DK179268B1 - Mass production of small temperature sensors with flip chips - Google Patents

Mass production of small temperature sensors with flip chips Download PDF

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Publication number
DK179268B1
DK179268B1 DKPA201270293A DKPA201270293A DK179268B1 DK 179268 B1 DK179268 B1 DK 179268B1 DK PA201270293 A DKPA201270293 A DK PA201270293A DK PA201270293 A DKPA201270293 A DK PA201270293A DK 179268 B1 DK179268 B1 DK 179268B1
Authority
DK
Denmark
Prior art keywords
circuit board
contact
structured
conductive
flip
Prior art date
Application number
DKPA201270293A
Other languages
Danish (da)
English (en)
Inventor
Karlheinz Wienand
Karlheinz Eckert
Gernot Hacker
Thomas Jost
Original Assignee
Heraeus Sensor Technology Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Sensor Technology Gmbh filed Critical Heraeus Sensor Technology Gmbh
Publication of DK201270293A publication Critical patent/DK201270293A/da
Application granted granted Critical
Publication of DK179268B1 publication Critical patent/DK179268B1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DKPA201270293A 2011-06-01 2012-05-31 Mass production of small temperature sensors with flip chips DK179268B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102011103828.4A DE102011103828B4 (de) 2011-06-01 2011-06-01 Massenproduktion kleiner Temepratursensoren mit Flip-Chips

Publications (2)

Publication Number Publication Date
DK201270293A DK201270293A (en) 2012-12-02
DK179268B1 true DK179268B1 (en) 2018-03-19

Family

ID=47173413

Family Applications (1)

Application Number Title Priority Date Filing Date
DKPA201270293A DK179268B1 (en) 2011-06-01 2012-05-31 Mass production of small temperature sensors with flip chips

Country Status (4)

Country Link
CN (1) CN102809442B (zh)
AT (1) AT511498B1 (zh)
DE (1) DE102011103828B4 (zh)
DK (1) DK179268B1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3435048A1 (de) 2017-07-25 2019-01-30 Heraeus Sensor Technology GmbH Sensor zur erfassung eines räumlichen temperaturprofils und verfahren zur herstellung einer sensoreinheit

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4050052A (en) * 1975-06-21 1977-09-20 W. C. Heraeus Gmbh Electrical temperature measuring resistor structure, particularly for resistance thermometers
US4901051A (en) * 1987-09-04 1990-02-13 Murata Manufacturing Co., Ltd. Platinum temperature sensor
US6241146B1 (en) * 1997-11-13 2001-06-05 Herarus Electro-Nite International N.V. Process for manufacturing a sensor arrangement for temperature measurement
EP2154501A2 (en) * 2008-08-07 2010-02-17 Melexis NV Laminated temperature sensor
WO2011024724A1 (ja) * 2009-08-28 2011-03-03 株式会社村田製作所 サーミスタ及びその製造方法
EP2312288A1 (de) * 2009-10-16 2011-04-20 JUMO GmbH & Co. KG Temperatursensor mit Multilayer-Leiterplatine

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3127727A1 (de) 1981-07-14 1983-02-03 Robert Bosch Gmbh, 7000 Stuttgart "vorrichtung zur messung der temperatur eines mediums"
DE8716103U1 (de) 1987-12-05 1988-01-21 Degussa Ag, 6000 Frankfurt Meßwiderstand für Temperaturmessungen
DE3939165C1 (en) 1989-11-27 1990-10-31 Heraeus Sensor Gmbh, 6450 Hanau, De Temp. sensor with measurement resistance - has ceramic disk with thin metallic coating as resistance layer, and plastic sheet conductor plate
DE29504105U1 (de) 1995-03-09 1995-04-27 Viessmann Werke Gmbh & Co, 35108 Allendorf Temperaturfühler
DE19621001A1 (de) 1996-05-24 1997-11-27 Heraeus Sensor Nite Gmbh Sensoranordnung zur Temperaturmessung und Verfahren zur Herstellung der Anordnung
DE19742236C2 (de) 1997-09-25 2000-10-05 Heraeus Electro Nite Int Elektrischer Sensor, insbesondere Temperatur-Sensor, mit Leiterplatte
DE19936924C1 (de) * 1999-08-05 2001-06-13 Georg Bernitz Vorrichtung zur Hochtemperaturerfassung und Verfahren zur Herstellung derselben
DE10104493A1 (de) * 2001-01-31 2002-08-22 Epiq Sensor Nite N V Temperatursensor und Verfahren zur Herstellung eines Temperatursensors
DE10215654A1 (de) * 2002-04-09 2003-11-06 Infineon Technologies Ag Elektronisches Bauteil mit mindestens einem Halbleiterchip und Flip-Chip-Kontakten sowie Verfahren zu seiner Herstellung
DK178446B1 (da) * 2005-10-24 2016-02-29 Heraeus Sensor Technology Gmbh Fremgangsmåde til fremstilling af en temperatursensor
DE102006004322A1 (de) * 2006-01-31 2007-08-16 Häusermann GmbH Leiterplatte mit zusätzlichen funktionalen Elementen sowie Herstellverfahren und Anwendung
DE102008014923A1 (de) * 2008-03-19 2009-09-24 Epcos Ag Foliensensor und Verfahren zur Herstellung eines Foliensensors

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4050052A (en) * 1975-06-21 1977-09-20 W. C. Heraeus Gmbh Electrical temperature measuring resistor structure, particularly for resistance thermometers
US4901051A (en) * 1987-09-04 1990-02-13 Murata Manufacturing Co., Ltd. Platinum temperature sensor
US6241146B1 (en) * 1997-11-13 2001-06-05 Herarus Electro-Nite International N.V. Process for manufacturing a sensor arrangement for temperature measurement
EP2154501A2 (en) * 2008-08-07 2010-02-17 Melexis NV Laminated temperature sensor
WO2011024724A1 (ja) * 2009-08-28 2011-03-03 株式会社村田製作所 サーミスタ及びその製造方法
EP2312288A1 (de) * 2009-10-16 2011-04-20 JUMO GmbH & Co. KG Temperatursensor mit Multilayer-Leiterplatine

Also Published As

Publication number Publication date
DE102011103828B4 (de) 2017-04-06
AT511498B1 (de) 2014-02-15
CN102809442A (zh) 2012-12-05
AT511498A3 (de) 2013-04-15
DK201270293A (en) 2012-12-02
CN102809442B (zh) 2015-06-17
DE102011103828A1 (de) 2012-12-06
AT511498A2 (de) 2012-12-15

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