 US US12/214,641 patent/US8415773B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009004780A (ja) | 2009-01-08 |
| DE102007028316B3 (de) | 2008-10-30 |
| ES2384280T3 (es) | 2012-07-03 |
| US8415773B2 (en) | 2013-04-09 |
| CN101330109B (zh) | 2012-05-02 |
| ATE556430T1 (de) | 2012-05-15 |
| US20090032912A1 (en) | 2009-02-05 |
| CN101330109A (zh) | 2008-12-24 |
| JP5358129B2 (ja) | 2013-12-04 |
| EP2015350B1 (de) | 2012-05-02 |
| EP2015350A1 (de) | 2009-01-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200719432A (en) | Semiconductor wafer dividing method | |
| SG131023A1 (en) | Semiconductor heterostructure and method for forming a semiconductor heterostructure | |
| TW200739706A (en) | Method of polishing a semiconductor-on-insulator structure | |
| WO2008123213A1 (ja) | 半導体装置及び半導体製造方法 | |
| FR2890489B1 (fr) | Procede de fabrication d'une heterostructure de type semi-conducteur sur isolant | |
| TW200703461A (en) | Glass-based semiconductor on insulator structures and methods of making same | |
| TW200620664A (en) | Semicomductor device and method for manufacturing the same | |
| WO2012013361A3 (en) | A polymeric substrate having a glass-like surface and a chip made of said polymeric substrate | |
| TW200741978A (en) | Stressor integration and method thereof | |
| EP2846358A3 (en) | Semiconductor device and manufacturing method thereof | |
| TW200719443A (en) | Semiconductor device and manufacturing method of the same | |
| TW200711004A (en) | Method of forming buried isolation regions in semiconductor substrates and semiconductor devices with buried isolation regions | |
| GB2461209A (en) | A technique for enhancing transistor performance by transistor specific contact design | |
| ATE438041T1 (de) | Lagerelement | |
| EP2348531A3 (en) | Thin film transistor and method of manufacturing the same | |
| TW200705719A (en) | Thin-film semiconductor-body | |
| TW200729393A (en) | Method for fabricating semiconductor device | |
| FR2888400B1 (fr) | Procede de prelevement de couche | |
| MY191753A (en) | Polishing pad with foundation layer and window attached thereto | |
| ATE454112T1 (de) | Brustprothese | |
| SG161182A1 (en) | Integrated circuit system employing an elevated drain | |
| ATE422710T1 (de) | Leistungshalbleiterbauelement mit sekundärpassivierungsschicht und zugehöriges herstellungsverfahren | |
| ATE478208T1 (de) | Akustikelemente | |
| DK2015350T3 (da) | Halvlederkomponent med bufferlag | |
| TW200735271A (en) | Semiconductor device fabrication method |