DK1713311T3 - Fremgangsmåde og apparat til fremstilling af elektronisk anordning ved anvendelse af en roterende trykproces valse mod valse - Google Patents
Fremgangsmåde og apparat til fremstilling af elektronisk anordning ved anvendelse af en roterende trykproces valse mod valseInfo
- Publication number
- DK1713311T3 DK1713311T3 DK06112095.2T DK06112095T DK1713311T3 DK 1713311 T3 DK1713311 T3 DK 1713311T3 DK 06112095 T DK06112095 T DK 06112095T DK 1713311 T3 DK1713311 T3 DK 1713311T3
- Authority
- DK
- Denmark
- Prior art keywords
- electronic device
- rotating
- printing process
- manufacturing electronic
- rolling printing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C4/00—Crushing or disintegrating by roller mills
- B02C4/02—Crushing or disintegrating by roller mills with two or more rollers
- B02C4/08—Crushing or disintegrating by roller mills with two or more rollers with co-operating corrugated or toothed crushing-rollers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C4/00—Crushing or disintegrating by roller mills
- B02C4/28—Details
- B02C4/30—Shape or construction of rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C4/00—Crushing or disintegrating by roller mills
- B02C4/28—Details
- B02C4/42—Driving mechanisms; Roller speed control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F9/00—Rotary intaglio printing presses
- B41F9/01—Rotary intaglio printing presses for indirect printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2217/00—Printing machines of special types or for particular purposes
- B41P2217/50—Printing presses for particular purposes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Methods (AREA)
- Rotary Presses (AREA)
- Thin Film Transistor (AREA)
- Handling Of Sheets (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050030722A KR100634327B1 (ko) | 2005-04-13 | 2005-04-13 | 롤-투-롤 윤전인쇄방식을 이용한 전자소자의 제조방법 및그 제조장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
DK1713311T3 true DK1713311T3 (da) | 2012-05-21 |
Family
ID=36782515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK06112095.2T DK1713311T3 (da) | 2005-04-13 | 2006-03-31 | Fremgangsmåde og apparat til fremstilling af elektronisk anordning ved anvendelse af en roterende trykproces valse mod valse |
Country Status (6)
Country | Link |
---|---|
US (2) | US20060254440A1 (da) |
EP (1) | EP1713311B1 (da) |
JP (1) | JP2006289983A (da) |
KR (1) | KR100634327B1 (da) |
AT (1) | ATE550917T1 (da) |
DK (1) | DK1713311T3 (da) |
Families Citing this family (88)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9460346B2 (en) | 2004-04-19 | 2016-10-04 | Google Inc. | Handheld device for capturing text from both a document printed on paper and a document displayed on a dynamic display device |
KR101265321B1 (ko) * | 2005-11-14 | 2013-05-20 | 엘지디스플레이 주식회사 | 스탬프 제조 방법, 그를 이용한 박막트랜지스터 및액정표시장치의 제조 방법 |
US8138075B1 (en) | 2006-02-06 | 2012-03-20 | Eberlein Dietmar C | Systems and methods for the manufacture of flat panel devices |
CA2667278A1 (en) * | 2006-10-20 | 2008-05-02 | Soligie, Inc. | Patterned printing plates and processes for printing electrical elements |
JP2008159812A (ja) * | 2006-12-22 | 2008-07-10 | Sharp Corp | 半導体層形成装置および半導体層形成方法 |
WO2008091571A2 (en) * | 2007-01-22 | 2008-07-31 | Nano Terra Inc. | High-throughput apparatus for patterning flexible substrates and method of using the same |
US8394483B2 (en) | 2007-01-24 | 2013-03-12 | Micron Technology, Inc. | Two-dimensional arrays of holes with sub-lithographic diameters formed by block copolymer self-assembly |
US8083953B2 (en) | 2007-03-06 | 2011-12-27 | Micron Technology, Inc. | Registered structure formation via the application of directed thermal energy to diblock copolymer films |
US8557128B2 (en) | 2007-03-22 | 2013-10-15 | Micron Technology, Inc. | Sub-10 nm line features via rapid graphoepitaxial self-assembly of amphiphilic monolayers |
JP2008251888A (ja) * | 2007-03-30 | 2008-10-16 | Sony Corp | パターン形成方法および電子素子の製造方法 |
US8294139B2 (en) | 2007-06-21 | 2012-10-23 | Micron Technology, Inc. | Multilayer antireflection coatings, structures and devices including the same and methods of making the same |
US7959975B2 (en) | 2007-04-18 | 2011-06-14 | Micron Technology, Inc. | Methods of patterning a substrate |
US8097175B2 (en) | 2008-10-28 | 2012-01-17 | Micron Technology, Inc. | Method for selectively permeating a self-assembled block copolymer, method for forming metal oxide structures, method for forming a metal oxide pattern, and method for patterning a semiconductor structure |
US8372295B2 (en) | 2007-04-20 | 2013-02-12 | Micron Technology, Inc. | Extensions of self-assembled structures to increased dimensions via a “bootstrap” self-templating method |
US8404124B2 (en) | 2007-06-12 | 2013-03-26 | Micron Technology, Inc. | Alternating self-assembling morphologies of diblock copolymers controlled by variations in surfaces |
US8080615B2 (en) | 2007-06-19 | 2011-12-20 | Micron Technology, Inc. | Crosslinkable graft polymer non-preferentially wetted by polystyrene and polyethylene oxide |
WO2009049264A1 (en) * | 2007-10-10 | 2009-04-16 | Kovio, Inc. | Wireless devices including printed integrated circuitry and methods for manufacturing and using the same |
KR100911214B1 (ko) * | 2007-10-10 | 2009-08-06 | 한국기계연구원 | 롤-투-롤 윤전인쇄시스템의 인압 제어장치 |
KR101014363B1 (ko) * | 2007-10-17 | 2011-02-15 | 한국기계연구원 | 롤투롤 윤전인쇄방식을 이용한 전자소자 제조장치 |
GB2453766A (en) * | 2007-10-18 | 2009-04-22 | Novalia Ltd | Method of fabricating an electronic device |
EP2206015A2 (en) | 2007-10-29 | 2010-07-14 | Dow Corning Corporation | Polar polydimethylsiloxane molds, methods of making the molds, and methods of using the molds for pattern transfer |
US20090145314A1 (en) * | 2007-12-07 | 2009-06-11 | Chemque, Inc. | Intaglio Printing Methods, Apparatuses, and Printed or Coated Materials Made Therewith |
JP2009143090A (ja) * | 2007-12-13 | 2009-07-02 | Fujimori Kogyo Co Ltd | 微細線パターンの形成方法および微細線パターン形成用のグラビア輪転印刷機 |
US8999492B2 (en) | 2008-02-05 | 2015-04-07 | Micron Technology, Inc. | Method to produce nanometer-sized features with directed assembly of block copolymers |
US8101261B2 (en) | 2008-02-13 | 2012-01-24 | Micron Technology, Inc. | One-dimensional arrays of block copolymer cylinders and applications thereof |
KR100953475B1 (ko) * | 2008-02-19 | 2010-04-16 | 건국대학교 산학협력단 | 전자소자 연속공정 롤투롤 인쇄를 위한 초정밀 레지스터제어 방법 |
US8425982B2 (en) | 2008-03-21 | 2013-04-23 | Micron Technology, Inc. | Methods of improving long range order in self-assembly of block copolymer films with ionic liquids |
US8426313B2 (en) | 2008-03-21 | 2013-04-23 | Micron Technology, Inc. | Thermal anneal of block copolymer films with top interface constrained to wet both blocks with equal preference |
US8114300B2 (en) | 2008-04-21 | 2012-02-14 | Micron Technology, Inc. | Multi-layer method for formation of registered arrays of cylindrical pores in polymer films |
DE102008021447A1 (de) * | 2008-04-29 | 2009-11-05 | Manroland Ag | Verfahren zum Betreiben einer in eine Rollendruckmaschine integrierten Bearbeitungseinrichtung |
KR101005234B1 (ko) | 2008-04-30 | 2010-12-31 | 건국대학교 산학협력단 | 섹셔날 타입 롤투롤 인쇄기의 레지스터 제어 방법 |
US8114301B2 (en) | 2008-05-02 | 2012-02-14 | Micron Technology, Inc. | Graphoepitaxial self-assembly of arrays of downward facing half-cylinders |
KR100963805B1 (ko) * | 2008-05-08 | 2010-06-17 | 건국대학교 산학협력단 | 매칭 로직을 통한 전자소자 인쇄 방법 및 이를 이용한rfid 태그 제조 방법 |
KR100981278B1 (ko) * | 2008-06-09 | 2010-09-10 | 한국과학기술원 | 롤과 기판의 정렬오차 보정이 가능한 유연 전자소자의인쇄장치 및 그 인쇄방법 |
WO2010016206A1 (ja) * | 2008-08-04 | 2010-02-11 | パナソニック株式会社 | フレキシブル半導体装置の製造方法 |
KR200457089Y1 (ko) | 2008-10-15 | 2011-12-06 | 미래나노텍(주) | 가변형 롤 코팅장치 |
JP5398339B2 (ja) * | 2009-04-28 | 2014-01-29 | 藤森工業株式会社 | 微細線パターンの形成方法および微細線パターン形成用のグラビア印刷機 |
KR20100123973A (ko) * | 2009-05-18 | 2010-11-26 | 삼성전자주식회사 | 컬러 필터, 그 제조 장치 및 그 제조 방법 |
KR101084308B1 (ko) * | 2009-05-18 | 2011-11-16 | 한국기계연구원 | 비접촉식 롤투롤 인쇄장비 및 그 제어방법 |
KR101100772B1 (ko) | 2009-07-28 | 2012-01-02 | 한국기계연구원 | 2줄 인쇄방법 |
US9174428B2 (en) | 2009-08-10 | 2015-11-03 | Corning Incorporated | Roll mechanics for enabling printed electronics |
KR20130079327A (ko) * | 2010-04-02 | 2013-07-10 | 로디아 오퍼레이션스 | 선택적 나노입자 집합 시스템 및 그 방법 |
DE102010014299B4 (de) | 2010-04-08 | 2015-03-05 | Berthold Schmidt | Betriebsverfahren zur Umwandlung von Strahlungsenergie in elektrische Energie und umgekehrt sowie Verwendung einer Anordnung zu dessen Durchführung |
DE102010015659A1 (de) | 2010-04-20 | 2011-10-20 | Giesecke & Devrient Gmbh | Transferverfahren zur Herstellung von Leiterstrukturen mittels Nanotinten |
US8724177B2 (en) * | 2010-06-09 | 2014-05-13 | Korea Institute Of Machinery & Materials | Printing apparatus having automatic printing sheet feeder |
KR101222488B1 (ko) * | 2010-06-29 | 2013-01-16 | 한국기계연구원 | 전자회로 인쇄용 윤전인쇄기로 제작되는 유연면광 무기 el디스플레이와 제조방법 |
US8304493B2 (en) | 2010-08-20 | 2012-11-06 | Micron Technology, Inc. | Methods of forming block copolymers |
KR101800158B1 (ko) | 2010-12-16 | 2017-12-20 | 엘지디스플레이 주식회사 | 롤 인쇄 장비 및 그를 이용한 패턴 형성방법 및 그를 이용한 액정표시장치의 제조방법 |
DE102011002417A1 (de) * | 2011-01-04 | 2012-07-05 | Robert Bosch Gmbh | Verfahren zur Herstellung einer elektronischen Schaltung, Druckwalze und Verfahren zur Herstellung einer solchen |
JP5790075B2 (ja) * | 2011-03-30 | 2015-10-07 | 凸版印刷株式会社 | 電界効果トランジスタの製造方法及びそれに用いる製造装置 |
EP2506330A1 (en) | 2011-04-01 | 2012-10-03 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Apparatus and method for providing an embedded structure and for providing an electro-optical device including the same |
US8635761B2 (en) | 2011-09-19 | 2014-01-28 | Xerox Corporation | System and method for formation of electrical conductors on a substrate |
JP5838692B2 (ja) * | 2011-09-27 | 2016-01-06 | 凸版印刷株式会社 | Cmos半導体装置の製造方法 |
JP2015503139A (ja) * | 2011-10-25 | 2015-01-29 | ユニピクセル ディスプレイズ,インコーポレーテッド | フレキソ印刷よって抵抗膜式タッチセンサ回路を製造する方法 |
TW201332782A (zh) * | 2011-10-25 | 2013-08-16 | Unipixel Displays Inc | 使用膠版輪轉式印刷之製造電容式觸控感測電路之方法 |
US8900963B2 (en) | 2011-11-02 | 2014-12-02 | Micron Technology, Inc. | Methods of forming semiconductor device structures, and related structures |
KR101221830B1 (ko) * | 2011-12-21 | 2013-01-15 | 한국기계연구원 | 라인 타입 마이크로 패턴 시트부재 성형 장치 |
KR101156651B1 (ko) | 2012-03-20 | 2012-06-15 | (주)아이펜 | 인쇄전자소자용 건조장치 |
CN104487920B (zh) * | 2012-05-04 | 2017-04-19 | 伊斯曼柯达公司 | 使用有机金属墨和带状网纹辊制造高分辨率导电图案 |
TWI647988B (zh) * | 2012-05-04 | 2019-01-11 | 柯達公司 | 使用有機金屬油墨和帶狀的傳墨輥製造觸控感測器、rf天線及高解析傳導圖案的方法 |
US20130319275A1 (en) * | 2012-05-30 | 2013-12-05 | Elsie A. Fohrenkamm | Method for providing a printed pattern |
JP2015530958A (ja) | 2012-05-30 | 2015-10-29 | コーニング インコーポレイテッド | フレキシブルガラスリボンを検査する装置および方法 |
US9193143B2 (en) | 2012-09-26 | 2015-11-24 | Korea Institute Of Machinery & Materials | Precision overprinting method of printed electronics rotary printing where location can be adjusted in real time |
JP6112501B2 (ja) * | 2012-10-05 | 2017-04-12 | 株式会社小森コーポレーション | グラビアオフセット印刷機 |
US9087699B2 (en) | 2012-10-05 | 2015-07-21 | Micron Technology, Inc. | Methods of forming an array of openings in a substrate, and related methods of forming a semiconductor device structure |
JP6112502B2 (ja) * | 2012-10-05 | 2017-04-12 | 株式会社小森コーポレーション | グラビアオフセット印刷機 |
EP2722179A1 (en) * | 2012-10-18 | 2014-04-23 | KBA-NotaSys SA | Intaglio printing press and method of monitoring operation of the same |
KR101453501B1 (ko) | 2012-12-12 | 2014-10-23 | 한국기계연구원 | 지폐 위변조방지 인쇄효과를 위한 그라비어오프셋 인쇄유닛에 의한 다색 중첩인쇄 방법 |
KR101425986B1 (ko) | 2012-12-13 | 2014-08-06 | (주) 파루 | 양면의 다층 연성회로기판 제조장치 및 방법 |
US20140248423A1 (en) * | 2013-03-04 | 2014-09-04 | Uni-Pixel Displays, Inc. | Method of roll to roll printing of fine lines and features with an inverse patterning process |
US9229328B2 (en) | 2013-05-02 | 2016-01-05 | Micron Technology, Inc. | Methods of forming semiconductor device structures, and related semiconductor device structures |
US9067449B2 (en) * | 2013-06-13 | 2015-06-30 | Canon Kabushiki Kaisha | Image recording method by serially transferring intermediate images |
US8985757B2 (en) * | 2013-08-13 | 2015-03-24 | Xerox Corporation | Systems and methods for ink-based digital printing using image offset configuration |
US9177795B2 (en) | 2013-09-27 | 2015-11-03 | Micron Technology, Inc. | Methods of forming nanostructures including metal oxides |
JP6270133B2 (ja) | 2014-02-12 | 2018-01-31 | 株式会社小森コーポレーション | フレキシブル電子デバイス製造装置 |
CN103921532A (zh) * | 2014-04-28 | 2014-07-16 | 北京黎马敦太平洋包装有限公司 | 一种烟用条与盒自动卷倒卷装置及印刷复卷方法 |
JP6476990B2 (ja) * | 2014-06-05 | 2019-03-06 | 大日本印刷株式会社 | 印刷版、印刷版の製造方法、機能性素子の製造方法および印刷装置 |
KR102238261B1 (ko) * | 2015-08-11 | 2021-04-09 | 코오롱인더스트리 주식회사 | 연료전지용 막전극접합체의 제조 방법 및 제조 시스템 |
US10379072B2 (en) | 2016-01-04 | 2019-08-13 | Cryovac, Llc | Multiple detector apparatus and method for monitoring an environment |
KR101738957B1 (ko) * | 2016-08-23 | 2017-05-23 | 김정길 | 그라비아 인쇄를 이용한 데코레이션 시트 및 그의 제조방법 |
WO2018095952A1 (de) | 2016-11-22 | 2018-05-31 | Covestro Deutschland Ag | Verfahren und system zur herstellung eines gegenstandes durch schichtweisen aufbau im stempelverfahren |
JP6386119B2 (ja) * | 2017-03-07 | 2018-09-05 | 株式会社小森コーポレーション | グラビアオフセット印刷機 |
KR102145957B1 (ko) * | 2018-08-28 | 2020-08-19 | 건국대학교 산학협력단 | 롤투롤을 활용한 플렉시블 대면적 온도 센서 제작 시스템 |
JP7229787B2 (ja) * | 2019-01-18 | 2023-02-28 | 東洋紡株式会社 | 固定部材、フレキシブル電子デバイスの製造方法、積層体及び印刷装置 |
US10748793B1 (en) | 2019-02-13 | 2020-08-18 | X Display Company Technology Limited | Printing component arrays with different orientations |
KR102418949B1 (ko) | 2021-01-29 | 2022-07-08 | 순천대학교 산학협력단 | 레지스터 측정장치 및 이를 포함하는 인쇄 시스템 |
CN113607310B (zh) * | 2021-06-01 | 2022-07-05 | 武汉大学 | 柔性压阻传感器的大规模制备方法 |
CN114885508B (zh) * | 2022-07-08 | 2022-10-28 | 宁波圆芯电子有限公司 | 柔性集成电路生产系统和方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH576869A5 (da) * | 1973-05-11 | 1976-06-30 | Mohn Reinhard Mohndruck Ohg | |
US4209551A (en) * | 1977-12-28 | 1980-06-24 | Toppan Printing Co., Ltd. | Method of fabricating a phosphor screen of a color television picture tube |
US4898752A (en) * | 1988-03-30 | 1990-02-06 | Westvaco Corporation | Method for making coated and printed packaging material on a printing press |
JPH02244785A (ja) | 1989-03-17 | 1990-09-28 | Toppan Printing Co Ltd | 細線印刷用基板 |
FR2709038B1 (fr) * | 1993-08-10 | 1995-11-10 | Leroux Gilles Sa | Procédé de fabrication pour support plastique, dispositif de fabrication pour un tel support et utilisation du procédé pour la fabrication de cartes à circuits intégrés. |
US5514503A (en) * | 1994-10-17 | 1996-05-07 | Corning Incorporated | Apparatus and method for printing a color filter |
JPH08187927A (ja) * | 1994-11-09 | 1996-07-23 | Nippon Oil Co Ltd | 印刷による転写方法 |
DE19624441C1 (de) * | 1996-06-19 | 1997-12-04 | Roland Man Druckmasch | Verfahren und Vorrichtung für den Tiefdruck mittels einer löschbaren Tiefdruckform |
JP4244520B2 (ja) * | 1997-12-26 | 2009-03-25 | ダイキン工業株式会社 | 柔軟性を有するoa機器用耐熱性材料 |
DE19807505A1 (de) * | 1998-02-21 | 1999-08-26 | Roland Man Druckmasch | Bogenrotationsdruckmaschine mit Druckeinheiten für den Mehrfarbendruck und wenigstens einer Beschichtungseinheit |
DE19817878A1 (de) * | 1998-04-22 | 1999-11-04 | Juerg Paul Haller | Verfahren zur Herstellung von Drucksendungen, Einrichtung zur Herstellung von Drucksendungen, Umhüllung für eine nach dem Verfahren hergestellte Drucksendung sowie ein zur Verwendung bei einem solchen Verfahren hergestelltes Kuvert |
US6314879B1 (en) * | 1999-05-12 | 2001-11-13 | Hurletron Incorporated | Flexographic printing apparatus |
DE10035788C1 (de) * | 2000-07-22 | 2002-03-14 | Koenig & Bauer Ag | Verfahren und Vorrichtung zur Regelung einer Bahnspannung in einer Rotationsdruckmaschine |
CN100509390C (zh) * | 2001-12-06 | 2009-07-08 | 柯尼格及包尔公开股份有限公司 | 调整印刷机的辊的贴合力和对辊的离合压进行控制的装置 |
-
2005
- 2005-04-13 KR KR1020050030722A patent/KR100634327B1/ko active IP Right Grant
-
2006
- 2006-03-31 DK DK06112095.2T patent/DK1713311T3/da active
- 2006-03-31 AT AT06112095T patent/ATE550917T1/de active
- 2006-03-31 US US11/394,086 patent/US20060254440A1/en not_active Abandoned
- 2006-03-31 EP EP06112095A patent/EP1713311B1/en not_active Not-in-force
- 2006-04-13 JP JP2006111356A patent/JP2006289983A/ja active Pending
-
2009
- 2009-06-01 US US12/476,104 patent/US8689687B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20060254440A1 (en) | 2006-11-16 |
ATE550917T1 (de) | 2012-04-15 |
EP1713311A3 (en) | 2007-04-25 |
JP2006289983A (ja) | 2006-10-26 |
US20090288567A1 (en) | 2009-11-26 |
EP1713311B1 (en) | 2012-03-21 |
EP1713311A2 (en) | 2006-10-18 |
US8689687B2 (en) | 2014-04-08 |
KR100634327B1 (ko) | 2006-10-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DK1713311T3 (da) | Fremgangsmåde og apparat til fremstilling af elektronisk anordning ved anvendelse af en roterende trykproces valse mod valse | |
HK1224385A1 (zh) | 浸沒式曝光方法及設備以及製造器件的方法 | |
DK1910642T3 (da) | Apparat og fremgangsmåde til overvågning af affaldsgeninjektionsslam | |
DK2137866T3 (da) | Fremgangsmåde og apparat til generering og behandling af en MAC-EHS-protokoldataenhed | |
NO20053213D0 (no) | Apparat og fremgangsmate for a beskrive et reservoar. | |
TWI366219B (en) | Polarization changing device, optical illumination apparatus, light-exposure apparatus and light-exposure method | |
DK1964432T3 (da) | Fremgangsmåde og apparat til at kommunikere transmissionsbacklog-information | |
DK3848928T3 (da) | Apparat og fremgangsmåde til frembringelse af audiosubbåndværdier med kompleks værdi | |
TWI319517B (en) | Lithographic apparatus, device manufacturing method | |
DK1969889T3 (da) | Fremgangsmåde og apparat til implementering og/eller anvendelse af en dedikeret styrekanal | |
TWI315454B (en) | Stage apparatus, lithographic apparatus and device manufacturing method | |
EP1986222A4 (en) | EXPOSURE DEVICE, EXPOSURE METHOD AND COMPONENT MANUFACTURING METHOD | |
HK1099962A1 (en) | Exposure apparatus, exposure method, and method for manufacturing device | |
IL176057A0 (en) | Exposure apparatus, exposure method, method for producing device, and optical part | |
DK2040490T3 (da) | Fremgangsmåde og apparat til en hørehjælpsanordning ved anvendelse af MEMS-sensorer | |
EP1986223A4 (en) | EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD | |
DK2091268T3 (da) | Apparat og fremgangsmåde til overvågning af en hørehjælpeindretning | |
DK1673979T3 (da) | Fremgangsmåde og anordning til rengöring af en overtræksmaskine | |
EP1965414A4 (en) | EXPOSURE METHOD, EXPOSURE DEVICE AND METHOD FOR MANUFACTURING COMPONENTS | |
EP1926128A4 (en) | EXPOSURE APPARATUS, METHOD, AND DEVICE MANUFACTURING PROCESS | |
SG126100A1 (en) | Lithographic apparatus, immersion projection apparatus and device manufacturing method | |
DK2054552T3 (da) | Fremgangsmåde og indretning til fornyelse af et ballastleje | |
DK2032341T3 (da) | Fremgangsmåde og apparat til støbning og samling af flerdelte plastanordninger | |
FI20041630A0 (fi) | Menetelmä ja laitteisto laitteen vaihtamiseksi aktiivisen yhteyden aikana | |
FI20055018A (fi) | Menetelmä muodostaa kuva, menetelmä testata elektronista laitetta ja testauslaite, testauskammio ja testausjärjestelmä |